# AI Data Center Parts

> Every physical part of an AI data center, and the companies that make each one. A parts-first catalog: 130 part categories in 11 layers,
> 1199 companies, 1864 part-company placements, each tagged with a confidence level
> (disclosed / reported / inferred). Prices are nightly snapshots, never real-time.

Stable identifiers:
- Parts use taxonomy numbers as IDs (e.g. 5.01 = direct-to-chip cold plates; children append a letter, 6.05a).
- Companies use kebab-case slugs (e.g. schneider-electric, tsmc).
- Every part page: https://ai-dc-parts.pages.dev/parts/<layer-slug>/<part-slug> — append .md for Markdown; JSON at https://ai-dc-parts.pages.dev/api/parts/<id>.json
- Every company page: https://ai-dc-parts.pages.dev/companies/<slug> — append .md for Markdown; JSON at https://ai-dc-parts.pages.dev/api/companies/<id>.json
- Full catalog as SQLite: https://ai-dc-parts.pages.dev/data/catalog.sqlite
- Whole catalog as one plain-text file: https://ai-dc-parts.pages.dev/llms-full.txt

Key pages:
- https://ai-dc-parts.pages.dev/parts — the full part tree by layer
- https://ai-dc-parts.pages.dev/companies — the company index
- https://ai-dc-parts.pages.dev/teardowns/gb300-nvl72 — GB300 NVL72 rack teardown
- https://ai-dc-parts.pages.dev/how-it-fits-together — the power/heat/data/shell chains
- https://ai-dc-parts.pages.dev/scales — parts × facility-scale matrix
- https://ai-dc-parts.pages.dev/bottlenecks — parts with sourced supply constraints
- https://ai-dc-parts.pages.dev/sources-and-method — provenance and confidence tags

Layers:
- Layer 1: Compute silicon & packaging (https://ai-dc-parts.pages.dev/parts/compute-silicon-and-packaging)
- Layer 2: Memory & storage (https://ai-dc-parts.pages.dev/parts/memory-and-storage)
- Layer 3: Networking & interconnect (https://ai-dc-parts.pages.dev/parts/networking-and-interconnect)
- Layer 4: Servers, racks & integration (https://ai-dc-parts.pages.dev/parts/servers-racks-and-integration)
- Layer 5: Liquid cooling (IT-side: chip to CDU) (https://ai-dc-parts.pages.dev/parts/liquid-cooling-it-side-chip-to-cdu)
- Layer 6: Facility cooling & HVAC (https://ai-dc-parts.pages.dev/parts/facility-cooling-and-hvac)
- Layer 7: Electrical: power distribution (grid to rack) (https://ai-dc-parts.pages.dev/parts/electrical-power-distribution-grid-to-rack)
- Layer 8: Power generation & energy supply (https://ai-dc-parts.pages.dev/parts/power-generation-and-energy-supply)
- Layer 9: Building shell, site & construction (https://ai-dc-parts.pages.dev/parts/building-shell-site-and-construction)
- Layer 10: Materials & upstream inputs (https://ai-dc-parts.pages.dev/parts/materials-and-upstream-inputs)
- Layer 11: Software, tools & services touching the hardware (optional) (https://ai-dc-parts.pages.dev/parts/software-tools-and-services-touching-the-hardware-optional)

Citation guidance: placements tagged "reported" come from trade press or partner lists; "inferred" are
uncited leads from the taxonomy seed. Only "disclosed" rows carry a primary source. Do not present
reported/inferred placements as confirmed supplier relationships.