AI data center supply chain news — week 36, 2026

342 items · 2026-09-07 to 2026-09-13 ·all news · newer: week 37, 2026 (366) · older: week 35, 2026 (344)

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Mexican cartel's crypto farm seized in mountain raid — 300 GPUs, satellite links, and industrial transformers tapped hydroelectric power — Tom's Hardware, 2026-09-13
Cartels in Mexico are reportedly entering crypto mining by seizing hardware like GPUs, transformers, and tapping hydroelectric power.
Merchant GPUs / accelerators, Power shelves & PSUs, MV/LV transformers, Copper
From grid constraint to grid asset: Rethinking the path to data center power — Data Center Dynamics, 2026-09-13
The article discusses repositioning data center power assets from mere loads to generating solutions to address grid constraints.
Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Gas supply chain
Sponsored: From pilot to production: Direct liquid cooling deployment risks in AI data center cooling — Data Center Dynamics, 2026-09-13
This article reviews the top eight challenges encountered when deploying direct liquid cooling in AI data centers compared to traditional air cooling methods.
Direct-to-chip cold plates, Rack manifolds, Quick disconnects
AI server exports to US slow; electronics parts jump 1.5 times in August — DigiTimes, 2026-09-13
Taiwan reported that electronic parts exports reached a record high of $32.22 billion in August 2026, with integrated circuits and printed circuit boards seeing significant growth.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, PCIe/CXL switches & retimers, NAND flash, Enterprise SSDs & controllers, HDD, Scale-up fabric, Scale-out switch ASICs, Switch systems & white-box ODMs, Optical transceivers, Optics contract manufacturing, Lasers, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics, Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Fiber, connectors, structured cabling, DCI / coherent optics, Timing & telemetry silicon, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Passives, BMC & platform firmware, Timing, security & misc board silicon, Power shelves & PSUs, Fans, Chassis, rails, rack enclosures, In-rack busbar & power whips, Rack PDUs, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Fire detection & suppression, Fire detection & suppression, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, 800 V DC architecture & solid-state transformers, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Fusion, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Gas supply chain, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment, Prefab / modular data centers & power/cooling skids, Site utilities, water & fiber entrance, Physical security & access, Testing, commissioning & certification, Copper, Aluminum, Grain-oriented electrical steel & amorphous cores, Rare earths & permanent magnets, Specialty glass & glass fiber, Refrigerants & insulating gases, Industrial & specialty gases, Critical minerals: gallium, germanium, indium, tungsten, beryllium, DCIM, digital twins, capacity planning, Cluster management & GPU orchestration, Site selection, power procurement, market intelligence, brokerage, Capital & financing, Test & measurement instruments, Robotics, inspection & operations hardware
AI server tracker: Taiwan optics race beyond 1.6T — DigiTimes, 2026-09-13
The AI infrastructure cycle is driving the optical communications supply chain in Taiwan toward advanced components like CW lasers, FAUs, external laser sources, and co-packaged optics, with increasing speeds targeting 3.2T.
Optical transceivers, Optics contract manufacturing, Lasers, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics
Sponsored: Making data centers ready for AI workloads with rack-level cooling — Data Center Dynamics, 2026-09-12
High-density AI workloads require advanced rack-level cooling solutions, forcing organizations to strategically decide where to deploy them.
Chip-level thermal: lids, heat spreaders, TIMs, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units
Kioxia Exceria Pro G2 2TB SSD Review — Speed built to last — Tom's Hardware, 2026-09-12
Kioxia released a review of its Exceria Pro G2 SSD, which utilizes PCIe 5.0 for storage.
Enterprise SSDs & controllers, Kioxia
Analysis: Speed built Colossus, yet redundancy may decide whether SpaceX can scale it — DigiTimes, 2026-09-12
The AI infrastructure market emphasizes raw compute power and rapid construction timeline in determining industry dominance.
Merchant GPUs / accelerators, Chassis, rails, rack enclosures, Hyperscalers, neoclouds & model labs
Exclusive: ASUS xHIS aims to become digital backbone for AI-ready healthcare — DigiTimes, 2026-09-12
Asustek Computer is integrating AI into healthcare, noting that data, workflows, and system architectures are the primary barriers to hospital AI adoption, rather than the AI models themselves.
Server CPUs, Motherboards, CPU trays, switch trays
Taiwan sees AI-era power upgrade openings in France — DigiTimes, 2026-09-12
Taiwanese companies are exploring energy and power infrastructure upgrades in France through trade delegations focused on grid security and energy resilience.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, 800 V DC architecture & solid-state transformers, Transmission, interconnection & grid equipment, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Copper, Aluminum, Grain-oriented electrical steel & amorphous cores, Rare earths & permanent magnets, Specialty glass & glass fiber, Refrigerants & insulating gases, Industrial & specialty gases
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs — DigiTimes, 2026-09-11
Increased complexity in advanced packaging, involving both larger package sizes and smaller internal features, is pressuring semiconductor inspection processes and raising defect costs.
2.5D/3D advanced packaging, Packaging & bonding equipment, Merchant GPUs / accelerators, Hyperscaler custom ASICs
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line — DigiTimes, 2026-09-11
Resonac identified five primary material challenges—warpage, plating, coating, bonding, and polishing—that must be addressed as panel-level packaging advances.
2.5D/3D advanced packaging, ABF / high-layer package substrates, Substrate materials, Resonac
Fabships Aim to Exploit ‘Free’ Space Vacuum for Compound Semiconductor Substrates — EE Times, 2026-09-11
Startup Besxar successfully completed a SpaceX mission, returning recovered wafer samples from space without contamination, suggesting space is a viable area for semiconductor manufacturing.
Silicon wafers, Glass-core substrates, Interposers, silicon bridges, RDL
ASUS Pro WS W890E-SAGE SE Motherboard Review — ServeTheHome, 2026-09-11
ASUS showcased its Pro WS W890E-SAGE SE motherboard, which is designed for the new Xeon 600 workstation platform.
Motherboards, CPU trays, switch trays
Sanctioned Chinese supercomputer maker stripped of IO500 benchmark crown, Intel-powered Aurora retakes the lead — record-breaking ParaStor F9000 storage system doesn't meet reproducibility requirements — Tom's Hardware, 2026-09-11
Sugon's ParaStor F9000 storage systems were disqualified from the IO500 Production benchmark due to failure to meet requirements for architectural details and hardware availability.
AI storage systems
Plans for 120MW data center withdrawn in Lombardy, Italy — Data Center Dynamics, 2026-09-11
The mayor canceled plans for a 120MW data center in Lombardy because the municipality was not provided with necessary grid connection data.
Data center developers, operators & REITs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment, Site utilities, water & fiber entrance
Sponsored: Fluid strategy in the era of high-density computing — Data Center Dynamics, 2026-09-11
The discussion outlines key considerations for using liquid cooling directly to the chip, including material compatibility, contamination control, and lifecycle planning.
Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment
Unplanned power plant outages fell sharply during 2025/26 winter storms: FERC-NERC report — Utility Dive, 2026-09-11
A report indicated that better preparedness and regional power sharing helped prevent planned blackouts during severe winter weather in early 2026.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Reciprocating engines & engine microgrids, Fuel cells, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment
Former Digital Realty and Equinix executive named CEO of Anthropic-backed Theseus Infrastructure — Data Center Dynamics, 2026-09-11
A former executive from Digital Realty and Equinix has been appointed CEO of Theseus Infrastructure, a company backed by Anthropic.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Anthropic, CyrusOne, Digital Realty, Equinix
Pentagon in talks to loan Fluidstack $5bn - report — Data Center Dynamics, 2026-09-11
The Pentagon's Office of Strategic Capital is reportedly in talks to loan Fluidstack $5 billion.
Fluids & coolant treatment, Fluidstack
DCD Talks: Powering US data center growth beyond the traditional grid with David Bosco, PROPWR — Data Center Dynamics, 2026-09-11
US data centers are increasingly looking towards behind-the-meter power sources due to escalating grid constraints.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, SMRs, advanced reactors, components, fuel, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment
Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says — DigiTimes, 2026-09-11
Demand for advanced logic, HBM, DRAM, and advanced packaging will drive global wafer fab equipment spending to $270 billion by 2030.
Leading-edge foundry, HBM, DRAM, 2.5D/3D advanced packaging
DISA launches tender for $21.6bn JWCC contracts — Data Center Dynamics, 2026-09-11
The Defense Industrial Security Agency (DISA) has initiated a tender for $21.6 billion in JWCC contracts, requiring cloud providers to submit bids by October 6th.
Hyperscalers, neoclouds & model labs
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging — DigiTimes, 2026-09-11
Taiwanese panel manufacturers AUO and Innolux are shifting focus and capital from display production toward advanced packaging and co-packaged optics (CPO) to capture higher-growth market segments.
2.5D/3D advanced packaging, Silicon photonics & co-packaged optics
Indian Researchers Look Beyond GPUs to Neuromorphic AI Hardware — EE Times, 2026-09-11
Indian researchers suggested that future computational advances may come from neuromorphic AI hardware rather than solely from continued GPU improvements.
Startup accelerators
CIOE: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom — DigiTimes, 2026-09-11
Hitachi High-Tech is leveraging partnerships rather than proprietary technology to position itself in China's burgeoning optical and photonics sector.
Optical transceivers, Optics contract manufacturing, Lasers, Silicon photonics & co-packaged optics
Taiwan govt boosts EDA R&D to target global gaps — DigiTimes, 2026-09-11
Taiwan plans a major initiative to boost EDA R&D, focusing on developing next-generation design tools to fill gaps left by international industry leaders.
ASIC design services, IP & EDA
Nvidia expands Australian AI factory push as global demand rises — DigiTimes, 2026-09-11
Nvidia's expansion plans in Australia highlight the global race for AI compute and investment.
Merchant GPUs / accelerators, Hyperscalers, neoclouds & model labs, Nvidia
Taiwan tech minister in Europe to advance semiconductor cooperation — DigiTimes, 2026-09-11
Taiwan's tech minister visited Europe to boost cooperation in advanced semiconductor packaging, silicon photonics, and supply chain resilience.
ASIC design services, IP & EDA, Silicon photonics & co-packaged optics, 2.5D/3D advanced packaging
ASPEED plans December BMC price hikes to fuel server security footprint — DigiTimes, 2026-09-11
Aspeed plans to raise prices across all product lines for its BMC chips in December 2026 amid sustained demand for AI servers.
BMC & platform firmware
Nvidia's US$13 billion Hugging Face deal bets physical AI can start at US$400, not US$40,000 — DigiTimes, 2026-09-11
The cost of scaling physical AI, particularly in humanoid robotics, is predicted to depend on lowering experimental costs rather than solely on increasing robotic intelligence.
Nvidia
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22% — DigiTimes, 2026-09-10
Synopsys demonstrated a 22% reduction in the die area for an NPU when using its Fusion Compiler design tool with Samsung's SF2P process, advancing the commercialization of Samsung's 2nm technology.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry, 2.5D/3D advanced packaging, Synopsys
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT — DigiTimes, 2026-09-10
AI demand is expected to drive the global IC substrate market to $19.5 billion by 2026, led by advancements in ABF and BT technologies.
ABF / high-layer package substrates, Substrate materials
Academia Sinica to open 8-inch quantum chip platform in September 2026 — DigiTimes, 2026-09-10
Academia Sinica plans to open its 8-inch quantum chip fabrication facility to external users in September 2026.
Leading-edge foundry, Fab materials, masks, gases
Foxconn's global expansion signals a longer-term manufacturing shift — DigiTimes, 2026-09-10
Foxconn's global expansion strategy, implemented over the last decade, is being highlighted as a way to build supply chain resilience against geopolitical shifts.
Leading-edge foundry, General contractors & design-build, Foxconn (Hon Hai)
More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief — DigiTimes, 2026-09-10
Microsoft's AI accelerators are designed solely for running internal inference workloads on its own Azure fleet, and are not intended for external commercial sale.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Microsoft, Nvidia
Google bankrolls PG&E virtual power plant — Utility Dive, 2026-09-10
Google is funding PG&E's SHARE program, a demonstration of private distributed energy capacity that may later incorporate utility-scale resources.
Utilities, IPPs & power providers signing data-center deals
