https://gridtochip.site/companies/hanmi-semiconductor News and posts about Hanmi Semiconductor on GridToChip https://www.digitimes.com/news/a20261020VL205/hanmi-packaging-subsidiary-silicon-valley-equipment.html Tue, 20 Oct 2026 01:54:57 GMT Hanmi Semiconductor has opened a US subsidiary in Silicon Valley to meet the growing demand for advanced semiconductor packaging equipment fueled by AI chip expansion. (DigiTimes) https://www.digitimes.com/news/a20261019PD215/equipment-packaging-hanmi-ai-chip-hbm.html Mon, 19 Oct 2026 02:35:00 GMT Hanmi plans to launch a wide Thermal Compression Bonder by 2027 and is also expanding its offerings for 2.5D AI chip packaging. (DigiTimes) https://www.digitimes.com/news/a20261008VL214/samsung-hanmi-substrate-expansion-equipment.html Thu, 08 Oct 2026 04:21:55 GMT Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment. (DigiTimes) https://www.digitimes.com/news/a20260922PD231/hanmi-packaging-equipment-hbm-osat.html Tue, 22 Sep 2026 06:56:26 GMT Hanmi Semiconductor shipped its first FC Bonder 75 to a client, expanding its packaging services beyond HBM into general semiconductor packaging. (DigiTimes) https://www.digitimes.com/news/a20260916VL207/hanmi-equipment-packaging-manufacturing-investment.html Wed, 16 Sep 2026 03:49:52 GMT Hanmi Semiconductor reportedly secured an order to supply advanced packaging equipment to Terafab, marking its entry into the planned US semiconductor project. (DigiTimes) https://www.digitimes.com/news/a20260904VL217/packaging-hanmi-taiwan-outsourcing-production.html Sat, 05 Sep 2026 22:46:00 GMT Hanmi Semiconductor successfully qualified its 2.5D packaging bonder equipment for a Taiwanese foundry, bolstering its position in the advanced packaging supply chain. (DigiTimes)