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GB300 NVL72: every supplier in the rack

Supplier placements marked reported come from reference-design partner lists and trade press, not company disclosures. Unmarked placements are inferred from the taxonomy seed. This is a map of who plays where, not a confirmed bill of materials.

  1. Rack architecture and reference design
    Rack-scale systems 4.01
    Nvidia (NVDA)
  2. Rack integration, ODM and OEM badge
    Rack-scale systems 4.01 · EMS, system integration & rack-level test 4.02
    Quanta Computer, Wiwynn, Inventec, Pegatron, Supermicro, Dell, HPE, Lenovo, Cisco, Gigabyte, ASUS · Foxconn/Ingrasys, ZT/Sanmina
  3. 18× compute trays (Bianca board: 2× Grace + 4× B300)
    GPU baseboards & compute trays 4.03
    Nvidia, Quanta Computer, Wistron, Wiwynn, Inventec · Foxconn/Ingrasys
  4. 9× NVLink switch trays (2× NVSwitch each)
    Scale-up fabric 3.01 · Motherboards, CPU trays, switch trays 4.04
    Nvidia · ODMs
  5. NVLink copper spine and backplane cartridges (~5,000 cables)
    NVLink copper spine / backplane cartridges 3.10
    Amphenol*, TE Connectivity*, Foxconn Interconnect*, Luxshare*, Bizlink*
  6. B300 GPU die and CoWoS-L package
    Merchant GPUs / accelerators 1.01 · Leading-edge foundry 1.09 · 2.5D/3D advanced packaging 1.11
    TSMC, Amkor · overflow back-end at ASE/SPIL
  7. HBM3E (288 GB per GPU)
    HBM 2.01
    SK Hynix, Micron, Samsung Electronics (qualification status varies)
  8. Grace CPU and LPDDR5X
    Server CPUs 1.05 · DRAM 2.02
    Micron, Samsung Electronics, SK Hynix · Nvidia/Arm on TSMC
  9. ABF substrate
    ABF / high-layer package substrates 1.13 · Substrate materials 1.14
    Ibiden, Unimicron · ABF film Ajinomoto, T-glass Nittobo
  10. Lids and TIMs
    Chip-level thermal: lids, heat spreaders, TIMs 1.17
    Jentech, Indium, Honeywell
  11. Compute-tray PCB
    High-layer-count PCBs 4.05 · Copper-clad laminate & PCB materials 4.06
    WUS, Victory Giant, Shennan, Unimicron, Tripod, Panasonic · GCE, laminate Elite Material, TUC
  12. Sockets and board connectors
    Board-level connectors & sockets 4.07
    Lotes, Foxconn Interconnect, TE Connectivity, Amphenol, Molex, Samtec
  13. VRMs and power stages
    Board-level power: VRMs, power stages, PoL, power semis 4.08
    Monolithic Power Systems, Infineon, Renesas, Vicor*
  14. MLCCs and inductors
    Passives 4.09
    Murata, Samsung Electro-Mechanics, TDK, Taiyo Yuden, Yageo, Chilisin
  15. BMC and firmware
    BMC & platform firmware 4.10
    Aspeed, AMI
  16. ConnectX-8 SuperNICs, BlueField-3 DPUs
    NICs / SuperNICs 1.06 · DPUs 1.07
    Nvidia
  17. 800G / 1.6T OSFP transceivers (scale-out)
    Optical transceivers 3.04 · Optics contract manufacturing 3.05 · Lasers 3.06 · Optical DSPs, drivers, TIAs 3.07
    Innolight, Eoptolink, Coherent, Fabrinet (Nvidia-branded), Applied Optoelectronics, Lumentum, Coherent, Marvell, Broadcom
  18. DAC / ACC / AEC cables
    Copper: DAC / ACC / AEC cables 3.09
    Amphenol, TE Connectivity, Bizlink, Luxshare, Credo
  19. E1.S NVMe SSDs
    Enterprise SSDs & controllers 2.08
    Samsung Electronics, Kioxia, Micron, SK Hynix, SanDisk
  20. Cold plates (GPU, CPU, NVSwitch)
    Direct-to-chip cold plates 5.01
    CoolIT, Boyd, Cooler Master, AVC, Auras, Delta Electronics, Jentech · Foxconn and Wiwynn
  21. Rack manifolds
    Rack manifolds 5.02
    CoolIT, Boyd, nVent, Vertiv, Kaori, AVC, Auras
  22. Quick disconnects
    Quick disconnects 5.03
    Stäubli, Parker Hannifin, Danfoss, Fositek* · CPC (Dover)
  23. Hoses and fittings
    Hoses, tubing, fittings, valves 5.04
    Parker Hannifin, Danfoss, Swagelok
  24. CDU (in-rack or in-row)
    Coolant distribution units 5.05
    Vertiv, Motivair (Schneider), CoolIT, nVent, Boyd, Delta Electronics, Nidec, Supermicro (own), Foxconn (Hon Hai), Auras
  25. CDU heat exchangers and pumps
    CDU internals: plate heat exchangers, pumps, filters 5.06
    Alfa Laval, SWEP, Kaori, Grundfos, Xylem, Wilo, Iwaki
  26. Coolant (PG25) and treatment
    Fluids & coolant treatment 5.09
    Dow, BASF, Ecolab (Nalco), ChemTreat, Kurita
  27. Leak detection
    Leak detection, flow & pressure sensing 5.10
    TTK · nVent RLE, Sensirion and Keyence sensors
  28. Power shelves (33 kW class, ORV3)
    Power shelves & PSUs 4.12
    Delta Electronics, Lite-On, Flex, FSP, AcBel · Chicony
  29. PSU power semis (GaN/SiC)
    Board-level power: VRMs, power stages, PoL, power semis 4.08 · Power shelves & PSUs 4.12
    Navitas, Infineon, Wolfspeed, onsemi, EPC
  30. ±48 V / 1,400 A busbar
    In-rack busbar & power whips 4.15
    Eaton*, Delta Electronics*, Bizlink*, Lite-On*
  31. Rack cabinet, rails, chassis
    Chassis, rails, rack enclosures 4.14
    Chenbro, King Slide, Rittal · Foxconn and Quanta
  32. Tray fans (for non-GPU components)
    Fans 4.13
    Delta Electronics, Nidec, Sunon, AVC
  33. Rack PDU and power whips
    Rack PDUs 4.16 · LV cable, wire, tray, raceway 7.09
    Vertiv, Eaton, Schneider Electric, Legrand, Southwire, Prysmian
  34. Rack-level test and burn-in
    EMS, system integration & rack-level test 4.02 · Semiconductor test & burn-in 1.18
    Chroma, Keysight, Advantest, Teradyne, KYEC

Outside the rack (RPP/PDU, busway, UPS, generator, facility CDU, chillers) — Layers 6–7 — see Layer 6 and Layer 7.