Loft Orbital, Marlan Space, and Mistral sign $1bn deal to put compute in space — Data Center Dynamics, 2026-09-10
Loft Orbital, Marlan Space, and Mistral signed a $1bn deal to establish a compute capability constellation in space.
Merchant GPUs / accelerators, Mistral
Sponsored: The hidden capacity inside aging data centers: Uncovering performance, capacity, and capital through efficiency — Data Center Dynamics, 2026-09-10
The article discusses the potential for unused capacity in older data centers, emphasizing that power efficiency and asset assessment are critical in today's market.
DCIM, digital twins, capacity planning, Hyperscalers, neoclouds & model labs
Cryptominer BTC Digital could build AI data center in Vietnam — Data Center Dynamics, 2026-09-10
Cryptominer BTC Digital signed an MoU with a local developer to build an AI data center in Vietnam.
Hyperscalers, neoclouds & model labs
Solar generation expected to grow 21% this year, 18% in 2027: EIA — Utility Dive, 2026-09-10
U.S. electricity use is projected to increase due to data centers and manufacturing expansion, according to the EIA.
Renewables & long-duration storage hardware
Parallel Works and CoreWeave partner on cloud platform for DARPA — Data Center Dynamics, 2026-09-10
Parallel Computing and CoreWeave are partnering to develop a managed AI and HPC platform for the DARPA's NODES program.
Merchant GPUs / accelerators, CoreWeave
Google-Blackstone's TPU neocloud named Crux AI, hires Meta's data center engineering head Alan Duong — Data Center Dynamics, 2026-09-10
The newly named Crux AI neocloud, a partnership between Google and Blackstone, plans to hire extensively before ramping up to 2GW per year.
Hyperscaler custom ASICs, Rack-scale systems, Blackstone
UK Prime Minister Andy Burnham rejects calls for national data center moratorium — Data Center Dynamics, 2026-09-10
The UK Prime Minister rejected calls for a national pause on data centers, stating that AI Growth Zones will benefit local communities.
Renewable energy firm Friesen Elektra explores data center project in Lower Saxony, Germany — Data Center Dynamics, 2026-09-10
Renewable energy firm Friesen Elektra is exploring a data center project in Lower Saxony, Germany, potentially utilizing its existing hydrogen park location.
Utilities, IPPs & power providers signing data-center deals, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design
The data center thermal chain — Data Center Dynamics, 2026-09-10
The article discusses the entire chain of managing heat generated by data center chips, from initial capture to potential reuse.
Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment
From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation — DigiTimes, 2026-09-10
AI inference is pushing memory architecture toward processing near memory, 3D stacked SRAM, and high-bandwidth flash solutions.
Memory modules, CXL controllers & memory expanders, NAND flash
STMicroelectronics sets 2027 AI revenue plan with fiber chips at 80% — DigiTimes, 2026-09-10
STMicroelectronics forecasts that 80% of its target revenue of over $2 billion for AI data-center transmission in 2027 will be derived from fiber-optic chips.
Optical transceivers, Silicon photonics & co-packaged optics, STMicroelectronics
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years — DigiTimes, 2026-09-10
Huachuang Xinguang predicts that MicroLED optical interconnects will be usable in data centers within the next 3 to 5 years.
Silicon photonics & co-packaged optics, Optics contract manufacturing
AUO matching glass substrate size stokes TSMC collab speculation — DigiTimes, 2026-09-10
AUO is expanding its large-format panel manufacturing expertise to enter the advanced semiconductor packaging market.
Glass-core substrates, Interposers, silicon bridges, RDL
Taiwan nuclear drill simulates drone attack, drawing on Ukraine war lessons — DigiTimes, 2026-09-10
Taiwan is simulating a drone attack using a nuclear drill to test and strengthen its emergency response capabilities at critical power infrastructure.
Nuclear: existing fleet PPAs & restarts, Specialty glass & glass fiber
Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs — DigiTimes, 2026-09-10
Enflame, a Chinese AI chipmaker, is set to list on the Shanghai Stock Exchange, joining three other domestic GPU manufacturers, marking a significant capital market event for the sector.
Merchant GPUs / accelerators
Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control — DigiTimes, 2026-09-10
Taiwanese IC design companies are exploring opportunities in physical AI and robotics, with Arm expanding its ecosystem to include Realtek.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA
Hermes Testing ships membrane probe cards, targets SiPh and CPO — DigiTimes, 2026-09-10
Hermes Testing Solutions is expanding its test services and customized products for advanced applications like silicon photonics and co-packaged optics, and its proprietary membrane probe card is beginning to generate revenue.
ASIC design services, IP & EDA, 2.5D/3D advanced packaging
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens — DigiTimes, 2026-09-10
Elmos Semiconductor extended its wafer supply agreement with SK keyfoundry until 2037, focusing on 130nm technology despite tightening market conditions for 8-inch foundry capacity.
Silicon wafers, Leading-edge foundry
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand — DigiTimes, 2026-09-10
AI and HPC demand is fueling investment in advanced semiconductor processes, HBM, and advanced packaging, which benefits the global semiconductor equipment market and Taiwan's IPC suppliers.
HBM, 2.5D/3D advanced packaging
STMicroelectronics ties AI data center carbon cuts to power design, not location — DigiTimes, 2026-09-10
STMicroelectronics stated that achieving carbon neutrality in AI data centers is primarily dependent on internal rack-level power and cooling design, rather than the geographical location of the facility.
Board-level power: VRMs, power stages, PoL, power semis, Power shelves & PSUs, In-rack busbar & power whips, STMicroelectronics
Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead — DigiTimes, 2026-09-10
Naver is proposing to build an AI factory for European firms by combining France's energy infrastructure with its own AI stack to expand data center capacity.
Hyperscalers, neoclouds & model labs, Site selection, power procurement, market intelligence, brokerage, Naver
Samsung trims foundry partner network as remaining DSPs gain momentum — DigiTimes, 2026-09-10
Samsung Electronics reduced its foundry Design Solution Partner network to 11 companies to focus on partners that can convert designs into foundry orders.
ASIC design services, IP & EDA, Samsung Electronics
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks — DigiTimes, 2026-09-10
Morphotonics proposed that the AR waveguide bottleneck can be solved by leveraging display industry expertise rather than traditional semiconductor background methods.
Silicon photonics & co-packaged optics
Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26 — DigiTimes, 2026-09-10
Wiwynn Corporation forecasts that AI server shipments will surpass general-purpose server shipments in the third quarter of 2026.
Rack-scale systems, Motherboards, CPU trays, switch trays
Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans — DigiTimes, 2026-09-10
Chinese chip manufacturer Loongson raised funds to expand its core CPU and GPU development for AI inference applications.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Server CPUs
Sandia Develops Analog Memory Approach for More Energy-Efficient Computing — HPCwire, 2026-09-09
Sandia National Laboratories developed ETCRAM, an analog memory approach that promises more energy-efficient computing than traditional digital memory.
Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, PCIe/CXL switches & retimers
WD-Backed IDC Study Finds AI Is Driving Data Storage Growth — HPCwire, 2026-09-09
New IDC research highlights that as AI scales, the enduring role of data storage is as critical as compute infrastructure.
AI storage systems
FlexSysAI launches grid-flexibility pilot with ResetData, CSIRO, University of Queensland — Data Center Dynamics, 2026-09-09
FlexSysAI is conducting a grid-flexibility pilot that will test its AI orchestration platform at the ResetData data center.
DCIM, digital twins, capacity planning
LEDs Push Wireless Power Further — EE Times, 2026-09-09
Researchers demonstrated an LED alternative to laser wireless power transfer for charging indoor IoT devices up to five meters away using adaptive optics and AI beam steering.
Direct-to-chip cold plates, Rack manifolds, Hoses, tubing, fittings, valves
Alice & Bob and Hyperion Report Maps Path to HPC-Quantum-AI Integration — HPCwire, 2026-09-09
A new report details the necessary steps and insights from industry practitioners to enable the integration of High-Performance Computing, Quantum, and AI systems.
Front-of-meter solar, storage could serve 32% of California’s 2032 peak load: study — Utility Dive, 2026-09-09
A study analyzed that 32% of California’s 2032 peak load could potentially be supplied by front-of-meter solar and storage.
Renewables & long-duration storage hardware
Panmnesia and Meta Outline CXL Fabric Spanning Entire AI Data Centers — HPCwire, 2026-09-09
Panmnesia and Meta proposed a next-generation AI data center architecture where the entire facility is conceptualized as operating like a single integrated chip, utilizing CXL fabrics.
Hyperscaler custom ASICs, CXL controllers & memory expanders, Scale-up fabric, Motherboards, CPU trays, switch trays, High-layer-count PCBs
Samsung working with OpenAI on next-generation custom chip - report — Data Center Dynamics, 2026-09-09
Samsung is collaborating with OpenAI to develop a next-generation custom chip.
Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, OpenAI
OpenAI says its next-generation processors could be made at Samsung — double-sourcing with TSMC hints at massive volume requirements — Tom's Hardware, 2026-09-09
OpenAI is increasing its chip supply security by planning to utilize two separate foundries, including Samsung, for its next generation of custom AI processors.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry, OpenAI
OpenAI says its next-generation processors could be made at Samsung — double-sourcing with TSMC hints at massive volume requirements [Updated] — Tom's Hardware, 2026-09-09
OpenAI is working with Samsung to potentially double source AI ASICs, indicating a need for substantial silicon volume from multiple foundries.
Hyperscaler custom ASICs, Leading-edge foundry, OpenAI
Data Center PUE: liquid cooling cut 10%, the ratio moved 3% — Data Center Dynamics, 2026-09-09
The article discusses the challenges and advantages of liquid cooling technologies, noting that traditional Power Usage Effectiveness (PUE) metrics do not accurately reflect the efficiency improvements gained from these systems.
Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems
Verizon powers American AI with billions-strong Corning fiber deal — Data Center Dynamics, 2026-09-09
Verizon entered into a multi-billion dollar agreement with Corning to supply over 80 million miles of high-density optical fiber.
Optical transceivers, Optics contract manufacturing, Fiber, connectors, structured cabling
Goodram PX700 2TB SSD Review — High-end punch on a budget core — Tom's Hardware, 2026-09-09
The Goodram PX700 SSD offers performance comparable to premium drives with good power efficiency, though its price point is noted as a concern.
Enterprise SSDs & controllers
Ivory Coast targets launch of first state-owned data center in 2027 — Data Center Dynamics, 2026-09-09
The Ivory Coast plans to launch its first state-owned data center in 2027 with backing from the US Export-Import Bank.
Hyperscalers, neoclouds & model labs, Physical security & access, General contractors & design-build, Architecture, engineering & MEP design
Google and Blackstone JV experiences delays in data center projects - report — Data Center Dynamics, 2026-09-09
A joint venture between Google and Blackstone is facing delays in its data center development projects.
Blackstone
SoftBank-backed SB Energy subsidiary to develop former Texas 3M campus into R&D tech center — Data Center Dynamics, 2026-09-09
A SoftBank-backed subsidiary plans to convert a former 3M campus in Texas into an R&D technology center with a $1 billion investment.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, Prefab / modular data centers & power/cooling skids, SoftBank
Oracle issues RFP for 2GW of new renewable capacity in New Mexico — Data Center Dynamics, 2026-09-09
Oracle issued a Request for Proposal for 2GW of new renewable energy capacity in New Mexico.
Renewables & long-duration storage hardware, Oracle
Big Tech eyes glacier-strewn Patagonia for building mega AI data centers — region offers 17,300 glaciers, coldness, and cheap energy, but fiber lines are scarce — Tom's Hardware, 2026-09-09
Patagonia, Argentina, is being identified as a potential location for large AI data centers due to its abundant glacial resources, cold climate, and inexpensive energy.
Hyperscalers, neoclouds & model labs, Physical security & access, Site utilities, water & fiber entrance
Playing their part in a sustainable AI era: How businesses can tap into data center power without spiking emissions — Data Center Dynamics, 2026-09-09
Businesses must find ways to utilize data center power responsibly to support AI growth while managing increased emissions and grid strain.
Water treatment, reuse, consumption, Building management, controls, environmental sensors, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment
AI computing power propels tech sector to US$30 trillion, putting servers at the core of 2027's supply chain — DigiTimes, 2026-09-09
Analysts predict that servers and associated data center supply chains will be the main growth drivers for ICT products in 2027, with AI server shipments expected to rise by 17.8%.
Rack-scale systems, EMS, system integration & rack-level test, Motherboards, CPU trays, switch trays
Oil leak from data center contaminates water in Bangkok, Thailand — Data Center Dynamics, 2026-09-09
An oil spill originating from a data center contaminated local water sources in Bangkok, Thailand.
Fluids & coolant treatment
Samsung, LG secure roles as key suppliers for Apple's foldable iPhone — DigiTimes, 2026-09-09
Apple's anticipated foldable iPhone is expected to source key components, including displays, cameras, substrates, passives, and memory, from major South Korean suppliers like Samsung Display and LG Innotek.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Interposers, silicon bridges, RDL, Memory modules, LG Innotek, Samsung Electro-Mechanics, Samsung Electronics, SK Hynix
Damac and Vodafone Türkiye triple Izmir data center project budget — Data Center Dynamics, 2026-09-09
The investment for the Izmir data center project by Damac and Vodafone Türkiye has increased to $300 million.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build
Huaqin signs Nanchang projects as robotics push widens — DigiTimes, 2026-09-09
Huaqin Technology has secured two new projects in Nanchang High-tech Zone, expanding its manufacturing base for embodied-AI robotics and data collection.
General contractors & design-build, MEP & electrical contractors
Google pledges €13bn investment in digital infrastructure in Finland — Data Center Dynamics, 2026-09-09
Google announced a €13 billion investment in digital infrastructure in Finland over the next two years.
Hyperscalers, neoclouds & model labs
Jin Lian Cheng expands into semiconductor wafer fab UPS battery recycling — DigiTimes, 2026-09-09
Jin Lian Cheng Resources upgraded its lead-acid battery recycling facility to meet increased demand from semiconductor plants using high-spec UPS systems.
Energy storage: UPS batteries & BESS
Google steps up green power purchases in Taiwan for 24/7 carbon-free electricity — DigiTimes, 2026-09-09
Taiwan Power is planning to launch Sandbox 3.0 in October 2026 to address energy flexibility and address TSMC's surplus electricity requirements, encouraging green power use.
Heat reuse & district heating interfaces, Renewables & long-duration storage hardware, Testing, commissioning & certification
Quantum Scaling Is Becoming a Control-Electronics Problem — EE Times, 2026-09-09
The pursuit of quantum scaling necessitates moving control electronics closer to the cooling infrastructure to manage increasing complexity in wiring, heat, and latency.
Chip-level thermal: lids, heat spreaders, TIMs, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix — DigiTimes, 2026-09-09
Samsung established an advanced packaging research center in Japan to improve development proximity with key Japanese suppliers for HBM and narrow the gap with SK Hynix.
2.5D/3D advanced packaging, HBM, Samsung Electronics, SK Hynix
Realtek expands cloud AI push with ASIC and SSD chips — DigiTimes, 2026-09-09
Realtek is expanding its AI focus by generating revenue from ASIC projects and entering 3nm product manufacturing, even though its ASIC business is currently smaller than MediaTek's.
Hyperscaler custom ASICs, Merchant GPUs / accelerators, Enterprise SSDs & controllers, MediaTek
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders — DigiTimes, 2026-09-09
Ample Electronic noted that increased demand from MLCC customers and AI server-related products is boosting its business momentum due to higher purchases of copper paste.
Passives
SK hynix Charts Its Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix presented its future direction at the 2026 Future Forum, emphasizing the opportune timing for technological advancements.
Memory modules, HDD, SK Hynix
JD.com's real target with 3 million robots: physical AI — DigiTimes, 2026-09-09
JD.com announced a multi-year plan to accelerate its physical AI adoption by acquiring millions of robots, autonomous vehicles, and drones for its logistics supply chain.
Philippines bets AI will lift GDP by 12 percent in seven years – without hurting outsourcing — The Register, 2026-09-09
The Philippines predicts AI will boost its GDP by 12% over seven years while maintaining its outsourcing sector.
China's AI meets photonics: CIOE, IICIE, and elexcon open together in Shenzhen — DigiTimes, 2026-09-09
Three concurrent expos in Shenzhen showcase the growing convergence of artificial intelligence, photonics, and semiconductor technology.
Silicon photonics & co-packaged optics, Optical DSPs, drivers, TIAs
Huawei orchestrates China's DUV lithography push to cut reliance on ASML — DigiTimes, 2026-09-09
Huawei is actively leading China's effort to develop a domestic semiconductor supply chain, specifically supporting lithography suppliers and linking them with chip manufacturers like SMIC.
ASIC design services, IP & EDA, Leading-edge foundry, Fab materials, masks, gases, Huawei
Apple yields to memory suppliers in historic strategy shift, with Kioxia tipped as NAND long-term agreement recipient — DigiTimes, 2026-09-09
Apple is reportedly prioritizing long-term supply guarantees for NAND flash memory from manufacturers like Kioxia over negotiating low component costs due to structural shortages.
NAND flash, Apple, Kioxia
India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains — DigiTimes, 2026-09-09
HCLTech launched a semiconductor lab in Bengaluru to accelerate testing, qualification, and failure analysis for global chipmakers.
ASIC design services, IP & EDA
Exclusive Interview: WG Tech sees a faster route for TGV beyond displays — DigiTimes, 2026-09-09
WG Tech is expanding its focus from display glass into semiconductor uses, specifically targeting through-glass via (TGV) substrates for advanced packaging and optical communications.
Glass-core substrates, Interposers, silicon bridges, RDL
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix outlined its strategic direction for 2026, focusing on expanding memory solutions, particularly for storage and advanced data center needs.
Memory modules, Memory interface / buffer chips, HDD, AI storage systems, SK Hynix
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix outlined its future strategy focusing on leadership in advanced memory products and high-bandwidth memory solutions.
DRAM, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, SK Hynix
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix presented its future strategies at the 2026 Future Forum, emphasizing advancements in memory and storage solutions.
Merchant GPUs / accelerators, Memory modules, CXL controllers & memory expanders, PCIe/CXL switches & retimers, Enterprise SSDs & controllers, SK Hynix
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix Vice President Hyungsoo Kim participated in a panel discussion at the 2026 Future Forum regarding the company's business and technology direction.
Memory modules, SK Hynix
SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward” — newsroom:sk-hynix, 2026-09-09
SK hynix Vice President Euicheol Lim delivered a keynote presentation at the 2026 Future Forum to outline the company's future business and technological direction.
Memory modules, SK Hynix
Preferred Networks eyes an IPO as Japan's AI chip ambitions outgrow private funding — DigiTimes, 2026-09-09
A major Japanese private tech firm is seeking an IPO because the difficulty of manufacturing high-volume AI chips, rather than designing them, is the current bottleneck.
Hyperscaler custom ASICs, Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Interposers, silicon bridges, RDL
Qualcomm to build custom AI inference chips for AWS — DigiTimes, 2026-09-09
Amazon Web Services (AWS) agreed to build customized AI inference silicon and optical interconnects for Qualcomm, giving the company a major opportunity to enter the hyperscale data center market.
Hyperscaler custom ASICs, Silicon photonics & co-packaged optics
China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling — DigiTimes, 2026-09-09
Biren Technology is collaborating with Shanghai University to jointly research AI-chip optical interconnects and advanced thermal management techniques.
Merchant GPUs / accelerators, Silicon photonics & co-packaged optics, Chip-level thermal: lids, heat spreaders, TIMs
SDC, LGD target advanced glass packaging — DigiTimes, 2026-09-09
South Korean display manufacturers are exploring glass substrates for advanced packaging, although their strategy is currently described as exploratory.
Glass-core substrates
Data Movement’s Where the Value Is, Says Former Cray CEO Ungaro — HPCwire, 2026-09-08
Former Cray CEO Peter Ungaro stated that the primary value in the current market lies in data movement, not just raw compute capacity.
Optical transceivers, Silicon photonics & co-packaged optics, Copper: DAC / ACC / AEC cables, DCI / coherent optics
Qualcomm and AWS Collaborate on AI Inference Chips and 1.6T Connectivity — HPCwire, 2026-09-08
Qualcomm and Amazon announced a multi-generation partnership to develop customized silicon for AI inference and high-speed optical connectivity up to 1.6T.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Optical transceivers, Silicon photonics & co-packaged optics, Amazon (AWS)
Strategy Paper Urges Canada to Add Semiconductors to AI Strategy — EE Times, 2026-09-08
A strategy paper recommended that Canada must integrate semiconductors into its national AI strategy to support its domestic hardware capabilities.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases
Amazon ropes Qualcomm into something, something AI, networking chips — The Register, 2026-09-08
Amazon and Qualcomm are collaborating on AI networking chips through a multi-generation chip collaboration.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Amazon (AWS)
NEC signs MoU with UNDP to support conservation, climate action through use of AI — Data Center Dynamics, 2026-09-08
NEC signed an MoU with UNDP to support climate action and conservation through AI, which will include assessing and studying digital infrastructure resilience.
DCIM, digital twins, capacity planning, Architecture, engineering & MEP design, General contractors & design-build
Google's European energy and infrastructure principle joins Mistral Compute — Data Center Dynamics, 2026-09-08
Mistral, an AI firm, is partnering with Google's European energy and infrastructure arm, Marc Oman, with plans to deploy a 1GW facility.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Mistral
Google backs solar-storage project at former West Virginia coal mine — Utility Dive, 2026-09-08
Google is supporting a project at a former coal mine that will incorporate 100 MWh of zinc-based storage and lithium-ion batteries.
Renewables & long-duration storage hardware
Large-load tariffs increasingly rely on upfront payments, exit fees, ramp schedules — Utility Dive, 2026-09-08
Large-load electricity tariffs are requiring higher upfront payments and ramp schedules, according to research from Lawrence Berkeley National Laboratory.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Testing, commissioning & certification
PsiQuantum Finalizes $100M Award with the US Department of Commerce — HPCwire, 2026-09-08
PsiQuantum secured a $100 million Department of Commerce award to advance its R&D for manufacturing critical components in the U.S.
Leading-edge foundry, Critical minerals: gallium, germanium, indium, tungsten, beryllium
ASML and TSMC want bigger masks for smaller chips — The Register, 2026-09-08
Industry leaders are collaborating on advanced mask technology to prepare high-NA EUV systems for mass production.
Leading-edge foundry, Silicon wafers
TSMC to start using High-NA EUV lithography in 2030 — A10 or A11 technology prime candidates for use — Tom's Hardware, 2026-09-08
TSMC plans to incorporate High-NA EUV lithography technology in 2030, with 6x12-inch photomasks and new scanners expected by 2033.
Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment
Bonneville eyes switch to CAISO’s EDAM from Southwest Power Pool’s Markets+ — Utility Dive, 2026-09-08
BPA is evaluating the criteria required for the federal power marketer to join California's CAISO EDAM, moving away from the SWEDAM.
Floor PDUs, RPPs, static transfer switches, ATS, Metering, power quality, monitoring
D-Wave Signs Definitive Agreement for up to $100M in CHIPS Act Funding — HPCwire, 2026-09-08
D-Wave secured up to $100 million in CHIPS Act funding for R&D related to its superconducting annealing and gate-model technology.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, FPGAs, Leading-edge foundry
SGC Energy partners with Vertiv to deploy PowerNexus at planned AI data center in Gunsan, South Korea — Data Center Dynamics, 2026-09-08
SGC Energy and Vertiv plan to deploy a PowerNexus system for a future AI data center in South Korea.
Facility water loop hardware, Heat reuse & district heating interfaces, MEP & electrical contractors, Site selection, power procurement, market intelligence, brokerage, Vertiv
UK energy operator sticks with Palantir in £21M direct award — The Register, 2026-09-08
A UK energy operator awarded £21 million to Palantir for a proprietary platform, maintaining the incumbent vendor while preparing for future competition.
Hyperscalers, neoclouds & model labs
Retrofitting for the next era of data centers — Data Center Dynamics, 2026-09-08
Colocation providers are enabling capacity and growth in data centers through retrofitting and enhanced efficiency.
Hyperscalers, neoclouds & model labs, Physical security & access, Prefab / modular data centers & power/cooling skids
Fleet seeks approval to build two methane power plants to power data centers in Nevada - report — Data Center Dynamics, 2026-09-08
A group is seeking approval to construct two methane power plants to supply electricity to data centers in Nevada.
Gas supply chain, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers
What does sustained AI growth mean for data center fiber infrastructure? — Data Center Dynamics, 2026-09-08
The increasing demands of AI computing are driving changes and advancements in data center fiber infrastructure.
Optical transceivers, Optics contract manufacturing, Lasers, Optical DSPs, drivers, TIAs, Fiber, connectors, structured cabling, DCI / coherent optics
