Parts by facility scale

Two axes drive the bill of materials. Facility size decides which site-level parts exist at all; rack density decides the cooling and power-shelf chain. Dots mark where a part appears; blank cells mean the part is typically absent, not merely smaller.

Cooling density:

Part	edge	enterprise	hyper	ai campus	gw class
Layer 1 — Compute silicon & packaging
Merchant GPUs / accelerators		●	●	●	●
Hyperscaler custom ASICs		●	●	●	●
ASIC design services, IP & EDA		●	●	●	●
Startup accelerators		●	●	●	●
Server CPUs		●	●	●	●
NICs / SuperNICs		●	●	●	●
DPUs		●	●	●	●
FPGAs		●	●	●	●
Leading-edge foundry		●	●	●	●
Silicon wafers		●	●	●	●
2.5D/3D advanced packaging		●	●	●	●
Packaging & bonding equipment		●	●	●	●
ABF / high-layer package substrates		●	●	●	●
Substrate materials		●	●	●	●
Glass-core substrates		●	●	●	●
Interposers, silicon bridges, RDL		●	●	●	●
Chip-level thermal: lids, heat spreaders, TIMs		●	●	●	●
Semiconductor test & burn-in		●	●	●	●
Fab equipment		●	●	●	●
Fab materials, masks, gases		●	●	●	●
Layer 2 — Memory & storage
HBM	●	●	●	●	●
DRAM	●	●	●	●	●
Memory modules	●	●	●	●	●
Memory interface / buffer chips	●	●	●	●	●
CXL controllers & memory expanders		●	●	●	●
PCIe/CXL switches & retimers		●	●	●	●
NAND flash	●	●	●	●	●
Enterprise SSDs & controllers	●	●	●	●	●
HDD		●	●	●	●
AI storage systems		●	●	●	●
Layer 3 — Networking & interconnect
Scale-up fabric			●	●	●
Scale-out switch ASICs			●	●	●
Switch systems & white-box ODMs		●	●	●	●
Optical transceivers			●	●	●
Optics contract manufacturing			●	●	●
Lasers			●	●	●
Optical DSPs, drivers, TIAs			●	●	●
Silicon photonics & co-packaged optics			●	●	●
Copper: DAC / ACC / AEC cables			●	●	●
NVLink copper spine / backplane cartridges			●	●	●
Fiber, connectors, structured cabling			●	●	●
DCI / coherent optics				●	●
Timing & telemetry silicon			●	●	●
Layer 4 — Servers, racks & integration
Rack-scale systems			●	●	●
EMS, system integration & rack-level test		●	●	●	●
GPU baseboards & compute trays		●	●	●	●
Motherboards, CPU trays, switch trays		●	●	●	●
High-layer-count PCBs		●	●	●	●
Copper-clad laminate & PCB materials		●	●	●	●
Board-level connectors & sockets		●	●	●	●
Board-level power: VRMs, power stages, PoL, power semis		●	●	●	●
Passives		●	●	●	●
BMC & platform firmware		●	●	●	●
Timing, security & misc board silicon		●	●	●	●
Power shelves & PSUs			●	●	●
Fans		●	●	●	●
Chassis, rails, rack enclosures		●	●	●	●
In-rack busbar & power whips		●	●	●	●
Rack PDUs		●	●	●	●
Air-cooled heatsinks & vapor chambers		●	●	●	●
Layer 5 — Liquid cooling (IT-side: chip to CDU)
Direct-to-chip cold plates		●	●	●	●
Rack manifolds		●	●	●	●
Quick disconnects		●	●	●	●
Hoses, tubing, fittings, valves		●	●	●	●
Coolant distribution units		●	●	●	●
CDU internals: plate heat exchangers, pumps, filters		●	●	●	●
Rear-door heat exchangers		●	●
Immersion cooling systems		●	●	●
Fluids & coolant treatment		●	●	●	●
Leak detection, flow & pressure sensing		●	●	●	●
Rack/row cooling controls & software		●	●	●	●
Layer 6 — Facility cooling & HVAC
Chillers & compressors		●	●	●	●
Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors		●	●	●	●
CRAH / CRAC / fan walls / in-row units		●	●	●	●
Air handling, economizers, filtration		●	●	●	●
Facility water loop hardware		●	●	●	●
Water treatment, reuse, consumption		●	●	●	●
Heat reuse & district heating interfaces			●	●	●
Building management, controls, environmental sensors		●	●	●	●
Fire detection & suppression		●	●	●	●
Layer 7 — Electrical: power distribution (grid to rack)
Large power transformers (345–765 kV) & substations				●	●
HV switchgear, GIS, breakers, protection relays				●	●
MV switchgear, E-houses, power skids			●	●	●
MV/LV transformers		●	●	●	●
LV switchgear, switchboards, panelboards		●	●	●	●
Busway / busbar trunking			●	●	●
Floor PDUs, RPPs, static transfer switches, ATS		●	●	●	●
Circuit protection, fuses, surge, grounding		●	●	●	●
LV cable, wire, tray, raceway		●	●	●	●
UPS (static, modular, rotary/DRUPS) & UPS power semis		●	●	●	●
Energy storage: UPS batteries & BESS		●	●	●	●
Power smoothing / supercapacitors			●	●	●
Backup generation: gensets, fuel systems, HVO		●	●	●	●
Paralleling switchgear & generator controls			●	●	●
Metering, power quality, monitoring		●	●	●	●
800 V DC architecture & solid-state transformers				●	●
Layer 8 — Power generation & energy supply
Gas turbines (onsite / behind-the-meter) & HRSGs				●	●
Reciprocating engines & engine microgrids			●	●	●
Fuel cells			●	●
Nuclear: existing fleet PPAs & restarts				●	●
SMRs, advanced reactors, components, fuel				●	●
Fusion					●
Utilities, IPPs & power providers signing data-center deals		●	●	●	●
Renewables & long-duration storage hardware				●	●
Transmission, interconnection & grid equipment				●	●
Gas supply chain				●	●
Layer 9 — Building shell, site & construction
Data center developers, operators & REITs	●	●	●	●	●
Hyperscalers, neoclouds & model labs			●	●	●
Architecture, engineering & MEP design		●	●	●	●
General contractors & design-build		●	●	●	●
MEP & electrical contractors		●	●	●	●
Structure, steel, precast, envelope, site equipment		●	●	●	●
Prefab / modular data centers & power/cooling skids			●	●	●
Site utilities, water & fiber entrance		●	●	●	●
Physical security & access	●	●	●	●	●
Testing, commissioning & certification		●	●	●	●
Layer 10 — Materials & upstream inputs
Copper	●	●	●	●	●
Aluminum	●	●	●	●	●
Grain-oriented electrical steel & amorphous cores		●	●	●	●
Rare earths & permanent magnets	●	●	●	●	●
Specialty glass & glass fiber	●	●	●	●	●
Refrigerants & insulating gases		●	●	●	●
Industrial & specialty gases	●	●	●	●	●
Critical minerals: gallium, germanium, indium, tungsten, beryllium	●	●	●	●	●
Layer 11 — Software, tools & services touching the hardware (optional)
DCIM, digital twins, capacity planning		●	●	●	●
Cluster management & GPU orchestration		●	●	●	●
Site selection, power procurement, market intelligence, brokerage		●	●	●	●
Capital & financing		●	●	●	●
Test & measurement instruments		●	●	●	●
Robotics, inspection & operations hardware		●	●	●	●