What Zhen Ding makes for data centers
public · HQ Taiwan
Zhen Ding is a publicly listed company and based in Taiwan. It appears on 2 parts of the AI data center — ABF / high-layer package substrates and High-layer-count PCBs — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging and Layer 4 — Servers, racks & integration. Its shares trade on Taiwan Stock Exchange as 4958.TW. ABF / high-layer package substrates is flagged as a supply constraint in this catalog.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substratesconstrained | manufacturer | disclosed | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB |
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| High-layer-count PCBs | manufacturer | inferred | AT&S, Compeq, Dongshan, Gold Circuit GCE, ISU Petasys, Ibiden |
Where Zhen Ding sits in the stack
Zhen Ding's placements in this catalog cover 2 parts, from layer 1 (compute silicon & packaging) to layer 4 (servers, racks & integration). One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- ABF / high-layer package substratesconstrained — The high-layer-count ABF substrates that an advanced chip package is mounted on, sitting between the interposer and the server board.
- High-layer-count PCBs — The bare printed circuit boards themselves — high-density interconnect, backdrilled, 20 to 40 copper layers — that GPU and switch trays are built on.
Closest peers in this catalog
Monthly revenue (TWSE/TPEx filing)
| Month | Revenue (TWD m) | MoM | YoY |
|---|---|---|---|
| 2026-09 | 26,358 | 27.5% | 36.1% |
| 2026-08 | 20,666 | 17.4% | 41.1% |
| 2026-07 | 17,601 | 3.3% | 31.8% |
Latest feed
- Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand — DigiTimes, 2026-09-02Zhen Ding has introduced 1.6T optical modules and 34-layer AI server boards designed for next-generation AI infrastructure.
Questions about Zhen Ding
- What does Zhen Ding make for AI data centers?
- This catalog places Zhen Ding on 2 parts: ABF / high-layer package substrates (manufacturer) and High-layer-count PCBs (manufacturer).
- Is Zhen Ding publicly traded?
- Yes — Zhen Ding is listed on Taiwan Stock Exchange under 4958.TW. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Zhen Ding based?
- Taiwan, per the company record in this catalog.
- Who else makes ABF / high-layer package substrates for AI data centers?
- AT&S, Daeduck, Ibiden, Kinsus, LG Innotek and Nan Ya PCB are also placed on ABF / high-layer package substrates in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Zhen Ding the mix is 1 disclosed and 1 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.