What Jentech makes for data centers
public · HQ Taiwan
Jentech is a publicly listed company and based in Taiwan. It appears on 3 parts of the AI data center — Chip-level thermal: lids, heat spreaders, TIMs, Air-cooled heatsinks & vapor chambers and Direct-to-chip cold plates — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging, Layer 4 — Servers, racks & integration and Layer 5 — Liquid cooling (IT-side: chip to CDU). Its shares trade on Taiwan Stock Exchange as 3653.TW.
Parts, by layer
Layer 1 — Compute silicon & packaging
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Air-cooled heatsinks & vapor chambers | manufacturer | inferred | AVC, Auras, Chaun-Choung CCI, Delta Electronics, Foxconn (Hon Hai), Boyd |
Layer 5 — Liquid cooling (IT-side: chip to CDU)
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Direct-to-chip cold plates | manufacturer | inferred | AVC, Auras, Delta Electronics, Flex, Fositek, Foxconn (Hon Hai) |
Where Jentech sits in the stack
Jentech's placements in this catalog cover 3 parts, from layer 1 (compute silicon & packaging) to layer 5 (liquid cooling (it-side: chip to cdu)). None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- Chip-level thermal: lids, heat spreaders, TIMs — The metal lids, heat spreaders, and thermal interface materials applied directly at the die level to move heat off an accelerator package before it ever reaches a cold plate or heat sink.
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
Closest peers in this catalog
Seen in real machines
Jentech is named in 1 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine.
- Nvidia GB300 NVL72 · rack teardown
- Lids and TIMs
- Cold plates (GPU, CPU, NVSwitch)
Monthly revenue (TWSE/TPEx filing)
| Month | Revenue (TWD m) | MoM | YoY |
|---|---|---|---|
| 2026-09 | 3,054 | -5.3% | 80.0% |
| 2026-08 | 3,226 | 0.4% | 90.9% |
| 2026-07 | 3,213 | 21.3% | 91.0% |
| 2026-06 | 2,650 | 14.5% | 57.6% |
| 2026-05 | 2,313 | 0.1% | 37.8% |
| 2026-04 | 2,311 | 6.8% | 26.9% |
| 2026-03 | 2,164 | 70.6% | 18.9% |
| 2026-02 | 1,268 | -32.3% | -14.6% |
| 2026-01 | 1,873 | 0.2% | 29.4% |
| 2025-12 | 1,870 | 9.9% | 13.3% |
| 2025-11 | 1,701 | 0.0% | 16.7% |
| 2025-10 | 1,701 | 0.2% | 29.8% |
Questions about Jentech
- What does Jentech make for AI data centers?
- This catalog places Jentech on 3 parts: Chip-level thermal: lids, heat spreaders, TIMs (manufacturer), Air-cooled heatsinks & vapor chambers (manufacturer) and Direct-to-chip cold plates (manufacturer).
- Is Jentech publicly traded?
- Yes — Jentech is listed on Taiwan Stock Exchange under 3653.TW. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Jentech based?
- Taiwan, per the company record in this catalog.
- Who else makes chip-level thermal: lids, heat spreaders, TIMs for AI data centers?
- Dow, Henkel, Honeywell, Shin-Etsu, Boyd and Fujipoly are also placed on Chip-level thermal: lids, heat spreaders, TIMs in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Jentech the mix is 3 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.