What Intel makes for data centers
public · HQ Santa Clara, US · intel.com
Intel makes the Xeon server CPUs used alongside GPUs in most AI servers, and is developing its own AI accelerators (Gaudi 3, Crescent Island). Its foundry business fabricates advanced-node chips and advanced packaging (EMIB, Foveros) as an alternative to TSMC, and it makes interposers, is developing glass-core substrates, and supplies silicon photonics components and network interface chips (IPU) for data center networking.
Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
9 parts across 2 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Merchant GPUs / accelerators | manufacturer | inferred | AMD, Nvidia | Gaudi 3 |
| Server CPUs | manufacturer | inferred | AMD, Arm, Nvidia, Ampere | Xeon |
| NICs / SuperNICs | manufacturer | inferred | AMD, Broadcom, Marvell, Nvidia | |
| DPUs | manufacturer | inferred | Microsoft, AMD, Marvell, Nvidia | IPU |
| Leading-edge foundry | manufacturer | inferred | TSMC, Samsung Electronics | Foundry |
| 2.5D/3D advanced packaging | manufacturer | inferred | TSMC, Samsung Electronics | Foundry |
| Glass-core substrates | manufacturer | inferred | AGC, Corning, Samsung Electro-Mechanics, Unimicron, Absolics | |
| Interposers, silicon bridges, RDL | manufacturer | inferred | TSMC, Samsung Electronics, UMC | EMIB |
Layer 3 — Networking & interconnect
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Silicon photonics & co-packaged optics | manufacturer | inferred | TSMC, Broadcom, GlobalFoundries, Marvell, Nvidia, Tower Semiconductor |
Disclosed customers
| Customer | % | Metric | Period | Filing |
|---|---|---|---|---|
| one customer | 43% | revenue | 2025-12-27 | 10-K |
Latest feed
- Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping — Tom's Hardware, 2026-08-27Glass-core substrates, which Intel had promised as replacements for organic chip packaging, are nearing final qualification but have yet to reach commercial availability.
Verification: enriched, last verified 2026-08-27. Sources: www.intel.com · en.wikipedia.org.· Markdown · JSON