What Disco makes for data centers
public · HQ Japan
Disco is a publicly listed company and based in Japan. It appears on 2 parts of the AI data center — Packaging & bonding equipment and HBM — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging and Layer 2 — Memory & storage. Its shares trade on Tokyo Stock Exchange as 6146.T. HBM is flagged as a supply constraint in this catalog.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Packaging & bonding equipment | manufacturer | inferred | ASMPT, Applied Materials, BESI, Camtek, Hanmi Semiconductor, KLA | dicing/grinding |
Layer 2 — Memory & storage
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| HBMconstrained | manufacturer | inferred | BESI, Hanmi Semiconductor, Micron, SK Hynix, Samsung Electronics |
Where Disco sits in the stack
Disco's placements in this catalog cover 2 parts, from layer 1 (compute silicon & packaging) to layer 2 (memory & storage). One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- HBMconstrained — High-bandwidth memory stacked directly on the same package as an AI accelerator, giving the GPU or ASIC very fast, close-range access to the memory it needs to stay fed.
- Packaging & bonding equipment — The bonding, dicing, inspection, and molding equipment used to physically assemble and verify advanced chip packages.
Closest peers in this catalog
Questions about Disco
- What does Disco make for AI data centers?
- This catalog places Disco on 2 parts: Packaging & bonding equipment (manufacturer) and HBM (manufacturer).
- Is Disco publicly traded?
- Yes — Disco is listed on Tokyo Stock Exchange under 6146.T. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Disco based?
- Japan, per the company record in this catalog.
- Who else makes packaging & bonding equipment for AI data centers?
- ASMPT, Applied Materials, BESI, Camtek, Hanmi Semiconductor and KLA are also placed on Packaging & bonding equipment in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Disco the mix is 2 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.