What Samsung Electro-Mechanics makes for data centers
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Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
3 parts across 2 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substrates | manufacturer | inferred | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB | |
| Glass-core substrates | manufacturer | inferred | AGC, Corning, Intel, Unimicron, Absolics |