Amphenol vs TE Connectivity
Amphenol and TE Connectivity are both placed on 4 of the same AI data center parts in this catalog, spanning layers 3, 4. Amphenol appears on 5 parts in total and TE Connectivity on 4.
At a glance
| Amphenol | TE Connectivity | |
|---|---|---|
| Ownership | public | public |
| Headquarters | Wallingford, United States | Galway, Switzerland |
| Primary listing | APH | TEL |
| Market cap | 182.7B USD | 60.3B USD |
| Parts placed | 5 | 4 |
| Layers covered | 2 | 2 |
| Units / subsidiaries | 0 | 0 |
| Seen in machines | 1 | 1 |
Market caps are a nightly snapshot in each listing's own currency, never converted.
What the shared parts are
- Copper: DAC / ACC / AEC cables — High-speed copper cable assemblies — DAC, ACC, and AEC types — that link GPUs, NICs, and switches over short distances as a lower-cost alternative to optical transceivers.
- NVLink copper spine / backplane cartridges — The copper cable assemblies and backplane cartridges that physically wire the scale-up fabric together inside a rack, most visible in Nvidia's NVL72 architecture.
- Board-level connectors & sockets — The physical connectors — CPU and GPU sockets, board-to-board and cable connectors, and I/O cages — that link chips, trays and cables together on and between boards.
- OSFP/QSFP cages — The metal cages mounted on switch and NIC boards that mechanically receive and shield pluggable OSFP or QSFP optical and copper transceiver modules.
The 4 parts both make
| Part | Amphenol | TE Connectivity |
|---|---|---|
| Copper: DAC / ACC / AEC cables Layer 3 — Networking & interconnect | manufacturer inferred | manufacturer inferred |
| NVLink copper spine / backplane cartridges Layer 3 — Networking & interconnect | manufacturer reported | manufacturer reported |
| Board-level connectors & sockets Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
| OSFP/QSFP cages Layer 4 — Servers, racks & integration | manufacturer inferred | manufacturer inferred |
Only Amphenol
- In-rack busbar & power whips layer 4
Only TE Connectivity
Every part TE Connectivity is placed on is shared with the other company.
Named in the same machines
- Nvidia GB300 NVL72 rack teardown
Questions
- Do Amphenol and TE Connectivity compete?
- In this catalog they are both placed on 4 of the same parts, across 2 layers: Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Board-level connectors & sockets, OSFP/QSFP cages. Sharing a part does not mean selling the same product to the same buyer, so read each row's product note.
- Which has more placements, Amphenol or TE Connectivity?
- Amphenol has 5 placements and TE Connectivity has 4. Placement counts reflect how thoroughly each company has been catalogued as well as its real breadth, so they are not a ranking.
Generated from the catalog's part-to-company table. Each placement is tagged disclosed, reported or inferred; see sources & method. Neither company is endorsed or ranked here.