What Zhen Ding makes for data centers
public
Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
2 parts across 2 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substrates | manufacturer | inferred | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB |
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| High-layer-count PCBs | manufacturer | inferred | AT&S, Compeq, Dongshan, Gold Circuit GCE, ISU Petasys, Ibiden |
Monthly revenue (TWSE/TPEx filing)
| Month | Revenue (TWD m) | MoM | YoY |
|---|---|---|---|
| 2026-07 | 17,601 | 3.3% | 31.8% |