EnerNex: large loads, new rules — Utility Dive, 2026-09-08
The growing demand from AI mega-campuses is forcing revisions in grid planning and highlighting the constraints of conventional engineering studies.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Transmission, interconnection & grid equipment, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design
A VPP is a garden. Let’s make them flourish nationwide. — Utility Dive, 2026-09-08
Utilities are consistently purchasing Virtual Power Plants (VPPs), which are treated as power generation assets despite their non-uniform nature.
Utilities, IPPs & power providers signing data-center deals
LG's robot actuator push turns appliance know-how into a physical AI supply-chain bet — DigiTimes, 2026-09-08
LG is investing in components critical to humanoid robots, making the supply chain a focus beyond just the finished product.
Merchant GPUs / accelerators, Chassis, rails, rack enclosures
What to expect at CIOE, Shenzhen's optoelectronics mega-expo — DigiTimes, 2026-09-08
The optoelectronics mega-expo in Shenzhen is expected to provide insights into the hardware supply chain supporting global AI infrastructure.
Optical transceivers, Silicon photonics & co-packaged optics
US chip investment push puts ownership at center of Korea's $200 billion deal — DigiTimes, 2026-09-08
Bilateral negotiations between the US and Korea are underway concerning further semiconductor manufacturing investments, targeting the selection of the first project under South Korea's $200 billion strategic mechanism.
Leading-edge foundry, Hyperscalers, neoclouds & model labs
Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors — DigiTimes, 2026-09-08
Samsung is accelerating its silicon photonics development by using TSMC-vetted test vendors to conduct wafer-level testing for photonic integrated circuits, aiming for services by 2027.
ASIC design services, IP & EDA, Silicon photonics & co-packaged optics, Fab equipment, Samsung Electronics
Sponsored: The race to secure power without burdening the grid — Data Center Dynamics, 2026-09-08
The massive demand from AI infrastructure is changing data center planning and construction methods due to power limitations.
Backup generation: gensets, fuel systems, HVO, Utilities, IPPs & power providers signing data-center deals
ChenFull Precision expands from defense and semiconductor equipment into quantum computing — DigiTimes, 2026-09-08
ChenFull Precision is expanding its core manufacturing business from general precision equipment into the semiconductor process equipment supply chain.
Packaging & bonding equipment, Fab equipment, Fab materials, masks, gases
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined — company also trailblazing giant 6×12 photomasks to speed production and lower costs — Tom's Hardware, 2026-09-08
Intel achieved a major industry milestone by processing over one million wafers using High-NA EUV tools, while also advancing the use of 6×12 photomasks to increase efficiency.
Leading-edge foundry, Silicon wafers, Fab equipment, Intel
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027 — DigiTimes, 2026-09-08
Co-packaged optics (CPO) has entered mass deployment, but its critical testing processes across different insertion stages face hurdles.
Silicon photonics & co-packaged optics
Advantech to open North America HQ and expand US manufacturing — DigiTimes, 2026-09-08
Advantech is expanding its North American presence with a new HQ and localized manufacturing to better support rising AI demand in the US.
Motherboards, CPU trays, switch trays, Power shelves & PSUs, Chassis, rails, rack enclosures
CIOE 2026 opens in Shenzhen: 5,000 exhibitors chase the AI-driven optics boom — DigiTimes, 2026-09-08
The CIOE 2026 expo will showcase over 5,000 exhibitors focused on how AI and high-speed optics are shaping the optoelectronics sector.
Optical transceivers, Silicon photonics & co-packaged optics, Optics contract manufacturing
Malaysia weighs Huawei Ascend 910C for MYR2 billion sovereign AI cloud — DigiTimes, 2026-09-08
Malaysia is considering using Huawei's Ascend 910C accelerators as the core computing backbone for a planned MYR2 billion sovereign AI cloud.
Merchant GPUs / accelerators, Hyperscaler custom ASICs
ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows — DigiTimes, 2026-09-08
Inspection equipment manufacturer ViTrox is renewing its focus on the Malaysian semiconductor market in response to increased demand from AI and advanced packaging.
Semiconductor test & burn-in
Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model — DigiTimes, 2026-09-08
Maintaining the massive, recurring cost of advanced semiconductor research infrastructure in Taiwan presents a greater challenge than securing funding and land.
Leading-edge foundry, Hyperscaler custom ASICs, ASIC design services, IP & EDA
Huawei proudly shows off an entirely un-American chip — The Register, 2026-09-08
Huawei demonstrated a chip that the article suggests is not designed within the American market.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Huawei
Infineon COO leaves a US fab open, says GlobalFoundries, ESMC already cover it — DigiTimes, 2026-09-08
Infineon COO highlighted the balance between in-house production, outsourcing, and global expansion, noting that GlobalFoundries and ESMC currently address the needs of a specific US fab.
Leading-edge foundry, Packaging & bonding equipment, Hyperscaler custom ASICs, GlobalFoundries, Infineon
SK Hynix weighs Gwangju investment as Yongin buildout continues — DigiTimes, 2026-09-07
SK Hynix is evaluating accelerated investment in Gwangju's semiconductor cluster to proceed concurrently with its ongoing Yongin development, raising questions about the order flow between the two sites.
DRAM, Memory modules, SK Hynix
Taiwan and Saxony start building the talent pipeline behind TSMC's German fab — DigiTimes, 2026-09-07
Following TSMC's fab investment in Germany, academic institutions from Taiwan and Germany discussed forging long-term research collaborations in areas like quantum sensing and semiconductor materials.
Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment, Fab materials, masks, gases
FitTech shifts from LED to optical communications, eyes InP relief — DigiTimes, 2026-09-07
FitTech is pivoting from LED to optical communications, anticipating increased outsourced chip testing orders as the shortage of indium phosphide (InP) material eases and future demand rises.
Silicon photonics & co-packaged optics, Optical DSPs, drivers, TIAs, Critical minerals: gallium, germanium, indium, tungsten, beryllium
AI demand gives Aspeed visibility into 2027 as supply constraints ease — DigiTimes, 2026-09-07
Aspeed reported that its order visibility now extends into 2027, with backlogs for that year already surpassing expected 2026 revenue, due to easing supply chain constraints.
Hyperscaler custom ASICs, ASIC design services, IP & EDA, DPUs, Aspeed
The cooling loop can't keep up — Data Center Dynamics, 2026-09-07
The article discusses how thermal lag in the control systems of Coolant Distribution Units (CDUs) presents a risk that is not adequately accounted for in reliability planning.
Direct-to-chip cold plates, Rack manifolds, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software
Why Microcooling Will Be a Critical Enabler of Agentic AI — EE Times, 2026-09-07
Microcooling is necessary to manage heat and sustain advanced AI intelligence in tiny devices.
Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters
Key ASIC and CT Vision plan green AI data center in Malaysia — Data Center Dynamics, 2026-09-07
Companies are planning to build an AI data center in Malaysia powered entirely by renewable energy.
Hyperscaler custom ASICs, Rack-scale systems, Data center developers, operators & REITs
Sponsored: What makes a battery a data center battery? — Data Center Dynamics, 2026-09-07
The article details that modern data center UPS batteries require specific design features, such as low internal resistance and high-rate performance, exemplified by pure lead TPPL design.
Energy storage: UPS batteries & BESS
Using waste heat from data centers — Data Center Dynamics, 2026-09-07
Data centers can use their waste heat to generate useful warmth for local communities.
Rear-door heat exchangers, Heat reuse & district heating interfaces
Flea market shopper uncovers $1,500 worth of Samsung SSDs inside a $30 expansion card — Three 2TB 980 Pro drives were hidden beneath an Asus Hyper M.2 heatsink — Tom's Hardware, 2026-09-07
A bargain hunter in Kuwait found three Samsung 980 Pro 2TB SSDs mistakenly included inside a cheap Asus PCIe expansion card.
Enterprise SSDs & controllers
SK Hynix reportedly ends LG eSSD talks as ASICLAND deal expands — DigiTimes, 2026-09-07
SK Hynix reportedly terminated discussions with LG Electronics regarding the design outsourcing for a next-generation enterprise SSD controller.
Enterprise SSDs & controllers, SK Hynix
How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis — DigiTimes, 2026-09-07
Researchers are studying neuroscience to design energy-efficient microelectronics that can address the growing power and thermal issues in advanced AI chips.
Hyperscaler custom ASICs, ASIC design services, IP & EDA
Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI — DigiTimes, 2026-09-07
The physical requirements of AI are shifting Silicon Valley's tech center of gravity back toward heavy industrial hardware, demanding massive infrastructure for compute and cooling.
Merchant GPUs / accelerators, Chassis, rails, rack enclosures, Direct-to-chip cold plates, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Facility water loop hardware, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Gas turbines (onsite / behind-the-meter) & HRSGs, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging — DigiTimes, 2026-09-07
UC San Diego is training engineers for TSMC and pioneering advanced 3D packaging design.
2.5D/3D advanced packaging, Leading-edge foundry
South Korea secures US$2B from Air Products, Axcelis, Corning, Pacifico Energy to bolster supply chains — DigiTimes, 2026-09-07
Multiple US tech companies have invested $2B into South Korea's semiconductor materials, equipment, and clean energy sectors to secure critical supply chains.
Specialty glass & glass fiber, Industrial & specialty gases, Critical minerals: gallium, germanium, indium, tungsten, beryllium, Air Products
India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it — DigiTimes, 2026-09-07
India is positioning its semiconductor ecosystem to provide global supply chain redundancy, and views Taiwan as a key partner in this effort.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment, Fab equipment, Fab materials, masks, gases
Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads — EE Times, 2026-09-07
Kioxia is developing a Flash-for-DRAM initiative utilizing NAND flash optimized for high-speed AI workloads.
NAND flash, Enterprise SSDs & controllers, Kioxia
Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market — DigiTimes, 2026-09-07
AI and HPC are driving semiconductor expansion globally, creating high demand for facility integration, equipment installation, and engineering services.
Leading-edge foundry, Fab equipment, Fab materials, masks, gases
Sponsored: Five intensifying forces, one system-level strategy — Data Center Dynamics, 2026-09-07
AI infrastructure demands a shift from component-level optimization to integrated, validated system-level strategies due to increasing density, speed, scale, and complexity.
Rack-scale systems, EMS, system integration & rack-level test
Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40% — DigiTimes, 2026-09-07
Phison anticipates that NAND Flash supply will remain constrained through 2027, challenging projections of a quick return to oversupply.
NAND flash, Phison
Micron scores seventh PTAB win in YMTC patent fight — DigiTimes, 2026-09-07
Micron Technology won a seventh Patent Trial and Appeal Board ruling against Yangtze Memory Technologies in a legal battle regarding patents, while other challenges are proceeding through the USPTO.
Memory modules
Exclusive: Taipower's new green power sandbox could ease TSMC's surplus electricity problem — DigiTimes, 2026-09-07
TSMC's surplus electricity challenges may be alleviated by Taipower's development of a new green power sandbox, aligning with the industry's broader push for renewable energy goals.
Utilities, IPPs & power providers signing data-center deals
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E — DigiTimes, 2026-09-07
SK Hynix plans to allocate 34% of its DRAM output by year-end to its 1c DRAM, a sixth-generation 10nm-class process, while also preparing for HBM4E.
Memory modules, SK Hynix
India says it cannot build electronics without China and has started easing the rules to prove it — DigiTimes, 2026-09-07
India stated that while pursuing a semiconductor build-out, the country acknowledges its dependency on Chinese supply chains for electronics.
Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law — DigiTimes, 2026-09-07
Huawei claims its next-generation Kirin 2026 processor data will challenge the established understanding that increased transistor density automatically leads to insurmountable thermal limits in 3D chips.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, 2.5D/3D advanced packaging, Chip-level thermal: lids, heat spreaders, TIMs, Huawei
Thailand pauses all datacenter builds and approvals — The Register, 2026-09-07
Thailand has halted all datacenter construction and approvals, following mixed industry updates regarding payments and major hardware purchases.
Hyperscalers, neoclouds & model labs, Fujitsu, Huawei
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens — DigiTimes, 2026-09-07
The week's AI infrastructure news covered semiconductor supply chains, including Nexperia's legal issues, Sandisk's HBF, Micron's HBM expansion, and Marvell's silicon photonics roadmap.
HBM, Silicon photonics & co-packaged optics, Marvell, Micron, SanDisk

