# Boyd

Company ID: boyd · private · HQ US

Boyd makes liquid and air thermal-management hardware for data centers: single- and two-phase cold plates, coolant distribution units, rack manifolds and cooling loops, heat exchangers, and air-cooled heatsinks and vapor chambers. Its thermal business ("Boyd Thermal") was sold by Goldman Sachs Asset Management to Eaton in a deal that closed in March 2026, so the data-center product lines now sit inside Eaton.

## Parts made

| Part | Layer | Role | Confidence |
|---|---|---|---|
| Chip-level thermal: lids, heat spreaders, TIMs (1.17) | 1 | manufacturer | inferred |
| Air-cooled heatsinks & vapor chambers (4.17) | 4 | manufacturer | inferred |
| Direct-to-chip cold plates (5.01) | 5 | manufacturer | inferred |
| Rack manifolds (5.02) | 5 | manufacturer | inferred |
| Coolant distribution units (5.05) | 5 | manufacturer | inferred |