What Broadcom makes for data centers

Seen in real machines

Broadcom is named in 4 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine.

• Nvidia GB300 NVL72 · rack teardown
  • 800G / 1.6T OSFP transceivers (scale-out)
• AMD Helios (MI455X) · rack teardown
  • Scale-up switch tray (2x Broadcom Tomahawk 6 ASICs per tray, UALink-over-Ethernet, 21.6 TB/s bidirectional per switch)*
• Google TPU7x (Ironwood) · rack teardown
  • TPU7x (Ironwood) ASIC die (co-designed with Broadcom, fabricated on TSMC N3P)* (co-design, SerDes and ASIC implementation)
• Fugaku · supercomputer
  • On-die SerDes, HBM I/O and SRAM IP in the A64FX* (SerDes, HBM I/O and SRAM blocks per a single independent report)

Disclosed customers

Latest feed

• Commentary: Samsung's US 2nm ramp faces no room for error — DigiTimes, 2026-10-20
  Samsung's ability to successfully ramp production of its 2nm process at its US fab is crucial for its foundry recovery and servicing major orders from clients like Tesla and Broadcom.
• Co-Packaged Optics Moves from Promise to Production Planning — EE Times, 2026-10-14
  Major industry players including Meta and Broadcom discussed the roadmap for co-packaged optics (CPO) production and the standardization of the OCI MSA to meet anticipated demand in 2028.
• AI chip competition shifts to data-center efficiency as memory, interconnect limits bite — DigiTimes, 2026-10-14
  The competition in AI chip development is pivoting toward data-center efficiency to overcome scaling limitations in high-bandwidth memory and interconnect speeds.
• Broadcom executive says chipmakers must tackle packaging, power limits together — DigiTimes, 2026-10-14
  A Broadcom executive emphasized that semiconductor manufacturers must simultaneously address advanced packaging challenges and power consumption limits to support next-generation hardware.
• Micas Networks Unveils 3 102.4T Open Ethernet Platforms for AI Factories — HPCwire, 2026-10-12
  Micas Networks has launched three 102.4T Open Ethernet platforms designed for high-scale AI factory interconnects.
• Beijing escalates domestic chip drive with Broadcom audits — DigiTimes, 2026-09-27
  China is increasing its domestic push to replace foreign technology in critical computing infrastructure, focusing on high-speed networking hardware and AI accelerators.
• Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues — DigiTimes, 2026-09-14
  Google Cloud reported that its AI server investments, specifically using its in-house TPUs, have a rapid payback period of less than one year, benefiting ASIC design partners like MediaTek and Broadcom.
• Broadcom says CPO fits scale-out better than scale-up — DigiTimes, 2026-09-03
  Broadcom stated that co-packaged optics is better suited for scale-out networking rather than scale-up, citing potential power savings of up to 70% versus pluggable modules.
• Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028 — DigiTimes, 2026-09-03
  Broadcom outlined that its six XPU customers require 30GW of accelerated compute capacity between fiscal 2027 and 2028, totaling US$350 billion in semiconductor shipments.
• Broadcom's custom AI silicon takes over the income statement as revenue climbs 86% — DigiTimes, 2026-09-03
  Broadcom reported strong third-quarter revenue of US$29.6 billion, with custom AI silicon revenue reaching US$16.7 billion and now exceeding all other product segment sales.