Who makes direct-to-chip cold plates for AI data centers
A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
The cold plate is the first thermal interface in the loop: coolant enters through a quick disconnect, flows across channels machined or etched into the plate above the silicon, and exits carrying the heat toward the rack manifold. Every accelerator, CPU, and switch die on a liquid-cooled tray gets its own plate, so the part is qualified against a specific chip package and reference design rather than sold as a generic component. That qualification tie is the main structural feature investors should track: a plate design that wins a reference socket tends to stay for the life of that platform, and switching vendors mid-cycle means re-validating thermal performance against the die. AI GPUs run hotter and denser than prior server chips, which is why liquid cold plates displaced air heatsinks as the default rather than an option, and why two-phase and microfluidic variants are being developed for the next step up in power density. Some rack integrators build cold plates in-house for their own designs, which narrows the market available to independent cold-plate makers even as unit volume grows. Watch for supplier concentration at the top GPU platforms and how much of the volume in-house integrators keep for themselves versus outsource.
AI delta: Rising per-die power density pushed liquid cold plates from a niche option to the default thermal interface on AI accelerator packages, direct-to-chip cooling being the entry point for the two-phase and microfluidic variants under development for the next density step.
Companies on this part (15)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Auras | manufacturer | public | 3324.TWO | 1360 TWD | +0.4% | inferred | |
| AVC | manufacturer | public | 3017.TW | 3145 TWD | -2.8% | inferred | |
| Delta Electronics | manufacturer | public | 2308.TW | 1560 TWD | -3.4% | inferred | |
| Flex | manufacturer | public | FLEX | 76.55 USD | -0.2% | inferred | |
| Fositek | manufacturer | public | 6805.TW | 2335 TWD | -2.5% | reported | |
| Foxconn (Hon Hai) | in house | public | 2317.TW | 245 TWD | -1.6% | inferred | in-house for their own racks |
| Jentech | manufacturer | public | 3653.TW | 6070 TWD | -7.3% | inferred | |
| Kaori | manufacturer | public | 8996.TW | 1560 TWD | -7.4% | inferred | |
| Lotes | manufacturer | public | 3533.TW | 1795 TWD | -1.9% | reported | |
| Nidec | manufacturer | public | 6594.T | 1705 JPY | -0.5% | inferred | |
| Vertiv | manufacturer | public | VRT | 194 USD | -0.2% | inferred | |
| Wiwynn · unit of Wistron | in house | public | 6669.TW | 1840 TWD | -2.6% | inferred | |
| Boyd | manufacturer | private | disclosed | · source | |||
| Cooler Master | manufacturer | private | inferred | ||||
| CoolIT | manufacturer | private | disclosed | · source |
Two-phase and microfluidic 5.01a
Who competes here
The same table read the other way: every company above competes for direct-to-chip cold plates sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Seen in real machines
direct-to-chip cold plates is named in 13 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine. The companies shown are the ones named on that line, not necessarily the maker of this part.
