Taiwan Stock Exchange
58 listings · prices in TWD · exchange code TW
58 companies in this catalog have listings on Taiwan Stock Exchange. They cluster in servers, racks & integration (42), compute silicon & packaging (14), liquid cooling (IT-side: chip to CDU) (8) and networking & interconnect (7). Prices are a nightly snapshot in TWD, never converted and never real-time.
| Company | Symbol | Price | 1d | Mkt cap | Layers |
|---|---|---|---|---|---|
| AcBel | 6282.TW ↗ | 41.70 TWD | -3.0% | 35.7B | L4 |
| Accton (Edgecore) | 2345.TW ↗ | 1775 TWD | -2.2% | 992.1B | L3 L9 |
| Aces | 3605.TW ↗ | 172 TWD | -3.7% | 30.6B | L4 |
| Alchip | 3661.TW ↗ | 3495 TWD | -5.9% | 301.6B | L1 |
| Alpha Networks | 3380.TW ↗ | 32.40 TWD | -0.5% | 17.6B | L3 |
| ASE Technology (ASE/SPIL) | 3711.TW ↗ | 654 TWD | -4.1% | 2.88T | L1 |
| ASRock Rack | 3515.TW ↗ | 224 TWD | -0.9% | 27.7B | L4 |
| ASUS | 2357.TW ↗ | 946 TWD | -3.7% | 702.7B | L4 |
| AVC | 3017.TW ↗ | 3145 TWD | -2.8% | 1.23T | L4 L5 |
| Bizlink | 3665.TW ↗ | 1875 TWD | -4.3% | 365.8B | L3 L4 |
| Chaun-Choung CCI | 6230.TW ↗ | 108 TWD | -3.6% | 9.3B | L4 |
| Chenbro | 8210.TW ↗ | 764 TWD | -4.5% | 96.0B | L4 |
| Chicony Power | 6412.TW ↗ | 72.30 TWD | -2.0% | 29.0B | L4 |
| Chilisin | 2456.TW ↗ | L4 | |||
| Chroma | 2360.TW ↗ | 1980 TWD | -1.0% | 838.7B | L4 L11 |
| Compal | 2324.TW ↗ | 37.30 TWD | -0.9% | 158.8B | L4 |
| Compeq | 2313.TW ↗ | 225 TWD | -6.5% | 277.0B | L4 |
| Cyber Power | 3617.TW ↗ | 247 TWD | -2.2% | 23.4B | L4 L7 |
| Delta Electronics | 2308.TW ↗ | 1560 TWD | -3.4% | 4.05T | L3 L4 L5 L6 L7 L9 |
| Elite Material | 2383.TW ↗ | 5070 TWD | +1.9% | 1.82T | L4 |
| Faraday | 3035.TW ↗ | 192 TWD | -2.8% | 50.0B | L1 |
| Fositek | 6805.TW ↗ | 2335 TWD | -2.5% | 160.1B | L5 |
| Foxconn (Hon Hai) | 2317.TW ↗ | 245 TWD | -1.6% | 3.45T | L4 L5 |
| FSP | 3015.TW ↗ | 50.00 TWD | -1.6% | 9.4B | L4 |
| Gigabyte | 2376.TW ↗ | 349 TWD | -2.4% | 233.8B | L4 |
| Global Unichip | 3443.TW ↗ | 7585 TWD | -4.9% | 1.02T | L1 |
| Gold Circuit GCE | 2368.TW ↗ | 1115 TWD | -7.1% | 572.8B | L4 |
| Inventec | 2356.TW ↗ | 60.50 TWD | -1.0% | 217.0B | L4 |
| Iteq | 6213.TW ↗ | 777 TWD | -5.6% | 282.5B | L4 |
| Jentech | 3653.TW ↗ | 6070 TWD | -7.3% | 893.5B | L1 L4 L5 |
| Kaori | 8996.TW ↗ | 1560 TWD | -7.4% | 145.1B | L5 |
| King Slide | 2059.TW ↗ | 9755 TWD | -3.2% | 929.6B | L4 |
| Kinsus | 3189.TW ↗ | 986 TWD | -2.4% | 519.5B | L1 |
| KYEC | 2449.TW ↗ | 263 TWD | -5.6% | 337.0B | L1 |
| Lite-On | 2301.TW ↗ | 256 TWD | -2.7% | 579.9B | L4 L7 |
| Lotes | 3533.TW ↗ | 1795 TWD | -1.9% | 204.2B | L4 L5 |
| MediaTek | 2454.TW ↗ | 4010 TWD | -3.1% | 6.40T | L1 |
| MiTAC (Tyan) | 3706.TW ↗ | 80.50 TWD | -1.1% | 117.5B | L4 |
| MSI | 2377.TW ↗ | 163 TWD | -0.6% | 137.7B | L4 |
| Nan Ya PCB | 8046.TW ↗ | 1265 TWD | -5.2% | 817.4B | L1 L4 |
| Nanya | 2408.TW ↗ | 414 TWD | -5.2% | 1.43T | L2 |
| Nanya Plastics | 1303.TW ↗ | 301 TWD | -5.9% | 2.39T | L4 |
| Nuvoton | 4919.TW ↗ | 135 TWD | -7.2% | 60.8B | L4 |
| Pegatron | 4938.TW ↗ | 104 TWD | -1.0% | 276.9B | L4 |
| Powertech | 6239.TW ↗ | 248 TWD | -6.9% | 180.7B | L1 |
| Quanta Computer | 2382.TW ↗ | 322 TWD | -1.8% | 1.32T | L3 L4 |
| Sunon | 2421.TW ↗ | 155 TWD | -2.5% | 44.3B | L4 |
| Tripod | 3044.TW ↗ | 556 TWD | -4.1% | 292.2B | L4 |
| TSMC | 2330.TW ↗ | 2385 TWD | -0.8% | 61.85T | L1 L3 |
| UMC | 2303.TW ↗ | 126 TWD | -1.6% | 1.57T | L1 |
| Unimicron | 3037.TW ↗ | 1085 TWD | -1.4% | 1.78T | L1 L4 |
| Walsin | 2492.TW ↗ | 368 TWD | -9.2% | 178.6B | L4 |
| Winbond | 2344.TW ↗ | 155 TWD | -3.1% | 695.3B | L2 L4 |
| Wistron | 3231.TW ↗ | 190 TWD | -2.6% | 651.7B | L4 |
| Wistron NeWeb | 6285.TW ↗ | 230 TWD | -6.5% | 111.2B | L3 |
| Wiwynn | 6669.TW ↗ | 1840 TWD | -2.6% | 1.02T | L4 L5 |
| Yageo | 2327.TW ↗ | 507 TWD | -6.8% | 1.04T | L4 |
| Zhen Ding | 4958.TW ↗ | 567 TWD | -2.1% | 612.0B | L1 L4 |
What the Taiwan Stock Exchange names make
Every part below is a place this catalog records the company as a supplier. Each edge carries its own confidence tag on the part page — most start as inferred leads.
- AcBel · 6282.TW — Power shelves & PSUs.
- Accton (Edgecore) · 2345.TW — Switch systems & white-box ODMs, Data center developers, operators & REITs.
- Aces · 3605.TW — Board-level connectors & sockets.
- Alchip · 3661.TW — Hyperscaler custom ASICs, ASIC design services, IP & EDA.
- Alpha Networks · 3380.TW — Switch systems & white-box ODMs.
- ASE Technology (ASE/SPIL) · 3711.TW — OSATs taking CoWoS back-end and overflow. Also trades on US exchanges (NYSE/Nasdaq).
- ASRock Rack · 3515.TW — Rack-scale systems, Motherboards, CPU trays, switch trays.
- ASUS · 2357.TW — Rack-scale systems, Motherboards, CPU trays, switch trays.
- AVC · 3017.TW — Fans, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds.
- Bizlink · 3665.TW — Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Board-level connectors & sockets, In-rack busbar & power whips.
- Chaun-Choung CCI · 6230.TW — Air-cooled heatsinks & vapor chambers.
- Chenbro · 8210.TW — Chassis, rails, rack enclosures.
- Chicony Power · 6412.TW — Power shelves & PSUs.
- Chilisin · 2456.TW — Passives.
- Chroma · 2360.TW — Test & measurement instruments, Rack test.
- Compal · 2324.TW — Rack-scale systems, EMS, system integration & rack-level test.
- Compeq · 2313.TW — High-layer-count PCBs.
- Cyber Power · 3617.TW — Rack PDUs, UPS (static, modular, rotary/DRUPS) & UPS power semis.
- Delta Electronics · 2308.TW — Switch systems & white-box ODMs, Board-level power: VRMs, power stages, PoL, power semis, Power shelves & PSUs, Fans, In-rack busbar & power whips, Rack PDUs, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates and 10 more parts.
- Elite Material · 2383.TW — Copper-clad laminate & PCB materials.
- Faraday · 3035.TW — ASIC design services, IP & EDA.
- Fositek · 6805.TW — Direct-to-chip cold plates, Quick disconnects.
- Foxconn (Hon Hai) · 2317.TW — Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Fans, Chassis, rails, rack enclosures, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds and 1 more part.
- FSP · 3015.TW — Power shelves & PSUs.
- Gigabyte · 2376.TW — Rack-scale systems, Motherboards, CPU trays, switch trays.
- Global Unichip · 3443.TW — ASIC design services, IP & EDA.
- Gold Circuit GCE · 2368.TW — High-layer-count PCBs.
- Inventec · 2356.TW — Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays.
- Iteq · 6213.TW — Copper-clad laminate & PCB materials.
- Jentech · 3653.TW — Chip-level thermal: lids, heat spreaders, TIMs, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates.
- Kaori · 8996.TW — Direct-to-chip cold plates, Rack manifolds, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters.
- King Slide · 2059.TW — Chassis, rails, rack enclosures.
- Kinsus · 3189.TW — ABF / high-layer package substrates.
- KYEC · 2449.TW — OSATs taking CoWoS back-end and overflow, Semiconductor test & burn-in.
- Lite-On · 2301.TW — Power shelves & PSUs, In-rack busbar & power whips, 800 V DC architecture & solid-state transformers.
- Lotes · 3533.TW — Board-level connectors & sockets, Direct-to-chip cold plates.
- MediaTek · 2454.TW — Hyperscaler custom ASICs, ASIC design services, IP & EDA.
- MiTAC (Tyan) · 3706.TW — Rack-scale systems, Motherboards, CPU trays, switch trays.
- MSI · 2377.TW — Motherboards, CPU trays, switch trays.
- Nan Ya PCB · 8046.TW — ABF / high-layer package substrates, High-layer-count PCBs.
- Nanya · 2408.TW — DRAM.
- Nanya Plastics · 1303.TW — Copper-clad laminate & PCB materials.
- Nuvoton · 4919.TW — BMC & platform firmware.
- Pegatron · 4938.TW — Rack-scale systems, GPU baseboards & compute trays.
- Powertech · 6239.TW — OSATs taking CoWoS back-end and overflow.
- Quanta Computer · 2382.TW — Switch systems & white-box ODMs, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays. Also trades on US exchanges (NYSE/Nasdaq).
- Sunon · 2421.TW — Fans.
- Tripod · 3044.TW — High-layer-count PCBs.
- TSMC · 2330.TW — Leading-edge foundry, 2.5D/3D advanced packaging, Interposers, silicon bridges, RDL, Silicon photonics & co-packaged optics. Also trades on US exchanges (NYSE/Nasdaq).
- UMC · 2303.TW — Interposers, silicon bridges, RDL.
- Unimicron · 3037.TW — ABF / high-layer package substrates, Glass-core substrates, High-layer-count PCBs.
- Walsin · 2492.TW — Passives.
- Winbond · 2344.TW — DRAM, Timing, security & misc board silicon.
- Wistron · 3231.TW — EMS, system integration & rack-level test, GPU baseboards & compute trays, Chassis, rails, rack enclosures.
- Wistron NeWeb · 6285.TW — Switch systems & white-box ODMs.
- Wiwynn · 6669.TW — Rack-scale systems, GPU baseboards & compute trays, Direct-to-chip cold plates.
- Yageo · 2327.TW — Passives.
- Zhen Ding · 4958.TW — ABF / high-layer package substrates, High-layer-count PCBs.
Reading this table
The Layers column is where each company sits in the physical stack — L1 is silicon, L11 is the building and its operations. A company on several layers touches the data center in several places; that is exposure breadth, not size. Nothing here is investment advice, and inclusion is a supply-chain mapping, not a view on the shares. Browseevery exchange, the part tree, orthe parts under supply constraint.