What Kinsus makes for data centers
public · HQ Taiwan
Kinsus is a publicly listed company and based in Taiwan. It appears on 1 part of the AI data center — ABF / high-layer package substrates — in the role of manufacturer. That part sits in Layer 1 — Compute silicon & packaging. Its shares trade on Taiwan Stock Exchange as 3189.TW. ABF / high-layer package substrates is flagged as a supply constraint in this catalog.
Listing
Taiwan Stock Exchange: 3189.TW· 986 TWD -2.38% · mkt cap 519.5B TWD
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
1 part across 1 layer · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substratesconstrained | manufacturer | inferred | AT&S, Daeduck, Ibiden, LG Innotek, Nan Ya PCB, Samsung Electro-Mechanics |
Where Kinsus sits in the stack
Kinsus's placements in this catalog cover 1 part, all in layer 1, compute silicon & packaging. One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- ABF / high-layer package substratesconstrained — The high-layer-count ABF substrates that an advanced chip package is mounted on, sitting between the interposer and the server board.
Closest peers in this catalog
Monthly revenue (TWSE/TPEx filing)
| Month | Revenue (TWD m) | MoM | YoY |
|---|---|---|---|
| 2026-09 | 5,181 | 7.7% | 44.5% |
| 2026-08 | 4,810 | 5.7% | 40.6% |
| 2026-07 | 4,549 | 7.7% | 35.9% |
| 2026-06 | 4,224 | 0.6% | 32.3% |
| 2026-05 | 4,200 | 3.1% | 33.0% |
| 2026-04 | 4,072 | 3.4% | 26.8% |
| 2026-03 | 3,939 | 22.9% | 25.1% |
| 2026-02 | 3,204 | -19.1% | 10.0% |
| 2026-01 | 3,961 | 7.4% | 54.9% |
| 2025-12 | 3,689 | 4.8% | 25.2% |
| 2025-11 | 3,521 | -2.2% | 39.7% |
| 2025-10 | 3,601 | 0.4% | 39.8% |
Latest feed
- Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape — DigiTimes, 2026-09-18The Taoyuan City Government plans to develop a 40-hectare high-end IC substrate zone in the Aerotropolis, intending to start joint land preparation with manufacturers in 2028.
Questions about Kinsus
- What does Kinsus make for AI data centers?
- This catalog places Kinsus on 1 part: ABF / high-layer package substrates (manufacturer).
- Is Kinsus publicly traded?
- Yes — Kinsus is listed on Taiwan Stock Exchange under 3189.TW. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Kinsus based?
- Taiwan, per the company record in this catalog.
- Who else makes ABF / high-layer package substrates for AI data centers?
- AT&S, Daeduck, Ibiden, LG Innotek, Nan Ya PCB and Samsung Electro-Mechanics are also placed on ABF / high-layer package substrates in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Kinsus the mix is 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.