4.12a · part of Power shelves & PSUs
Who makes gan and sic inside for AI data centers
Wide-bandgap gallium-nitride and silicon-carbide power devices used inside the power shelf's AC-DC and DC-DC conversion stages for higher efficiency and power density than silicon.
Companies on this part (5)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Infineon | manufacturer | public | IFX.DE | 57.17 EUR | +3.6% | inferred | |
| Navitas | manufacturer | public | NVTS | 12.51 USD | -5.0% | inferred | |
| onsemi | manufacturer | public | ON | 74.80 USD | +0.2% | inferred | |
| Wolfspeed | manufacturer | public | WOLF | 26.95 USD | -3.1% | inferred | |
| EPC | manufacturer | private | inferred |
Who competes here
The same table read the other way: every company above competes for gan and sic inside sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Nearby parts
- Parent: Power shelves & PSUs
- Previous in layer: Timing, security & misc board silicon
- Next in layer: Fans
- Layer: Layer 4 — Servers, racks & integration
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON