What Hanmi Semiconductor makes for data centers
public · HQ South Korea
Hanmi Semiconductor is a publicly listed company and based in South Korea. It appears on 2 parts of the AI data center — Packaging & bonding equipment and HBM — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging and Layer 2 — Memory & storage. Its shares trade on Korea Exchange (KOSPI) as 042700.KS. HBM is flagged as a supply constraint in this catalog.
Listing
Korea Exchange (KOSPI): 042700.KS· 191000 KRW -0.78% · mkt cap 18.12T KRW
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
2 parts across 2 layers · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Packaging & bonding equipment | manufacturer | inferred | ASMPT, Applied Materials, BESI, Camtek, Disco, KLA | HBM TC bonders |
Layer 2 — Memory & storage
Where Hanmi Semiconductor sits in the stack
Hanmi Semiconductor's placements in this catalog cover 2 parts, from layer 1 (compute silicon & packaging) to layer 2 (memory & storage). One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- HBMconstrained — High-bandwidth memory stacked directly on the same package as an AI accelerator, giving the GPU or ASIC very fast, close-range access to the memory it needs to stay fed.
- Packaging & bonding equipment — The bonding, dicing, inspection, and molding equipment used to physically assemble and verify advanced chip packages.
Closest peers in this catalog
Latest feed
- Hanmi Semiconductor establishes US hub to support AI packaging customers — DigiTimes, 2026-10-20Hanmi Semiconductor has opened a US subsidiary in Silicon Valley to meet the growing demand for advanced semiconductor packaging equipment fueled by AI chip expansion.
- Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup — DigiTimes, 2026-10-19Hanmi plans to launch a wide Thermal Compression Bonder by 2027 and is also expanding its offerings for 2.5D AI chip packaging.
- Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion — DigiTimes, 2026-10-08Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment.
- Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging — DigiTimes, 2026-09-22Hanmi Semiconductor shipped its first FC Bonder 75 to a client, expanding its packaging services beyond HBM into general semiconductor packaging.
- Hanmi Semiconductor reportedly lands first back-end foothold at Terafab — DigiTimes, 2026-09-16Hanmi Semiconductor reportedly secured an order to supply advanced packaging equipment to Terafab, marking its entry into the planned US semiconductor project.
- Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands — DigiTimes, 2026-09-05Hanmi Semiconductor successfully qualified its 2.5D packaging bonder equipment for a Taiwanese foundry, bolstering its position in the advanced packaging supply chain.
Questions about Hanmi Semiconductor
- What does Hanmi Semiconductor make for AI data centers?
- This catalog places Hanmi Semiconductor on 2 parts: Packaging & bonding equipment (manufacturer) and HBM (manufacturer).
- Is Hanmi Semiconductor publicly traded?
- Yes — Hanmi Semiconductor is listed on Korea Exchange (KOSPI) under 042700.KS. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Hanmi Semiconductor based?
- South Korea, per the company record in this catalog.
- Who else makes packaging & bonding equipment for AI data centers?
- ASMPT, Applied Materials, BESI, Camtek, Disco and KLA are also placed on Packaging & bonding equipment in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Hanmi Semiconductor the mix is 1 disclosed and 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.