Who makes optical dsps, drivers, tias for AI data centers
The signal-processing silicon inside optical modules — DSPs plus the drivers and TIAs that condition the electrical signal on either side of the laser and photodetector.
Optical DSPs, drivers, and TIAs sit inside the transceivers of 3.04 and the co-packaged optics of 3.08, converting between the electrical domain of the switch or GPU and the optical domain of the laser (3.06) and fiber (3.11). DSPs handle the heavier signal-processing work while drivers and TIAs condition the signal closer to the laser and photodetector; the two functions come from overlapping but not identical sets of suppliers. As speed grades rise from 800G toward 1.6T, DSP power consumption and complexity both increase, which is part of why co-packaged optics designs that eliminate some DSP stages are being evaluated as an alternative. An investor should watch DSP supplier concentration at each new speed grade, since qualifying a DSP for a new speed is a slow process that tends to favor incumbents with existing design wins.
Companies on this part (4)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Broadcom | manufacturer | public | AVGO | 372 USD | +2.6% | inferred | |
| Credo | manufacturer | public | CRDO | 240 USD | +2.2% | inferred | |
| Marvell | manufacturer | public | MRVL | 241 USD | -5.6% | inferred | DSPs |
| MaxLinear | manufacturer | public | MXL | 63.42 USD | -4.2% | inferred |
Drivers and TIAs 3.07a
Who competes here
The same table read the other way: every company above competes for optical dsps, drivers, tias sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Nearby parts
- Children: Drivers and TIAs
- Previous in layer: Lasers
- Next in layer: Silicon photonics & co-packaged optics
- Layer: Layer 3 — Networking & interconnect
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON