All parts, by layer
Layer 1 — Compute silicon & packaging
- 1.01 Merchant GPUs / accelerators · 3 companies
- 1.02 Hyperscaler custom ASICs (XPUs) · 9 companies
- 1.03 ASIC design services, IP & EDA · 13 companies
- 1.04 Startup accelerators (non-GPU architectures) · 11 companies
- 1.05 Server CPUs · 8 companies
- 1.06 NICs / SuperNICs · 5 companies
- 1.07 DPUs · 5 companies
- 1.08 FPGAs (inference, networking, test) · 4 companies
- 1.09 Leading-edge foundry · 3 companies
- 1.10 Silicon wafers · 5 companies
- 1.11 2.5D/3D advanced packaging (CoWoS-S/L/R, SoIC, EMIB/Foveros, I-Cube) · 7 companies
- 1.12 Packaging & bonding equipment · 16 companies
- 1.13 ABF / high-layer package substrates · 10 companies
- 1.14 Substrate materials · 5 companies
- 1.15 Glass-core substrates (emerging) · 6 companies
- 1.16 Interposers, silicon bridges, RDL · 4 companies
- 1.17 Chip-level thermal: lids, heat spreaders, TIMs · 9 companies
- 1.18 Semiconductor test & burn-in · 9 companies
- 1.19 Fab equipment (upstream) · 8 companies
- 1.20 Fab materials, masks, gases (upstream) · 21 companies
- Photoresist · 5
- Masks and blanks · 4
- CMP and chemicals · 6
- Sputtering targets · 2
- Gases · 4
Layer 2 — Memory & storage
- 2.01 HBM (HBM3E, HBM4) · 6 companiesconstrained
- 2.02 DRAM (DDR5 RDIMM/MRDIMM, LPDDR5X for Grace) · 6 companies
- 2.03 Memory modules · 7 companies
- 2.04 Memory interface / buffer chips (RCD, DB, MRCD/MDB) · 3 companies
- 2.05 CXL controllers & memory expanders · 8 companies
- 2.06 PCIe/CXL switches & retimers · 5 companies
- 2.07 NAND flash · 6 companies
- 2.08 Enterprise SSDs & controllers · 15 companies
- Drives · 8
- Controllers · 7
- 2.09 HDD (nearline / object tiers) · 3 companies
- 2.10 AI storage systems (parallel file systems, object, GPU-direct) · 14 companies
Layer 3 — Networking & interconnect
- 3.01 Scale-up fabric (GPU-to-GPU inside the rack/pod) · 6 companies
- 3.02 Scale-out switch ASICs · 5 companies
- 3.03 Switch systems & white-box ODMs · 13 companies
- 3.04 Optical transceivers (400G / 800G / 1.6T) · 15 companies
- 3.05 Optics contract manufacturing · 5 companies
- 3.06 Lasers (EML, CW/DFB, VCSEL) · 8 companies
- 3.07 Optical DSPs, drivers, TIAs · 7 companies
- Drivers and TIAs · 3
- 3.08 Silicon photonics & co-packaged optics (CPO) · 18 companies
- 3.09 Copper: DAC / ACC / AEC cables · 13 companies
- 3.10 NVLink copper spine / backplane cartridges · 5 companies
- 3.11 Fiber, connectors, structured cabling · 15 companies
- 3.12 DCI / coherent optics (campus-to-campus, metro) · 9 companies
- 3.13 Timing & telemetry silicon · 5 companies
Layer 4 — Servers, racks & integration
- 4.01 Rack-scale systems (NVL72-class, MI400 Helios-class) · 23 companies
- 4.02 EMS, system integration & rack-level test · 14 companies
- Rack test · 2
- 4.03 GPU baseboards & compute trays (HGX, Bianca, UBB/OAM) · 8 companies
- 4.04 Motherboards, CPU trays, switch trays · 5 companies
- 4.05 High-layer-count PCBs (HDI, backdrilled, 20–40 layers) · 15 companies
- 4.06 Copper-clad laminate & PCB materials · 14 companies
- Copper foil · 3
- Low-Dk glass cloth · 2
- 4.07 Board-level connectors & sockets · 15 companies
- OSFP/QSFP cages · 3
- 4.08 Board-level power: VRMs, power stages, PoL, power semis · 17 companies
