Huawei vs Vertiv
Huawei and Vertiv are both placed on 5 of the same AI data center parts in this catalog, spanning layers 5, 6, 7, 9. Huawei appears on 11 parts in total and Vertiv on 22.
At a glance
| Huawei | Vertiv | |
|---|---|---|
| Ownership | private | public |
| Headquarters | Shenzhen, China | Westerville, United States |
| Primary listing | none in catalog | VRT |
| Market cap | 74.8B USD | |
| Parts placed | 11 | 22 |
| Layers covered | 7 | 6 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 0 | 2 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.
- Rear-door heat exchangers — A heat exchanger mounted on the rear door of a server rack that cools exhaust air with chilled water or refrigerant before it leaves the rack, without cooling the chips directly.
- CRAH / CRAC / fan walls / in-row units — CRAH, CRAC, fan-wall, and in-row units circulate conditioned air across IT equipment in air-cooled halls, using either facility chilled water (CRAH) or an internal refrigerant circuit (CRAC).
- UPS (static, modular, rotary/DRUPS) & UPS power semis — Uninterruptible power supplies that bridge the gap between a utility outage and generator start, built as static (battery-based), modular, or rotary/diesel-rotary (DRUPS) designs, plus the power semiconductors inside them.
- 1 more in the table below.
The 5 parts both make
| Part | Huawei | Vertiv |
|---|---|---|
| Coolant distribution units Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
| Rear-door heat exchangers Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer inferred | manufacturer inferred |
| CRAH / CRAC / fan walls / in-row units Layer 6 — Facility cooling & HVAC | manufacturer inferred | manufacturer disclosed |
| UPS (static, modular, rotary/DRUPS) & UPS power semis Layer 7 — Electrical: power distribution (grid to rack) | manufacturer inferred | manufacturer disclosed |
| Prefab / modular data centers & power/cooling skids Layer 9 — Building shell, site & construction | manufacturer inferred | manufacturer disclosed |
Only Huawei
- AI storage systems layer 2
- Scale-out switch ASICs layer 3
- Switch systems & white-box ODMs layer 3
- DCI / coherent optics layer 3
- Hyperscalers, neoclouds & model labs layer 9
- Inverters layer 8
Only Vertiv
- Power shelves & PSUs layer 4
- Rack PDUs layer 4
- Direct-to-chip cold plates layer 5
- Rack manifolds layer 5
- Leak detection, flow & pressure sensing layer 5
- Rack/row cooling controls & software layer 5
- Chillers & compressors layer 6
- Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors layer 6
- Building management, controls, environmental sensors layer 6
- MV switchgear, E-houses, power skids layer 7
- and 7 more on Vertiv's page.
Questions
- Do Huawei and Vertiv compete?
- In this catalog they are both placed on 5 of the same parts, across 4 layers: Coolant distribution units, Rear-door heat exchangers, CRAH / CRAC / fan walls / in-row units, UPS (static, modular, rotary/DRUPS) & UPS power semis and 1 more. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Huawei or Vertiv?
- Huawei has 11 placements and Vertiv has 22. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.