earnings

Delays trim CAEC August sales, but UPS demand outlook stays firm — DigiTimes, 2026-09-13
CAEC experienced a decrease in August revenue due to shipping delays of LiFePO4 battery systems used in UPS equipment, although the revenue remained high historically.
Energy storage: UPS batteries & BESS
Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware — DigiTimes, 2026-09-11
King Slide Works reported the fastest revenue growth among tracked AI supply chain companies for August, following significant growth in previous months.
GPU baseboards & compute trays
Higher prices can't crimp server sales as AI drives demand — The Register, 2026-09-11
AI demand is expected to drive continued server sales from both enterprise and government buyers, offsetting concerns about higher component prices.
Motherboards, CPU trays, switch trays, High-layer-count PCBs, Power shelves & PSUs
Kioxia eyes US listing amid NAND profit rebound — DigiTimes, 2026-09-11
Kioxia's planned US listing is supported by rebounding NAND profitability, which is driven by robust data-center demand and continued capacity expansion.
NAND flash, Kioxia
AI server tracker: Taiwan's rack supply chain reveals where the AI buildout is accelerating — DigiTimes, 2026-09-11
Taiwanese suppliers of rack-scale components, including rail kits, thermal solutions, and power supplies, booked significant revenue increases in August, indicating accelerating AI buildout.
Chassis, rails, rack enclosures, Air-cooled heatsinks & vapor chambers, Power shelves & PSUs
AI server tracker: Taiwan's August filings say demand is still accelerating — DigiTimes, 2026-09-11
Taiwanese AI hardware companies reported strong August revenue growth, indicating continued acceleration in the AI data center build-out.
Merchant GPUs / accelerators, EMS, system integration & rack-level test, Rack manifolds, Optical transceivers, Substrate materials, Chip-level thermal: lids, heat spreaders, TIMs
Rayzher rides semiconductor fab buildout to record revenue — DigiTimes, 2026-09-10
Rayzher Industrial reported record revenue for August 2026 and strong cumulative revenue for the first eight months, driven by the semiconductor fab buildout.
Industrial & specialty gases
China's AI accelerator supplier Biren posts 2,000% year-over-year revenue growth — US export controls benefit homegrown chips as Nvidia and AMD exit market — Tom's Hardware, 2026-09-10
Biren Technology reported massive year-over-year revenue growth in the first half of 2026, capitalizing on the removal of competition from Nvidia and AMD.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Nvidia
ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out — DigiTimes, 2026-09-10
ASE reported record revenue in August, driven by sustained high demand for semiconductor packaging and testing services related to AI.
2.5D/3D advanced packaging, Packaging & bonding equipment
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up — DigiTimes, 2026-09-10
Foxsemicon posted record revenue in Q2 2026, projecting stronger second-half results as its Thailand facility ramps up.
TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth — DigiTimes, 2026-09-10
TSMC reported significant revenue increases in August 2026, driven by sustained demand for AI semiconductors.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry
Powerlogic revenue rises for 3rd straight month on niche demand — DigiTimes, 2026-09-10
Fan manufacturer Powerlogic reported a 2.47% increase in month-over-month revenue in August 2026, citing niche applications as a support for its operations.
Fans
Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion — DigiTimes, 2026-09-10
Wistron and Wiwynn achieved record revenues in August 2026, driven by expanding shipments of AI servers.
EMS, system integration & rack-level test, Wistron, Wiwynn
Phison pushes in-house AI solutions as August revenue surges to record high — DigiTimes, 2026-09-10
Phison Electronics noted that its AI Data Platform is benefiting from strong demand for AI inference and enterprise storage, driving record revenue growth.
AI storage systems
AI servers push Asus' August revenue up 51% — DigiTimes, 2026-09-09
Asus' August revenue increased by 12.87% compared to July and 51.17% year-over-year, driven by increased demand for AI servers and PCs.
Motherboards, CPU trays, switch trays, EMS, system integration & rack-level test
Ledlink Optics posts 21-month revenue high on AI server, auto demand — DigiTimes, 2026-09-09
Ledlink Optics reported increased revenue in August, driven by demand from the AI server and automotive sectors.
Optical transceivers, Optics contract manufacturing, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics
Asia Vital revenue hits record as US CSP ASIC server demand climbs — DigiTimes, 2026-09-09
Asia Vital reported a 29.10% year-over-year revenue increase for August 2026, driven by continued strong demand for ASIC servers to a major US cloud service provider.
Hyperscaler custom ASICs, Rack-scale systems
Intel reportedly set to hike CPU prices by 10% ahead of 'major annual product' launch in March 2027 — report says AMD will follow up between June and July — Tom's Hardware, 2026-09-08
Intel is reportedly planning a 10% CPU price increase ahead of a major product launch, which AMD is expected to follow up on later in 2026.
Server CPUs, Intel
Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027 — DigiTimes, 2026-09-08
Semiconductor testing company Ma-tek reported record August revenue of NT$565 million, achieving continuous growth for the sixth consecutive month.
Semiconductor test & burn-in, Industrial & specialty gases
PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand — DigiTimes, 2026-09-08
Zhen Ding Technology reported strong August revenues, exceeding US$634 million, driven by increasing demand for server components, optical modules, and IC substrates.
High-layer-count PCBs
Ennoconn reports August growth as Kontron stake rises to 48.36% — DigiTimes, 2026-09-08
Ennoconn reported August growth driven by Physical AI applications and semiconductor fab construction, while increasing its stake in Kontron.
Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment, Fab equipment
Macronix, Winbond, Etron see revenue surge through August as memory price rally continues — DigiTimes, 2026-09-08
Three memory manufacturers reported sharply increasing revenues through August, citing sustained high demand in the memory market.
Memory modules, Memory interface / buffer chips
Adata, Team Group post record August revenue as memory module makers build inventory for 2027 — DigiTimes, 2026-09-08
Major memory module manufacturers, including Adata and Team Group, reported record revenue in August 2026 due to sustained high demand and rising prices in the AI market.
Memory modules
Acer Asia units post double-digit growth on strong AI orders — DigiTimes, 2026-09-07
Acer's Asia unit experienced double-digit revenue growth in the first half of 2026, driven by strong AI server demand, particularly for Altos Computing.
Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays
Accton sets August revenue record as AI networking demand surges — DigiTimes, 2026-09-07
Accton Technology reported a record-high August revenue, attributing the surge to strong demand for AI networking equipment.
Scale-out switch ASICs, Optical transceivers, Optics contract manufacturing
JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion — DigiTimes, 2026-09-07
JM-Applied reported significant growth in the first half of 2026, driven by increased demand for gas supply systems and equipment at wafer fabs due to AI and HPC expansion.
Fab materials, masks, gases, Micron
Chicony Power's August revenue dips as AI server and satellite demand strengthens — DigiTimes, 2026-09-07
Chicony Power's August revenue declined due to a memory supply shortage impacting notebook power supplies, although strong demand from AI servers and satellite communications suggests continued growth.
DRAM, Power shelves & PSUs
Foxconn revenue climbs on AI server demand, outlook improves — DigiTimes, 2026-09-07
Foxconn reported sharp revenue increases due to continued demand for AI servers and related cloud and networking hardware, suggesting the global supply chain remains supported.
Rack-scale systems, EMS, system integration & rack-level test, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Copper-clad laminate & PCB materials, Power shelves & PSUs, Foxconn (Hon Hai)

