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<title>GlobalFoundries</title>
<link>https://gridtochip.site/companies/globalfoundries</link>
<description>News and posts about GlobalFoundries on GridToChip</description>
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<title>DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge</title>
<link>https://www.digitimes.com/news/a20261019PD235/microsoft-tsmc-2nm-intel-digitimes.html</link>
<pubDate>Mon, 19 Oct 2026 08:55:00 GMT</pubDate>
<description>Microsoft's Maia 300 is highlighted as a leader in the 2nm race, while TSMC's US strategy is changing and Intel's EMIB-T packaging is reportedly encountering yield issues. (DigiTimes)</description>
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<title>Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China</title>
<link>https://www.digitimes.com/news/a20261016PD220/capacity-globalfoundries-packaging-tsmc-wafer.html</link>
<pubDate>Fri, 16 Oct 2026 03:53:56 GMT</pubDate>
<description>The agreement between TSMC and GF suggests that advanced packaging techniques, such as those involving 2.5D/3D integration and interposers, are being applied to mature semiconductor nodes, which impacts the electronics supply chain. (DigiTimes)</description>
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<title>Japan Offers GlobalFoundries $21B for U.S. Fab Expansion</title>
<link>https://www.eetimes.com/japan-offers-globalfoundries-21b-for-u-s-fab-expansion</link>
<pubDate>Thu, 15 Oct 2026 19:00:00 GMT</pubDate>
<description>Japan has proposed a $21 billion investment to support the expansion of GlobalFoundries' U.S. fabrication facility. (EE Times)</description>
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<title>Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem</title>
<link>https://www.digitimes.com/news/a20261015PD220/tsmc-globalfoundries-cowos-manufacturing-silicon.html</link>
<pubDate>Thu, 15 Oct 2026 04:00:19 GMT</pubDate>
<description>GlobalFoundries has signed a multi-year agreement with TSMC to provide silicon interposer capacity for its CoWoS advanced packaging ecosystem at its Malta facility. (DigiTimes)</description>
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<title>GlobalFoundries to build and operate two new chip fabs in NY as part of $21bn US-Japan deal</title>
<link>https://www.datacenterdynamics.com/en/news/globalfoundries-to-build-and-operate-two-new-chip-fabs-in-ny-as-part-of-21bn-us-japan-deal</link>
<pubDate>Wed, 14 Oct 2026 15:11:46 GMT</pubDate>
<description>GlobalFoundries will construct and operate two new semiconductor fabrication facilities in New York as part of a $21 billion investment agreement with Japan. (Data Center Dynamics)</description>
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<title>GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET</title>
<link>https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-unveils-7nm-class-fdx-fusion-node-fd-soi-node-doubles-22fdx-transistor-density-comes-7-years-after-firm-abandoned-finfet</link>
<pubDate>Mon, 12 Oct 2026 14:30:00 GMT</pubDate>
<description>GlobalFoundries has announced the development of a 7nm-class FDX Fusion process node using FD-SOI technology, with production slated to begin in 2028. (Tom's Hardware)</description>
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<title>Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI</title>
<link>https://www.eetimes.com/manfred-horstmann-globalfoundries-bets-on-fdx-fusion-for-physical-ai</link>
<pubDate>Fri, 09 Oct 2026 22:00:00 GMT</pubDate>
<description>GlobalFoundries is leveraging its FDX fusion technology to support the manufacturing of high-performance silicon for physical AI applications. (EE Times)</description>
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<title>GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap</title>
<link>https://www.digitimes.com/news/a20261009VL200/tsmc-globalfoundries-packaging-cowos-silicon.html</link>
<pubDate>Fri, 09 Oct 2026 02:43:17 GMT</pubDate>
<description>GlobalFoundries has secured a $2 billion deal from TSMC to manufacture interposers, addressing a supply gap in the US semiconductor packaging market. (DigiTimes)</description>
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<title>GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion</title>
<link>https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion</link>
<pubDate>Thu, 08 Oct 2026 18:23:28 GMT</pubDate>
<description>GlobalFoundries has signed a $2 billion, five-year agreement to manufacture silicon interposers in the United States for TSMC's CoWoS packaging technology. (Tom's Hardware)</description>
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<title>GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US</title>
<link>https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion</link>
<pubDate>Thu, 08 Oct 2026 18:23:28 GMT</pubDate>
<description>GlobalFoundries has announced it will manufacture silicon interposers in the United States to support TSMC's CoWoS advanced packaging technology. (Tom's Hardware)</description>
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<title>TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal</title>
<link>https://www.theregister.com/systems/2026/10/08/tsmc-taps-globalfoundries-to-bolster-us-silicon-interposer-production-in-2b-deal/5302061</link>
<pubDate>Thu, 08 Oct 2026 17:22:32 GMT</pubDate>
<description>TSMC has entered into a $2 billion agreement with GlobalFoundries to increase the production of silicon interposers within the United States. (The Register)</description>
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<title>GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components</title>
<link>https://www.datacenterdynamics.com/en/news/globalfoundries-signs-2bn-five-year-deal-with-tsmc-for-production-of-advanced-packaging-components</link>
<pubDate>Thu, 08 Oct 2026 15:07:16 GMT</pubDate>
<description>GlobalFoundries has entered into a $2 billion, five-year agreement with TSMC specifically for the production of advanced packaging components. (Data Center Dynamics)</description>
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<title>Quantum firm Xanadu partners with GlobalFoundries for photonic component development</title>
<link>https://www.datacenterdynamics.com/en/news/quantum-firm-xanadu-partners-with-globalfoundries-for-photonic-component-development</link>
<pubDate>Wed, 07 Oct 2026 12:06:13 GMT</pubDate>
<description>Quantum computing company Xanadu has partnered with GlobalFoundries to develop photonic components, likely leveraging advanced foundry capabilities for silicon photonics. (Data Center Dynamics)</description>
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<title>Xanadu and GlobalFoundries Partner to Scale Photonic Quantum Chip Production</title>
<link>https://www.hpcwire.com/off-the-wire/xanadu-and-globalfoundries-partner-to-scale-photonic-quantum-chip-production</link>
<pubDate>Tue, 06 Oct 2026 12:57:48 GMT</pubDate>
<description>Xanadu and GlobalFoundries have established a partnership to scale the production of photonic quantum chips. (HPCwire)</description>
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<title>Singapore deepens chip R&amp;amp;D ties with Applied Materials, KLA and GlobalFoundries</title>
<link>https://www.digitimes.com/news/a20260925PD201/kla-applied-materials-globalfoundries-manufacturing-silicon.html</link>
<pubDate>Fri, 25 Sep 2026 09:15:59 GMT</pubDate>
<description>Singapore is expanding its semiconductor R&amp;D ecosystem, focusing on advanced packaging and silicon photonics with partners like Applied Materials, KLA, and GlobalFoundries. (DigiTimes)</description>
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<title>Singapore brands its chip sector as it tries to move up from manufacturing</title>
<link>https://www.digitimes.com/news/a20260925PD201/kla-applied-materials-globalfoundries-manufacturing-silicon.html</link>
<pubDate>Fri, 25 Sep 2026 09:15:59 GMT</pubDate>
<description>Singapore is strengthening its semiconductor industry by increasing R&amp;D collaboration with companies like Applied Materials, KLA, and GlobalFoundries, focusing on advanced packaging and silicon photonics. (DigiTimes)</description>
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<title>GlobalFoundries and Marvell sign multi-year development agreement for optical technologies</title>
<link>https://www.datacenterdynamics.com/en/news/globalfoundries-and-marvell-sign-multi-year-development-agreement-for-optical-technologies</link>
<pubDate>Mon, 21 Sep 2026 10:53:05 GMT</pubDate>
<description>GlobalFoundries and Marvell have entered into a multi-year agreement to expand silicon germanium capacity at the GlobalFoundries facility in Burlington, Vermont. (Data Center Dynamics)</description>
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<title>GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity</title>
<link>https://www.digitimes.com/news/a20260918VL208/marvell-globalfoundries-technology-capacity-data.html</link>
<pubDate>Fri, 18 Sep 2026 01:56:11 GMT</pubDate>
<description>GlobalFoundries and Marvell Technology increased their production capacity for SiGe technology to meet the demand for optical connectivity in AI data centers. (DigiTimes)</description>
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<title>Marvell pushes GlobalFoundries to light up wafer production</title>
<link>https://www.theregister.com/systems/2026/09/18/marvell-pushes-globalfoundries-to-light-up-wafer-production/5297340</link>
<pubDate>Thu, 17 Sep 2026 23:16:53 GMT</pubDate>
<description>Marvell stated that GlobalFoundries must improve its supply side to support its ambitious growth plans. (The Register)</description>
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<title>GlobalFoundries and Marvell Expand Collaboration for Next-Gen Optical Connectivity</title>
<link>https://www.hpcwire.com/off-the-wire/globalfoundries-and-marvell-expand-collaboration-for-next-gen-optical-connectivity</link>
<pubDate>Thu, 17 Sep 2026 13:59:40 GMT</pubDate>
<description>GlobalFoundries and Marvell entered a multi-year agreement to boost capacity for SiGe technology for next-generation optical connectivity. (HPCwire)</description>
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<title>As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics</title>
<link>https://www.digitimes.com/news/a20260915VL227/silicon-photonics-globalfoundries-data-expo.html</link>
<pubDate>Wed, 16 Sep 2026 00:28:56 GMT</pubDate>
<description>GlobalFoundries showcased a miniature transceiver that signals the industry's transition from copper cabling to optical interconnects, driven by AI demand. (DigiTimes)</description>
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<title>Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached</title>
<link>https://www.digitimes.com/news/a20260909PR207/worldwide-funding-quantum-computing-hardware-technology.html</link>
<pubDate>Wed, 09 Sep 2026 06:55:00 GMT</pubDate>
<description>The US government finalized a major set of contracts totaling US$775 million under the CHIPS Act, providing funding for GlobalFoundries and several quantum computing companies, which includes mandated equity participation. (DigiTimes)</description>
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<title>GlobalFoundries Finalizes $375M CHIPS Funding Agreement for Quantum R&amp;D</title>
<link>https://www.hpcwire.com/off-the-wire/globalfoundries-finalizes-375m-chips-funding-agreement-for-quantum-rd</link>
<pubDate>Tue, 08 Sep 2026 15:34:35 GMT</pubDate>
<description>GlobalFoundries secured a $375 million research and development award from the Department of Commerce's CHIPS Office to advance its Quantum Technology Solutions. (HPCwire)</description>
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<title>Infineon COO leaves a US fab open, says GlobalFoundries, ESMC already cover it</title>
<link>https://www.digitimes.com/news/a20260907PD223/infineon-outsourcing-capacity-2026-production.html</link>
<pubDate>Tue, 08 Sep 2026 01:17:51 GMT</pubDate>
<description>Infineon COO highlighted the balance between in-house production, outsourcing, and global expansion, noting that GlobalFoundries and ESMC currently address the needs of a specific US fab. (DigiTimes)</description>
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<title>GlobalFoundries and RAAAM Tape Out GCRAM Test Chip on FDX Platform</title>
<link>https://www.hpcwire.com/off-the-wire/globalfoundries-and-raaam-tape-out-gcram-test-chip-on-fdx-platform</link>
<pubDate>Thu, 03 Sep 2026 12:19:40 GMT</pubDate>
<description>GlobalFoundries and RAAAM Memory Technologies began a collaboration to develop Gain-Cell RAM (GCRAM) by successfully submitting a test chip on GlobalFoundries’ FDX FD-SOI platform. (HPCwire)</description>
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