Boyd vs Jentech
Boyd and Jentech are both placed on 3 of the same AI data center parts in this catalog, spanning layers 1, 4, 5. Boyd appears on 5 parts in total and Jentech on 3.
At a glance
| Boyd | Jentech | |
|---|---|---|
| Ownership | private | public |
| Headquarters | United States | Taiwan |
| Primary listing | none in catalog | 3653.TW |
| Market cap | 893.5B TWD | |
| Parts placed | 5 | 3 |
| Layers covered | 3 | 3 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Chip-level thermal: lids, heat spreaders, TIMs — The metal lids, heat spreaders, and thermal interface materials applied directly at the die level to move heat off an accelerator package before it ever reaches a cold plate or heat sink.
- Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
- Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
The 3 parts both make
| Part | Boyd | Jentech |
|---|---|---|
| Chip-level thermal: lids, heat spreaders, TIMs Layer 1 — Compute silicon & packaging | manufacturer inferred | manufacturer inferred |
| Air-cooled heatsinks & vapor chambers Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| Direct-to-chip cold plates Layer 5 — Liquid cooling (IT-side: chip to CDU) | manufacturer disclosed | manufacturer inferred |
Only Boyd
- Rack manifolds layer 5
- Coolant distribution units layer 5
Only Jentech
Every part Jentech is placed on is shared with the other company.
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Boyd and Jentech compete?
- In this catalog they are both placed on 3 of the same parts, across 3 layers: Chip-level thermal: lids, heat spreaders, TIMs, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Boyd or Jentech?
- Boyd has 5 placements and Jentech has 3. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.