What Samsung Electronics makes for data centers
public · HQ Suwon, KR · samsung.com
Samsung Electronics manufactures the HBM, DDR5 DRAM, and NAND flash and enterprise SSDs used inside AI servers, along with memory modules and SSD controllers. Its foundry and packaging units also supply advanced-node chip fabrication, 2.5D/3D advanced packaging, and package substrates used in AI accelerators, and it is developing glass-core substrates through its Electro-Mechanics unit.
Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
10 parts across 2 layers · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Leading-edge foundry | manufacturer | inferred | TSMC, Intel | Foundry |
| 2.5D/3D advanced packaging | manufacturer | inferred | TSMC, Intel | |
| Interposers, silicon bridges, RDL | manufacturer | inferred | TSMC, Intel, UMC |
Layer 2 — Memory & storage
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| HBMconstrained | manufacturer | inferred | BESI, Disco, Hanmi Semiconductor, Micron, SK Hynix | |
| DRAM | manufacturer | inferred | Micron, Nanya, SK Hynix, Winbond, CXMT | |
| Memory modules | manufacturer | inferred | ADATA, Micron, Netlist, Penguin Solutions/SMART, SK Hynix, Kingston | |
| CXL controllers & memory expanders | manufacturer | inferred | Astera Labs, Marvell, Microchip, Micron, Montage, Rambus | |
| NAND flash | manufacturer | inferred | Kioxia, Micron, SK Hynix, SanDisk, YMTC | |
| Drives | manufacturer | inferred | Kioxia, Micron, Phison, SK Hynix, SanDisk, Seagate | |
| Controllers | in house | inferred | Kioxia, Marvell, Microchip, Micron, Phison, Silicon Motion | plus in-house at |
Latest feed
- Samsung eyes zHBM products from 2029 as heat remains key hurdle — DigiTimes, 2026-08-28Samsung anticipates its first-generation zHBM products by 2029, noting that heat management remains a primary engineering challenge for stacking HBM over AI accelerators.
- Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production — DigiTimes, 2026-08-28Samsung presented its advanced semiconductor packaging roadmap, focusing on FOPLP using glass substrates and emphasizing AI's role in future research.
Verification: enriched, last verified 2026-08-27. Sources: www.samsung.com · en.wikipedia.org.· Markdown · JSON