What Huawei makes for data centers
private · HQ Shenzhen, China · huawei.com
Huawei makes networking switch ASICs and switch systems, coherent optics for data center interconnect, and UPS, CRAH, and rear-door heat exchanger equipment for data center cooling and power. It also supplies AI storage systems, prefabricated modular data centers, and solar inverters, and builds its own AI server and cloud infrastructure, primarily for the Chinese and allied markets.
Exposure
11 parts across 7 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 2 — Memory & storage
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| AI storage systems | manufacturer | inferred | Dell, Everpure, HPE, IBM, NetApp, Supermicro |
Layer 3 — Networking & interconnect
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Scale-out switch ASICs | manufacturer | inferred | Broadcom, Cisco, Marvell, Nvidia | |
| Switch systems & white-box ODMs | manufacturer | inferred | Quanta Computer, Accton (Edgecore), Alpha Networks, Arista, Celestica, Cisco | |
| DCI / coherent optics | manufacturer | inferred | Adtran, Ciena, Cisco, Coherent, Lumentum, Marvell |
Layer 5 — Liquid cooling (IT-side: chip to CDU)
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Coolant distribution units | manufacturer | inferred | Auras, Daikin, Delta Electronics, Envicool, Foxconn (Hon Hai), Johnson Controls | |
| Rear-door heat exchangers | manufacturer | inferred | Legrand, Vertiv, nVent, Coolcentric, Motivair, Rittal |
Layer 6 — Facility cooling & HVAC
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| CRAH / CRAC / fan walls / in-row units | manufacturer | inferred | Schneider Electric, Daikin, Envicool, Johnson Controls, Kingspan, Mitsubishi Electric |
Layer 7 — Electrical: power distribution (grid to rack)
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| UPS (static, modular, rotary/DRUPS) & UPS power semis | manufacturer | inferred | Schneider Electric, ABB, Cyber Power, Delta Electronics, Eaton, Fuji Electric |
Layer 8 — Power generation & energy supply
Layer 9 — Building shell, site & construction
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Hyperscalers, neoclouds & model labs | operator | inferred | Alphabet (Google), Microsoft, Alibaba, Amazon (AWS), Apple, Baidu | region: China and Asia |
| Prefab / modular data centers & power/cooling skids | manufacturer | inferred | Schneider Electric, ABB, Delta Electronics, Eaton, Nucor, Powell |
Where Huawei sits in the stack
Huawei's placements in this catalog cover 11 parts, from layer 2 (memory & storage) to layer 9 (building shell, site & construction). None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- AI storage systems — Purpose-built storage software and appliances — parallel file systems, object stores, and GPU-direct pipelines — that aggregate many drives into one system capable of feeding a large number of accelerators at once.
- Scale-out switch ASICs — The switch ASICs that route traffic between racks and pods, distinct from the scale-up fabric inside a single rack.
- Switch systems & white-box ODMs — The physical switches — built by branded vendors and white-box ODMs — that house scale-out switch ASICs and connect racks into a cluster fabric.
- DCI / coherent optics — Coherent optical systems that carry data center interconnect (DCI) traffic between buildings on a campus or between metro sites, distinct from the shorter-reach optics inside a data hall.
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
- and 6 more in the table above.
Closest peers in this catalog
Latest feed
- First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule — DigiTimes, 2026-10-23The US FCC prohibited two electronic devices from entering the US market due to the presence of surveillance chips from Huawei's HiSilicon.
- Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in — DigiTimes, 2026-10-22Nvidia's lead over Huawei in China's AI accelerator market has significantly narrowed according to IDC data for the first half of 2026.
- DeepSeek-Huawei chip co-design could shift AI training away from Nvidia — DigiTimes, 2026-10-20DeepSeek is reportedly collaborating closely with Huawei on future AI chip designs to reduce dependence on Nvidia.
- AI inference is running into a memory bottleneck. Huawei wants to tackle it with OceanStor M900 — The Register, 2026-10-19The Context Memory Storage platform is positioned to enhance the cost-effectiveness of running large-scale AI inference.
- Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking — DigiTimes, 2026-10-16Chinese chip toolmakers are adopting hybrid bonding techniques as Huawei diversifies its technology focus beyond traditional transistor shrinkage.
- Huawei Proposes Next-Gen OTN for AIDC-Centric All-Optical Network — HPCwire, 2026-10-15Huawei introduced a next-generation Optical Transport Network (OTN) designed specifically for AI/DC-centric all-optical networking applications.
- Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints? — DigiTimes, 2026-10-15Huawei unveiled the architecture of its Kirin 9050 Pro chip, highlighting advancements in LogicFolding and hybrid bonding technologies for its upcoming roadmap.
- Nvidia's share of China's AI chips falls by a third while Huawei gains — DigiTimes, 2026-10-14Nvidia's market share in the Chinese AI chip sector has decreased by one-third as Huawei's market presence expands.
- Huawei's NPO bet challenges CPO's path to AI scale — DigiTimes, 2026-10-07Huawei is positioning its NPO (Network Processor Optical) technology as an alternative to CPO (Co-packaged Optics) to address the scaling challenges of AI infrastructure.
- Huawei counters chip-node limits with Ascend, SuperPoD and τ law — DigiTimes, 2026-10-05Huawei is positioning its Ascend accelerators and SuperPoD systems to navigate and counter international chip-node restrictions.
Questions about Huawei
- What does Huawei make for AI data centers?
- This catalog places Huawei on 11 parts: AI storage systems (manufacturer), Scale-out switch ASICs (manufacturer), Switch systems & white-box ODMs (manufacturer), DCI / coherent optics (manufacturer), Coolant distribution units (manufacturer), Rear-door heat exchangers (manufacturer), CRAH / CRAC / fan walls / in-row units (manufacturer) and UPS (static, modular, rotary/DRUPS) & UPS power semis (manufacturer), and 3 more.
- Is Huawei publicly traded?
- No listing is on file for Huawei in this catalog; it is recorded as private.
- Where is Huawei based?
- Shenzhen, China, per the company record in this catalog.
- Who else makes AI storage systems for AI data centers?
- Dell, Everpure, HPE, IBM, NetApp and Supermicro are also placed on AI storage systems in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Huawei the mix is 11 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.
Verification: enriched, last verified 2026-08-27. Sources: www.huawei.com · www.huawei.com.· Markdown · JSON