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What TSMC makes for data centers

public · HQ Hsinchu, TW · tsmc.com

TSMC is the pure-play foundry that manufactures essentially every AI accelerator shipping today, and packages them under its 3DFabric platform — CoWoS-S, CoWoS-L and CoWoS-R 2.5D advanced packaging joining GPU dies and HBM stacks on interposers — plus SoIC 3D stacking and the COUPE silicon-photonics platform.

Listing
Taiwan Stock Exchange: 2330.TW· 2420 TWD +0.41% · mkt cap 62.76T TWD0
Also listed: TSM
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
4 parts across 2 layers
No disclosed data-center revenue share on file.

Parts, by layer

Layer 1 — Compute silicon & packaging

PartRoleConfidenceCompetitorsNote
Leading-edge foundrymanufacturerinferredIntel, Samsung Electronicsfor essentially every AI accelerator shipping today
2.5D/3D advanced packagingmanufacturerinferredIntel, Samsung Electronicsdominant and the historical bottleneck
Interposers, silicon bridges, RDLmanufacturerinferredIntel, Samsung Electronics, UMCCoWoS interposers, LSI bridges

Layer 3 — Networking & interconnect

PartRoleConfidenceCompetitorsNote
Silicon photonics & co-packaged opticsmanufacturerinferredBroadcom, GlobalFoundries, Intel, Marvell, Nvidia, Tower SemiconductorCOUPE

Monthly revenue (TWSE/TPEx filing)

MonthRevenue (TWD m)MoMYoY
2026-07467,5815.6%44.7%
2026-06442,6806.2%2404483690.0%
2026-05416,9751.5%1961803721.0%
2026-04410,725-1.1%1544828558.0%
2026-03415,19230.7%1134103440.0%
2026-02317,657-20.8%718911741.0%
2026-01401,25519.8%401255128.0%
2025-12335,004-2.5%3809054272.0%
2025-11343,614-6.5%3474050704.0%
2025-10367,47311.0%3130436902.0%
2025-09330,981-1.4%2762963851.0%
2025-08335,7723.9%2431982931.0%

Disclosed customers

Customer%MetricPeriodFiling
one customer93%receivables2025-12-3120-F
one customer70%revenue2025-12-3120-F

Verification: enriched, last verified 2026-08-27. Sources: www.tsmc.comMarkdown · JSON