- GaN and SiC · 5
- 4.09 Passives (MLCC, inductors, polymer/tantalum, resistors) · 12 companiestight
- 4.10 BMC & platform firmware · 6 companies
- 4.11 Timing, security & misc board silicon · 7 companies
- 4.12 Power shelves & PSUs (33 kW-class ORV3 shelves, rack-level) · 17 companies
- 4.13 Fans (air-cooled servers, hybrid trays) · 8 companies
- 4.14 Chassis, rails, rack enclosures · 13 companies
- Enclosures · 8
- 4.15 In-rack busbar & power whips · 6 companies
- 4.16 Rack PDUs · 9 companies
- 4.17 Air-cooled heatsinks & vapor chambers · 9 companies
Layer 5 — Liquid cooling (IT-side: chip to CDU)
- 5.01 Direct-to-chip cold plates · 21 companies
- 5.02 Rack manifolds (CDMs) · 11 companies
- 5.03 Quick disconnects (UQD / UQDB) · 7 companies
- 5.04 Hoses, tubing, fittings, valves · 9 companies
- 5.05 Coolant distribution units (in-rack, in-row, 1–2.5 MW+ facility units) · 24 companies
- 5.06 CDU internals: plate heat exchangers, pumps, filters · 13 companies
- Pumps · 5
- Filtration · 3
- 5.07 Rear-door heat exchangers · 8 companies
- 5.08 Immersion cooling systems · 9 companies
- 5.09 Fluids & coolant treatment · 16 companies
- 5.10 Leak detection, flow & pressure sensing · 10 companies
- 5.11 Rack/row cooling controls & software · 5 companies
Layer 6 — Facility cooling & HVAC
- 6.01 Chillers & compressors · 18 companies
- Compressors · 5
- 6.02 Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors · 21 companies
- Fans and motors · 9
- 6.03 CRAH / CRAC / fan walls / in-row units · 16 companies
- 6.04 Air handling, economizers, filtration · 10 companies
- 6.05 Facility water loop hardware (pumps, valves, piping, heat exchangers, tanks) · 26 companies
- Pumps · 6
- Valves and actuators · 9
- Piping · 5
- Plate HX · 4
- Tanks and thermal storage · 2
- 6.06 Water treatment, reuse, consumption · 9 companies
- 6.07 Heat reuse & district heating interfaces · 10 companies
- 6.08 Building management, controls, environmental sensors · 22 companies
- PLCs · 5
- Sensors · 4
- AI-driven cooling control · 3
- 6.09 Fire detection & suppression · 16 companies
- Detection · 7
- Suppression · 6
- Agents · 3
Layer 7 — Electrical: power distribution (grid to rack)
- 7.01 Large power transformers (345–765 kV) & substations · 18 companiesconstrained
- 7.02 HV switchgear, GIS, breakers, protection relays · 21 companies
- 7.03 MV switchgear, E-houses, power skids · 12 companies
- 7.04 MV/LV transformers (pad-mount, dry-type, cast-resin) · 18 companies
- 7.05 LV switchgear, switchboards, panelboards · 10 companies
- 7.06 Busway / busbar trunking · 10 companies
- 7.07 Floor PDUs, RPPs, static transfer switches, ATS · 12 companies
- 7.08 Circuit protection, fuses, surge, grounding · 10 companies
- 7.09 LV cable, wire, tray, raceway · 18 companies
- 7.10 UPS (static, modular, rotary/DRUPS) & UPS power semis · 24 companies
- 7.11 Energy storage: UPS batteries & BESS · 28 companies
- Li-ion for UPS · 7
- NiZn · 1
- VRLA · 3
- Sodium-ion · 2
- Grid-scale BESS · 10
- PCS and inverters · 5
- 7.12 Power smoothing / supercapacitors (GPU load-swing mitigation) · 5 companies
- 7.13 Backup generation: gensets, fuel systems, HVO · 20 companies
- Day tanks and fuel systems · 2
- Aftertreatment · 2
- HVO · 2
- Rental fleets · 4
- 7.14 Paralleling switchgear & generator controls · 10 companies
- 7.15 Metering, power quality, monitoring · 13 companies
- 7.16 800 V DC architecture & solid-state transformers (Rubin / Kyber era) · 23 companies
- SSTs (emerging) · 5
Layer 8 — Power generation & energy supply
- 8.01 Gas turbines (onsite / behind-the-meter) & HRSGs · 12 companiesconstrained
- HRSGs · 3
- 8.02 Reciprocating engines & engine microgrids · 13 companies
- 8.03 Fuel cells · 6 companies
- 8.04 Nuclear: existing fleet PPAs & restarts · 13 companies
- 8.05 SMRs, advanced reactors, components, fuel · 40 companies
- Developers · 19
- Components · 7
- Fuel and enrichment · 7
- Uranium · 7
- 8.06 Fusion (long-dated PPAs) · 9 companies
- 8.07 Utilities, IPPs & power providers signing data-center deals · 52 companies
- 8.08 Renewables & long-duration storage hardware · 36 companies
- 8.09 Transmission, interconnection & grid equipment · 54 companies
- 8.10 Gas supply chain (for onsite generation) · 33 companies
Layer 9 — Building shell, site & construction
- 9.01 Data center developers, operators & REITs · 69 companies
- 9.02 Hyperscalers, neoclouds & model labs (the tenants and owners) · 35 companies
- 9.03 Architecture, engineering & MEP design · 30 companies
- 9.04 General contractors & design-build · 60 companies
- 9.05 MEP & electrical contractors (self-perform) · 25 companies
- 9.06 Structure, steel, precast, envelope, site equipment · 45 companies
- Steel · 7
- Precast · 7
- Cement and aggregates · 9
- Envelope · 6
- Raised floor · 2
- Doors and hardware · 3
- Site and civil · 3
- Equipment and rental · 8
- 9.07 Prefab / modular data centers & power/cooling skids · 19 companies
- 9.08 Site utilities, water & fiber entrance · 25 companies
- 9.09 Physical security & access · 22 companies
- 9.10 Testing, commissioning & certification · 21 companies
- Cx agents · 5
- Load banks · 5
- Test equipment · 5
- Certification and standards · 6
Layer 10 — Materials & upstream inputs
- 10.01 Copper (busbars, cable, cold plates, transformer windings) · 23 companies
- Miners · 13
- Refining and products · 10
- 10.02 Aluminum (heat sinks, cable, structures) · 10 companies
- 10.03 Grain-oriented electrical steel & amorphous cores (transformers) · 9 companiestight
- 10.04 Rare earths & permanent magnets (fans, motors, gensets, wind) · 15 companies
- 10.05 Specialty glass & glass fiber (optical fiber, T-glass, glass cores) · 8 companies
- 10.06 Refrigerants & insulating gases · 6 companies
- SF6 alternatives · 0
- 10.07 Industrial & specialty gases (fabs, lasers, suppression) · 6 companies
- 10.08 Critical minerals: gallium, germanium, indium, tungsten, beryllium · 7 companies
Layer 11 — Software, tools & services touching the hardware (optional)
- 11.01 DCIM, digital twins, capacity planning · 13 companies
- 11.02 Cluster management & GPU orchestration (out of scope for a parts site; listed for completeness) · 6 companies
- 11.03 Site selection, power procurement, market intelligence, brokerage · 13 companies
- 11.04 Capital & financing (context) · 25 companies
- 11.05 Test & measurement instruments · 11 companies
- 11.06 Robotics, inspection & operations hardware · 4 companies