product launch

d-Matrix Joins the NVIDIA NVLink Fusion Platform — ServeTheHome, 2026-09-12
d-Matrix plans to utilize NVIDIA's NVLink Fusion technology for its next-generation Raptor AI accelerators to facilitate scaling.
NVLink copper spine / backplane cartridges, d-Matrix, Nvidia
Inside Architect Labs’ Two-Week Chip Design — EE Times, 2026-09-12
Architect Labs claims its AI platform, Redwood, can significantly reduce the time required for custom chip design from years to mere weeks.
Hyperscaler custom ASICs, ASIC design services, IP & EDA
Murata targets mass production of its AI power substrate next year — DigiTimes, 2026-09-12
Murata plans to transition into the substrate layer by initiating mass production of its AI power substrate, iPaS, next year.
ABF / high-layer package substrates, Substrate materials, Murata
Luxshare eyes AR glasses breakthrough through car HUD model — DigiTimes, 2026-09-11
Luxshare showcased various optical and sensing technologies, including modules for AR/VR/XR and automotive use, highlighting its push for vertical integration in the optics supply chain.
Optical transceivers, Silicon photonics & co-packaged optics, Lasers, Fiber, connectors, structured cabling, Luxshare
SoC PLANNER: A New Generation of Automated SoC Design Exploration Managing Cost-Effectiveness and Sustainability — EE Times, 2026-09-11
CEA, Defacto Technologies, and Innova Advanced Technologies launched SoC PLANNER, a new platform designed for automating and exploring next-generation System-on-Chip (SoC) designs.
ASIC design services, IP & EDA
Oracle delivered 300,000 GPUs in Q1 FY2027 — Data Center Dynamics, 2026-09-11
Oracle is releasing 300,000 GPUs in Q1 FY2027, alongside announcing a future agentic AI accelerator.
Merchant GPUs / accelerators, Oracle
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing — DigiTimes, 2026-09-11
ficonTEC launched a new automated optical test solution to address bottlenecks in Co-packaged optics (CPO) testing, anticipating increased demand for such equipment over the next couple of years.
Silicon photonics & co-packaged optics, Packaging & bonding equipment, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates — DigiTimes, 2026-09-11
Samsung Electro-Mechanics and LG Innotek showcased competing advanced package substrate technologies at the KPCA Show 2026 in response to the demands of evolving AI semiconductors.
ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, LG Innotek, Samsung Electro-Mechanics
Enflame enters public markets with Nvidia alternatives in its sights — DigiTimes, 2026-09-11
Enflame Technology, a Chinese AI chipmaker, listed on Shanghai's STAR Market to raise capital for developing next-generation AI processors and computing systems, focusing on alternatives to Nvidia.
Merchant GPUs / accelerators, Hyperscaler custom ASICs
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO — DigiTimes, 2026-09-11
Huawei launched a 7.2 Tbps near-packaged optics (NPO) module designed for AI data centers, aiming to set new standards for optical interconnectivity.
Optical transceivers, Silicon photonics & co-packaged optics, Optics contract manufacturing, Huawei
d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics — DigiTimes, 2026-09-10
AI chip startup d-Matrix plans to integrate its Raptor inference processors into Nvidia MGX racks using NVLink Fusion technology for low-latency AI inference.
Merchant GPUs / accelerators, Startup accelerators, GPU baseboards & compute trays, d-Matrix, Nvidia
Samsung, SK Hynix eye 2028 High-NA DRAM rollout — DigiTimes, 2026-09-10
SK Hynix plans to use High-NA lithography for DRAM production beginning in 2028 and is considering joining a consortium to develop 12-inch photomasks.
DRAM, SK Hynix
d-Matrix and NVIDIA Plan NVLink Fusion Rack System for AI Inference — HPCwire, 2026-09-10
d-Matrix and NVIDIA announced a collaboration featuring an NVLink Fusion rack-level system designed for seamless AI inference deployment.
Scale-up fabric, Rack-scale systems, d-Matrix, Nvidia
Qualcomm Talks Next-Gen Oryon CPU, Adreno GPU, and Hexagon NPU — ServeTheHome, 2026-09-10
Qualcomm revealed details about its next-generation integrated computing components, including the Oryon CPU, Adreno GPU, and Hexagon NPU.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Server CPUs
ITRI to showcase 3.2T silicon photonics and AI data center cooling — DigiTimes, 2026-09-10
ITRI will showcase advanced technologies at a 2026 expo, including silicon photonics and a 3D aluminum microchannel cooler designed for AI data centers.
Silicon photonics & co-packaged optics, Direct-to-chip cold plates
Chinese quartz approved for semiconductor equipment and DRAM manufacturing, but it still can't break America's monopoly — China secures domestic supply for chipmaking components, but Spruce Pine still holds the crucible monopoly — Tom's Hardware, 2026-09-10
Pacific Quartz gained qualified status for its high-purity quartz to be used in semiconductor equipment and DRAM manufacturing.
Leading-edge foundry, Memory modules
Huawei bets big on near-packaged optics with 7.2T module to fuel AI scaling — Data Center Dynamics, 2026-09-10
Huawei is focusing on near-packaged optics, introducing a 7.2T module to support scaling AI networks.
Silicon photonics & co-packaged optics, Huawei
TSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort — Tom's Hardware, 2026-09-10
Industry leaders ASML, Intel, Samsung, and TSMC are collaborating on the transition to large 6×12-inch photomasks for High-NA EUV lithography to enable larger processors.
Leading-edge foundry, Packaging & bonding equipment, Fab materials, masks, gases, Intel
Cincon High-Performance Power Modules for Edge AI & IPCs — EE Times, 2026-09-10
Cincon is offering baseplate-cooled DC-DC and AC-DC power solutions for Internet-connected devices (IPCs) and edge AI environments.
Board-level power: VRMs, power stages, PoL, power semis
Spirox TGV inspection capable of scanning entire substrate in 20 minutes — DigiTimes, 2026-09-10
Spirox has entered the advanced packaging inspection market using nonlinear optical technology, focusing on inspecting Glass Through-Glass Via (TGV) and Through-Silicon Via (TSV) features, with samples already being tested by global material and foundry companies.
Glass-core substrates, Interposers, silicon bridges, RDL, Packaging & bonding equipment
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process — DigiTimes, 2026-09-10
DB HiTek successfully completed reliability qualification for its 1,200 V SiC MOSFET process using 8-inch wafers, which could increase foundry capacity for high-power semiconductors.
Leading-edge foundry, Fab materials, masks, gases
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips — DigiTimes, 2026-09-10
JD Cloud plans to build a 100,000-card cluster using GPUs supplied by Moore Threads, marking a significant deployment of domestic Chinese GPUs.
Merchant GPUs / accelerators, Hyperscaler custom ASICs
SK Hynix says 3D DRAM will borrow from logic foundry playbook — DigiTimes, 2026-09-10
SK Hynix is considering adopting logic foundry methodologies for its 3D DRAM development, suggesting a deeply integrated approach to memory and advanced packaging.
Merchant GPUs / accelerators, 2.5D/3D advanced packaging, Memory modules, SK Hynix
China gets an early shot at the next SiC power-chip cycle — DigiTimes, 2026-09-10
Alkaidsemi launched a 1,200 V silicon carbide superjunction MOSFET, aiming to capitalize on emerging demands from AI servers and high-voltage DC data centers.
Hyperscaler custom ASICs, DPUs, Board-level power: VRMs, power stages, PoL, power semis, Critical minerals: gallium, germanium, indium, tungsten, beryllium
Amazon Deal Shines Light on Qualcomm’s High-Bandwidth Compute Strategy — HPCwire, 2026-09-10
Qualcomm is leveraging its investment in high-bandwidth compute to develop custom AI accelerators.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Startup accelerators, Rack-scale systems, Amazon (AWS)
Parallel Works and CoreWeave Deliver Managed AI Cloud for DARPA NODES — HPCwire, 2026-09-09
Parallel Works and CoreWeave announced a managed AI and HPC platform for DARPA, combining Parallel Works’ ACTIVATE platform with CoreWeave’s AI Native Cloud Platform.
Rack-scale systems, EMS, system integration & rack-level test
Arm Neoverse CSS N4 Launched for Next-Gen CPUs and DPUs — ServeTheHome, 2026-09-09
Arm has launched the Neoverse CSS N4 IP for building next-generation, power-efficient CPUs and DPUs with PCIe Gen7 capabilities.
Server CPUs, DPUs
JD Cloud and Moore Threads team up on cluster of 100,000 GPUs — Data Center Dynamics, 2026-09-09
JD Cloud and Moore Threads are partnering on a cluster of 100,000 GPUs, utilizing Chinese hardware components.
Merchant GPUs / accelerators, Rack-scale systems, GPU baseboards & compute trays
Xanadu and ASML to Collaborate on Lithography for Photonic Quantum Hardware — HPCwire, 2026-09-09
Xanadu and ASML announced a collaboration to develop advanced lithography processes for Xanadu’s photonic quantum hardware.
Leading-edge foundry, Fab equipment
BIWIN Brings Storage Solutions for AI Era at embedded world NA 2026 — EE Times, 2026-09-09
BIWIN is showcasing embedded SSDs, memory, and industrial storage designed for cloud and edge use at embedded world NA 2026.
Enterprise SSDs & controllers
LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up — DigiTimes, 2026-09-09
LG Innotek is using internal AI to address microcracks in semiconductor glass substrates, aiming for initial production by around 2028.
Glass-core substrates, LG Innotek
SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens — DigiTimes, 2026-09-09
SEMIFIVE has launched mass production of its data center accelerator using Samsung Foundry's 4nm process, indicating high utilization of Samsung's fabrication capacity.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Leading-edge foundry
Arm expands push for agentic AI infrastructure with new Neoverse chip design — DigiTimes, 2026-09-09
Arm introduced new Neoverse CPU designs (N4 and AGI) aimed at providing customers with flexible silicon options for agentic AI infrastructure.
Hyperscaler custom ASICs, Server CPUs
Arm Expands AI Infrastructure for Agentic Era with AGI CPU and Neoverse CSS N4 — HPCwire, 2026-09-08
Arm announced that its expanded AI infrastructure, featuring AGI CPUs and Neoverse CSS N4, is designed to support the increased CPU-based computing demands of the agentic AI era.
Server CPUs, Hyperscaler custom ASICs
Imec Advances Scalable Superconducting Tech with NbTiN Circuits and 30nm Interconnects — HPCwire, 2026-09-08
Imec presented details on a three-metal-level superconducting NbTiN-based Josephson junction circuit for next-generation HPC and AI applications.
ASIC design services, IP & EDA, 2.5D/3D advanced packaging, Interposers, silicon bridges, RDL, Leading-edge foundry
Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV — HPCwire, 2026-09-08
Intel Foundry and ASML presented progress regarding the industrial adoption of High NA Extreme Ultraviolet (EUV) lithography.
Leading-edge foundry, Fab materials, masks, gases, Intel
Qualcomm and AWS partner on custom silicon for large-scale AI data centers — Data Center Dynamics, 2026-09-08
Qualcomm and AWS are collaborating on custom silicon for large-scale AI data centers, which will also incorporate optical connectivity up to 1.6T.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Silicon photonics & co-packaged optics, Optical transceivers
EuroHPC and NAISS Inaugurate Arrhenius Supercomputer in Sweden — HPCwire, 2026-09-08
EuroHPC and NAISS inaugurated the Arrhenius supercomputer in Linköping University in Sweden.
Hyperscalers, neoclouds & model labs, Prefab / modular data centers & power/cooling skids
SkyWater Launches Quantum Solutions Foundry Business — HPCwire, 2026-09-08
SkyWater Technology launched Quantum Solutions, a dedicated merchant foundry offering semiconductor solutions for quantum computing, networking, and sensing.
Leading-edge foundry, Merchant GPUs / accelerators
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline — DigiTimes, 2026-09-08
ASML, alongside Intel Foundry, TSMC, and Samsung, announced a joint commitment to transition from 6-inch to 12-inch photomasks for High NA EUV lithography, with TSMC setting the timeline.
Leading-edge foundry, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Intel
Huawei Kirin 9050 Pro puts LogicFolding to the test with 55% density gain, 66% lower NPU power — DigiTimes, 2026-09-08
Huawei showcased the Kirin 9050 Pro, citing a significant increase in transistor density and lower power consumption for its various cores.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Huawei
Arm debuts next-gen semi-custom Neoverse CSS N4 ‘Ranger’ platform — compute subsystem packs up to 128 cores per die on TSMC N3P — Tom's Hardware, 2026-09-08
Arm introduced its next-generation Neoverse CSS N4 platform, capable of integrating up to 128 cores per die and 256 MB of L3 cache.
Hyperscaler custom ASICs, ASIC design services, IP & EDA
Arm debuts next-gen semi-custom Neoverse CSS N4 ‘Falcon' platform — compute subsystem packs up to 128 cores per die on TSMC N3P — Tom's Hardware, 2026-09-08
Arm introduced its next-generation Neoverse CSS N4 'Falcon' compute platform, which can integrate up to 128 cores per die and 256 MB of L3 cache using TSMC N3P technology.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Server CPUs, Leading-edge foundry, 2.5D/3D advanced packaging
Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission — DigiTimes, 2026-09-07
Corning plans to expand its use of advanced glass solutions for packaging, substrates, and high-speed optical communications to address AI infrastructure bottlenecks.
Glass-core substrates, Optical transceivers, Silicon photonics & co-packaged optics
Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO — DigiTimes, 2026-09-07
Taiwan display manufacturers Innolux and AUO are expanding into the advanced semiconductor supply chain by developing technologies like FOPLP, glass substrates, and Micro LED for Co-packaged Optics.
Glass-core substrates, Silicon photonics & co-packaged optics
xTool reveals its next generation of lasers — modular X1 supports CO2, Diode, UV, Fiber, and MOPA lasers — Tom's Hardware, 2026-09-07
xTool introduced the modular X1 laser system, capable of supporting multiple laser types including CO2, Diode, UV, Fiber, and MOPA.
Industrial & specialty gases
Stulz launches new air cooling systems for Edge data centers — Data Center Dynamics, 2026-09-07
Stulz launched new air cooling systems specifically designed for Edge data centers.
CRAH / CRAC / fan walls / in-row units, Stulz
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV — DigiTimes, 2026-09-07
Naura Technology demonstrated a selective etching process for 64-layer 3D DRAM, providing an alternative path for domestic memory manufacturers facing restrictions on advanced EUV lithography.
DRAM, Memory modules

