Who makes leading-edge foundry for AI data centers

Who competes here

The same table read the other way: every company above competes for leading-edge foundry sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.

Seen in real machines

leading-edge foundry is named in 17 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine. The companies shown are the ones named on that line, not necessarily the maker of this part.

• Nvidia GB300 NVL72 · rack teardown
  • B300 GPU die and CoWoS-L package — TSMC, Amkor
• AMD Helios (MI455X) · rack teardown
  • MI455X GPU die (CDNA 5; compute chiplets on TSMC N2, fabric/cache and I/O chiplets on TSMC N3P) — AMD, TSMC
• Google TPU7x (Ironwood) · rack teardown
  • TPU7x (Ironwood) ASIC die (co-designed with Broadcom, fabricated on TSMC N3P) — Alphabet (Google), Broadcom, MediaTek, TSMC
• El Capitan · supercomputer
  • MI300A dies fabricated by TSMC (N5 compute dies, N6 I/O and cache dies) and joined with TSMC SoIC and CoWoS packaging — TSMC
• Frontier · supercomputer
  • MI250X accelerator (two GCDs per module, fabricated on TSMC 6nm; 4 modules per node) — AMD, TSMC
  • Slingshot switches (64-port Rosetta ASIC on TSMC 16nm; 74 groups of 32 switches in a dragonfly) — HPE, TSMC
• Aurora · supercomputer
  • Intel Data Center GPU Max 1550 "Ponte Vecchio" (47 tiles, 2 stacks, 128 GB HBM2e; compute tiles on TSMC N5, base and cache tiles on Intel 7, Foveros + Co-EMIB packaging) — Intel, TSMC
  • Slingshot Rosetta switch ASIC (64 ports, 685 mm2, TSMC 16 nm FinFET, about 160 W typical) — HPE, TSMC
• JUPITER · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC
  • Cluster module CPUs, SiPearl Rhea1 (162 dual-socket nodes, 80 Arm Neoverse V1 cores and 64 GB HBM2e per CPU; first samples delivered to Bull 2026-09-22) — SiPearl, Arm, TSMC
• Alps · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC
  • Slingshot-11 fabric (64-port Rosetta switch ASIC on TSMC 16 nm; 200 Gb/s links; also carries Capstor, Iopsstor and Ritom storage traffic) — HPE, TSMC
  • AMD Instinct MI300A partition (128 nodes, 4 APUs per node, 512 in total; HPE Cray EX255A blades) — AMD, TSMC, HPE
• LUMI · supercomputer
  • AMD Instinct MI250X accelerator (two GCDs per module, 110 compute units each, 64 GB HBM2e per GCD; TSMC 6nm) — AMD, TSMC
  • Slingshot switches and dragonfly fabric (LUMI-G: 24 groups of 32 switches; LUMI-C: 8 groups of 16 switches; copper inside groups, optical between) — HPE, TSMC
• Leonardo · supercomputer
  • A100 GPU (custom 64 GB SXM4 part, four per Booster node; GA100 die fabricated on TSMC 7nm N7) — Nvidia, TSMC
• Isambard-AI · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC
• Venado · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC
  • Slingshot 11 fabric (64-port Rosetta switch ASIC on TSMC 16 nm; 200 Gb/s per port per trade press) — HPE, TSMC
• Perlmutter · supercomputer
  • NVIDIA A100 accelerator (Ampere GA100, 40 GB HBM2 or 80 GB HBM2e, fabricated on TSMC 7nm; four per GPU node) — Nvidia, TSMC
  • Slingshot switches and dragonfly fabric (switch blades at the rear of each cabinet; 16-switch groups; copper inside groups, optical between) — HPE, TSMC
• Eagle (Microsoft Azure) · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC
• Eos · supercomputer
  • H100 die fabrication (GH100, TSMC 4N process customised for NVIDIA) — TSMC
• Fugaku · supercomputer
  • A64FX die fabrication and 2.5D packaging with four on-package HBM2 stacks (32 GiB, 1,024 GB/s per node) — TSMC
• MareNostrum 5 · supercomputer
  • Hopper GPU die fabrication (TSMC 4N process) — TSMC

From the blog

• October's shortage headlines were about memory and chip tools, not GPUs 2026-10-19
• Nine supercomputers, six countries, one foundry 2026-10-05

Watch

Independent videos — no affiliation; nothing loads from YouTube until you click.

Latest feed

• Vertical Semiconductor awarded $73m in CHIPS Act funding to support vGaN transistor development — Data Center Dynamics, 2026-10-23
  Vertical Semiconductor received $73 million in CHIPS Act funding from the Department of Commerce to advance its vGaN transistor development.
• China can make advanced chips without EUV, but the bill keeps growing — Tom's Hardware, 2026-10-23
  Chinese manufacturers can push older DUV lithography to near 5nm using multiple patterning, but the associated costs and yield issues suggest future advancements will face economic limitations.
• First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule — DigiTimes, 2026-10-23
  The US FCC prohibited two electronic devices from entering the US market due to the presence of surveillance chips from Huawei's HiSilicon.
• Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap — DigiTimes, 2026-10-23
  Samsung Electronics ordered final equipment to boost its Texas foundry fab's 2nm capacity to 20,000 wafers per month by the second half of 2027.
• Rapidus courts US AI customers ahead of planned 2H27 2nm mass production — DigiTimes, 2026-10-23
  Rapidus plans to commence 2nm chip mass production in the second half of 2027, with initial demand anticipated primarily from the US AI sector.
• US signs up to US$389 million in CHIPS R&D deals for power chips and fusion — DigiTimes, 2026-10-23
  The US Department of Commerce awarded federal R&D funds totaling $389 million through the CHIPS Act to companies focused on power management semiconductors and related materials.
• Why is TSMC suddenly looking at Texas? — DigiTimes, 2026-10-23
  TSMC is evaluating Texas as a potential location for future US manufacturing capacity and considering a cooperative agreement with Terafab.
• Samsung Foundry targets automotive, edge AI chips with 8LPU+ — DigiTimes, 2026-10-23
  Samsung Foundry plans to utilize its established 8-nanometer process for a second generation of chips targeting automotive and edge AI applications.
• Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B — DigiTimes, 2026-10-22
  Chi Yi Hsin Technology has reported a substantial order backlog for its advanced-process and packaging facilities in Arizona, with work continuing through 2028 and visibility to 2030.
• Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges — DigiTimes, 2026-10-22
  Intel is moving forward with equipment installation at its Arizona Fab 62 and advancing construction on its Ohio site amid rising demand for AI data center CPUs.