What GlobalFoundries makes for data centers
public
GlobalFoundries is a publicly listed company. It appears on 1 part of the AI data center — Silicon photonics & co-packaged optics — in the role of manufacturer. That part sits in Layer 3 — Networking & interconnect. Its shares trade on US exchanges (NYSE/Nasdaq) as GFS.
Listing
US exchanges (NYSE/Nasdaq): GFS· 44.39 USD +3.04% · mkt cap 24.7B USD
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
1 part across 1 layer
No disclosed data-center revenue share on file.
Parts, by layer
Layer 3 — Networking & interconnect
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Silicon photonics & co-packaged optics | manufacturer | disclosed | TSMC, Broadcom, Intel, Marvell, Nvidia, Tower Semiconductor |
Where GlobalFoundries sits in the stack
GlobalFoundries's placements in this catalog cover 1 part, all in layer 3, networking & interconnect. None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- Silicon photonics & co-packaged optics — An approach that integrates optical components directly onto or next to the switch or GPU package, replacing some pluggable transceivers with light routed closer to the silicon.
Closest peers in this catalog
Disclosed customers
Latest feed
- DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge — DigiTimes, 2026-10-19Microsoft's Maia 300 is highlighted as a leader in the 2nm race, while TSMC's US strategy is changing and Intel's EMIB-T packaging is reportedly encountering yield issues.
- Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China — DigiTimes, 2026-10-16The agreement between TSMC and GF suggests that advanced packaging techniques, such as those involving 2.5D/3D integration and interposers, are being applied to mature semiconductor nodes, which impacts the electronics supply chain.
- Japan Offers GlobalFoundries $21B for U.S. Fab Expansion — EE Times, 2026-10-15Japan has proposed a $21 billion investment to support the expansion of GlobalFoundries' U.S. fabrication facility.
- Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem — DigiTimes, 2026-10-15GlobalFoundries has signed a multi-year agreement with TSMC to provide silicon interposer capacity for its CoWoS advanced packaging ecosystem at its Malta facility.
- GlobalFoundries to build and operate two new chip fabs in NY as part of $21bn US-Japan deal — Data Center Dynamics, 2026-10-14GlobalFoundries will construct and operate two new semiconductor fabrication facilities in New York as part of a $21 billion investment agreement with Japan.
- GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET — Tom's Hardware, 2026-10-12GlobalFoundries has announced the development of a 7nm-class FDX Fusion process node using FD-SOI technology, with production slated to begin in 2028.
- Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI — EE Times, 2026-10-09GlobalFoundries is leveraging its FDX fusion technology to support the manufacturing of high-performance silicon for physical AI applications.
- GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap — DigiTimes, 2026-10-09GlobalFoundries has secured a $2 billion deal from TSMC to manufacture interposers, addressing a supply gap in the US semiconductor packaging market.
- GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion — Tom's Hardware, 2026-10-08GlobalFoundries has signed a $2 billion, five-year agreement to manufacture silicon interposers in the United States for TSMC's CoWoS packaging technology.
- GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Tom's Hardware, 2026-10-08GlobalFoundries has announced it will manufacture silicon interposers in the United States to support TSMC's CoWoS advanced packaging technology.
Questions about GlobalFoundries
- What does GlobalFoundries make for AI data centers?
- This catalog places GlobalFoundries on 1 part: Silicon photonics & co-packaged optics (manufacturer).
- Is GlobalFoundries publicly traded?
- Yes — GlobalFoundries is listed on US exchanges (NYSE/Nasdaq) under GFS. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Who else makes silicon photonics & co-packaged optics for AI data centers?
- TSMC, Broadcom, Intel, Marvell, Nvidia and Tower Semiconductor are also placed on Silicon photonics & co-packaged optics in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For GlobalFoundries the mix is 1 disclosed. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.