supply constraint

AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers — DigiTimes, 2026-09-12
High demand for AI computing is causing a capacity shortage in passive electronic components, benefiting Taiwanese manufacturers.
Passives
China's DRAM supply chain clears another materials hurdle — DigiTimes, 2026-09-11
A Chinese quartz company has secured qualification for high-purity quartz products to support domestic DRAM manufacturing.
Memory modules, Industrial & specialty gases
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion — DigiTimes, 2026-09-11
China's rapid expansion of its energy storage sector has prompted government intervention due to a surge in speculative project claims rather than actual construction.
Energy storage: UPS batteries & BESS, Renewables & long-duration storage hardware
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle — DigiTimes, 2026-09-11
Sources reported that while supply of low-CTE glass fiber cloth for advanced substrates is constrained, glass-core substrates are still in the technical validation phase, facing challenges like brittleness and TGV metallization issues.
Glass-core substrates
Beyond Category 5: What extreme hurricanes mean for electric utilities — Utility Dive, 2026-09-10
Changes in storm behavior necessitate that electric utilities update their planning frameworks to account for evolving grid risks.
Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Transmission, interconnection & grid equipment
The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator — Tom's Hardware, 2026-09-10
The increasing demand for ABF substrates, crucial for advanced AI chips, is creating supply and technical bottlenecks that the industry must resolve.
ABF / high-layer package substrates, Substrate materials, Glass-core substrates
Murata to stop some MLCC lines as AI server demand strains supply — DigiTimes, 2026-09-10
Murata will phase out production of certain MLCC part numbers due to intense AI-driven demand pressures.
Passives
China's Nvidia rivals raise prices as HBM shortage bites — DigiTimes, 2026-09-10
Chinese chip manufacturers are increasing their prices for accelerators because the high-bandwidth memory (HBM) supply is constrained and expensive.
Merchant GPUs / accelerators, HBM, Nvidia
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on — DigiTimes, 2026-09-10
A reliability evaluation of through-glass via modules submitted to TSMC has slowed the planned rollout of glass substrates from Samsung Electro-Mechanics.
Glass-core substrates, Packaging & bonding equipment, Samsung Electro-Mechanics
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap — DigiTimes, 2026-09-10
China's CXMT faced difficulties bringing its HBM3 production to scale, with initial yields reportedly stabilizing around 25%.
HBM
Samsung to help fortify OpenAI's semiconductor supply chain — The Register, 2026-09-09
Samsung is assisting OpenAI by strengthening its semiconductor supply chain, particularly for compute and memory components.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Memory modules, CXL controllers & memory expanders, OpenAI
OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity — DigiTimes, 2026-09-09
The article suggests that Samsung's most advanced commercial wafers are increasingly consumed internally by Samsung's memory division, indicating a capacity constraint for external customers like OpenAI.
Leading-edge foundry, Silicon wafers, OpenAI
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes — DigiTimes, 2026-09-09
Kioxia is resisting deeper manufacturing ties with SK Hynix and foregoing higher NAND prices, preferring to rely on long-term customer agreements and steady capacity growth despite tight memory supply.
NAND flash, Kioxia, SK Hynix
Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage — DigiTimes, 2026-09-09
Supply chain constraints for advanced semiconductor processes, packaging, and mature-node chips are expected to persist for several years.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment
ERCOT load continues to reach record highs — Utility Dive, 2026-09-08
ERCOT has reported that weekly average peak loads have exceeded previous records for over six weeks.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO
Belgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft — prosecutors suspect BelGaN insiders transferred chip IP to China before the company collapsed — Tom's Hardware, 2026-09-08
A former researcher was arrested in Belgium over alleged industrial espionage, concerning the transfer of proprietary gallium nitride semiconductor technology to a Chinese rival.
Critical minerals: gallium, germanium, indium, tungsten, beryllium
US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans — DigiTimes, 2026-09-08
Semiconductor investment plans by Samsung and SK Hynix are being influenced by ongoing U.S. chip tariff policies and bilateral negotiations between South Korea and the US.
DRAM, Memory modules, Samsung Electronics, SK Hynix
CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation — DigiTimes, 2026-09-08
Chinese DRAM manufacturer CXMT forecasts tight global memory supply until the second half of 2026, driven by AI demand while the company increases capacity and expands into server memory.
Memory modules, DRAM, CXL controllers & memory expanders
Renewable power shortage puts Taiwan's chip cluster under scrutiny — DigiTimes, 2026-09-08
Taiwan's semiconductor and AI infrastructure expansion is intensifying pressure on chip manufacturers to adopt renewables, due to prohibitive green power costs and severe power supply constraints.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases
Tungsten hexafluoride supply chain alerts as Peric expands — DigiTimes, 2026-09-08
High demand for tungsten hexafluoride due to memory expansions, combined with Chinese export controls on tungsten, is causing international price spikes.
Industrial & specialty gases
SST market grows 32% as global players race to secure position — DigiTimes, 2026-09-07
The increasing power demands and density of AI servers are driving data center power designs away from traditional 54VDC and towards 800V high-voltage direct current.
800 V DC architecture & solid-state transformers
ASC cable break causes connectivity disruption between Perth and Singapore — Data Center Dynamics, 2026-09-07
A break in an ASC cable is disrupting connectivity between Perth and Singapore.
Fiber, connectors, structured cabling
HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days — DigiTimes, 2026-09-07
Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply due to high AI infrastructure demand for HBM, server DRAM, and enterprise SSDs.
HBM, DRAM, Memory modules, Samsung Electronics, SK Hynix
Model fatigue, China's price pressure, and a profit horizon still years away — DigiTimes, 2026-09-07
The AI industry faces pressure from China, which has significantly closed the technology gap while offering products at lower prices, leading to a challenging profit outlook for major players.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators
Exclusive: Infineon COO says chip shortage recovery will take longer — DigiTimes, 2026-09-07
Infineon's COO stated that the current global chip shortage is different from the pandemic-era shortage and will take an extended time to fully resolve.
Server CPUs, Leading-edge foundry, Fab materials, masks, gases, Infineon
DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia — DigiTimes, 2026-09-07
DeepSeek plans to acquire 160,000 Huawei chips for a 1 GW data center in Inner Mongolia as China seeks to reduce reliance on Nvidia components.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Huawei, Nvidia
Analysis: Under tariff threats, Taiwan chipmakers hedge beyond US — DigiTimes, 2026-09-07
Taiwanese chipmakers are diversifying their global investments and deepening international industrial links in response to potential new US tariffs.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry

regulation

Court rejects DOE ‘emergency’ order delaying coal plant retirement as overstep — Utility Dive, 2026-09-11
A federal court ruled that the Department of Energy's use of 'emergency' powers to delay the retirement of coal plants was an overstep of statutory authority and threatens energy market stability.
Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Rare earths & permanent magnets
New York ISO’s independence is critical when the grid is stressed — Utility Dive, 2026-09-11
The article emphasizes that an independent grid operator like NYISO is crucial for maintaining stability during grid stress events.
Metering, power quality, monitoring, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, Paralleling switchgear & generator controls, NYISO
Pennsylvania PUC to consider ratemaking, ROE and curtailment as data center load grows — Utility Dive, 2026-09-11
The Pennsylvania Public Utility Commission is considering rate adjustments, Return on Equity (ROE), and load curtailment due to rising electricity demand from data centers in the PJM region.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment — DigiTimes, 2026-09-11
Despite softening his previous stance, Donald Trump threatened high tariffs on Taiwan's chips in anticipation of a visit by Chinese President Xi Jinping.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry, Silicon wafers
FCC closes a chip-level loophole while media debate another White House retreat — DigiTimes, 2026-09-11
FCC published a rule extending US communications supply-chain restrictions to include individual components and parts within finished devices, affecting contract manufacturers and vendors.
Leading-edge foundry, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates
California PUC to revise general rate case plan around transparency goals — Utility Dive, 2026-09-10
The California Public Utilities Commission is considering revising its general rate case plan, focusing on linking utility performance to compensation.
Floor PDUs, RPPs, static transfer switches, ATS, Metering, power quality, monitoring, Circuit protection, fuses, surge, grounding
US Justice Department probes Nvidia-Groq deal over antitrust concerns — DigiTimes, 2026-09-10
The US Department of Justice is investigating Nvidia's agreement with Groq over potential antitrust violations.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Nvidia
Google, Xcel, others back MISO’s ‘zero injection’ large-load proposal — Utility Dive, 2026-09-09
MISO proposes to fast-track reviews for generating projects that supply large loads served by the same substation, including co-located facilities.
HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Floor PDUs, RPPs, static transfer switches, ATS, Paralleling switchgear & generator controls
West Virginia regulators reject delay in review of NextEra’s MARL project — Utility Dive, 2026-09-09
West Virginia regulators rejected a proposed delay in the review of the NextEra MidAtlantic Resiliency Link project, which was selected by the PJM Interconnection for regional expansion.
Utilities, IPPs & power providers signing data-center deals, Hyperscalers, neoclouds & model labs, NextEra
Oregon pauses land sales of state owned property for data center projects through July 1, 2027 — Data Center Dynamics, 2026-09-09
The Oregon governor has paused the sale of state-owned property for data center development until July 1, 2027.
Data center developers, operators & REITs
China's up to 99.2% anti-dumping duty on Japan DCS boosts local chip material suppliers — DigiTimes, 2026-09-09
China implemented anti-dumping tariffs on Japanese dichlorosilane (DCS), a semiconductor material, which is expected to boost local suppliers of chip materials.
Industrial & specialty gases, Silicon wafers
Thailand pauses 49 data center projects — DigiTimes, 2026-09-09
Thailand has temporarily paused nearly 50 data center projects while developing new regulations due to concerns about energy consumption and environmental impact.
Data center developers, operators & REITs, Architecture, engineering & MEP design, Structure, steel, precast, envelope, site equipment
Thailand asks data center operators to suspend 49 buildouts until legal framework is complete — new legislation is supposed to create 'airtight' requirements for large-scale data centers — Tom's Hardware, 2026-09-08
Thailand has instructed data center operators to temporarily halt all construction until a new legal framework is finalized, which aims to establish strict standards for large-scale data centers.
Data center developers, operators & REITs, General contractors & design-build, Architecture, engineering & MEP design
ERCOT to complete Texas data center audit by December — Data Center Dynamics, 2026-09-07
The state of Texas ordered an audit of data centers to be completed by December.
Hyperscalers, neoclouds & model labs, Physical security & access
Ireland weighs cut-price gas for data centers in exchange for curtailment - report — Data Center Dynamics, 2026-09-07
Ireland might adjust gas pricing for data centers if they agree to temporarily reduce consumption during times of peak demand.
Gas supply chain
Thailand pauses construction on 49 data centers, as it plans new regulations — Data Center Dynamics, 2026-09-07
Thailand is halting data center construction while developing new regulations due to concerns regarding power consumption and local community impacts.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Physical security & access
Data center development halted in Masovian Voivodeship, Poland — Data Center Dynamics, 2026-09-07
City council members voted against granting permits for a data center facility in Poland.
Data center developers, operators & REITs, General contractors & design-build

capacity

Microsoft targets 38GW of data center capacity in 2032 - report — Data Center Dynamics, 2026-09-11
Microsoft plans to develop a substantial amount of data center capacity, targeting 38GW by 2032.
Hyperscalers, neoclouds & model labs, Microsoft
Nostrum's data center in Badajoz gets the green light for electrical connection — Data Center Dynamics, 2026-09-11
Nostrum received approval for the electrical connection to its data center in Badajoz, featuring a 400/220 kV substation.
Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing — DigiTimes, 2026-09-10
Shenzhen Kaifa Technology plans to invest CNY1.85 billion to expand its high-end memory-chip packaging and testing capacity through its subsidiary Payton Technology.
2.5D/3D advanced packaging, Semiconductor test & burn-in, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders
Zankore secures $3.1bn senior term loan facility for AI cloud build-out — Data Center Dynamics, 2026-09-10
Zankore secured a $3.1 billion loan facility to begin building 100MW of AI cloud capacity, with plans to scale up to 1GW.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Site selection, power procurement, market intelligence, brokerage
S+B Gruppe to build data center in Bucharest, Romania — Data Center Dynamics, 2026-09-10
S+B Gruppe has received planning permission to build a 12MW data center in Bucharest, Romania.
Data center developers, operators & REITs, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment
Firmus, OpenAI strike compute deal for Malaysia AI factories — DigiTimes, 2026-09-10
OpenAI and Firmus are partnering to add dedicated AI compute capacity in Malaysia, expanding the region's AI infrastructure.
Rack-scale systems, Hyperscalers, neoclouds & model labs, Firmus (Sustainable Metal Cloud), OpenAI
Google Expands Finnish AI Infrastructure with €13B Investment Plan — HPCwire, 2026-09-09
Google plans a minimum €13 billion investment in digital infrastructure in Finland over the next two years.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Site selection, power procurement, market intelligence, brokerage
SoftBank-backed SB Energy subsidiary to develop former Texas 3M campus in R&D tech center — Data Center Dynamics, 2026-09-09
SoftBank-backed SB Energy plans to develop a former 3M campus in Texas as a tech R&D center with a $1 billion investment.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, General contractors & design-build, Prefab / modular data centers & power/cooling skids, SoftBank
Amkor expands Arizona chip campus with phase 2 plan — DigiTimes, 2026-09-09
Amkor Technology is expanding its Arizona chip campus to increase advanced packaging capacity to meet growing demand in the US semiconductor supply chain.
2.5D/3D advanced packaging, Packaging & bonding equipment
Axcelis to build new Korea manufacturing site in US$35 million expansion — DigiTimes, 2026-09-09
Axcelis Technologies plans a US$35 million expansion to build a new semiconductor equipment facility in South Korea, strengthening global chip supply chains.
Fab equipment, Packaging & bonding equipment
China's AI computing plan targets sixfold growth, 100,000-card clusters — DigiTimes, 2026-09-09
China plans a massive cumulative investment of CNY3.8 trillion into information infrastructure from 2026 to 2030, accelerating large-scale AI computing deployment.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Rack-scale systems, Hyperscalers, neoclouds & model labs
CSPs expand Malaysia AI server hubs as Southeast Asia grows — DigiTimes, 2026-09-09
Cloud service providers, including Microsoft and Google, are expanding their AI computing capacity footprint in Malaysia, relying on available land, power, and infrastructure to drive regional data center growth.
Hyperscalers, neoclouds & model labs, Microsoft
Digital Realty launches 6.4MW data center in Nairobi, Kenya — Data Center Dynamics, 2026-09-08
iColo is partnering with Digital Realty to launch a 6.4MW data center facility in Nairobi, Kenya.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Digital Realty
Firmus to provide OpenAI with compute capacity in Malaysia — Data Center Dynamics, 2026-09-08
Firmus plans to provide compute capacity to OpenAI's Stargate project in Malaysia.
Rack-scale systems, Firmus (Sustainable Metal Cloud), OpenAI
Samsung allocates more than half of 4nm foundry capacity to HBM4 — DigiTimes, 2026-09-08
Samsung is dedicating 50-60% of its 4nm foundry capacity to manufacturing base dies for HBM4 to expedite shipments to major AI chip customers.
Leading-edge foundry, HBM, Samsung Electronics
GLP begins development of 200MW data center in Foshan, China — Data Center Dynamics, 2026-09-07
GLP is beginning development of a 200MW data center facility in Foshan, China.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design
Corvex targets 8MW of AI cloud capacity by end of 2026 — Data Center Dynamics, 2026-09-07
Corvex plans to add 8MW of AI cloud capacity by the end of 2026.
Hyperscalers, neoclouds & model labs
JV plans 54MW data center in Dallas, Texas — Data Center Dynamics, 2026-09-07
Northampton Capital is partnering with Provident Data Centers to develop a 54MW data center in Dallas, Texas.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Physical security & access
Goodman Group gets green light for 135MW data center in northern Sydney, Australia — Data Center Dynamics, 2026-09-07
Goodman Group secured approval for a 135MW data center facility in northern Sydney, Australia.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, General contractors & design-build, Physical security & access
Anthropic signed $517bn in compute agreements in past 11 months — Data Center Dynamics, 2026-09-07
Anthropic has secured agreements representing 14.8 GW of compute capacity over the last 11 months.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Rack-scale systems, Anthropic
Humain breaks ground on Neom’s Oxagon data center — Data Center Dynamics, 2026-09-07
Neom began construction on its Oxagon data center campus, which is projected to reach a capacity of 1.5 GW.
Data center developers, operators & REITs, General contractors & design-build, Prefab / modular data centers & power/cooling skids
Greenfield and Finsbury Infrastructure to invest €360m in Milan data center — Data Center Dynamics, 2026-09-07
The project will invest €360 million in a data center in Milan and has already secured 80MW of power capacity.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors
Amazon Leo files for three new 6-antenna ground stations in Florida, Minnesota, and Texas — Data Center Dynamics, 2026-09-07
Amazon Leo plans to expand its ground station network across multiple states to support its expanding satellite constellation.
Hyperscalers, neoclouds & model labs, Site utilities, water & fiber entrance, Amazon (AWS)
Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says — DigiTimes, 2026-09-07
Infineon's new Dresden fabrication plant is expected to reach full operating capacity within two to three years due to accelerated expansion and strong AI demand.
Leading-edge foundry, Packaging & bonding equipment, Fab equipment, Fab materials, masks, gases, Infineon
India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus — DigiTimes, 2026-09-07
TCS's HyperVault subsidiary secured a large plot in Hyderabad for an AI data center campus intended to reach a capacity of 1GW.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, Prefab / modular data centers & power/cooling skids

m and a

Australia's NextDC raises AU$1.1bn in convertible notes — Data Center Dynamics, 2026-09-11
NextDC secured AU$1.1 billion in convertible notes to fund future data center construction.
Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Prefab / modular data centers & power/cooling skids, NEXTDC
ASE to buy AOI, AVI equipment from Machvision for NT$334M — DigiTimes, 2026-09-11
ASE approved the acquisition of automated inspection equipment, including AOI and AVI systems, from Machvision to meet capacity expansion needs.
Semiconductor test & burn-in, Packaging & bonding equipment, Leading-edge foundry
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor — DigiTimes, 2026-09-11
Ayar Labs raised US$650 million, including funding from Wiwynn, to scale its co-packaged optics (CPO) products into high-volume manufacturing.
Silicon photonics & co-packaged optics, Ayar Labs, Wiwynn
Innolux factory shift could reshape InnoCare's supply chain and growth mix — DigiTimes, 2026-09-11
InnoCare Optoelectronics is adjusting its supply chain and expanding its services due to Innolux Corporation restructuring its factories, including the closure of a second plant in 2026.
Optics contract manufacturing
Ayar Labs Brings 2026 Funding to $650M for CPO Manufacturing — HPCwire, 2026-09-11
Ayar Labs secured additional funding, reaching a total of $650 million, to support its CPO manufacturing and expand its design center in India.
Silicon photonics & co-packaged optics, Ayar Labs
Pentagon reportedly weighs US$5B loan to AI infrastructure startup Fluidstack — DigiTimes, 2026-09-11
The Pentagon is reportedly discussing a $5 billion loan to AI cloud-computing startup Fluidstack to finance the expanding AI infrastructure sector.
Hyperscalers, neoclouds & model labs, Fluidstack
ProLogium deepens partnership with Kyushu Electric Power through strategic investment — DigiTimes, 2026-09-10
ProLogium announced that Kyushu Electric Power will make a strategic investment, expanding their collaboration into capital participation, which reflects confidence in battery technology and electrification.
Capital & financing
Positron AI Raises $875M Series C to Scale Memory-First Inference Systems — HPCwire, 2026-09-10
Positron AI secured $875 million in Series C funding to scale its memory-first inference systems, following a 50-rack deployment at Oracle Cloud Infrastructure.
Hyperscaler custom ASICs, Rack-scale systems, Oracle
ADI Snaps Alif Semiconductor to Push AI into Physical Systems — EE Times, 2026-09-10
ADI acquired Alif Semiconductor for $1.35 billion to advance edge AI into physical systems.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, Startup accelerators
Google takes the nuclear option for €13B Finland expansion — The Register, 2026-09-09
Google entered into a major long-term power agreement in Finland that significantly covers the capacity of the Loviisa nuclear plant, supplemented by renewable and battery projects.
Nuclear: existing fleet PPAs & restarts, Utilities, IPPs & power providers signing data-center deals
Hscale secures $1bn contract with hyperscaler for Spanish data centers — Data Center Dynamics, 2026-09-09
Hscale secured a $1 billion contract with a hyperscaler to provide capacity for data center cloud and AI workloads in Spain.
Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design
NextEra secures $1.9bn loan from US DOE to support restart of the Duane Arnold nuclear power plant in Linn County, Iowa — Data Center Dynamics, 2026-09-09
NextEra received a $1.9 billion loan from the US Department of Energy to help restart the Duane Arnold nuclear plant, which has a long-term Power Purchase Agreement with Google.
Nuclear: existing fleet PPAs & restarts, Utilities, IPPs & power providers signing data-center deals, NextEra
Google signs nuclear PPA with Fortum in Loviisa, Finland — Data Center Dynamics, 2026-09-09
Google signed a power purchase agreement (PPA) with Fortum for nuclear power in Loviisa, Finland.
Nuclear: existing fleet PPAs & restarts, Utilities, IPPs & power providers signing data-center deals, Fortum
Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached — DigiTimes, 2026-09-09
The US government finalized a major set of contracts totaling US$775 million under the CHIPS Act, providing funding for GlobalFoundries and several quantum computing companies, which includes mandated equity participation.
Leading-edge foundry, Hyperscaler custom ASICs, ASIC design services, IP & EDA, GlobalFoundries
Verizon, Corning strike multi-billion-dollar fiber deal for broadband and AI buildout — DigiTimes, 2026-09-09
Verizon and Corning have entered a multi-billion-dollar supply agreement regarding fiber optics, impacting both broadband access and AI infrastructure development.
Fiber, connectors, structured cabling, Specialty glass & glass fiber
GlobalFoundries Finalizes $375M CHIPS Funding Agreement for Quantum R&D — HPCwire, 2026-09-08
GlobalFoundries secured a $375 million research and development award from the Department of Commerce's CHIPS Office to advance its Quantum Technology Solutions.
Leading-edge foundry, Hyperscaler custom ASICs, GlobalFoundries
NextEra secures $1.9B DOE loan for Duane Arnold nuclear restart — Utility Dive, 2026-09-08
NextEra secured a $1.9 billion Department of Energy loan to finance the restarts of three nuclear power plants.
Nuclear: existing fleet PPAs & restarts, NextEra
Mistral raises €3bn in Series D led by Samsung Electronics — Data Center Dynamics, 2026-09-08
Mistral secured €3 billion in Series D funding round, led by Samsung Electronics, which will be used to expand its computing capacity.
Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Samsung Electronics
FIT wins Amphenol patent license, expands AI interconnect push — DigiTimes, 2026-09-08
Foxconn Interconnect Technology secured a patent license from Amphenol to advance high-speed backplane connector solutions for the AI era.
2.5D/3D advanced packaging, Board-level power: VRMs, power stages, PoL, power semis, Board-level connectors & sockets, Amphenol
Grain Management finalizes merger of Ritter, Great Plains Communications to form Rightfiber — Data Center Dynamics, 2026-09-07
Grain Management finalized a merger with Ritter and Great Plains Communications to create Rightfiber, which serves twenty states.
2.5D/3D advanced packaging, Packaging & bonding equipment

design win

Bull Selected to Modernize Spain’s National Weather Forecasting Infrastructure — HPCwire, 2026-09-10
Bull was awarded a €31 million contract to modernize Spain's national weather forecasting infrastructure with new supercomputing capabilities.
Rack-scale systems, Hyperscalers, neoclouds & model labs
Film studio turned data center project gets approval in High Wycombe, UK — Data Center Dynamics, 2026-09-10
A film studio property in High Wycombe, UK, received planning approval for a data center project.
Data center developers, operators & REITs, General contractors & design-build
Nvidia partners with Aussie companies to bring 2GW online by 2027 — Data Center Dynamics, 2026-09-10
Nvidia is partnering with Australian companies, including cloud providers and data center operators, to bring 2GW of capacity online by 2027.
Merchant GPUs / accelerators, Rack-scale systems, Nvidia
TSMC and Samsung commit to adopting ASML’s High NA EUV lithography tools by 2030 — Data Center Dynamics, 2026-09-09
TSMC and Samsung plan to adopt ASML's High NA EUV lithography tools by 2030, with Intel joining the photomask initiative.
Leading-edge foundry, Fab materials, masks, gases, Intel
Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise — DigiTimes, 2026-09-08
Nvidia is reportedly redesigning its Rubin Ultra AI accelerator to use an 8-high HBM configuration instead of the planned 12-high, due to increasing memory costs.
Merchant GPUs / accelerators, HBM, Nvidia

Covered this week

Parts: Merchant GPUs / accelerators, Power shelves & PSUs, MV/LV transformers, Copper, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Gas supply chain, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, PCIe/CXL switches & retimers, NAND flash, Enterprise SSDs & controllers, HDD, Scale-up fabric, Scale-out switch ASICs, Switch systems & white-box ODMs, Optical transceivers, Optics contract manufacturing, Lasers, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics, Copper: DAC / ACC / AEC cables, NVLink copper spine / backplane cartridges, Fiber, connectors, structured cabling, DCI / coherent optics, Timing & telemetry silicon, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Passives, BMC & platform firmware, Timing, security & misc board silicon, Fans, Chassis, rails, rack enclosures, In-rack busbar & power whips, Rack PDUs, Air-cooled heatsinks & vapor chambers, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Fire detection & suppression, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, 800 V DC architecture & solid-state transformers, Fuel cells, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Fusion, Utilities, IPPs & power providers signing data-center deals, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment, Prefab / modular data centers & power/cooling skids, Site utilities, water & fiber entrance, Physical security & access, Testing, commissioning & certification, Aluminum, Grain-oriented electrical steel & amorphous cores, Rare earths & permanent magnets, Specialty glass & glass fiber, Refrigerants & insulating gases, Industrial & specialty gases, Critical minerals: gallium, germanium, indium, tungsten, beryllium, DCIM, digital twins, capacity planning, Cluster management & GPU orchestration, Site selection, power procurement, market intelligence, brokerage, Capital & financing, Test & measurement instruments, Robotics, inspection & operations hardware, AI storage systems

Companies: d-Matrix, Nvidia, Kioxia, Murata, Resonac, Luxshare, NYISO, Anthropic, CyrusOne, Digital Realty, Equinix, Fluidstack, Microsoft, Oracle, NEXTDC, LG Innotek, Samsung Electro-Mechanics, Huawei, Ayar Labs, Wiwynn, Synopsys, SK Hynix, Foxconn (Hon Hai), Mistral, CoreWeave, Intel, Blackstone, STMicroelectronics, Wistron, Firmus (Sustainable Metal Cloud), OpenAI, Naver, Samsung Electronics, Amazon (AWS), NextEra, SoftBank, Fortum, MediaTek, GlobalFoundries, Apple, Vertiv, Amphenol, Infineon, Aspeed, Stulz, Air Products, Phison, Micron, Fujitsu, Marvell, SanDisk

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