What Boyd makes for data centers
private · HQ US · boydcorp.com
Ownership: Boyd Thermal sold to Eaton (announced Nov 2025, closed 2026-03-12); remaining Boyd ownership under review
Boyd makes liquid and air thermal-management hardware for data centers: single- and two-phase cold plates, coolant distribution units, rack manifolds and cooling loops, heat exchangers, and air-cooled heatsinks and vapor chambers. Its thermal business ("Boyd Thermal") was sold by Goldman Sachs Asset Management to Eaton in a deal that closed in March 2026, so the data-center product lines now sit inside Eaton.
Exposure
5 parts across 3 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Air-cooled heatsinks & vapor chambers | manufacturer | inferred | AVC, Auras, Chaun-Choung CCI, Delta Electronics, Foxconn (Hon Hai), Jentech |
Layer 5 — Liquid cooling (IT-side: chip to CDU)
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Direct-to-chip cold plates | manufacturer | inferred | AVC, Auras, Delta Electronics, Flex, Fositek, Foxconn (Hon Hai) | |
| Rack manifolds | manufacturer | inferred | AVC, Auras, Delta Electronics, Foxconn (Hon Hai), Kaori, Parker Hannifin | |
| Coolant distribution units | manufacturer | inferred | Auras, Daikin, Delta Electronics, Envicool, Foxconn (Hon Hai), Johnson Controls |
Verification: needs_review, last verified 2026-08-27. Sources: www.boydcorp.com · www.eaton.com.· Markdown · JSON