What TE Connectivity makes for data centers
public · HQ Galway, Switzerland · te.com
TE Connectivity makes DAC/ACC/AEC copper cables, board-level connectors and sockets, OSFP/QSFP cages, and NVLink backplane and spine cartridges for AI server interconnect, sold through its Digital Data Networks segment. The company redomiciled from Switzerland to Ireland in September 2024.
Parts, by layer
Layer 3 — Networking & interconnect
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Copper: DAC / ACC / AEC cables | manufacturer | inferred | Amphenol, Bizlink, Credo, Foxconn Interconnect, Luxshare, Volex | |
| NVLink copper spine / backplane cartridges | manufacturer | reported | Amphenol, Bizlink, Foxconn Interconnect, Luxshare |
Layer 4 — Servers, racks & integration
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| Board-level connectors & sockets | manufacturer | inferred | Aces, Amphenol, Bizlink, Foxconn Interconnect, Hirose, JAE | |
| OSFP/QSFP cages | manufacturer | inferred | Amphenol, Molex |
Where TE Connectivity sits in the stack
TE Connectivity's placements in this catalog cover 4 parts, from layer 3 (networking & interconnect) to layer 4 (servers, racks & integration). None of them currently carries a sourced supply constraint tag. Across these parts it overlaps with other companies most often on the lines below.
What these parts are
- Copper: DAC / ACC / AEC cables — High-speed copper cable assemblies — DAC, ACC, and AEC types — that link GPUs, NICs, and switches over short distances as a lower-cost alternative to optical transceivers.
- NVLink copper spine / backplane cartridges — The copper cable assemblies and backplane cartridges that physically wire the scale-up fabric together inside a rack, most visible in Nvidia's NVL72 architecture.
- Board-level connectors & sockets — The physical connectors — CPU and GPU sockets, board-to-board and cable connectors, and I/O cages — that link chips, trays and cables together on and between boards.
- OSFP/QSFP cages — The metal cages mounted on switch and NIC boards that mechanically receive and shield pluggable OSFP or QSFP optical and copper transceiver modules.
Closest peers in this catalog
Seen in real machines
TE Connectivity is named in 1 of the rack teardowns and supercomputer breakdowns on this site. Each line below is a piece of that machine.
- Nvidia GB300 NVL72 · rack teardown
- NVLink copper spine and backplane cartridges (~5,000 cables)*
- Sockets and board connectors
- DAC / ACC / AEC cables
Questions about TE Connectivity
- What does TE Connectivity make for AI data centers?
- This catalog places TE Connectivity on 4 parts: Copper: DAC / ACC / AEC cables (manufacturer), NVLink copper spine / backplane cartridges (manufacturer), Board-level connectors & sockets (manufacturer) and OSFP/QSFP cages (manufacturer).
- Is TE Connectivity publicly traded?
- Yes — TE Connectivity is listed on US exchanges (NYSE/Nasdaq) under TEL. Prices shown on this page are a nightly snapshot, not real-time, and nothing here is investment advice.
- Where is TE Connectivity based?
- Galway, Switzerland, per the company record in this catalog.
- Who else makes copper: DAC / ACC / AEC cables for AI data centers?
- Amphenol, Bizlink, Credo, Foxconn Interconnect, Luxshare and Volex are also placed on Copper: DAC / ACC / AEC cables in this catalog.
- How well sourced are these placements?
- Every part→company placement carries a confidence tag. For TE Connectivity the mix is 1 reported and 3 inferred. "disclosed" means the company or a filing says so; "reported" comes from trade press or a reference-design list; "inferred" is a lead from the taxonomy with no citation yet. Treat reported and inferred as leads, not facts.
Answers are generated from this catalog's own rows — see sources & method.
Verification: enriched, last verified 2026-08-27. Sources: www.te.com · investors.te.com.· Markdown · JSON