What BESI makes for data centers
public
Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
2 parts across 2 layers · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Packaging & bonding equipment | manufacturer | inferred | ASMPT, Applied Materials, Camtek, Disco, Hanmi Semiconductor, KLA | hybrid bonding |
Layer 2 — Memory & storage
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| HBMconstrained | manufacturer | inferred | Disco, Hanmi Semiconductor, Micron, SK Hynix, Samsung Electronics |