What Flex makes for data centers

Where Flex sits in the stack

Flex's placements in this catalog cover 5 parts, from layer 3 (networking & interconnect) to layer 7 (electrical: power distribution (grid to rack)). None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.

What these parts are

• Optics contract manufacturing — Contract manufacturers that assemble and test optical transceivers on behalf of module brands and switch vendors.
• EMS, system integration & rack-level test — Electronics manufacturing services firms assemble, wire and burn-in the finished server or rack before it ships, standing between the ODM board build and the customer's data center floor.
• Power shelves & PSUs — The rack-mounted power shelves that convert facility AC or DC input into the regulated rail distributed to trays across the rack, built to the Open Rack V3 33 kW-class spec used in rack-scale AI systems.
• Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
• 800 V DC architecture & solid-state transformers — An emerging DC power distribution architecture, using 800 V DC in place of the AC busbar and power-shelf approach current racks use, paired with solid-state transformers (SSTs) that could replace multiple stages of conventional AC transformation.

Closest peers in this catalog