What Samsung Electro-Mechanics makes for data centers
public · HQ South Korea · samsungsem.com
Samsung Electro-Mechanics is a publicly listed company and based in South Korea. It appears on 3 parts of the AI data center — ABF / high-layer package substrates, Glass-core substrates and Passives — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging and Layer 4 — Servers, racks & integration. Its shares trade on Korea Exchange (KOSPI) as 009150.KS. ABF / high-layer package substrates is flagged as a supply constraint in this catalog.
Listing
Korea Exchange (KOSPI): 009150.KS· 1122000 KRW -2.01% · mkt cap 84.76T KRW
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
3 parts across 2 layers · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substratesconstrained | manufacturer | disclosed | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB | |
| Glass-core substrates | manufacturer | inferred | AGC, Corning, Intel, Unimicron, Absolics |
Layer 4 — Servers, racks & integration
Where Samsung Electro-Mechanics sits in the stack
Samsung Electro-Mechanics's placements in this catalog cover 3 parts, from layer 1 (compute silicon & packaging) to layer 4 (servers, racks & integration). One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- ABF / high-layer package substratesconstrained — The high-layer-count ABF substrates that an advanced chip package is mounted on, sitting between the interposer and the server board.
- Glass-core substrates — Substrates that use a glass core instead of an organic laminate, an emerging alternative aimed at the largest, most demanding AI packages.
- Passivestight — The multilayer ceramic capacitors, inductors and other passive components that filter and stabilize power everywhere on a board, populated in far greater numbers on AI boards than on standard servers.
Closest peers in this catalog
Seen in real machines
Samsung Electro-Mechanics is named in 1 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine.
- Nvidia GB300 NVL72 · rack teardown
- MLCCs and inductors
Latest feed
- Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity — DigiTimes, 2026-10-23Tesla and Nvidia are reportedly investing combined funds into Samsung Electro-Mechanics to expand ABF substrate production capacity in South Korea.
- Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion — DigiTimes, 2026-10-21Samsung Electro-Mechanics won a large contract to supply package substrates for memory semiconductors due to rising AI demand.
- Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T — DigiTimes, 2026-10-21Samsung Electro-Mechanics signed a long-term supply agreement for memory packaging substrates, expanding its existing agreements that cover MLCCs and silicon capacitors.
- Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints — DigiTimes, 2026-10-17Samsung Electro-Mechanics' planned expansion for AI server substrate production is reportedly facing equipment supply constraints and longer delivery times from machinery manufacturers.
- Samsung's US$9B chip expansion faces funding, supply hurdles — DigiTimes, 2026-10-13Samsung is facing funding and supply chain challenges regarding its $9 billion chip production expansion.
- Semco moves glass substrates to package-level testing — DigiTimes, 2026-10-10Semco is transitioning the testing of glass substrates to the package level.
- Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion — DigiTimes, 2026-10-08Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment.
- Samsung secures customer backing for US$5B substrate expansion — DigiTimes, 2026-10-06Samsung has secured backing for a $5 billion expansion to increase its production capacity for high-layer package substrates.
- Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging — DigiTimes, 2026-09-16Samsung Electro-Mechanics and Qualcomm are collaborating on developing an organic bridge for advanced 2.1D packaging.
- AI servers are eating MLCC capacity, and Chinese suppliers are taking what's left — DigiTimes, 2026-09-15AI server demand is increasing prices and limiting capacity for MLCCs, forcing Chinese suppliers to pivot into PC markets.
Questions about Samsung Electro-Mechanics
- What does Samsung Electro-Mechanics make for AI data centers?
- This catalog places Samsung Electro-Mechanics on 3 parts: ABF / high-layer package substrates (manufacturer), Glass-core substrates (manufacturer) and Passives (manufacturer).
- Is Samsung Electro-Mechanics publicly traded?
- Yes — Samsung Electro-Mechanics is listed on Korea Exchange (KOSPI) under 009150.KS. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Samsung Electro-Mechanics based?
- South Korea, per the company record in this catalog.
- Who else makes ABF / high-layer package substrates for AI data centers?
- AT&S, Daeduck, Ibiden, Kinsus, LG Innotek and Nan Ya PCB are also placed on ABF / high-layer package substrates in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Samsung Electro-Mechanics the mix is 2 disclosed and 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.