What Unimicron makes for data centers
public · HQ Taiwan
Unimicron is a publicly listed company and based in Taiwan. It appears on 3 parts of the AI data center — ABF / high-layer package substrates, Glass-core substrates and High-layer-count PCBs — in the role of manufacturer. Those parts sit in Layer 1 — Compute silicon & packaging and Layer 4 — Servers, racks & integration. Its shares trade on Taiwan Stock Exchange as 3037.TW. ABF / high-layer package substrates is flagged as a supply constraint in this catalog.
Listing
Taiwan Stock Exchange: 3037.TW· 1085 TWD -1.36% · mkt cap 1.78T TWD
Snapshot 2026-10-25T10:41:17Z — nightly, not real-time.· Chart on TradingView ↗
Exposure
3 parts across 2 layers · 1 constrained
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substratesconstrained | manufacturer | disclosed | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB | |
| Glass-core substrates | manufacturer | inferred | AGC, Corning, Intel, Samsung Electro-Mechanics, Absolics |
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| High-layer-count PCBs | manufacturer | inferred | AT&S, Compeq, Dongshan, Gold Circuit GCE, ISU Petasys, Ibiden |
Where Unimicron sits in the stack
Unimicron's placements in this catalog cover 3 parts, from layer 1 (compute silicon & packaging) to layer 4 (servers, racks & integration). One of them is tagged constrained, meaning a sourced shortage rather than a long lead time. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- ABF / high-layer package substratesconstrained — The high-layer-count ABF substrates that an advanced chip package is mounted on, sitting between the interposer and the server board.
- Glass-core substrates — Substrates that use a glass core instead of an organic laminate, an emerging alternative aimed at the largest, most demanding AI packages.
- High-layer-count PCBs — The bare printed circuit boards themselves — high-density interconnect, backdrilled, 20 to 40 copper layers — that GPU and switch trays are built on.
Closest peers in this catalog
Seen in real machines
Unimicron is named in 1 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine.
- Nvidia GB300 NVL72 · rack teardown
- ABF substrate
- Compute-tray PCB
Monthly revenue (TWSE/TPEx filing)
| Month | Revenue (TWD m) | MoM | YoY |
|---|---|---|---|
| 2026-09 | 18,651 | 5.1% | 64.7% |
| 2026-08 | 17,746 | 9.2% | 56.3% |
| 2026-07 | 16,254 | 9.1% | 43.7% |
| 2026-06 | 14,897 | 6.0% | 36.3% |
| 2026-05 | 14,060 | 0.9% | 32.4% |
| 2026-04 | 13,933 | 6.5% | 27.6% |
| 2026-03 | 13,079 | 12.7% | 23.3% |
| 2026-02 | 11,600 | -9.1% | 16.2% |
| 2026-01 | 12,767 | 8.0% | 34.5% |
| 2025-12 | 11,822 | 2.4% | 26.9% |
| 2025-11 | 11,541 | 1.9% | 20.4% |
| 2025-10 | 11,327 | % | 8.1% |
From the blog
Latest feed
- Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains — DigiTimes, 2026-10-22Unimicron warned that the rapid increase in AI demand is straining the PCB supply chain due to equipment constraints, short development cycles, and overlapping capacity bookings.
- TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote — DigiTimes, 2026-10-10The TPCA Show 2026 will feature a keynote from Unimicron focusing on advancements in substrate materials and high-layer-count packaging for AI computing.
- Unimicron expands ABF substrate capacity with NT$10B Hukou land deal — DigiTimes, 2026-10-01Unimicron is expanding its ABF substrate production capacity by securing a NT$10B land deal in Hukou.
- Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape — DigiTimes, 2026-09-18The Taoyuan City Government plans to develop a 40-hectare high-end IC substrate zone in the Aerotropolis, intending to start joint land preparation with manufacturers in 2028.
- AI substrate shortages widen as Unimicron signals capacity support through 2029 — DigiTimes, 2026-09-03Unimicron confirmed it is working to alleviate the shortage of AI substrates, providing capacity support for MediaTek through 2029, at Semicon Taiwan 2026.
- Key Nvidia and Intel supplier raided over alleged China origin fraud — Unimicron faces probe over PCB origin washing, risk of 40% U.S. tariff penalty — Tom's Hardware, 2026-08-31Prosecutors are investigating Unimicron for allegedly shipping and mislabeling China-made PCBs as Taiwanese products, which are critical components for major tech companies like Nvidia and Intel.
- Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector — DigiTimes, 2026-08-31Investigations into IC substrate maker Unimicron highlight increased scrutiny of cross-border manufacturing practices in Taiwan's electronics industry.
- Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row — DigiTimes, 2026-08-31The chairman of Gudeng Precision Industrial asserted that the trust placed in Taiwan by international customers is crucial to maintaining its role in global supply chains, referencing a controversy involving PCB maker Unimicron.
- Update: ABF substrate maker Unimicron searched in origin-labeling probe — DigiTimes, 2026-08-28A probe investigating origin labeling for ABF substrate manufacturers has been updated.
Questions about Unimicron
- What does Unimicron make for AI data centers?
- This catalog places Unimicron on 3 parts: ABF / high-layer package substrates (manufacturer), Glass-core substrates (manufacturer) and High-layer-count PCBs (manufacturer).
- Is Unimicron publicly traded?
- Yes — Unimicron is listed on Taiwan Stock Exchange under 3037.TW. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is Unimicron based?
- Taiwan, per the company record in this catalog.
- Who else makes ABF / high-layer package substrates for AI data centers?
- AT&S, Daeduck, Ibiden, Kinsus, LG Innotek and Nan Ya PCB are also placed on ABF / high-layer package substrates in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For Unimicron the mix is 1 disclosed and 2 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.