What Boyd makes for data centers

Where Boyd sits in the stack

Boyd's placements in this catalog cover 5 parts, from layer 1 (compute silicon & packaging) to layer 5 (liquid cooling (it-side: chip to cdu)). None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.

What these parts are

• Chip-level thermal: lids, heat spreaders, TIMs — The metal lids, heat spreaders, and thermal interface materials applied directly at the die level to move heat off an accelerator package before it ever reaches a cold plate or heat sink.
• Air-cooled heatsinks & vapor chambers — The finned aluminum or copper heatsinks and vapor chambers that spread and dissipate heat from chips that rely on airflow (4.13) rather than a liquid cold plate.
• Direct-to-chip cold plates — A metal plate with internal microchannels, bonded or clamped directly onto a GPU, CPU, or switch package, that carries coolant across the die to remove heat by conduction rather than airflow.
• Rack manifolds — The manifold (sometimes called a CDM) that distributes coolant from the CDU supply line to each cold plate in a rack and collects the return flow, usually mounted vertically at the rear or side of the rack.
• Coolant distribution units — The unit that separates the IT-side (technology) coolant loop from the facility water loop, exchanging heat between them and pumping and filtering the technology-side flow — sized from in-rack and in-row units up to multi-megawatt facility-class units.

Closest peers in this catalog