1.11a · part of 2.5D/3D advanced packaging
Who makes osats taking cowos back-end and overflow for AI data centers
Outsourced assembly and test (OSAT) providers that take on back-end assembly and overflow packaging work when primary CoWoS capacity is full.
Companies on this part (4)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Amkor | manufacturer | public | AMKR | 51.74 USD | +0.9% | inferred | |
| ASE Technology (ASE/SPIL) | manufacturer | public | 3711.TW | 608 TWD | +1.0% | inferred | |
| KYEC | manufacturer | public | 2449.TW | 263 TWD | +5.8% | inferred | test |
| Powertech | manufacturer | public | 6239.TW | 287 TWD | +4.0% | inferred |
Who competes here
The same table read the other way: every company above competes for osats taking cowos back-end and overflow sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Nearby parts
- Parent: 2.5D/3D advanced packaging
- Previous in layer: Silicon wafers
- Next in layer: Packaging & bonding equipment
- Layer: Layer 1 — Compute silicon & packaging
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON