Parts by facility scale

Two axes drive the bill of materials. Facility size decides which site-level parts exist at all; rack density decides the cooling and power-shelf chain. Dots mark where a part appears; blank cells mean the part is typically absent, not merely smaller.

Edge / micro
0–1 MW
telco huts, retail edge, on-prem containers
Enterprise / small colo
1–10 MW
corporate data centers, regional colocation rooms
Large colo / hyperscale building
10–100 MW
single large buildings, wholesale colocation, cloud regions
AI campus
100–1000 MW
multiple buildings, dedicated substation, liquid cooling standard
GW-class campus
1000+ MW
onsite generation, 345–765 kV interconnection, nuclear or gas PPAs
Partedgeenterprisehyperai campusgw class
Layer 1 — Compute silicon & packaging
Merchant GPUs / accelerators●●●●
Hyperscaler custom ASICs●●●●
ASIC design services, IP & EDA●●●●
Startup accelerators●●●●
Server CPUs●●●●
NICs / SuperNICs●●●●
DPUs●●●●
FPGAs●●●●
Leading-edge foundry●●●●
Silicon wafers●●●●
2.5D/3D advanced packaging●●●●
Packaging & bonding equipment●●●●
ABF / high-layer package substrates●●●●
Substrate materials●●●●
Glass-core substrates●●●●
Interposers, silicon bridges, RDL●●●●
Chip-level thermal: lids, heat spreaders, TIMs●●●●
Semiconductor test & burn-in●●●●
Fab equipment●●●●
Fab materials, masks, gases●●●●
Layer 2 — Memory & storage
HBM●●●●●
DRAM●●●●●
Memory modules●●●●●
Memory interface / buffer chips●●●●●
CXL controllers & memory expanders●●●●
PCIe/CXL switches & retimers●●●●
NAND flash●●●●●
Enterprise SSDs & controllers●●●●●
HDD●●●●
AI storage systems●●●●
Layer 3 — Networking & interconnect
Scale-up fabric●●●
Scale-out switch ASICs●●●
Switch systems & white-box ODMs●●●●
Optical transceivers●●●
Optics contract manufacturing●●●
Lasers●●●
Optical DSPs, drivers, TIAs●●●
Silicon photonics & co-packaged optics●●●
Copper: DAC / ACC / AEC cables●●●
NVLink copper spine / backplane cartridges●●●
Fiber, connectors, structured cabling●●●
DCI / coherent optics●●
Timing & telemetry silicon●●●
Layer 4 — Servers, racks & integration
Rack-scale systems●●●
EMS, system integration & rack-level test●●●●
GPU baseboards & compute trays●●●●
Motherboards, CPU trays, switch trays●●●●
High-layer-count PCBs●●●●
Copper-clad laminate & PCB materials●●●●
Board-level connectors & sockets●●●●
Board-level power: VRMs, power stages, PoL, power semis●●●●
Passives●●●●
BMC & platform firmware●●●●
Timing, security & misc board silicon●●●●
Power shelves & PSUs●●●
Fans●●●●
Chassis, rails, rack enclosures●●●●
In-rack busbar & power whips●●●●
Rack PDUs●●●●
Air-cooled heatsinks & vapor chambers●●●●
Layer 5 — Liquid cooling (IT-side: chip to CDU)
Direct-to-chip cold plates●●●●
Rack manifolds●●●●
Quick disconnects●●●●
Hoses, tubing, fittings, valves●●●●
Coolant distribution units●●●●
CDU internals: plate heat exchangers, pumps, filters●●●●
Rear-door heat exchangers●●
Immersion cooling systems●●●
Fluids & coolant treatment●●●●
Leak detection, flow & pressure sensing●●●●
Rack/row cooling controls & software●●●●
Layer 6 — Facility cooling & HVAC
Chillers & compressors●●●●
Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors●●●●
CRAH / CRAC / fan walls / in-row units●●●●
Air handling, economizers, filtration●●●●
Facility water loop hardware●●●●
Water treatment, reuse, consumption●●●●
Heat reuse & district heating interfaces●●●
Building management, controls, environmental sensors●●●●
Fire detection & suppression●●●●
Layer 7 — Electrical: power distribution (grid to rack)
Large power transformers (345–765 kV) & substations●●
HV switchgear, GIS, breakers, protection relays●●
MV switchgear, E-houses, power skids●●●
MV/LV transformers●●●●
LV switchgear, switchboards, panelboards●●●●
Busway / busbar trunking●●●
Floor PDUs, RPPs, static transfer switches, ATS●●●●
Circuit protection, fuses, surge, grounding●●●●
LV cable, wire, tray, raceway●●●●
UPS (static, modular, rotary/DRUPS) & UPS power semis●●●●
Energy storage: UPS batteries & BESS●●●●
Power smoothing / supercapacitors●●●
Backup generation: gensets, fuel systems, HVO●●●●
Paralleling switchgear & generator controls●●●
Metering, power quality, monitoring●●●●
800 V DC architecture & solid-state transformers●●
Layer 8 — Power generation & energy supply
Gas turbines (onsite / behind-the-meter) & HRSGs●●
Reciprocating engines & engine microgrids●●●
Fuel cells●●
Nuclear: existing fleet PPAs & restarts●●
SMRs, advanced reactors, components, fuel●●
Fusion●
Utilities, IPPs & power providers signing data-center deals●●●●
Renewables & long-duration storage hardware●●
Transmission, interconnection & grid equipment●●
Gas supply chain●●
Layer 9 — Building shell, site & construction
Data center developers, operators & REITs●●●●●
Hyperscalers, neoclouds & model labs●●●
Architecture, engineering & MEP design●●●●
General contractors & design-build●●●●
MEP & electrical contractors●●●●
Structure, steel, precast, envelope, site equipment●●●●
Prefab / modular data centers & power/cooling skids●●●
Site utilities, water & fiber entrance●●●●
Physical security & access●●●●●
Testing, commissioning & certification●●●●
Layer 10 — Materials & upstream inputs
Copper●●●●●
Aluminum●●●●●
Grain-oriented electrical steel & amorphous cores●●●●
Rare earths & permanent magnets●●●●●
Specialty glass & glass fiber●●●●●
Refrigerants & insulating gases●●●●
Industrial & specialty gases●●●●●
Critical minerals: gallium, germanium, indium, tungsten, beryllium●●●●●
Layer 11 — Software, tools & services touching the hardware (optional)
DCIM, digital twins, capacity planning●●●●
Cluster management & GPU orchestration●●●●
Site selection, power procurement, market intelligence, brokerage●●●●
Capital & financing●●●●
Test & measurement instruments●●●●
Robotics, inspection & operations hardware●●●●