What AT&S makes for data centers
public
Listing
Snapshot 2026-08-28T02:17:39Z — nightly, not real-time. · Chart on TradingView ↗
Exposure
2 parts across 2 layers
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substrates | manufacturer | inferred | Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB, Samsung Electro-Mechanics |
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| High-layer-count PCBs | manufacturer | inferred | Compeq, Dongshan, Gold Circuit GCE, ISU Petasys, Ibiden, Kingboard |