4.06a · part of Copper-clad laminate & PCB materials
Who makes copper foil for AI data centers
The rolled or electrodeposited copper foil bonded to laminate cores that forms the actual conductive layers inside a PCB.
Companies on this part (3)
| Company | Role | Ownership | Ticker | Price | 1d | Confidence | Note |
|---|---|---|---|---|---|---|---|
| Furukawa | manufacturer | public | 5801.T | 4042 JPY | -0.9% | inferred | |
| Mitsui Kinzoku | manufacturer | public | 5706.T | 29150 JPY | +1.3% | inferred | |
| Chang Chun | manufacturer | private | inferred |
Who competes here
The same table read the other way: every company above competes for copper foil sockets. Confidence tags matter — an inferred placement is a lead, not a confirmed rivalry.
Nearby parts
- Parent: Copper-clad laminate & PCB materials
- Previous in layer: High-layer-count PCBs
- Next in layer: Board-level connectors & sockets
- Layer: Layer 4 — Servers, racks & integration
Sources: placements without a source URL come from the taxonomy seed and are tagged accordingly. How this data is built.· Markdown · JSON