{
 "id": "boyd",
 "url": "/companies/boyd",
 "name": "Boyd",
 "aliases": [],
 "ownership_type": "private",
 "parent_company_id": null,
 "ownership_note": "Boyd Thermal sold to Eaton (announced Nov 2025, closed 2026-03-12); remaining Boyd ownership under review",
 "hq_country": "US",
 "website": "https://www.boydcorp.com",
 "description_md": "Boyd makes liquid and air thermal-management hardware for data centers: single- and two-phase cold plates, coolant distribution units, rack manifolds and cooling loops, heat exchangers, and air-cooled heatsinks and vapor chambers. Its thermal business (\"Boyd Thermal\") was sold by Goldman Sachs Asset Management to Eaton in a deal that closed in March 2026, so the data-center product lines now sit inside Eaton.",
 "dc_exposure_note": null,
 "listings": [],
 "quote": null,
 "parts": [
  {
   "part_id": "1.17",
   "name": "Chip-level thermal: lids, heat spreaders, TIMs",
   "layer_id": 1,
   "role": "manufacturer",
   "confidence": "inferred",
   "product_note": null,
   "source_url": null
  },
  {
   "part_id": "4.17",
   "name": "Air-cooled heatsinks & vapor chambers",
   "layer_id": 4,
   "role": "manufacturer",
   "confidence": "inferred",
   "product_note": null,
   "source_url": null
  },
  {
   "part_id": "5.01",
   "name": "Direct-to-chip cold plates",
   "layer_id": 5,
   "role": "manufacturer",
   "confidence": "inferred",
   "product_note": null,
   "source_url": null
  },
  {
   "part_id": "5.02",
   "name": "Rack manifolds",
   "layer_id": 5,
   "role": "manufacturer",
   "confidence": "inferred",
   "product_note": null,
   "source_url": null
  },
  {
   "part_id": "5.05",
   "name": "Coolant distribution units",
   "layer_id": 5,
   "role": "manufacturer",
   "confidence": "inferred",
   "product_note": null,
   "source_url": null
  }
 ]
}