Samsung Electronics https://ai-dc-parts.pages.dev/companies/samsung-electronics News and posts about Samsung Electronics on AI Data Center Parts Samsung eyes zHBM products from 2029 as heat remains key hurdle https://www.digitimes.com/news/a20260828VL208/samsung-bandwidth-packaging-3d-president.html Fri, 28 Aug 2026 03:45:00 GMT Samsung anticipates its first-generation zHBM products by 2029, noting that heat management remains a primary engineering challenge for stacking HBM over AI accelerators. (DigiTimes) Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production https://www.digitimes.com/news/a20260828PD216/samsung-foplp-panel-packaging-production.html Fri, 28 Aug 2026 03:08:37 GMT Samsung presented its advanced semiconductor packaging roadmap, focusing on FOPLP using glass substrates and emphasizing AI's role in future research. (DigiTimes)