- Nvidia GB300 NVL72 · rack teardown
- Cold plates (GPU, CPU, NVSwitch) — CoolIT, Boyd, Cooler Master, AVC, Auras, Delta Electronics, Jentech
- El Capitan · supercomputer
- In-cabinet liquid cooling (100% fanless direct liquid cooling, 29 coolant distribution units) — HPE
- Frontier · supercomputer
- In-cabinet liquid cooling (direct cold plates on all node components, shared coolant distribution units; 25 CDUs, each serving three cabinets) — HPE
- Aurora · supercomputer
- In-cabinet liquid cooling (cold plates, manifolds, quick-disconnect blades, one CDU per up to four cabinets, facility water up to 32 C) — HPE
- JUPITER · supercomputer
- Rack-level cooling (BullSequana XH3000 direct liquid cooling on warm water, 37-47 C circulating) — Eviden/Atos
- LUMI · supercomputer
- In-cabinet direct liquid cooling (cabinet cooling manifolds, quick-connect blades and a coolant distribution unit for the Cray EX cabinets) — HPE
- Leonardo · supercomputer
- In-cabinet liquid cooling (XH2000 direct liquid cooling on warm water: cold plate on every 1U blade, hydraulic chassis with heat exchanger, secondary manifolds, non-spill quick disconnects) — Eviden/Atos
- Isambard-AI · supercomputer
- In-cabinet direct liquid cooling (cold plates on compute and network blades, dripless quick connects, coolant distribution units serving up to four cabinets each, up to 400 kW per cabinet) — HPE
- Perlmutter · supercomputer
- In-cabinet direct liquid cooling (cold plates on the compute blades, liquid-cooled switch blades and ports, coolant distribution units) — HPE
- Fugaku · supercomputer
- MareNostrum 5 · supercomputer
- In-rack liquid cooling and rear-door cooling (direct liquid cooling on a 32-42 C warm-water circuit, rear-door cold doors on a 17-27 C circuit) — Eviden/Atos, Lenovo
- Horizon · supercomputer
- Rack and rear-door liquid cooling (direct liquid cooling in the racks, 28 rear doors, 7 coolant distribution units, PG-25 coolant) — Dell
- Doudna (NERSC-10) · supercomputer
- Direct liquid cooling (Dell ORv3 direct-liquid-cooled server technology) — Dell
Nearby parts
- Children: Two-phase and microfluidic
- Next in layer: Rack manifolds
- Layer: Layer 5 — Liquid cooling (IT-side: chip to CDU)
From the blog
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- Interview: TI sees liquid cooling shift to tray-level control in AI data centers — DigiTimes, 2026-10-23Texas Instruments stated that the trend in AI data centers is moving toward granular, tray-level thermal control rather than relying solely on centralized CDU management.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The design of future AI infrastructure will require integrating advanced compute, cooling, and power elements from various parts of the supply chain.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The article discusses future data center designs for AI infrastructure, touching on cooling, power, and overall planning.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The article discusses anticipated design principles for future AI infrastructure, focusing on elements like advanced compute components and specialized cooling/interconnect features.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22Effective real-world AI application requires improvements across faster compute, wider memory bandwidth, higher-performance networking, better storage, and more stable power infrastructure.
- Nvidia launches DSX POD, claims the Vera-Rubin reference architecture will make AI data centers more water and energy efficient — Data Center Dynamics, 2026-10-21Nvidia announced the DSX POD, claiming the Vera-Rubin reference architecture will improve the water and energy efficiency of AI data centers.
- Qisda integrates four companies to build scalable rack-scale AI solutions — DigiTimes, 2026-10-21Qisda Group is forming a consortium of four companies to build scalable rack-level AI solutions integrating high-speed connectivity, modular compute, and liquid cooling.
- SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor — DigiTimes, 2026-10-21The rapid scaling of AI infrastructure is being constrained by the availability of electrical capacity, cooling solutions, and necessary compute hardware.
- xMems solid-state cooling chips for data centers and Edge devices go into production — Data Center Dynamics, 2026-10-20xMems has started manufacturing solid-state cooling chips designed for data centers and edge devices.
- Building Physical AI Systems That Can Work in the Real World — EE Times, 2026-10-20The article discusses the need for holistic system architecture that balances compute, power, and safety when building physical AI systems, suggesting this approach is more critical than just model size.
Questions about direct-to-chip cold plates
- What are direct-to-chip cold plates?
- A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
- Which companies make direct-to-chip cold plates for AI data centers?
- This catalog lists 15 companies on Direct-to-chip cold plates, 12 of them with listed equity: Auras, AVC, Delta Electronics, Flex, Fositek, Foxconn (Hon Hai), Jentech, Kaori, Lotes, Nidec, and 5 more.
- How does AI change demand for direct-to-chip cold plates?
- Rising per-die power density pushed liquid cold plates from a niche option to the default thermal interface on AI accelerator packages, direct-to-chip cooling being the entry point for the two-phase and microfluidic variants under development for the next density step.
- How reliable are these direct-to-chip cold plates supplier placements?
- The 15 placements on this part break down as 2 disclosed, 2 reported, 11 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a taxonomy lead with no citation yet.
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON