AI data center supply chain news — week 37, 2026
366 items · 2026-09-14 to 2026-09-20 ·all news · newer: week 38, 2026 (293) · older: week 36, 2026 (342)
other
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-20SK hynix held a forum to outline its technology vision and future growth strategy for the AI era.
- DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment — DigiTimes, 2026-09-20Increasing complexity and integration of AI accelerators, featuring HBM and chiplets, is pushing the demand for high-end IC substrates with larger surface areas and higher layer counts.
- ACES targets AI compute, power with cable ramp-up — DigiTimes, 2026-09-20Increased demand from AI server buildouts and cloud providers adopting in-house ASICs is driving the need for high-speed interconnects and transmission cables.
- Ampoc AI PCB orders surge as it expands into CPO — DigiTimes, 2026-09-20Ampoc Far-East reported a surge in demand for its high-end PCB wet-process equipment due to AI and HPC applications, leading to capacity that is near fully booked through 2026 and for the next one to two years.
- ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth — DigiTimes, 2026-09-20ACM Research Shanghai plans to grow by focusing on overseas equipment installations and orders for panel-level advanced packaging equipment.
- India roundup: Semicon India 2026 puts commercial production and supplier investment in focus — DigiTimes, 2026-09-20India is transitioning its semiconductor sector from policy focus to active production, driven by government funding and increased investment across the supply chain, including equipment, materials, and testing.
- Jensen Huang says there is '0% chance' AI destroys the world by 2030 — 'We should go as fast as we can, irrespective of anyone else,' dismisses Anthropic doom warnings and rejects new regulations — Tom's Hardware, 2026-09-20Nvidia's CEO stated that concerns about AI posing existential risks should be dismissed and that development should proceed rapidly regardless of regulations.
- Pricing future megawatts: the growing role of earnouts in data center M&A — Data Center Dynamics, 2026-09-20The article discusses the increasing use of earnouts in mergers and acquisitions (M&A) concerning data center power capacity.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Utilities, IPPs & power providers signing data-center deals, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment, Prefab / modular data centers & power/cooling skids, Site utilities, water & fiber entrance, Site selection, power procurement, market intelligence, brokerage
- Google's simulated fruit fly brain 'mines Bitcoin' in web browser proof of concept — FutureBit says real organic neuron miner could have '10x the efficiency of the best silicon 3nm ASICs' — Tom's Hardware, 2026-09-20A project has demonstrated a proof-of-concept for an organic neuron Bitcoin miner based on a simulated fruit fly brain, suggesting potential efficiency improvements over current silicon ASICs.
- Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips — DigiTimes, 2026-09-20Taiwanese equipment suppliers are experiencing growth significantly outpacing chipmakers, primarily due to increased demand for chip testing services.
- Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign — DigiTimes, 2026-09-20Wiwynn is modernizing its server assembly plants by adding collaborative robots and implementing central heat exchange systems to support liquid-cooled rack testing.
- AI boom could leave an e-waste trail that wraps 6 times around Earth — The Register, 2026-09-19The report warns that e-waste estimates focused only on GPUs fail to account for the significant waste generated by power, cooling, and networking infrastructure.
- Elon Musk's Terafab hits a roadblock before making a single chip, receives cease-and-desist order — firm files trademark lawsuit, has sold Tera-Fab-branded lithography tools for over a decade — Tom's Hardware, 2026-09-19Elon Musk's Terafab semiconductor project is facing a legal dispute over the use of the name 'Tera-Fab' by a separate lithography equipment company.
- Interview: Advanced packaging shifts toward system-level co-design for AI — DigiTimes, 2026-09-18Advanced packaging for AI is trending towards system-level co-design, incorporating technologies like co-packaged optics, chiplets, and glass substrates.
- Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight — DigiTimes, 2026-09-18Taiwan's chipmakers are experiencing a strong year, but the performance data indicates that TSMC is not the most impressive performer.
- CXL adds memory capacity, but HBM retains its bandwidth edge — DigiTimes, 2026-09-18While CXL increases memory capacity, industry experts caution that it cannot fully replace the superior bandwidth provided by HBM.
- AMD targets Nvidia with first official benchmarks for EPYC 'Venice' CPUs — company claims 256-core chip is more than twice as fast as Nvidia Vera, 96-core model 20% faster per-core — Tom's Hardware, 2026-09-18AMD benchmarked its EPYC 'Venice' CPUs, claiming significantly higher performance compared to Nvidia's 96-core offering.
- AI’s Compute Scarcity Problem Will Not Be Solved by Data Centers Alone — HPCwire, 2026-09-18The article critiques the industry's focus on building more data centers and buying more GPUs, arguing that addressing AI's compute scarcity requires more than just hardware construction.
- Details about Intel's next-gen Nova Lake CPUs keep leaking — an attempt to establish a timeline based on what we know so far — Tom's Hardware, 2026-09-18This story compiles leaks and rumors concerning the expected release timeline for Intel's next-generation Nova Lake CPUs.
- NSF Launches Microelectronics Initiative for AI, HPC and Advanced Communications — HPCwire, 2026-09-18The NSF announced an initiative to help U.S. manufacturers transition low-dimensional semiconductor technologies into advanced microelectronics for AI and HPC.ASIC design services, IP & EDA, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, PCIe/CXL switches & retimers, Silicon photonics & co-packaged optics, High-layer-count PCBs, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Passives, Timing, security & misc board silicon, Specialty glass & glass fiber, Industrial & specialty gases
- IEEE Honors ORNL Quantum Ecosystem Collaborations — HPCwire, 2026-09-18ORNL was honored by IEEE for its collaborative ecosystem involving government, industry, and academia to tackle complex quantum science problems.
- Hidden costs — Data Center Dynamics, 2026-09-18A guide is being released to help navigate the complexities of the data center supply chain in 2026.
- China's premier memory maker CXMT eyes producing flash for SSDs, report claims — 3D NAND research and development line rumored for its second manufacturing facility near Beijing — Tom's Hardware, 2026-09-18China's memory producer CXMT is rumored to establish a second facility near Beijing to produce 3D NAND flash for solid-state drives.
- DCD Intelligence: Data center expansion is outpacing talent — Data Center Dynamics, 2026-09-18The report indicates that staffing across the data center industry is falling below required operational levels.
- Sponsored: Retrofitting existing data centers for AI: Two practical paths to liquid cooling — Data Center Dynamics, 2026-09-18The article outlines two practical methods for existing data center operators to implement liquid cooling without requiring a full facility overhaul.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software
- Enabling the next generation of AI data centers — Data Center Dynamics, 2026-09-18The planning for future data centers must adapt to anticipated growth driven by the demand for AI infrastructure.
- Gazprom partners with Crypto Energy to deploy modular data center at gas field in Siberia - report — Data Center Dynamics, 2026-09-18Gazprom is partnering with Crypto Energy to build a modular data center utilizing gas from a depleted field in Siberia.
- Oracle signs 1.7GW of wind energy supply agreements to support operations in Texas — Data Center Dynamics, 2026-09-18Oracle secured 1.7GW of wind energy supply via agreements with RWE and Engie to support its operations in Texas.
- Russia claims strikes on De Novo data center in Kyiv, Ukraine — Data Center Dynamics, 2026-09-18Russia reportedly targeted a data center in Kyiv, Ukraine.
- Modder gets Nvidia's DLSS 5 working in a web browser using WebGPU — 147MB browser port runs on non-Nvidia GPUs and macOS but takes two seconds per render — Tom's Hardware, 2026-09-18A developer demonstrated a web browser port of Nvidia's DLSS 5 technology using WebGPU, which successfully ran on non-Nvidia GPUs and macOS.
- ASML snubs Elon Musk-backed particle accelerator chipmaking tech — firm doubles down on 1,000W laser-produced plasma systems for chipmaking tools — Tom's Hardware, 2026-09-18ASML confirmed its focus on laser-produced plasma systems for chipmaking tools rather than adopting particle accelerator technology.
- Blockfusion signs CoreWeave as a customer in Niagara Falls, New York — Data Center Dynamics, 2026-09-18CoreWeave has signed a deal with Blockfusion in Niagara Falls, New York.
- DCD Talks: What 800 VDC means for data center cooling with Mike Donahue, Schneider Electric Global — Data Center Dynamics, 2026-09-18Schneider Electric discussed how moving to 800 VDC architecture impacts data center cooling and overall operational considerations.
- Piecing Together the Indian Electronics and Semiconductor Ecosystem — EE Times, 2026-09-18The article provides an overview of the burgeoning Indian electronics and semiconductor ecosystem, covering topics like the India Semiconductor Mission and quantum computing.
- Corning to raise display glass substrate prices 15% from 4Q26 — DigiTimes, 2026-09-18Corning will raise its prices for display glass substrates globally by 15% starting in Q4 2026.
- Sponsored: The truth about speed to power – and why it matters now more than ever — Data Center Dynamics, 2026-09-18Integrated microgrid control technology fundamentally changes the power landscape for modern data centers.
- Doosan commits KRW968 billion to CCL expansion as demand strains capacity — DigiTimes, 2026-09-18Doosan is making its largest investment to expand copper-clad laminate (CCL) production in South Korea and China due to rising demand from AI accelerators, network switches, and optical modules.
- SK hynix Launches ‘SK hynix Ventures’ in Silicon Valley to Expand Global AI Ecosystem Investment — newsroom:sk-hynix, 2026-09-18SK hynix launched a venture arm in Silicon Valley to increase investments across the global AI ecosystem.
- Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage — DigiTimes, 2026-09-18Samsung deepened its investment relationship with Dutch chip startup Euclyd, which has reportedly reached the test-chip stage at the Samsung Foundry.
- CPO raises PCB downgrade concerns but switches stick with M8 CCL — DigiTimes, 2026-09-18The industry is speculating that increased use of Co-packaged Optics (CPO) may reduce the need for high-speed copper transmission requirements on AI server motherboards.
- Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home — DigiTimes, 2026-09-18Japan and the U.S. are discussing a chip plant that could potentially allow two former chipmaking leaders to jointly rebuild manufacturing capacity.
- Global chipmakers answer India's pitch with equipment, materials, and R&D — not fabs — DigiTimes, 2026-09-18Major chip companies committed to supporting the Indian semiconductor ecosystem by investing in equipment, materials, and R&D centers rather than announcing new fabs.
- Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia — DigiTimes, 2026-09-18Tata Electronics announced 16 MoUs at Semicon India 2026, though most of these agreements were not formally documented by the company.
- Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion — DigiTimes, 2026-09-18The Indian government is promoting the idea that its chip fabrication mission has transitioned from planning to commercial manufacturing, backed by a new US$13.5 billion funding phase.
- Housing slump and plant builds diverge as Tung Ho Steel sees AI demand support — DigiTimes, 2026-09-18Tung Ho Steel noted that although Taiwan's housing slump depressed rebar orders, high-tech investment and plant construction continue to support its section steel and steel structure business.
- Samsung taps Japan for 3.xD chiplet push as packaging race heats up — DigiTimes, 2026-09-18Samsung is strengthening its semiconductor ecosystem with Japan to advance large-area chiplet packaging for AI processors and high-performance computing.
- GaN is winning the AI power argument, not yet the cost battle — DigiTimes, 2026-09-18GaN is becoming a crucial power semiconductor for high-power AI data centers, but industry experts predict it will not fully replace silicon for several years.
- Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push — DigiTimes, 2026-09-18Samsung Display is planning a large investment into an RGB OLED-on-Silicon production line to advance next-generation microdisplay technology for the XR market.
- Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers — DigiTimes, 2026-09-18Micron held a supplier conference focusing on speeding up fab construction and scaling growth, covering structural, MEP, and equipment needs.
- AI's next infrastructure squeeze is storage: Seagate sees demand accelerating — DigiTimes, 2026-09-18A report indicates that AI adoption is rapidly increasing the demand for large-scale data storage and infrastructure.
- Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape — DigiTimes, 2026-09-18The Taoyuan City Government plans to develop a 40-hectare high-end IC substrate zone in the Aerotropolis, intending to start joint land preparation with manufacturers in 2028.
- FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks — DigiTimes, 2026-09-18FIT anticipates strong AI demand and notes that while optical products are starting to ship in 2026, scaling and adoption depend on customer pull.
- Nan Ya accelerates AI materials shift with major capacity expansion — DigiTimes, 2026-09-18Nan Ya Plastics is expanding its role in high-end electronic materials, particularly printed circuit board materials, in response to increasing AI hardware demand.
- Marvell pushes GlobalFoundries to light up wafer production — The Register, 2026-09-17Marvell stated that GlobalFoundries must improve its supply side to support its ambitious growth plans.
- U.S. Awards Anderon $1B for Quantum Wafer Manufacturing — EE Times, 2026-09-17The U.S. government announced a $1 billion award for IBM's Anderon facility to manufacture quantum wafers domestically.
- CEO Le Roux Is ‘Bullish’ on French Supercomputer Maker’s Future — HPCwire, 2026-09-17Bull, a supercomputer company that separated from Atos Group, remains confident in its ability to meet the high-performance computing and AI demands of European companies.
- NSF Expands X-Labs Initiative with 3 Additional Topics — HPCwire, 2026-09-17The National Science Foundation expanded its X-Labs program, inviting proposals for AI applied to physical systems and adding several new topics for 2026.
- The companies that are cooling on gas — Data Center Dynamics, 2026-09-17Data centers may be connected to gas pipelines for energy supply.
- 800VDC protection in data centers — Data Center Dynamics, 2026-09-17The adoption of 800V DC architecture is highlighted for improving data center efficiency for next-generation AI facilities.
- NVIDIA Vera Rubin NVL72 Delivers Leading Performance in MLPerf Inference v6.1 Debut — HPCwire, 2026-09-17An early submission using NVIDIA Vera Rubin NVL72 systems demonstrated significantly improved throughput for AI inference compared to existing NVIDIA GB300 NVL72 systems.
- Microsoft files to develop two-building campus outside Atlanta, Georgia — Data Center Dynamics, 2026-09-17Microsoft plans to expand its campus by developing two new buildings in Union City, Georgia.
- Google considers data center development in New Mexico — Data Center Dynamics, 2026-09-17Google is exploring the possibility of building its first data center facility in New Mexico.
- SK Hynix’s Intel Liaisons: What You Need to Know — EE Times, 2026-09-17The necessity of a deal between Intel and SK Hynix is driven by geopolitical factors rather than technical business requirements.
- Apple eyes Nvidia NVLink to power its new custom M8 Ultra AI servers — historically bitter rivals reportedly team up for 2029 data center push — Tom's Hardware, 2026-09-17Apple is reportedly exploring the use of Nvidia's NVLink Fusion to power its upcoming custom data center servers.
- Google, Nvidia, and Emerald AI found the AI Energy Management Alliance to support demand response capabilities within the data center sector — Data Center Dynamics, 2026-09-17Google, Nvidia, and Emerald AI formed the AI Energy Management Alliance to help data centers manage demand response.
- Magnora joins venture for Estonia data center project — Data Center Dynamics, 2026-09-17Magnora partnered with renewable energy firm Sunly for a new data center project in Estonia.
- Sponsored: Arcadis launches Data Center Growth Lab to build next generation of data center talent — Data Center Dynamics, 2026-09-17Arcadis has launched a Data Center Growth Lab to help develop skilled talent for the industry.
- AMD pivots to China developer ecosystems as Nvidia retreats — DigiTimes, 2026-09-17Due to U.S. export controls causing Nvidia to withdraw from China's high-end AI market, AMD is pivoting its strategy to focus on local developer ecosystems and edge AI platforms.
- UK research agency backs drone-based internet service experiment with lasers, microwaves, and gravity waves used for wireless power — Britain invests $94 million into Starlink alternative — Tom's Hardware, 2026-09-17UK researchers are exploring the use of drones, lasers, and microwaves for a new alternative to satellite internet services.
- SK Hynix looks beyond HBM as inference workloads diversify — DigiTimes, 2026-09-17SK Hynix is diversifying its memory strategy beyond traditional HBM use to support varied inference workloads.
- Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications — DigiTimes, 2026-09-17Industry leaders advised that the future of Physical AI relies more on integrated system deployment than on individual component advancements.
- Samsung bets on zHBM as 2.5D memory nears its limits — DigiTimes, 2026-09-17Samsung Electronics plans to use vertically stacked zHBM to push memory capabilities beyond the physical limitations of traditional 2.5D architectures.
- Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook — DigiTimes, 2026-09-17Topview Optronics expects AI-driven shifts to support its orders through 2026, despite ongoing memory shortages and rising component costs.
- TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership — DigiTimes, 2026-09-17TSMC's donation of 12-inch equipment is contingent on the Taiwanese government adjusting the scope of its research partnership and awaiting budget approval.
- Fujitsu ready to sell its custom ‘Monaka’ Arm chip, maybe to rival server-makers — The Register, 2026-09-17Fujitsu is planning to sell its custom 'Monaka' Arm chip, which could compete with existing server-maker offerings.
- Humanoid robots could reshape MEMS demand as physical AI advances — DigiTimes, 2026-09-17Advancements in physical AI and humanoid robotics are expected to significantly increase global demand for advanced sensing components, including MEMS chips and specialized sensors.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, FPGAs, 2.5D/3D advanced packaging, Packaging & bonding equipment, Memory interface / buffer chips, Optical DSPs, drivers, TIAs, Timing, security & misc board silicon, Critical minerals: gallium, germanium, indium, tungsten, beryllium
- Wiwynn sees strong AI demand offsetting US data center pushback — DigiTimes, 2026-09-17Wiwynn continues its aggressive expansion in North America driven by AI demand and strong customer pressure, despite growing US regulatory opposition to data centers.
- Samsung expands SRAM, IP to speed chip development — DigiTimes, 2026-09-17Samsung is expanding its offerings of IP and memory design tools to meet the accelerated development needs of AI chips.
- 20 of China's OSATs push into advanced packaging amid EUV curbs — DigiTimes, 2026-09-17China is expanding its advanced packaging base, involving specialized OSAT houses and chiplet startups, to develop AI and HPC capabilities despite EUV equipment restrictions.
- FIT ramps up optical interconnect push as AI race shifts to connectivity — DigiTimes, 2026-09-17FIT chairman Sidney Lu stated that the focus of AI advancement is shifting from computing power to improving connectivity and data flow efficiency within and across data centers.
- Samsung reportedly starts Tesla chip trial production at Taylor fab — DigiTimes, 2026-09-17Samsung has reportedly started trial production of Tesla's next-generation AI chip at its Texas foundry, aiming to verify 2nm production and yield.
- TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain — DigiTimes, 2026-09-17Tokyo Ohka Kogyo completed a new semiconductor materials production plant in South Korea.
- Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key — DigiTimes, 2026-09-17Apple is exploring an enterprise server AI inference system that may utilize future M8 Ultra chips and Nvidia's NVLink Fusion interconnect.
- Huawei sees AI agents driving 90% of token traffic by 2035 — DigiTimes, 2026-09-17Huawei predicts that AI agents will generate 90% of token traffic by 2035, requiring substantial growth in computing, networking, storage, and power infrastructure.Merchant GPUs / accelerators, Hyperscaler custom ASICs, Optical transceivers, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Power shelves & PSUs, Direct-to-chip cold plates, Rack manifolds, Chillers & compressors, CRAH / CRAC / fan walls / in-row units, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, UPS (static, modular, rotary/DRUPS) & UPS power semis, Huawei
- Foxconn links FII and FIT to tackle AI infrastructure beyond the chip — DigiTimes, 2026-09-17Foxconn is advancing beyond just supplying chips, offering comprehensive system-level solutions that integrate AI servers, high-speed interconnects, optical communications, power, and cooling.
- Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag — DigiTimes, 2026-09-17Google's future TPU project is planning to use Intel's EMIB-T packaging technology, with MediaTek confirming that the technology is mature enough for stable mass production by 2027.
- Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV — DigiTimes, 2026-09-17China's research institute outlined a method for developing gate-all-around (GAA) structures for sub-3nm chips that avoids dependency on EUV lithography.
- Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026 — DigiTimes, 2026-09-17Major equipment and materials suppliers announced combined investments into India's semiconductor supply chain, focusing on components and equipment rather than chip manufacturing capacity.
- Onsemi puts power density at the center of its next-decade strategy — DigiTimes, 2026-09-17Onsemi plans to leverage its semiconductor expertise to move into integrated power systems, focusing on improving power density, heat management, and overall efficiency in data centers.
- Applied Materials announces 10-year investment plan ahead of SEMICON India — DigiTimes, 2026-09-17Applied Materials plans a 10-year investment of US$375 million in Karnataka, India, for its operations in the Bengaluru Signature Business Park.
- BizLink's expansion strategy signals a wider shift toward localized, risk-aware global supply chains — DigiTimes, 2026-09-17BizLink is expanding internationally due to market demands, supply chain resilience concerns, and geopolitical pressures that favor local manufacturing.
- Kinpo's push into higher-margin products, quantum control signals a wider industrial pivot — DigiTimes, 2026-09-17Kinpo Electronics is pivoting its business toward higher-margin products, expanding capacity globally, and developing systems for quantum computing and satellite communications.
- Nvidia goes green to keep grid capacity from zapping its revenues — The Register, 2026-09-16Nvidia is promoting its technology to attract new clients while also focusing on energy efficiency.
- MLCommons Sets Participation Record with New MLPerf Inference v6.1 Benchmark Results — HPCwire, 2026-09-16MLCommons announced the new MLPerf Inference v6.1 benchmark, which introduces tests for advanced AI deployment patterns like Agentic Inference.
- Climavision offers expanded weather forecasting to data centers — Utility Dive, 2026-09-16Climavision offers enhanced weather forecasting services to assist data centers in managing loads relative to changing climate conditions and grid demands.
- Piecemakers bets edge AI devices will diverge from reliance on HBM — custom-designed memory fuses DRAM stack directly to the processor using hybrid bonding — Tom's Hardware, 2026-09-16PieceMakers, a DRAM designer, began trading on the bet that AI inference memory will no longer rely on HBM, suggesting alternative integration methods.
- Emerald AI, Google and NVIDIA Launch Alliance to Advance Flexible AI Data Centers — HPCwire, 2026-09-16Google, NVIDIA, and Emerald AI formed a new alliance focused on strengthening the power grid and infrastructure supporting flexible AI data centers.
- Investment tax credit glut gives corporate buyers more leverage, report says — Utility Dive, 2026-09-16Changes in federal rules are causing pressure on investment tax credits related to building costs, although credits tied to electricity production remain valuable.
- AWS says wartime damage means some Middle East cloud resources are gone for good — The Register, 2026-09-16Iranian strikes caused significant damage to cloud infrastructure in Bahrain and the UAE, leaving certain regional resources inoperable.
- Chinese state media counters Anthropic's call to put brakes on AI development — paper says move is ‘a response to Chinese competition’ — Tom's Hardware, 2026-09-16State media suggests that Anthropic's call for slowing down AI development is due to increasing competition from China.
- Jensen Huang thinks China will develop its own advanced lithography chipmaking tools by 2030 — Nvidia CEO says achievement of that capability 'is just a matter of time' — Tom's Hardware, 2026-09-16Nvidia CEO believes China will develop its own advanced lithography chipmaking tools by 2030, suggesting the capability is imminent.
- SK hynix reportedly discussing US memory chip manufacturing with Intel — options include leasing Ohio plant or forming joint venture with other AI hyperscalers — Tom's Hardware, 2026-09-16SK hynix and Intel are reportedly in discussions to establish HBM manufacturing in the US through options like leasing or a joint venture.
- AWS tells clients to quit Middle East data centers six months after Iranian drone strikes — Amazon offers no recovery timeline as UAE mulls underground data centers [Updated] — Tom's Hardware, 2026-09-16Following drone strikes more than six months ago, Amazon Web Services has advised clients to move data out of its facilities in the Middle East and provided no estimated timeline for recovery.
- No plans have been confirmed regarding the reported talks between SK hynix and Intel on memory chip production in the U.S. — newsroom:sk-hynix, 2026-09-16According to a September 2026 report, SK hynix was reportedly in talks with Intel regarding the possibility of manufacturing memory chips in the United States for the first time.
- AWS “unable to restore access” to data centers hit by Iran strikes — Data Center Dynamics, 2026-09-16Amazon Web Services data centers were reportedly hit by strikes in Iran, exceeding the resilience capacity of their availability zones.
- DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months — DigiTimes, 2026-09-16Google revealed its AI strategy at SEMICON Taiwan 2026, emphasizing both next-generation TPU products and the accelerating cycle of AI compute iteration.
- UK funds flying broadband stations with power beamed from below — The Register, 2026-09-16The UK's ARIA program allocated £70 million to 18 projects designed to maintain connectivity by keeping antennas elevated.
- Why Wiwynn chose El Paso for its first US plant — DigiTimes, 2026-09-16Wiwynn opened its first US manufacturing facility in El Paso, Texas, citing its proximity to its existing plant in Ciudad Juarez, Mexico.
- BizLink's CPO breakthrough hits the hard part: scaling — DigiTimes, 2026-09-16Despite BizLink beginning small-volume shipments of co-packaged optics, Roger Liang noted that mass deployment is bottlenecked by packaging, thermal management, and system reliability.
- TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii — DigiTimes, 2026-09-16TSMC co-COO Y.J. Mii highlighted that talent management is a key challenge for the company's overseas expansion efforts.
- CPO ramp pushes silicon photonics testing upstream to catch defects early — DigiTimes, 2026-09-16Increasing demand for high-speed optical interconnects and Co-packaged optics (CPO) is driving silicon photonics testing to focus on wafer yield and early risk screening.
- Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs — DigiTimes, 2026-09-16Increased AI server adoption is driving demand for advanced, multi-layered copper-clad laminates (CCLs), benefiting Taiwanese manufacturers like EMC and TUC.
- Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle — DigiTimes, 2026-09-16The shift of AI from purely software to physical systems is projected by Ennoconn Technology to create a multi-year expansion for industrial computing vendors, spanning applications like robotics and factories.
- Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end — DigiTimes, 2026-09-16Samsung is shifting its conventional memory module assembly business to partners in Vietnam and India, concentrating its internal back-end capacity on high-bandwidth memory (HBM).
- Glass substrates, TGV set to reshape 2027 advanced packaging race — DigiTimes, 2026-09-16The advanced packaging supply chain is shifting focus to glass substrates and through-glass vias (TGV) to meet expanding AI chip package demands for 2027.
- Kepler bets HBM can scale without EUV — chip giants are buying in — DigiTimes, 2026-09-16Kepler Computing, a memory chip startup, has emerged from stealth after securing $468 million in funding to develop new methods for high-density memory manufacturing.
- Astera says customers are rethinking HBM needs for AI accelerators — DigiTimes, 2026-09-16Astera Labs suggests that customers may reconsider the necessity of on-chip HBM for AI accelerators by utilizing external memory tiers for key-value cache storage.
- AI efficiency fuels Jevons Paradox debate over HBM demand — DigiTimes, 2026-09-16The development and increased use of AI agents, exemplified by OpenAI's GPT-6 Astra, suggests continued strong demand for high-bandwidth memory (HBM) and server DRAM, despite potential efficiency gains in individual tasks.
- Altera confidentially files for US IPO as AI chip demand fuels listing boom — DigiTimes, 2026-09-16Altera, a programmable chip maker backed by Silver Lake and Intel, has filed for a confidential US IPO to capitalize on investor interest in semiconductor and AI businesses.
- Apple, Intel links sharpen focus on Lens Technology's next glass growth markets — DigiTimes, 2026-09-16Lens Technology plans to expand its precision-glass services into foldable electronics for Apple and through-glass-via substrates for Intel.
- US-based Teradyne opens Bengaluru office to support India's semiconductor push — DigiTimes, 2026-09-16Teradyne has opened an office in Bengaluru to support India's expanding semiconductor manufacturing ambitions and associated supply chain growth.
- Advanced processes have no ready-made answers, says TSMC's COO — DigiTimes, 2026-09-16TSMC's COO stated that developing advanced processes lacks simple solutions, particularly regarding long-term investment decisions in the AI era.
- Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec — DigiTimes, 2026-09-16Due to physical limitations of scaling transistors, the semiconductor industry is shifting its focus from shrinking components to adopting complex 3D integration methods.
- Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era — DigiTimes, 2026-09-16Taiwan is promoting research into two-dimensional materials and advanced architectures to enable sub-1nm chip manufacturing and maintain leadership in the semiconductor industry.
- FSC teams with South Korean maker on TGV equipment for glass substrates — DigiTimes, 2026-09-16FSC is collaborating with Zhongke Xianfeng to provide through-glass via (TGV) equipment for glass substrates, which will be used in advanced packaging.
- A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors — DigiTimes, 2026-09-16A Taiwan machinery maker is challenging Japan's market dominance in high-end multilayer polymer capacitors, which are crucial for power delivery in AI servers and high-wattage CPUs/GPUs.
- DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy — DigiTimes, 2026-09-16Discussions at SEMICON Taiwan highlighted concerns regarding Taiwan's ability to supply sufficient power for its ongoing AI-driven semiconductor expansion and the reliance on renewable energy sources.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Reciprocating engines & engine microgrids, Fuel cells, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Industrial & specialty gases
- Rebellions and ai& Partner to Bring Energy-Efficient AI Inference Infrastructure to Japan — HPCwire, 2026-09-15Rebellions and ai& are partnering to deploy Rebellions' energy-efficient AI inference rack infrastructure in Japan for various enterprise and governmental clients.
- SDSC Receives $10M NSF Award to Deploy Expanse2 Supercomputer — HPCwire, 2026-09-15SDSC received a $10M NSF award for the deployment of the Expanse2 supercomputer.
- WD Details Scalable AI Storage Strategy at AI Infrastructure Summit — HPCwire, 2026-09-15WD presented a strategy at the AI Infrastructure Summit focusing on how accumulating data created by AI requires adaptable and scalable storage solutions.
- AI leaders clash over safety fears after Anthropic whistleblower says AI could 'kill us all' by 2030 — OpenAI, Anthropic and xAI figureheads call for external governance, while Jensen Huang says worries are 'made up' — Tom's Hardware, 2026-09-15AI leaders are divided over safety concerns, with some calling for a slowdown and external governance, while Nvidia CEO suggests these fears are exaggerated.
- Indian renewable firm Waaree forms new data center subsidiary — Data Center Dynamics, 2026-09-15Indian renewable firm Waaree established a new subsidiary to enter the data center market.
- AirTrunk partners with Emergence Quantum to explore cryogenic cooling in data centers — Data Center Dynamics, 2026-09-15AirTrunk is collaborating with Emergence Quantum to explore integrating cryogenic cooling solutions into data centers.
- Sponsored: Why cooling media quality monitoring is becoming a critical part of data center liquid cooling strategies — Data Center Dynamics, 2026-09-15Monitoring the quality of the cooling medium is becoming as critical to data center liquid cooling as the system's thermal performance.
- ‘Second-life’ battery project is B2U’s second in ERCOT, with more on the way — Utility Dive, 2026-09-15B2U announced a strategic agreement to expand its access to used batteries suitable for stationary energy storage, focusing on the ERCOT market.
- Change 4 mindsets to build a more resilient US grid: NERC CEO Jim Robb — Utility Dive, 2026-09-15NERC CEO Jim Robb argues that building new power infrastructure requires overcoming ingrained mindsets, not just dealing with physical challenges.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, 800 V DC architecture & solid-state transformers, Test & measurement instruments
- Digital Realty, Colovore, Hut 8, CoreSite, and DataBank file to build data centers in Texas — Data Center Dynamics, 2026-09-15Multiple data center companies are filing to build new facilities in Texas.
- AVK launches dedicated funding arm to own and operate onsite power solutions for data center customers — Data Center Dynamics, 2026-09-15AVK has established a dedicated funding arm to own and operate onsite power solutions for data center customers.
- US trade agency to fund study for Thailand-US subsea cable — Data Center Dynamics, 2026-09-15A US trade agency is set to fund a study concerning a subsea cable linking Thailand and the US.
- Ciena launches VC fund to back next-gen networking startups — Data Center Dynamics, 2026-09-15Ciena launched a $200 million venture fund to support next-generation optical interconnect startups.
- Why insurers pay attention to data center cooling — Data Center Dynamics, 2026-09-15Insurers are focusing on the reliability of cooling systems because of the increasing importance of thermal management in data centers.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software
- Murata considers bigger MLCC expansion as AI server demand extends beyond 2028 — DigiTimes, 2026-09-15Due to sustained high demand from AI servers, Murata is considering expanding its production capacity for multilayer ceramic capacitors (MLCC) even further.
- Interview: Corning sees CPO, glass core as new semiconductor battlegrounds — DigiTimes, 2026-09-15Corning is expanding its involvement in the semiconductor supply chain, focusing on advanced packaging, co-packaged optics, glass core substrates, and fan-out panel-level packaging.
- DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting — DigiTimes, 2026-09-15DIGITIMES Intelligence predicts the global semiconductor market will expand to $1.6 trillion in 2026, driven heavily by memory components.
- Minebea Mitsumi pauses M&A to chase AI hardware demand — DigiTimes, 2026-09-15Minebea Mitsumi paused its mergers and acquisitions plans to focus its production of motors and actuators in response to accelerating demand from AI hardware and data center components.
- Sponsored: From scale out to scale up — Data Center Dynamics, 2026-09-15Corning emphasized that meeting modern connectivity demands requires both scaling out and scaling up data center capabilities.
- Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM — DigiTimes, 2026-09-15Samsung Electronics is restructuring its semiconductor packaging operations, diverting equipment and capacity from Exynos processors to high-bandwidth memory production.
- Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028 — DigiTimes, 2026-09-15Samsung and SK Hynix are adopting different cell designs to enable DRAM scaling below the 10nm mark by 2028.
- GlobalWafers partially resumes Italy plant, restarts EPI production — DigiTimes, 2026-09-15GlobalWafers has partially resumed operations at its Italian plant after recovery work following a fire that damaged the 8-inch line.
- Taiwan's Ministry of Economic Affairs shares power grid experience at APEC Energy Ministerial Meeting — DigiTimes, 2026-09-15Taiwan shared its strategy for maintaining stable power supply to support high-tech industrial growth, particularly in response to AI and global energy shifts.Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Metering, power quality, monitoring, Transmission, interconnection & grid equipment, Industrial & specialty gases
- HS Hyosung joint venture to invest KRW1.2 trillion in Ulsan silicon anode plant — DigiTimes, 2026-09-15A joint venture between HS Hyosung and Umicore signed an agreement to build a large-scale silicon anode materials manufacturing plant in Ulsan.
- Panasonic Energy eyes JPY1 trillion yen AI storage revenue by 2028 — DigiTimes, 2026-09-15Panasonic Energy plans to heavily invest in energy storage systems to meet surging demand from AI data centers.
- Chinese chip tools reach 35% of equipment installed at local fabs — DigiTimes, 2026-09-15Chinese semiconductor equipment sources increased their installed percentage at local fabrication plants to 35% in 2025.
- Trump tells Nvidia's Jensen Huang that AI is 'bigger than the internet' and robot fears are a 'hoax' — DigiTimes, 2026-09-15Donald Trump spoke with Nvidia CEO Jensen Huang, emphasizing data center construction's importance while dismissing concerns about advanced machine intelligence.
- Xiaomi-backed Nuclei Sys tests public markets with RISC-V expansion still costly — DigiTimes, 2026-09-15Chinese chip designer Nuclei System Technology has started its IPO process to fund continued heavy research and development for its RISC-V architecture.
- Trump calls AI slowdown a conspiracy that helps China, closing off Washington support — DigiTimes, 2026-09-15Donald Trump labeled calls for slowing AI model development as a conspiracy benefiting China, a claim echoed by Chinese state media and opposed by European governments.
- SiPh shifts optical module bottleneck upstream: from device manufacturing to laser-grade substrate supply — DigiTimes, 2026-09-14Silicon photonics is expected to drive the growth of optical modules, particularly at 800G and higher, by transitioning the manufacturing bottleneck from devices to laser-grade substrate supply, with 1.6T modules expected to launch in 2026.
- Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27 — DigiTimes, 2026-09-14Phoenix Pioneer Technology reported profitability due to strong demand for its advanced AI power substrate, with order visibility extending into Q1 2027 and customers bypassing OSATs for direct long-term agreements.
- Nvidia, MediaTek deepen 20-year chip ties — DigiTimes, 2026-09-14Nvidia invested US$3.5 billion in MediaTek's bonds, expanding their partnership to cover custom AI chips, automotive, and data center needs.
- Wuliangye skips carmaking, turns liquor waste into silicon-carbon anodes — DigiTimes, 2026-09-14Wuliangye is entering the battery materials sector by using liquor-production by-products to create porous carbon for silicon-carbon anodes.
- LLNL Uses AI to Inspect 3D-Printed Parts Layer by Layer — HPCwire, 2026-09-14LLNL developed an AI-powered system to inspect 3D-printed parts layer by layer, potentially identifying defects before the printing process is complete.
- PPPL Links STELLAR-AI with UK Fusion Supercomputer Under Genesis Mission — HPCwire, 2026-09-14A proposed federation plans to link PPPL’s STELLAR-AI with the UKAEA’s AI supercomputing platform to accelerate fusion energy research.
- Seagate Finds Only 38% Fully Prepared for AI Data Demands — HPCwire, 2026-09-14Seagate released a report indicating that only 38% of businesses are fully prepared to manage their data infrastructure to meet future AI demands.
- Genesis Mission Project Uses AI to Speed Thin Film Development — HPCwire, 2026-09-14The Genesis Mission Project is using artificial intelligence to accelerate the development of thin films necessary for semiconductor manufacturing.
- Valve Steam Frame interview — why it costs up to $1,300, Snapdragon power, and 10x foveated streaming — Tom's Hardware, 2026-09-14Valve engineers discussed launching the Steam Frame while facing global shortages of memory and storage.
- Datacenter developers want your backyard. FAS says negotiate harder — The Register, 2026-09-14Developers are advised to negotiate local agreements regarding tax breaks, water usage, noise pollution, and decommissioning costs before signing contracts with local officials.
- Edged tops out data centers in Council Bluffs, Iowa — Data Center Dynamics, 2026-09-14Structural construction at the 200MW campus in Council Bluffs, Iowa, is nearing completion.
- Construction worker dies after being hit by crane lorry at data center site in Rayong, Thailand — Data Center Dynamics, 2026-09-14A construction worker died after being hit by a crane lorry at a data center site in Rayong, Thailand.
- DayOne breaks ground on data center in Tokyo, Japan — Data Center Dynamics, 2026-09-14DayOne started construction on its second data center facility in Tokyo.
- Digital Realty enters Turkey, plans 22MW facility in Ankara — Data Center Dynamics, 2026-09-14Digital Realty is establishing a 22MW facility in Ankara, Turkey, through a joint venture with Rönesans.
- Sponsored: Data center growth is reshaping the insurability question — Data Center Dynamics, 2026-09-14The article discusses how the rapidly expanding data center industry is changing the way risk and capacity are assessed.
- Why coolant health is becoming an uptime issue for AI data centers — Data Center Dynamics, 2026-09-14Maintaining coolant health is becoming a key factor in the operational uptime of AI data centers.
- Teravolt looks to cannibalize older industries to meet AI power demand — The Register, 2026-09-14Teravolt plans to repurpose older infrastructure, such as Bitcoin farms and aluminum smelters, to meet the rising power demands of data centers.
- Proven 8-pin PCIe plugs aren't immune to melting — Thermal Grizzly WireView adapter burns out on Radeon RX 7900 XTX — Tom's Hardware, 2026-09-14Three 8-pin connectors on a Thermal Grizzly WireView adapter reportedly melted and burned out when connected to a Radeon RX 7900 XTX graphics card, prompting an investigation.
- Maryland data center developers offer residents biggest-ever US community benefits package as big tech seeks to quell fears — $110 million deal includes $30 million elementary school, water reclamation system, and more — Tom's Hardware, 2026-09-14AI data center developers are reportedly offering comprehensive community benefits packages to ease local opposition and accelerate project approvals.
- Heca Data plans integrated zone for hyperscale data centers in Egypt — Data Center Dynamics, 2026-09-14A data center developer expressed interest in collaborating with the Egyptian government to establish integrated zones for hyperscale data centers.Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Prefab / modular data centers & power/cooling skids, Site utilities, water & fiber entrance, Physical security & access
- Dumpster diver builds home lab Proxmox server from weekly landfill runs for SSDs, HDDs, GPUs, and even RAM — weekly e-waste raids net multi-drive Proxmox server and Asus ROG laptop — Tom's Hardware, 2026-09-14A tech enthusiast built a home lab server using salvaged components like SSDs, HDDs, and GPUs from a local landfill.
- Power testing in the age of AI — Data Center Dynamics, 2026-09-14The article generally discusses the need for advanced power testing methods to support the increasing power density of AI data centers.
- Taiwan eases investment rules for AI center infrastructure projects — DigiTimes, 2026-09-14Taiwan is facilitating private investment in AI data center construction through a public-private partnership model, making infrastructure development more attractive to private industry.
- DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up — DigiTimes, 2026-09-14Taiwanese chip packaging firms are advancing FOPLP and glass-substrate development to meet the demands of AI processors requiring larger reticles and more complex packaging.
- Sponsored: When AI grows new limbs: The fiber scale out — Data Center Dynamics, 2026-09-14Corning is positioning itself as a key provider for the necessary fiber and connectivity components required for scaling AI infrastructure.
- China optical firms target photonics with mixed high-end, lower-cost push — DigiTimes, 2026-09-14Chinese optical firms presented mixed strategies at the 2026 CIOE, focusing on both high-end and lower-cost solutions for optical communications.
- Sandisk recruits engineers in Korea as memory talent race heats up — DigiTimes, 2026-09-14Sandisk is aggressively recruiting memory engineers in South Korea, specifically targeting expertise in NAND, HBM, and LPDDR.
- Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist — DigiTimes, 2026-09-14Samsung and Qualcomm are continuing discussions regarding 2nm foundry partnerships, focusing on resolving issues related to cost, yield, and processor optimization.
- AI's energy demand ignites global nuclear rush, straining Taiwan's restart — DigiTimes, 2026-09-14The increased energy demand from AI data centers is driving a global resurgence in nuclear power, straining supply and causing complications for Taiwan's plan to restart idle reactors.
- India semiconductor deals hit a multi-year high ahead of SEMICON India 2026 — DigiTimes, 2026-09-14Indian semiconductor companies have seen deal activity and equity funding reach multi-year highs ahead of the SEMICON India 2026 conference.
- CPO nears mass production — next battle about interfaces, yield and maintenance — DigiTimes, 2026-09-14The transition of optical interconnects toward co-packaged optics (CPO) and near-packaged optics (NPO) requires advancements not only in optical performance but also in alignment, manufacturability, and supply chain readiness for light sources and packaging.
- AI labs ask to be slowed, Congress stirs, and Nvidia calls the alarm a sales pitch — DigiTimes, 2026-09-14The article discusses the split between AI labs advocating for a coordinated slowdown of frontier AI development and chip suppliers like Nvidia dismissing these calls as a sales pitch.
- India's chip show nearly doubles in two years, with suppliers leading the build-out — DigiTimes, 2026-09-14The growth of the semiconductor exhibition in India suggests that the local semiconductor ecosystem is moving into the procurement phase, attracting suppliers for cleanroom, utility, and specialty materials.
- Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout — DigiTimes, 2026-09-14AI demand continues to drive semiconductor, memory, and infrastructure spending, with price hikes, tighter inventories, and advanced planning across multiple component supply chains.Merchant GPUs / accelerators, Hyperscaler custom ASICs, HBM, DRAM, Memory modules, NAND flash, Rack-scale systems, Motherboards, CPU trays, switch trays, Power shelves & PSUs, Direct-to-chip cold plates, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Chillers & compressors, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, UPS (static, modular, rotary/DRUPS) & UPS power semis, Gas turbines (onsite / behind-the-meter) & HRSGs, Hyperscalers, neoclouds & model labs, Specialty glass & glass fiber, Industrial & specialty gases, Eaton, Intel, MediaTek, Micron, Samsung Electronics, Synopsys
- AI agents drive token use 300-600x, Dell Taiwan says — DigiTimes, 2026-09-14Dell Taiwan noted that the shift to agentic AI dramatically increases token usage and accelerating the demand for on-premises AI computing.
- Shihlin Electric eyes orders through 2029 as T4 plant starts in 2027 — DigiTimes, 2026-09-14Shihlin Electric anticipates significant demand through 2029, driven by the need to reinforce Taiwan's power grid, support energy transitions, and build out AI data centers, with a new plant scheduled to start in 2027.
capacity
- AMAX expands liquid-cooled data center in push beyond hardware — DigiTimes, 2026-09-20AMAX is expanding its self-built liquid-cooled data center and services to meet customer demand, which provides over a year of order visibility.
- Tyntek optical communications MPD ramps quarterly, 2027 capacity triples — DigiTimes, 2026-09-20Tyntek announced a multi-billion dollar expansion plan to triple its optical communications capacity by 2027, driven by high-speed demand from a major U.S. customer.
- Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders — DigiTimes, 2026-09-18Ventec International Group is expanding its factory in Kunshan, China, to meet demand for AI and high-density interconnect materials.
- Brazil's Eveo plans data center in Recife — Data Center Dynamics, 2026-09-18Eveo plans a new data center in Recife, Brazil, expanding its presence alongside existing sites in Fortaleza, São Paulo, and Curitiba.
- Hitachi to double US production of small and medium-sized power transformers — Utility Dive, 2026-09-18Hitachi will double the US production capacity of small to medium-sized power transformers (10 MVA to 160 MVA) at a Mississippi facility.
- Bitdeer AI to lease 65MW data center in Johor, Malaysia — Data Center Dynamics, 2026-09-18Bitdeer AI plans to lease a 65MW data center in Johor, Malaysia.
- GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity — DigiTimes, 2026-09-18GlobalFoundries and Marvell Technology increased their production capacity for SiGe technology to meet the demand for optical connectivity in AI data centers.
- NorthC breaks ground on data center in Frankfurt, Germany — Data Center Dynamics, 2026-09-17NorthC began construction on a new 6MW data center facility in Frankfurt, Germany, scheduled to be operational in 2028.
- Aligned breaks ground on gigawatt-scale data center campus in Pennsylvania — Data Center Dynamics, 2026-09-17Aligned is beginning construction on a gigawatt-scale data center campus in Pennsylvania.
- Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity — DigiTimes, 2026-09-17Taiwanese test and packaging companies are positioned to benefit from increased demand for silicon photonics transimpedance amplifier (TIA) testing driven by faster optical interconnects in AI data centers.
- Lam Research plans US$1 billion India manufacturing expansion — DigiTimes, 2026-09-17Lam Research plans a $1 billion expansion into India, adding a new silicon component manufacturing facility and expanding its R&D operations.
- SK Hynix reportedly eyes Intel Ohio plant for US memory production — DigiTimes, 2026-09-17SK Hynix is planning to establish its first US memory chip manufacturing facility and is discussing potential operational arrangements with Intel in Ohio.
- Microsoft files to build data center campus in Prince William County, Virginia — Data Center Dynamics, 2026-09-16Microsoft plans to develop a data center campus consisting of two buildings in Prince William County, Virginia.
- Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027 — DigiTimes, 2026-09-16Wiwynn is shifting its strategy from leasing to purchasing land to build and expand its own manufacturing facilities in the US and Mexico.
- US AI data centers projected to become the fifth-largest natural gas consumer in the world by 2035 — consumption to grow by 15 billion cubic feet per day as demand for compute increases — Tom's Hardware, 2026-09-15U.S. AI data centers are expected to dramatically increase natural gas consumption, projected to grow by 15 billion cubic feet per day by 2035.
- Canada's Bell to quadruple capacity at planned Saskatchewan data center campus — Data Center Dynamics, 2026-09-15Bell plans to quadruple the capacity of its data center campus in Saskatchewan, with room for future growth.
- Polarise to lease capacity from CRA in Prague, Czechia — Data Center Dynamics, 2026-09-15A German AI cloud provider plans to lease 15MW of capacity from CRA in Prague, Czechia.
- Meta to expand Eagle Mountain data center campus in Utah — Data Center Dynamics, 2026-09-15Meta announced a fourth expansion at its data center campus in Utah's Eagle Mountain.
- Wiwynn deepens US AI server footprint with US$1.6 billion Texas manufacturing hub — DigiTimes, 2026-09-15Wiwynn has opened a new advanced manufacturing facility in Texas to support its growing presence in the US AI server market.
- Thor Equities submits plans for 150MW data center in Georgia, US — Data Center Dynamics, 2026-09-14Thor Equities plans to build a 150MW data center in Georgia, US, with an estimated cost of $1 billion.
regulation
- US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground — DigiTimes, 2026-09-20The US is pressuring Mexico to enforce stricter rules of origin for AI hardware components to restrict non-North American sourcing, leading the Mexican government to consult with Taiwanese ODMs.
- Virginia’s Loudoun County board votes to pause new data center applications — Data Center Dynamics, 2026-09-18The Loudoun County board voted to pause new data center applications, introducing a 12-month moratorium in the area.
- Brazil's President Lula signs ReData data center bill into law — Data Center Dynamics, 2026-09-18Brazil's President Lula has signed the ReData data center bill into law after it was passed by the Senate in September.
- House passes act to make AI data centers pay for grid upgrades to minimize impact on residents — measure directs states to consider adoption of federal standard within two years of passing — Tom's Hardware, 2026-09-18The proposed Ratepayer Protection Act mandates that data centers contribute to the cost of necessary grid upgrades to lessen the impact on local residents.
- Microsoft ‘preserving its ability’ to challenge data center transmission costs decision — Utility Dive, 2026-09-18Microsoft plans to appeal Virginia's decision to directly assign certain data center transmission costs, while Dominion Energy must propose policy changes by October.
- Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management — DigiTimes, 2026-09-18China's planning bodies have emphasized the strategic importance of ultra-wide bandgap semiconductors, such as gallium oxide and synthetic diamond, for the electronic information sector.
- House passes ratepayer protection bill to limit data center cost shifts — Utility Dive, 2026-09-17The bill aims to limit the shifting of data center costs onto ratepayers, following a trend of states adopting large-load tariffs.
- New York State recommends demanding AI data centers pay $1 million in community investment per megawatt — framework advises towns to plan for maintenance costs, site abandonment, and other contingencies — Tom's Hardware, 2026-09-17New York State issued recommendations for towns and municipalities to negotiate with data center developers, suggesting a $1 million per megawatt community investment framework and planning for maintenance and site abandonment.
- Scotland's parliament backs defacto, temporary, moratorium on new hyperscale data centers — Data Center Dynamics, 2026-09-16The Scottish parliament has approved a temporary moratorium on new hyperscale data centers until new planning guidelines are established.
- Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage — DigiTimes, 2026-09-16Upcoming high-level discussions between the US and China will heavily focus on technology leadership, export controls, and regulatory frameworks.
- EPA scraps Biden power plant GHG rules, moves to eliminate other standards — Utility Dive, 2026-09-15The Edison Electric Institute, representing investor-owned utilities, supported the repeal of carbon capture and storage standards implemented by the EPA.
- FCC Rule on Optical Connectivity Could Slow AI Race — EE Times, 2026-09-15A potential FCC rule banning imported optical networking equipment could disrupt the AI race and force hyperscalers to deal with potential shortages.
- China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy — DigiTimes, 2026-09-15Updated US FCC rules, which prohibit certain components, temporarily spares China's optical communications supply chain, including optical transceivers and CPO.
- China elevates HBM and HBF in five-year plan, opening a new front in AI memory — DigiTimes, 2026-09-15China's 15th Five-Year Plan has designated high-bandwidth memory and high-bandwidth flash memory as critical priority areas for future research.
- US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliers — DigiTimes, 2026-09-15The US is tightening controls on power systems and robotics equipment due to geopolitical concerns, adding structural and regulatory risks for Taiwanese supply chain players.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS
- Taiwan's carbon pricing enters new phase with carbon fee, ETS on parallel tracks — DigiTimes, 2026-09-15Taiwan's carbon fee is now active, establishing a stable carbon price to encourage emission reductions, with an ETS scheduled for later implementation.
- AI power demand pushes Taiwan to overhaul energy rules — DigiTimes, 2026-09-14Increased electricity demand from AI data centers is forcing Taiwan to overhaul its energy regulations, impacting how new power infrastructure and facility expansions are planned.
- South Korea broadens espionage law to counter rising tech leaks — DigiTimes, 2026-09-14South Korea strengthened its espionage laws to protect strategic technologies like semiconductors from all foreign sources.
earnings
- HEC Compucase AI server products drive 2026 revenue growth — DigiTimes, 2026-09-20HEC Compucase expects sustained double-digit revenue growth in 2026, driven by shipments of AI server products, cooling modules, and high-end power supplies.
- Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27 — DigiTimes, 2026-09-18Niching Industrial anticipates a 20% increase in 2026 revenue, driven by solid growth in IC substrates, heat spreaders, and SSD enclosures.
- CXMT cashes in on the DRAM shortage — and takes aim at HBM — DigiTimes, 2026-09-17CXMT is capitalizing on the memory shortage and resulting profitability to expand its offerings into LPDDR6 and HBM, suggesting an upstream development in the Chinese domestic memory supply chain.
- Samsung advances jump 70% amid shift to long-term memory deals — DigiTimes, 2026-09-16Samsung's advances increased by over 70% in H1 2026, reflecting a broader industry trend of memory suppliers entering multi-year agreements with key customers.
- Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead — DigiTimes, 2026-09-16Major memory suppliers reported record revenue in Q2 2026, driven by AI demand, with SSDs and LPDDR identified as key growth areas.
- AI server tracker: BMC, cable, case suppliers post August 2026 gains — DigiTimes, 2026-09-16Taiwan's AI server supply chain experienced varying year-over-year growth in August, affecting baseboard management controllers, cables, connectors, and server-case suppliers.
- Global semiconductor revenue hits record US$425B in 2Q26 — DigiTimes, 2026-09-15Global semiconductor revenue hit a record high of $425 billion in Q2 2026, driven by AI demand and strong memory pricing.
- OEM/EMS AI servers: August revenue trends, operational outlook — DigiTimes, 2026-09-15The electronics manufacturing sector shows massive revenue growth in AI hardware, contrasting with difficulties in the consumer device market.
- AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows — DigiTimes, 2026-09-15Copper-clad laminate (CCL) makers showed stronger revenue performance compared to PCB and IC substrate suppliers due to increased server demand and favorable pricing.
- AI demand lifts UMC, VIS, PSMC revenue — DigiTimes, 2026-09-14AI demand is increasing the revenue for power management ICs, networking chips, and specialty processes, leading to higher quotes from Taiwan foundries since 2026.
- Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues — DigiTimes, 2026-09-14Google Cloud reported that its AI server investments, specifically using its in-house TPUs, have a rapid payback period of less than one year, benefiting ASIC design partners like MediaTek and Broadcom.
- AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles — DigiTimes, 2026-09-14Taiwanese ASIC design service providers all showed year-over-year revenue growth in August 2026, indicating varied stages in the custom-silicon lifecycle.
- AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand — DigiTimes, 2026-09-14Taiwan's semiconductor testing suppliers reported year-over-year revenue growth due to strong demand from AI and HPC.
- CoreIntelligence Holdings posts 6% revenue growth in first 8 months as optical ASP soars and energy-saving products grow — DigiTimes, 2026-09-14CoreIntelligence Holdings reported that its revenue for the first eight months of 2026 grew 6% year-over-year, driven by increases in optical ASP and energy-saving products.
- Lite-On revenue rises in August on cloud power demand — DigiTimes, 2026-09-14Lite-On saw revenue growth in August, driven by strong demand for high-end server power supplies, battery backup units, and optoelectronic semiconductors for AI and cloud computing.
- Aurotek posts record August revenue on semiconductor, robot shipments — DigiTimes, 2026-09-14Aurotek reported record revenue in August due to high demand for its automation equipment in the semiconductor, AI server, and electronics manufacturing sectors.
- Renesas readies second price hike amid stronger power-chip demand — DigiTimes, 2026-09-14Renesas is planning a second price increase for its power semiconductors due to rising manufacturing costs and sustained strong demand from data centers.
product launch
- NVIDIA MMS1X00-N5400 QSFP112 1310NM 400Gbps Optic Quick Look — ServeTheHome, 2026-09-20NVIDIA introduced the MMS1X00-N5400 optic, a 500m QSFP112 module designed for 400Gbps linking.
- Kioxia XL1 CXL XL-FLASH NAND Device Shown — ServeTheHome, 2026-09-19Kioxia unveiled the XL1, an XL-FLASH Generation 2 NAND device designed to function as a 512GB memory expansion unit using CXL technology.
- AWS Launches Burstable EC2 T8i Instances Powered by Intel Xeon 6 — HPCwire, 2026-09-18AWS introduced its new T8i burstable EC2 instances, utilizing the sixth generation of Intel Xeon 6 processors.
- Intel Puts High-NA EUV into Production, but Stitching Still Has Something to Prove — EE Times, 2026-09-18Intel has put High-NA EUV into production, noting that electrical stitching and larger masks are the remaining manufacturing challenges.
- AMD shares first official benchmarks for EPYC 'Venice' CPUs, targets Nvidia — company claims 256-core chip is more than twice as fast as Nvidia Vera, 96-core model 20% faster per-core — Tom's Hardware, 2026-09-18AMD has released benchmarks for its EPYC 'Venice' CPUs, asserting that the 256-core model significantly surpasses Nvidia's Vera, while the 96-core model achieves a 20% per-core speed increase.
- Huawei details AI accelerator roadmap, pulls in next-generation Ascend NPUs by several quarters — FP4 performance of the Ascend 960PR doubles expectations — Tom's Hardware, 2026-09-18Huawei detailed its AI accelerator roadmap, including next-generation Ascend NPUs, Kunpeng CPUs, and connectivity solutions.
- CXMT eyes NAND amid global shortage, taking aim at YMTC — DigiTimes, 2026-09-18CXMT plans to expand its focus from DRAM into NAND flash, challenging YMTC's position in the enterprise storage market.
- Lightmatter Joins Open CPX MSA, Introduces Bidirectional CPX Optical Engine — HPCwire, 2026-09-18Lightmatter joined the Open CPX MSA and launched the Passage L20 CPX module, an Open CPX module designed to reduce optical cabling in AI scale-up networks by combining transmit and receive on a single fiber.
- Resonac grows 300mm SiC crystal, marking a substrate milestone — DigiTimes, 2026-09-18Resonac achieved a milestone by growing and processing a 300mm silicon carbide (SiC) single crystal, which could benefit data center power electronics and related industries.
- Huawei Connect 2026: Huawei scales supernodes into million-card AI systems — DigiTimes, 2026-09-18Huawei announced an Agentic supercluster architecture, using UnifiedBus to scale its Ascend AI computing to potentially one million accelerator cards.
- Nvidia roadmap shifts to rack-scale AI with Rubin Ultra — DigiTimes, 2026-09-18Nvidia plans to begin mass production shipments for its Vera Rubin Ultra, Vera CPU, and Rubin GPU platforms (including NVL4, NVL8, and NVL72) starting in late 2026, with further launches planned for late 2027.
- Huawei's next-gen Ascend NPUs could become China's best option — The Register, 2026-09-17Huawei's 960DT NPU is expected to launch soon, offering performance superior to Western alternatives for the Chinese market.
- Inside the lab where the Arm AGI CPU is brought to life — ServeTheHome, 2026-09-17The article provides a behind-the-scenes look at the development process for the new Arm AGI CPU server processor.
- Rune launches solar-sited modular compute system, raises $40m Series A — Data Center Dynamics, 2026-09-17Rune launched a modular compute system powered by solar energy, securing $40 million in Series A funding.
- Trumpf eyes glass as AI demand drives packaging innovation — DigiTimes, 2026-09-17Trumpf is expanding its laser and plasma generation capabilities to address the advanced packaging needs for drilling holes in glass substrates.
- Tier IV open-sources self-driving AI chip design to challenge Nvidia — DigiTimes, 2026-09-17Autonomous vehicle developer Tier IV plans to release its AI chip design and associated tools as open source, challenging Nvidia's market dominance in the sector.
- SK hynix Presents ‘New Spectrum’ for AI Infrastructure at ‘AI Infra Summit 2026’ — newsroom:sk-hynix, 2026-09-17SK hynix presented its latest memory technologies and future roadmaps at the AI Infra Summit 2026 to outline the evolving requirements of AI infrastructure.
- Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer — DigiTimes, 2026-09-17Huawei introduced the OceanStor M900 at Huawei Connect 2026, a petabyte-scale key-value cache designed to integrate memory and storage into AI infrastructure.
- Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects — DigiTimes, 2026-09-17Foxconn Interconnect Technology held an event themed 'Light at Scale' to discuss the next generation of AI connectivity, covering optics, photonics, and manufacturing challenges.
- Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet — DigiTimes, 2026-09-17Huawei unveiled the next-generation Ascend 960 supernode, making near-packaged optics the core component for scaling AI computing for massive models.
- onsemi Embedded Power Platform Announced — ServeTheHome, 2026-09-16onsemi unveiled its new Embedded Power Platform designed for AI racks, automotive, and industrial uses.
- SignatureIP Unveils MesoLink, a Mesochronous Bridge for PCIe/CXL Validation — HPCwire, 2026-09-16SignatureIP launched MesoLink, a new IP core that acts as a mesochronous connectivity bridge, allowing PCIe/CXL validation with full-rate SerDes on the FPGA side.
- CoreWeave Brings Up Multi-Rack NVIDIA Vera Rubin NVL72 Cluster — HPCwire, 2026-09-16CoreWeave announced the deployment of a multi-rack cluster using NVIDIA Vera Rubin NVL72, incorporating hundreds of Rubin GPUs.
- Onsemi unveils its Embedded Power Platform architecture to increase power density — Data Center Dynamics, 2026-09-16Onsemi introduced an Embedded Power Platform architecture utilizing the silicon wafer itself for embedding components and increasing power density.
- RAMXEED ULTIMATE FeRAM Guarantees 10-Year Data Retention under Continuous 125°C Exposure — EE Times, 2026-09-16RAMXEED launched its ULTIMATE FeRAM line, which guarantees 10 years of data retention even when exposed to continuous 125°C temperatures.
- Micron announces 512GB DDR5-9200 memory modules with 16W power draw — up to 12TB per server, claims 60% less energy-intensive than four 128GB modules — Tom's Hardware, 2026-09-16Micron launched 512GB DDR5-9200 memory modules, claiming they are significantly more energy-efficient than using multiple smaller modules.
- Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture — HPCwire, 2026-09-16Arteris announced an expansion of its multi-die portfolio, helping companies transition from monolithic System-on-Chip (SoC) designs to more flexible chiplet-based architectures for AI and HPC.
- Axelera AI launches Europa chip, makes hardware available in Dell and Supermicro servers — Data Center Dynamics, 2026-09-16Axelera AI has launched the Europa chip, making it available for integration into servers manufactured by Dell and Supermicro.
- Exa to deploy subsea cable linking UK and US — Data Center Dynamics, 2026-09-16Meridian is deploying a subsea cable to link the UK and US, connecting New Jersey and Somerset.
- Schneider Electric debuts 2.5MW power modules for AI data centers — Data Center Dynamics, 2026-09-16Schneider Electric launched prefab power modules with a capacity of 2.5MW to reduce the installation time for AI data centers.
- Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges — DigiTimes, 2026-09-16Geckos proposes using copper paste and vacuum printing as a lower-cost alternative to traditional glass interconnect methods for advanced packaging.
- Micron unveils 512GB DDR5 RDIMM for next-gen servers — DigiTimes, 2026-09-16Micron has introduced a 512GB DDR5 RDIMM, significantly increasing memory capacity for future server systems.
- MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions — DigiTimes, 2026-09-16MediaTek launched the Dimensity 9600 Pro, choosing to retain its existing HBPoP packaging over advanced WMCM technologies used by competitors due to cost considerations.
- Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030 — DigiTimes, 2026-09-16Sharp Corporation began taking orders for Nvidia AI servers, manufactured by Foxconn, aiming to generate JPY250 billion in revenue by fiscal 2030.
- As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics — DigiTimes, 2026-09-16GlobalFoundries showcased a miniature transceiver that signals the industry's transition from copper cabling to optical interconnects, driven by AI demand.
- DIGITIMES Insight: NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures — DigiTimes, 2026-09-16Nvidia's new NVHBM is an evolution of custom HBM, integrating the memory controller into the HBM base die to expand its control over custom AI architectures and rack connectivity.
- Astera Labs Expands Leo Memory Controllers for Agentic AI and Cloud Workloads — HPCwire, 2026-09-15Astera Labs announced new memory connectivity solutions, including the Leo X-Series and Leo 2 E & P-Series, to extend its Smart Memory Controller family for both GPU and CPU memory architectures.
- VDURA Launches Sentinel Monitoring for AI and GPU Storage — HPCwire, 2026-09-15VDURA launched Sentinel, a proactive monitoring support capability designed for the V12 Data Platform used in AI storage.
- SiFive and AMD Collaborate to Optimize AMD ROCm on RISC-V Datacenter Servers — HPCwire, 2026-09-15SiFive and AMD demonstrated a system running AMD ROCm on SiFive’s BigSky Datacenter Development Platform, highlighting the integration of RISC-V architecture for AI computing.
- Micron Advances Memory Innovation with Ultra-Dense Module for Next-Gen Servers — HPCwire, 2026-09-15Micron announced a breakthrough 512GB DDR5 module capable of delivering high performance speeds while significantly reducing operating power for data center servers.
- Axelera AI Launches Europa AIPU for Enterprise and Data Center Inference — HPCwire, 2026-09-15Axelera AI introduced the Europa architecture, a purpose-built inference accelerator designed for enterprise data centers, with Dell providing validated systems.
- Astera Labs Releases Leo 2 CXL Memory Controllers and Leo X Controller for Rackscale Fabric-Attached Memory — ServeTheHome, 2026-09-15Astera Labs launched the Leo 2 memory controllers, supporting CXL 3.2 and PCIe Gen6, and the Leo X controller for connecting memory expanders directly to AI accelerator fabrics.
- Japan's NTT Docomo deploys Nokia's latest Open RAN kit — Data Center Dynamics, 2026-09-15NTT Docomo is deploying a new Open RAN kit provided by Nokia.
- Are diamonds a data center's best friend? — Data Center Dynamics, 2026-09-15Akash Systems is launching diamond cooling technology for data halls.
- Perplexity’s local AI agent comes to Windows, but only for RTX GPUs with at least 24GB of VRAM — Portable Computer brings AI for multistep tasks to compatible PCs — Tom's Hardware, 2026-09-15Perplexity and Nvidia launched a local-first AI agent for Windows, restricting compatibility to GeForce RTX and RTX PRO GPUs with at least 24GB of VRAM.
- Sivers Semiconductors positions laser arrays as solution to copper's limits — DigiTimes, 2026-09-15Sivers Semiconductor showcased a 1.6T pluggable optical transceiver and an external light source (ELS) prototype module at the China International Optoelectronic Expo.
- Ainos pushes AI Nose into semiconductor front-end manufacturing — DigiTimes, 2026-09-15Ainos has commercially deployed its second-generation AI Nose for chemical sensing within semiconductor fabrication plants, advancing industrial AI monitoring.
- Alchip Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026 — HPCwire, 2026-09-14Alchip Technologies will demonstrate its advanced ASIC design capabilities, including 3nm production, 2nm design, and multi-die advanced packaging, at the AI Infra Summit 2026.
- Fujitsu Sets November Launch for FUJITSU-MONAKA CPU and Server — HPCwire, 2026-09-14Fujitsu announced that its next-generation CPU, FUJITSU-MONAKA, which utilizes 2nm 3D-stacked technology, will be available globally starting November 2026.
- Gaming takes a backseat as Nvidia overhauls the RTX 5090 for maximum AI margins — RTX Pro 5500 delivers 2.6X VRAM at matching specs — Tom's Hardware, 2026-09-14Nvidia launched the Blackwell Workstation Edition RTX Pro 5500 graphics card, targeting AI applications.
- Damac and Vodafone launch Turkish data center — Data Center Dynamics, 2026-09-14Damac and Vodafone launched a data center in Turkey with an initial capacity of 4MW, which can be scaled up to 20MW.
- Solo dev enables running CUDA on AMD hardware in Windows, getting multiple CUDA libraries running on a gaming Radeon RX 9060 XT GPU in Windows — CUDA-exclusive workloads on AMD hardware in Windows possible without virtualization or dual-booting — Tom's Hardware, 2026-09-14A developer demonstrated that the ZLUDA project can allow running CUDA-exclusive workloads on AMD hardware in Windows using AMD's HIP libraries.
- Fujitsu announces Monaka CPU and server will be available from November — Data Center Dynamics, 2026-09-14Fujitsu is launching a new CPU and associated server starting in November.
- Huawei pitches near-packaged optics as co-packaged costs bite — The Register, 2026-09-14Huawei introduced a 7.2 Tbps near-packaged optics module, promising to reduce repair difficulties before industry standards are established.
- Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost — DigiTimes, 2026-09-14Fujitsu plans to launch its high-efficiency AI CPU, Monaka, in 2027 by leveraging TSMC's 2nm technology.
- DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker — DigiTimes, 2026-09-14High NA EUV lithography systems are moving out of the lab and into production use, with adoption now dependent on economic viability.
- Sponsored: Gerchamp launches modular AI data center to bring high-density compute to available power — Data Center Dynamics, 2026-09-14Gerchamp is launching modular AI data centers designed for rapid deployment at sites with available power.
- Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment — DigiTimes, 2026-09-14AI data centers are rapidly adopting 1.6T connectivity, while 800G becomes standard for AI clusters and 400G remains prevalent in general enterprise use.
supply constraint
- Power grids can't keep pace with AI data center boom in EU, US — DigiTimes, 2026-09-18AI data center cost estimates are inaccurate because they often overlook the full expense of power generation, transmission, and grid infrastructure, leading to significant regional cost variations.
- NOR Flash and SLC NAND production are under threat as capacity gets routed to more profitable products — 'severe undersupply' threatens everyday electronics — Tom's Hardware, 2026-09-18The AI buildout is causing a tightening supply of NOR Flash and SLC NAND capacity as manufacturers prioritize more profitable products.
- AI Demand Will Keep DRAM Market Under Pressure — EE Times, 2026-09-18Strong AI spending is causing shortages in the DRAM market expected to last until 2027.
- US chip fabs face massive 157,000 worker shortfall, mere 3% of US engineering grads enter chipmaking — despite six-figure salaries, US chip manufacturers are in dire need of engineers and technicians — Tom's Hardware, 2026-09-18Consulting estimates project a severe shortage of thousands of engineers and technicians needed to staff semiconductor fabrication facilities in the coming decades.
- China's AI data center token costs hinge on access to advanced GPUs — DigiTimes, 2026-09-18Due to restricted access to high-end GPUs, the cost of running AI models in Chinese data centers is severely affected by geopolitics and chip availability.
- China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test — DigiTimes, 2026-09-18Despite major South Korean and American memory manufacturers focusing on HBM and server DRAM, Chinese firms like CXMT and YMTC are expanding their market share in conventional DRAM, mobile memory, and NAND Flash.
- High-end GPUs may be slowing China's AI compute expansion — DigiTimes, 2026-09-18China's AI compute expansion is constrained by limited access to high-end Nvidia GPUs, although total AI compute investment between the US and China may be comparable.
- LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market — DigiTimes, 2026-09-18Due to US restrictions on Chinese batteries and slowing capacity expansion in China, demand for energy storage systems (ESS) at South Korean manufacturers like LGES and Samsung SDI is high, potentially keeping them booked out for two years.
- Chip equipment makers face waits of up to 40 months for critical parts — DigiTimes, 2026-09-18Equipment makers are reporting long lead times for specialized components due to deeper capacity shortages in the semiconductor supply chain.
- Micron: AI memory crunch rewrites the market with long-term deals and custom designs — DigiTimes, 2026-09-18Micron executives predict that memory, a critical bottleneck for AI performance, will face supply shortages, with new capacity not expected to arrive until 2028.
- Investigative report details how export-restricted Nvidia AI chips reach China — public records reveal how Chinese entities skirt US sanctions — Tom's Hardware, 2026-09-17A report was released detailing the methods Chinese entities use to bypass U.S. sanctions and obtain American AI accelerators.
- Memory LTAs lock up 50-70% of capacity — DigiTimes, 2026-09-17Memory manufacturers are aggressively locking up capacity through long-term supply agreements (LTAs), with Kioxia having 50% and Micron around 60% of its capacity tied up.
- AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns — DigiTimes, 2026-09-17Intel warned that the high memory demands of AI are causing widespread shortages across the electronics industry.
- SK Hynix weighs US memory options as buyers lock in 2027 supply — DigiTimes, 2026-09-17As customers secure 2027 supply, SK Hynix is maintaining its US memory options amidst tighter availability, increasing pressure on memory makers to boost capacity.
- Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain — DigiTimes, 2026-09-17China's tightening rare earth export controls introduce increased cost and uncertainty into the global supply chain for critical minerals, impacting Taiwan.
- AI-induced memory shortage is changing how devices are built, Fairphone says memory now 60% of materials cost — smaller laptop and phone makers are redesigning products and have to test for fake chips — Tom's Hardware, 2026-09-16Limited availability and rising prices for memory components are forcing smaller device manufacturers to fundamentally redesign their hardware and sourcing strategies.
- AWS tells clients to abandon Middle East data centers six months after Iranian drone strikes — Amazon offers no recovery timeline as UAE mulls underground data centers — Tom's Hardware, 2026-09-16Following drone attacks on its data centers in the Middle East, AWS has advised customers to relocate their data, providing no recovery timeline.
- SK Hynix, Intel in talks on US production to ease memory crunch — DigiTimes, 2026-09-16SK Hynix is negotiating a potential US manufacturing deal with Intel to alleviate current tight memory chip supply.
- Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge — DigiTimes, 2026-09-16Major semiconductor companies, including Samsung, SK Hynix, and Micron, are all engaging in a multi-vendor sourcing effort to secure advanced manufacturing capacity for HBM base dies from foundries like TSMC.
- PJM faces 2030 reliability crisis if data center load growth continues: report — Utility Dive, 2026-09-15A report commissioned by the PA PUC warns that unchecked data center growth could lead to severe power reliability crises in the PJM region by 2030.
- High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures — DigiTimes, 2026-09-15Facing worsening memory shortages and rising prices, Team Group stated that edge AI manufacturers must pivot to flexible specifications and specialized hardware protection to succeed.
- AI servers are eating MLCC capacity, and Chinese suppliers are taking what's left — DigiTimes, 2026-09-15AI server demand is increasing prices and limiting capacity for MLCCs, forcing Chinese suppliers to pivot into PC markets.
- Beyond H100: China's GPU makers chase scale, not just parity — DigiTimes, 2026-09-15China's domestic GPU industry must now focus on holistic AI ecosystem solutions, including interconnects and software, rather than just matching high-end chip performance.
- TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity — DigiTimes, 2026-09-15TSMC's advanced capacity (3nm, 2nm, and CoWoS) remains constrained due to high demand from key clients like Nvidia and Apple, despite increased activity from AWS and MediaTek.
- Memory makers tighten supply as DRAM price rally extends into 2027 — DigiTimes, 2026-09-14Memory manufacturers are reportedly cutting DRAM shipment allocations drastically in 2027 and beyond, due to upstream capacity being fully sold out through 2028.
- Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion — DigiTimes, 2026-09-14Samsung and SK Hynix refused a massive power prepayment proposal, emphasizing the difficulty of financing the power infrastructure required for accelerating semiconductor expansion in South Korea.Merchant GPUs / accelerators, Hyperscaler custom ASICs, Memory modules, Rack-scale systems, Power shelves & PSUs, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Facility water loop hardware, Large power transformers (345–765 kV) & substations, MV switchgear, E-houses, power skids, MV/LV transformers, UPS (static, modular, rotary/DRUPS) & UPS power semis, Samsung Electronics, SK Hynix
- STMicro lead times top 1 year, boosting Taiwan chip makers — DigiTimes, 2026-09-14Severe supply chain shortages for microcontroller units (MCUs), particularly from STMicroelectronics, are forcing Taiwanese chip manufacturers to pursue opportunities in the high-end industrial MCU market through 2027.
- India roundup: India says it cannot build electronics without China — DigiTimes, 2026-09-14India is bolstering its electronics and semiconductor manufacturing capabilities by attracting international partners and expanding local chip production.
m and a
- Compal takes Compal Broadband Networks private to fold networking into its edge AI stack — DigiTimes, 2026-09-18Compal Electronics is buying its networking arm, Compal Broadband Networks, to integrate the router and gateway business fully into its edge AI hardware stack.
- PGIM sells data center development site in Munich — Data Center Dynamics, 2026-09-18PGIM sold a data center development site in Munich.
- Applied Materials to invest $5bn to bolster chip ambitions in India over coming decade — Data Center Dynamics, 2026-09-18Applied Materials plans to invest $5 billion in India to establish a large research park for bolstering its chip ambitions.
- Mitsubishi invests in Japanese optical quantum startup OptQC — Data Center Dynamics, 2026-09-18Mitsubishi invested in the Japanese optical quantum startup OptQC.
- Crusoe raises $3.9bn for AI data center build-out — Data Center Dynamics, 2026-09-18Crusoe announced a $3.9 billion funding round for AI data center development, with Nvidia joining the group of investors.
- Zettabyte signs MoU with Bowrington Capital for high-density computing deployment — Data Center Dynamics, 2026-09-18Zettabyte signed a memorandum of understanding with Bowrington Capital regarding the deployment of high-density computing.
- Asp Data Center secures NOK1.6bn to fund data center project in Stavanger, Norway — Data Center Dynamics, 2026-09-18Asp secured a NOK1.6bn funding round to support a new data center project in Stavanger, Norway.
- Winbond cements server NOR lead with Infineon deal — DigiTimes, 2026-09-18Winbond plans to acquire Infineon's NOR Flash and F-RAM businesses for $1.12 billion, solidifying its market leadership in NOR Flash for automotive and AI data center applications.
- CoreWeave launches US$3 billion bond sale amid growing revenue, debt — DigiTimes, 2026-09-18CoreWeave raised US$3 billion via a bond sale, demonstrating increased infrastructure spending despite market concerns over financial stability.
- Winbond's Infineon buyout puts GigaDevice under pressure — DigiTimes, 2026-09-17Winbond's US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM businesses has put pressure on GigaDevice.
- Meta, Apex Clean Energy agree to 144-MW Texas solar PPA — Utility Dive, 2026-09-17Meta secured the exclusive right to all environmental attributes from the 144-MW Texas solar project provided by Apex Clean Energy.
- AI chip startup Rebellions partners with ai& for Japanese AI infrastructure deployment — Data Center Dynamics, 2026-09-17ai& plans to purchase up to 100 units of Rebellions' RebelRack infrastructure for use in Japanese AI deployments.
- EUCLYD Raises Over €200M to Break the AI Efficiency Wall — HPCwire, 2026-09-17EUCLYD raised over €200 million in a Series A funding round, co-led by Samsung and other investors, to develop ultra-efficient infrastructure for AI models.
- Fujifilm to invest US$83 million in semiconductor materials plant in India — DigiTimes, 2026-09-17Fujifilm plans to establish a greenfield semiconductor materials plant in India with an investment of US$83.33 million, with commercial production expected in fiscal year 2028.
- AirJoule acquires cooling firm BitSink — Data Center Dynamics, 2026-09-16AirJoule acquired cooling firm BitSink in a deal estimated to be worth $67 million.
- Goodman raises $455m for its Hong Kong data center partnership — Data Center Dynamics, 2026-09-16Goodman raised $455 million to fund the construction of a data center partnership in Hong Kong, scheduled to open in 2028.
- IBM’s Anderon Finalizes $1B CHIPS Award for Quantum Wafer Manufacturing — HPCwire, 2026-09-16IBM's Anderon received a $1 billion CHIPS award to advance R&D in quantum wafer manufacturing.
- Serverfarm expands North American data center development fund to $3.89 billion — Data Center Dynamics, 2026-09-16Serverfarm expanded its North American data center development fund to $3.89 billion.
- Samsung backs Dutch AI chip startup Euclyd in US$230M funding round — DigiTimes, 2026-09-16Samsung Electronics is investing over $230 million in the Dutch AI chip startup Euclyd to support the development of alternative AI accelerator platforms.
- Star Shining launches IPO plan as renewable energy assets reach 676MW — DigiTimes, 2026-09-16Star Shining, an AUO Group affiliate, has begun its IPO process in Taiwan, aiming to list in 2028 after managing 676MW of renewable energy capacity.
- China's Guoxin Micro buys its way into power-chip manufacturing — DigiTimes, 2026-09-15Guoxin Micro plans to acquire WeEn Semiconductors to gain in-house wafer manufacturing capabilities and accelerate its entry into the power semiconductor market.
- AirJoule Acquires BitSink to Expand into AI and HPC Data Center Infrastructure — HPCwire, 2026-09-14AirJoule Technologies acquired BitSink to expand its offerings in cooling, electrical distribution, and racking infrastructure for AI and HPC data centers.
- Constellation Energy in deal to buy 609-MW Rhode Island gas plant from Shell — Utility Dive, 2026-09-14Constellation Energy is acquiring a gas plant in Rhode Island, and Shell acquired a Pennsylvania gas portfolio, expanding their respective power holdings.
- DIGITIMES Insight: China's GaN challengers are no longer playing catch-up — DigiTimes, 2026-09-14Innoscience, a Chinese manufacturer of GaN power semiconductors, recently gained capital market access through its listing in Hong Kong to fund expansion.
- Gritek to take full control of 12-inch silicon wafer venture in major restructuring — DigiTimes, 2026-09-14Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies.
- Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake — DigiTimes, 2026-09-14Hua Hong Grace finalized the acquisition of a majority stake in Huali Microelectronics, strengthening its role in China's semiconductor foundry sector.
- AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track — DigiTimes, 2026-09-14Industry focus for AI infrastructure is shifting from compute components to power, thermal management, and electrical grid components, exemplified by Flex's acquisition of EPC Power.
design win
- Solidigm weighs first US NAND fab, explores upstate New York — DigiTimes, 2026-09-18Solidigm, a subsidiary of SK Hynix, is evaluating establishing its first NAND flash manufacturing plant in upstate New York.
- GlobalFoundries and Marvell Expand Collaboration for Next-Gen Optical Connectivity — HPCwire, 2026-09-17GlobalFoundries and Marvell entered a multi-year agreement to boost capacity for SiGe technology for next-generation optical connectivity.
- India's Eastern state clears SiCSem's SiC unit in SEZ — DigiTimes, 2026-09-16SiCSem Private Limited received approval to construct an integrated silicon carbide (SiC) device plant in the Falta Special Economic Zone.
- Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging — DigiTimes, 2026-09-16Samsung Electro-Mechanics and Qualcomm are collaborating on developing an organic bridge for advanced 2.1D packaging.
- Hanmi Semiconductor reportedly lands first back-end foothold at Terafab — DigiTimes, 2026-09-16Hanmi Semiconductor reportedly secured an order to supply advanced packaging equipment to Terafab, marking its entry into the planned US semiconductor project.
- Digital Parks Africa expands into Nigeria, plans data center in Lagos — Data Center Dynamics, 2026-09-15Digital Parks Africa plans a new data center in Lagos, Nigeria, and their existing facility has secured deals to house Bull and Nvidia hardware.
Covered this week
Parts: Memory modules, CXL controllers & memory expanders, PCIe/CXL switches & retimers, Hyperscalers, neoclouds & model labs, MEP & electrical contractors, Prefab / modular data centers & power/cooling skids, Merchant GPUs / accelerators, Hyperscaler custom ASICs, Rack-scale systems, Motherboards, CPU trays, switch trays, 2.5D/3D advanced packaging, Substrate materials, Interposers, silicon bridges, RDL, ASIC design services, IP & EDA, Power shelves & PSUs, Air-cooled heatsinks & vapor chambers, Silicon wafers, NVLink copper spine / backplane cartridges, Test & measurement instruments, Optical transceivers, Optics contract manufacturing, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics, High-layer-count PCBs, Packaging & bonding equipment, Leading-edge foundry, Fab materials, masks, gases, Semiconductor test & burn-in, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Utilities, IPPs & power providers signing data-center deals, Data center developers, operators & REITs, Architecture, engineering & MEP design, General contractors & design-build, Structure, steel, precast, envelope, site equipment, Site utilities, water & fiber entrance, Site selection, power procurement, market intelligence, brokerage, Startup accelerators, Fab equipment, EMS, system integration & rack-level test, Rear-door heat exchangers, ABF / high-layer package substrates, Direct-to-chip cold plates, Coolant distribution units, NAND flash, Transmission, interconnection & grid equipment, Chip-level thermal: lids, heat spreaders, TIMs, Enterprise SSDs & controllers, Glass-core substrates, Copper-clad laminate & PCB materials, NICs / SuperNICs, Server CPUs, HBM, DRAM, Memory interface / buffer chips, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Passives, Timing, security & misc board silicon, Specialty glass & glass fiber, Industrial & specialty gases, Physical security & access, Circuit protection, fuses, surge, grounding, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, CDU internals: plate heat exchangers, pumps, filters, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, DCIM, digital twins, capacity planning, Renewables & long-duration storage hardware, Scale-up fabric, Scale-out switch ASICs, Reciprocating engines & engine microgrids, Fuel cells, Critical minerals: gallium, germanium, indium, tungsten, beryllium, FPGAs, Copper: DAC / ACC / AEC cables, AI storage systems, Copper, Gas supply chain, 800 V DC architecture & solid-state transformers, Building management, controls, environmental sensors, DCI / coherent optics, Lasers, HDD, GPU baseboards & compute trays, Chillers & compressors, CRAH / CRAC / fan walls / in-row units, Cluster management & GPU orchestration, In-rack busbar & power whips, DPUs, Switch systems & white-box ODMs, Air handling, economizers, filtration, Refrigerants & insulating gases, Fiber, connectors, structured cabling, Heat reuse & district heating interfaces, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Gas turbines (onsite / behind-the-meter) & HRSGs, Fans, Rare earths & permanent magnets, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Chassis, rails, rack enclosures, Rack PDUs, Fusion, Aluminum, Grain-oriented electrical steel & amorphous cores, Facility water loop hardware
Companies: SK Hynix, Nvidia, Wiwynn, Kioxia, Intel, OpenAI, Applied Materials, Microsoft, Engie, Oracle, Hitachi, CoreWeave, Huawei, Crusoe, Schneider Electric, Infineon, Doosan, Micron, Samsung Electronics, Lightmatter, Samsung SDI, GlobalFoundries, Resonac, Lam Research, Seagate, Kinsus, Unimicron, Marvell, Rebellions, Apple, Anthropic, Fujitsu, Foxconn (Hon Hai), Tesla, MediaTek, Fujifilm, onsemi, Bizlink, Supermicro, Amazon (AWS), Samsung Electro-Mechanics, Elite Material, Hanmi Semiconductor, Astera Labs, Altera, Teradyne, Qnity, Panasonic, Nokia, AirTrunk, DataBank, Digital Realty, Hut 8, Ciena, GlobalWafers, Umicore, STMicroelectronics, SanDisk, Broadcom, Eaton, Synopsys, Lite-On
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.