Who makes GPU baseboards & compute trays for AI data centers
GPU baseboards & compute trays (HGX, Bianca, UBB/OAM)
The baseboard is the printed circuit assembly that carries the GPUs (and often paired CPUs) and their direct power and interconnect, packaged into a tray that slides into the rack.
The compute tray sits between the packaged silicon (layer 1, layer 2 memory) and the rack-scale system (4.01): it's the board that physically carries the GPUs, any paired CPUs, VRMs (4.08), connectors (4.07) and the traces that bring scale-up fabric (3.01) to each chip. Nvidia's HGX and Bianca designs and the OAM/UBB open standard define the mechanical and electrical envelope; the ODMs build to that spec while Supermicro builds boards in-house rather than sourcing from the ODM tier. AI demand is the entire reason this part category exists in its current form — a baseboard carrying multiple high-power GPUs, coherent CPU links and dense high-speed interconnect is a different design problem from a general-purpose server motherboard, with far tighter power delivery, signal integrity and thermal requirements. For investors, the baseboard is where board complexity, layer count (4.05) and connector density all stack up, so it's a useful proxy for how much of a rack's bill of materials sits in high-spec board manufacturing versus commodity components; watch which board builders get first-wave qualification on each new GPU generation, since that tends to set the pecking order for the whole rack cycle.
AI delta: A compute tray carrying multiple high-power GPUs with coherent CPU links and dense scale-up interconnect is a fundamentally different design than a general-purpose server motherboard, which is why this category exists as its own part class.
Per rack: 18 compute trays per NVL72 (Nvidia rack specification, via taxonomy v0.1 Appendix A).
Companies on this part (8)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Foxconn (Hon Hai) | manufacturer | public | 2317.TW | 245 TWD | -1.6% | inferred | boards built by |
| Inventec | manufacturer | public | 2356.TW | 60.50 TWD | -1.0% | inferred | |
| Nvidia | manufacturer | public | NVDA | 211 USD | -0.7% | disclosed | and AMD designs · source |
| Pegatron | manufacturer | public | 4938.TW | 104 TWD | -1.0% | inferred | |
| Quanta Computer | manufacturer | public | 2382.TW | 322 TWD | -1.8% | inferred | |
| Supermicro | in house | public | SMCI | 32.94 USD | -1.7% | inferred | in-house |
| Wistron | manufacturer | public | 3231.TW | 190 TWD | -2.6% | inferred | |
| Wiwynn · unit of Wistron | manufacturer | public | 6669.TW | 1840 TWD | -2.6% | inferred |
Who competes here
The same table read the other way: every company above competes for GPU baseboards & compute trays sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Seen in real machines
GPU baseboards & compute trays is named in 17 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine. The companies shown are the ones named on that line, not necessarily the maker of this part.
- Nvidia GB300 NVL72 · rack teardown
- 18× compute trays (Bianca board: 2× Grace + 4× B300) — Nvidia, Quanta Computer, Wistron, Wiwynn, Inventec
- AMD Helios (MI455X) · rack teardown
- 18x compute trays (4x MI455X GPUs + 1x EPYC "Venice" CPU each) — AMD
- Google TPU7x (Ironwood) · rack teardown
- Compute host (4x TPU7x chips per host; 64 chips per rack form a "cube") — Alphabet (Google)
- El Capitan · supercomputer
- Frontier · supercomputer
- Compute blade (HPE Cray EX235A: two nodes per blade, each with 1 CPU and 4 MI250X, all components liquid-cooled) — HPE
- Aurora · supercomputer
- JUPITER · supercomputer
- Booster compute node (4x GH200 superchips, 4x NDR200 InfiniBand adapters, 960 GB NVMe boot disk; 5,884 nodes in about 125 racks) — Eviden/Atos, Nvidia
- Alps · supercomputer
- GH200 compute blade and node (2 nodes per blade, 4 Grace Hopper modules and 4 NICs per node; 7 of 8 blade slots filled per chassis; 2,688 nodes) — HPE, Nvidia
- AMD Instinct MI300A partition (128 nodes, 4 APUs per node, 512 in total; HPE Cray EX255A blades) — AMD, TSMC, HPE
- NVIDIA A100 partition (144 nodes, one AMD EPYC host and 4 A100 GPUs per node, 576 GPUs) and AMD Instinct MI250X partition (24 nodes, 4 MI250X per node, 96 GPUs; HPE Cray EX235A blades) — Nvidia, AMD, HPE
- LUMI · supercomputer
- LUMI-G compute blade (HPE Cray EX235a node type; one 64-core EPYC Trento and four MI250X per node; 2,978 nodes) — HPE
- Leonardo · supercomputer
- Compute blades (Booster: single-node X2135 'Da Vinci' GPU blade, fan-less and liquid-cooled; Data Centric: three-node X2140 CPU blade) — Eviden/Atos
- Isambard-AI · supercomputer
- Venado · supercomputer
- Perlmutter · supercomputer
- Eos · supercomputer
- DGX H100 compute system (8U server with eight H100 GPUs on an NVSwitch baseboard, two Xeon hosts, 640 GB of HBM3 and 2 TB of DDR5, up to 10.2 kW) — Nvidia
- Fugaku · supercomputer
- Compute node and board (1 CPU per node; 2 nodes per CPU Memory Unit; 16 nodes per Bunch of Blades; 48 per shelf; 384 per rack) — Fujitsu
- MareNostrum 5 · supercomputer
- Accelerated-partition compute node (Eviden-designed: 2 Xeon 8460Y+, 4 H100 on NVLink, 512 GB DDR5, 480 GB NVMe; 1,120 nodes in 35 racks) — Eviden/Atos
- Horizon · supercomputer
- System design and racks (Dell Integrated Rack Scalable Systems with direct-liquid-cooled PowerEdge servers; 128 cabinets, GPU racks of 144 GPUs at about 215 kW) — Dell
Nearby parts
- Previous in layer: EMS, system integration & rack-level test
- Next in layer: Motherboards, CPU trays, switch trays
- Layer: Layer 4 — Servers, racks & integration
From the blog
Latest feed
- IBM infrastructure revenue bounces back after Q2 drop — Data Center Dynamics, 2026-10-22IBM's CEO highlighted the positive momentum expected from sovereign AI initiatives boosting infrastructure revenue after a dip in the second quarter.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The design of future AI infrastructure will require integrating advanced compute, cooling, and power elements from various parts of the supply chain.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The article discusses anticipated design principles for future AI infrastructure, focusing on elements like advanced compute components and specialized cooling/interconnect features.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22Effective real-world AI application requires improvements across faster compute, wider memory bandwidth, higher-performance networking, better storage, and more stable power infrastructure.
- Amazon spends US$220B on AI as power delays squeeze cash flow — DigiTimes, 2026-10-22Amazon's planned $220B AI CAPEX for 2026 is hampered by power and construction delays, causing hardware like server racks to stockpile in warehouses.
- NVIDIA GTC Berlin 2026 NVIDIA Intros DSX PODs and More — ServeTheHome, 2026-10-21NVIDIA presented the DSX POD, a new type of server housed within a container, at the GTC 2026 event.
- Qisda integrates four companies to build scalable rack-scale AI solutions — DigiTimes, 2026-10-21Qisda Group is forming a consortium of four companies to build scalable rack-level AI solutions integrating high-speed connectivity, modular compute, and liquid cooling.
- Supermicro lifts quarterly sales estimate as AI demand outpaces forecasts — DigiTimes, 2026-10-21Supermicro updated its sales forecasts upwards due to stronger demand for its AI platforms and a favorable product mix.
- HPE Spaceborne Computer-4 Will Bring AI and HPC to the Moon on Astrolab FLIP — ServeTheHome, 2026-10-20HPE plans to take its Spaceborne Computer 4 system to the moon via Astrolab's FLIP for testing AI and HPC capabilities in a space environment.
- Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain — DigiTimes, 2026-10-16SEMI's CEO predicts the semiconductor industry will achieve $2 trillion in revenue by 2035, driven by AI and quantum computing growth.
Questions about GPU baseboards & compute trays
- What are GPU baseboards & compute trays?
- The baseboard is the printed circuit assembly that carries the GPUs (and often paired CPUs) and their direct power and interconnect, packaged into a tray that slides into the rack.
- Which companies make GPU baseboards & compute trays for AI data centers?
- This catalog lists 8 companies on GPU baseboards & compute trays, 8 of them with listed equity: Foxconn (Hon Hai), Inventec, Nvidia, Pegatron, Quanta Computer, Supermicro, Wistron, Wiwynn.
- How does AI change demand for GPU baseboards & compute trays?
- A compute tray carrying multiple high-power GPUs with coherent CPU links and dense scale-up interconnect is a fundamentally different design than a general-purpose server motherboard, which is why this category exists as its own part class.
- How many GPU baseboards & compute trays does a data center need?
- Per rack: 18 compute trays per NVL72 (Nvidia rack specification, via taxonomy v0.1 Appendix A). Figures come from the taxonomy behind this catalog.
- How reliable are these GPU baseboards & compute trays supplier placements?
- The 8 placements on this part break down as 1 disclosed, 7 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a taxonomy lead with no citation yet.
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON