AI data center supply chain news — week 35, 2026
344 items · 2026-08-31 to 2026-09-06 ·all news · newer: week 36, 2026 (342) · older: week 34, 2026 (168)
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- Eaton expands AI data center stack from grid to chip — DigiTimes, 2026-09-06Eaton is expanding its services for AI data centers, covering everything from grid power and DC conversion to liquid cooling and chip-level thermal management.
- Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports — DigiTimes, 2026-09-06A chipmaker warned that as data centers adopt liquid cooling for high-power AI processors, low-power components may become 'thermal orphans' that require new cooling solutions.
- Dark fab cybersecurity: Why autonomous manufacturing needs zero trust — DigiTimes, 2026-09-06The increasing autonomy of semiconductor fabs is making zero-trust cybersecurity architectures and trusted data standards critical for manufacturing operations.
- Experts say subsidies can't buy semiconductor competitiveness — DigiTimes, 2026-09-06Experts discussed the difficulty of achieving global semiconductor competitiveness purely through national subsidies.
- AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein — DigiTimes, 2026-09-06According to Merck's Benjamin Hein, the synergy of materials, processes, packaging, metrology, and software—driven by AI—will define the next generation of semiconductor innovation.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, 2.5D/3D advanced packaging, Packaging & bonding equipment, Substrate materials, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases
- AI racks move toward MW scale as power, cooling converge — DigiTimes, 2026-09-06Increasing AI compute density is causing massive power draw that strains both rack-level power delivery and cooling systems.
- Machine builders flood SEMICON 2026 to grow local chip tools — DigiTimes, 2026-09-06Taiwan's machinery industry aims to build a domestic semiconductor equipment supply chain by promoting local adoption of specialized tools and knowledge.
- Acer hedges memory price shock with local AI, diversification — DigiTimes, 2026-09-06Acer's CEO noted Taiwan's importance as a global AI hardware hub and capital source, highlighting the company's recent bond issuance.
- Why data center cooling is now business-critical — Data Center Dynamics, 2026-09-06The rapid expansion of data centers makes effective thermal fluid management a critical business concern for operators.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software
- Bitcoin mining data center condemned after leaking 3 million gallons of water and forcing school closures — facility operated for years under a city stop-work order — Tom's Hardware, 2026-09-06A Bitcoin mining data center was condemned after leaking 3 million gallons of water, causing local disruptions.
- The electrical power problem that will decide the AI race — Data Center Dynamics, 2026-09-06The massive power demands of AI are comparable to the energy needs of entire nations, impacting data center operations and expansion plans.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Hyperscalers, neoclouds & model labs, Site selection, power procurement, market intelligence, brokerage
- BenQ Materials targets CPO in semiconductor push — DigiTimes, 2026-09-06BenQ Materials plans to use its existing coating and adhesive technologies to expand into semiconductor materials, wafer manufacturing, and co-packaged optics (CPO), anticipating growth from 2027.
- TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy — DigiTimes, 2026-09-05Tokyo Electron believes AI is driving increased demand for advanced packaging, DRAM, HBM, and NAND flash, affirming Taiwan's critical role in the semiconductor supply chain.
- TWM, SYSTEX debut at smart building expo — DigiTimes, 2026-09-05Taiwan Mobile and Systex will jointly exhibit smart operations-management solutions, including an AI digital twin platform, at an upcoming building expo.
- Tongtai doubles semiconductor orders on AI data-center demand — DigiTimes, 2026-09-05Tongtai Group is expanding its traditional expertise into advanced packaging, hard material processing, and smart manufacturing solutions for the semiconductor and AI industries.
- Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem — DigiTimes, 2026-09-05A podcast highlighted that hybrid bonding is gaining traction and could significantly boost advanced packaging capacity between 2027 and 2028.
- Trumpf CTO says advanced packaging reshapes semiconductor equipment race — DigiTimes, 2026-09-05Increased demand from AI and HPC is elevating the importance of 3D stacking, advanced packaging, high-density interconnects, and thermal management beyond traditional front-end process scaling.
- AMD reportedly prepping Ryzen 5 7500 (non-F) CPU with integrated graphics at double the price — Six-core Zen 4 chip rumored to share identical specs with its F-moniker cousin — Tom's Hardware, 2026-09-05A rumored high-priced, non-F version of the Ryzen 5 7500 shares specs with its F-moniker cousin but would cost more than comparable chips.
- Dodge the RAMpocalypse with 20% discounts on Corsair RAM — hundreds off on 32GB and 64GB DDR5-6400 kits — Tom's Hardware, 2026-09-05Corsair is offering temporary discounts of up to 23% on various DDR5 memory kits.
- Sponsored: Planning power and cooling for high-density AI — Data Center Dynamics, 2026-09-05Experts suggest that due to increasing rack densities and accelerated hardware roadmaps, electrical and thermal infrastructure planning must be executed concurrently.
- Samsung, SK chiefs to meet Nvidia's Huang in New York amid US investment pressure — DigiTimes, 2026-09-05Samsung and SK Group executives plan to meet with Nvidia CEO in New York in late 2026 amid pressure on South Korean companies to increase US investments.
- Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics — DigiTimes, 2026-09-04ITEC utilized Semicon Taiwan to promote a die-bonding design claiming tripled throughput improvements by optimizing chip assembly motion.
- Taiwan semiconductor output targets NT$8 trillion — DigiTimes, 2026-09-04Taiwan's overall semiconductor industry output is projected to exceed NT$8 trillion in 2026, with advanced domestic equipment and materials also showing significant growth.
- Topco targets optical comms, cooling as copper gives way — DigiTimes, 2026-09-04System integration hurdles, particularly regarding short-reach optical communications for AI chips, are slowing the commercialization of high-speed optical and cooling solutions.
- TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain — DigiTimes, 2026-09-04TSMC plans to utilize high-density 3D advanced packaging to advance AI chip development, addressing the physical limitations of traditional 2D scaling.
- Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026 — DigiTimes, 2026-09-04Taiwan's first tokamak is scheduled to start plasma testing by the end of 2026, highlighting the ongoing technical challenges in achieving commercial fusion power.
- Samsung SDI nears solid-state battery mass production, eyes China supply chain — DigiTimes, 2026-09-04Samsung SDI is planning for mass production of all-solid-state batteries by late 2027 and has engaged with Chinese battery material supplier Tinci Materials.
- SiPh, optical lens demand ignite laser race — DigiTimes, 2026-09-04Silicon photonics is a rapidly developing area, and the demand for laser equipment is crucial for optical manufacturers pursuing co-packaged optics (CPO).
- Micron looks to lock in Taiwanese construction capacity with long-term deals — DigiTimes, 2026-09-04Micron Technology is aiming to secure long-term construction and facility engineering agreements in Taiwan instead of bidding on projects individually.
- Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC — DigiTimes, 2026-09-04China's memory sector is establishing a three-pronged strategy, with CXMT focusing on DRAM, YMTC on 3D NAND, and XMC on NOR Flash and advanced integration.
- Penguin Solutions to Showcase AI Infrastructure and Memory Solutions at AI Infra Summit 2026 — HPCwire, 2026-09-04Penguin Solutions announced participation at AI Infra Summit 2026 to showcase AI infrastructure and memory solutions.
- PLDT's Vitro REIT signs SG.GS as colocation customer in the Philippines — Data Center Dynamics, 2026-09-04SG.GS will become a colocation customer utilizing networking systems within Vitro's carrier-neutral facilities in the Philippines.
- Santee Cooper partners with Google Cloud to roll out AI-driven load forecasting and financial planning tools — Data Center Dynamics, 2026-09-04Santee Cooper will partner with Google Cloud to implement AI-driven tools for load forecasting and financial planning.
- Exa & euNetworks file to lay new subsea cables linking Dublin to the UK — Data Center Dynamics, 2026-09-04Exa and euNetworks are filing to install new subsea cables connecting Dublin to the UK.
- Sponsored: Faster asset audits and interventions — Data Center Dynamics, 2026-09-04Data centers are increasing asset density due to AI and IoT demand, requiring new methods for managing physical assets.
- Utilities eye small modular nuclear reactors for reliability as hyperscalers drive demand — Utility Dive, 2026-09-04Utilities are evaluating small modular nuclear reactors as reliable power sources due to increased demand from major tech companies and defense customers.
- Berkeley Lab: Excited-States Framework Could Illuminate New Optical Materials — HPCwire, 2026-09-04Researchers used supercomputers to gain an atomic-level understanding of how electron arrangement in low-dimensional materials affects their optical behavior.
- Denver data center continuously waters its lawn even after city announced drought restrictions, enraging residents — it’s unclear if site is breaking the law or using its own recycled water — Tom's Hardware, 2026-09-04An AI data center was reported to be watering its lawn despite ongoing drought restrictions in the area.
- Evolution DC signs pre-lease for first phase of Bangkok data center to unnamed hyperscaler — Data Center Dynamics, 2026-09-04Evolution DC has signed a pre-lease for its initial data center phase in Bangkok with an unnamed major cloud provider.
- Telxius to build Edge data center in Cancún, Mexico — Data Center Dynamics, 2026-09-04Telxius is planning to build an edge data center in Cancún, Mexico, to serve as the landing point for the Tikal submarine cable connecting Guatemala and the United States.
- Fake DDR5 memory kits now on sale starting at $43 — V-Color sells 0GB dummy modules and single-stick memory kits with a fake stick for $300 — Tom's Hardware, 2026-09-04V-Color is selling DDR5 filler memory kits that include a real module and a dummy module, as well as 0GB kits containing only filler sticks.
- SpaceXAI offers 50% Starlink discount to placate data center's residential neighbors; 2,000 have signed up — goodwill gesture comes amid vociferous community backlash — Tom's Hardware, 2026-09-04SpaceXAI is offering nearby residents a discount on Starlink to address community complaints near its data centers.
- Data center proposal approved by local council in suburb of Frankfurt, Germany — Data Center Dynamics, 2026-09-04A data center facility proposed in Gießen, Frankfurt, Germany, received local council approval for a connected load of up to 65MW.
- CPO testing shifts to mid-stage to avoid costly failures, Chroma says — DigiTimes, 2026-09-04Co-packaged optics (CPO) testing is shifting to an earlier stage to reduce costs associated with failures and complex test times.
- DCD Talks: How data center batteries are driving new market value with Carlos Pérez Linkenheil, AFRY — Data Center Dynamics, 2026-09-04AFRY's Carlos Pérez Linkenheil discussed how energy storage, specifically batteries, is increasing market value in the data center industry.
- UK military wants lasers to stop drone swarms without running out of ammo — The Register, 2026-09-04The UK military is developing an autonomous, vehicle-mounted defense system using lasers to neutralize drone swarms.
- How agentic AI and 'AI physics' are reshaping chip design — DigiTimes, 2026-09-04An Nvidia executive noted that simply increasing staff or optimizing existing software is insufficient to advance semiconductor designs toward trillion-transistor packages.
- When the Package Becomes an Electrical Design Variable — EE Times, 2026-09-04AI power integrity mandates that the package, chip, and board must be treated as a single power delivery network (PDN).
- South Korea taps chip windfall for next tech push — DigiTimes, 2026-09-04South Korea plans to utilize a semiconductor tax revenue to invest heavily in chips, AI infrastructure, robotics, and the necessary power and cooling systems.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Rack-scale systems, Direct-to-chip cold plates, Coolant distribution units, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Energy storage: UPS batteries & BESS, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Architecture, engineering & MEP design, General contractors & design-build, Nvidia
- Samsung turns to chips, OLED for next phase of Vietnam expansion — DigiTimes, 2026-09-04Samsung plans to expand its Vietnam operations to include semiconductor testing, high-end chip substrates, OLED displays, and R&D.
- Sponsored: Selecting the right partner for your data center changes everything — Data Center Dynamics, 2026-09-04The article discusses how robust power solutions, such as bridging power, are critical for maintaining data center resilience and long-term success.
- Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp — DigiTimes, 2026-09-04Trusval Technology is positioning itself to capitalize on AI-driven semiconductor expansion while navigating labor shortages, regulatory hurdles, and rising costs faced by Taiwanese fab engineering firms.
- Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027 — DigiTimes, 2026-09-04Advanced testing interfaces, driven by AI and HPC demand, are expected to see ASIC revenue rapidly grow and potentially surpass GPU sales.
- K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap — DigiTimes, 2026-09-04K&S, a semiconductor packaging equipment manufacturer, expects sustained high demand for its advanced packaging tools due to the spread of AI into new applications.
- Kyocera completes Nagasaki plant for semiconductor ceramics and packages — DigiTimes, 2026-09-04Kyocera completed a new manufacturing site in Nagasaki, intended to anchor its semiconductor-related product lines with a total investment of JPY68 billion.
- Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins — DigiTimes, 2026-09-04Kenmec is targeting semiconductor packaging facilities with an automated solution that uses overhead hoists and AI digital twins to address space and logistics constraints.
- AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground — DigiTimes, 2026-09-04The booming AI market, driven by infrastructure spending, increased demand for both conventional DRAM and HBM, while Chinese competitor CXMT expanded its market presence.
- Silicon Valley overflow fuels semiconductor boom in California's Capital Region — DigiTimes, 2026-09-04The California Capital Region is undergoing a major industrial transformation into a semiconductor powerhouse due to large-scale facility expansions.Leading-edge foundry, 2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Interposers, silicon bridges, RDL, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, PCIe/CXL switches & retimers
- Silicon photonics testing shift could reshape how CPO suppliers win business — DigiTimes, 2026-09-04Testing for silicon photonics and co-packaged optics (CPO) is moving to the wafer stage to improve yields, and equipment makers are shifting toward integrated, team-based bidding models.
- Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab — DigiTimes, 2026-09-04Industry leaders stressed that AI's rapid growth necessitates cross-industry collaboration to overcome organizational silos and maintain efficiency.
- Acer bets on RTX, GoogleBook as on-site AI demand grows — DigiTimes, 2026-09-04The AI trend is encouraging on-site AI hardware deployments, which is expected to create new business opportunities for Acer.
- LB Semicon starts Qualcomm shipments as DDI dependence fades — DigiTimes, 2026-09-04LB Semicon has started supplying products to Qualcomm, diversifying its business beyond reliance on display driver ICs.
- Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in — DigiTimes, 2026-09-04Kioxia is attempting to position NAND flash memory as a viable substitute for DRAM, especially as it faces increased competition from Micron and YMTC.
- Taiwan's tech council allocates NT$3.76 billion for quantum host — DigiTimes, 2026-09-03Taiwan's tech council and research institutes have allocated significant funding for developing quantum computing technology and verification platforms.
- Taiwan to expand industrial land for AI hardware boom — DigiTimes, 2026-09-03Taiwan plans to expand industrial land development to meet the increasing global demand for AI hardware infrastructure and manufacturing capacity until 2027.
- Young Liu urges 'Made with Taiwan' supply chain rethink — DigiTimes, 2026-09-03Foxconn's Young Liu advocated for a shift in Taiwan's industrial model from manufacturing goods to exporting technological expertise and partnership across the global supply chain.Leading-edge foundry, 2.5D/3D advanced packaging, Interposers, silicon bridges, RDL, NAND flash, Enterprise SSDs & controllers, AI storage systems, Silicon photonics & co-packaged optics, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, Critical minerals: gallium, germanium, indium, tungsten, beryllium, Foxconn (Hon Hai), MediaTek
- NAIRR Shifts from Pilot into Operations Mode — HPCwire, 2026-09-03The National Science Foundation announced that the National Artificial Intelligence Research Resource (NAIRR) is shifting from a pilot phase into full operational status.
- Hyperscale Data ends cryptomining operations at Michigan data center — Data Center Dynamics, 2026-09-03A hyperscale data center has ceased cryptographic mining operations at its Michigan facility to prepare for new cloud customers.
- India mulls removal of legacy Chinese telecoms kit - report — Data Center Dynamics, 2026-09-03India is considering replacing existing Chinese telecom equipment, which could affect the supply chain for hardware components.
- Equinix, Together AI, Nvidia partner on Inference Exchange — Data Center Dynamics, 2026-09-03Equinix, Together AI, and Nvidia are partnering to offer enterprises secure, low-latency AI inferencing.
- DataVita files for third data center at campus in North Lanarkshire, Scotland — Data Center Dynamics, 2026-09-03DataVita has submitted plans for a third data center at its North Lanarkshire, Scotland campus after revising its initial plans following local resident consultations.
- Tersis Technologies partners with Flux Core to pair waste-to-energy generation with decentralized data centers — Data Center Dynamics, 2026-09-03Tarsis Technologies and Flux Core have partnered to combine waste-to-energy generation with decentralized data centers.
- Ferveret is thinking inside the box — Data Center Dynamics, 2026-09-03Ferveret is implementing immersion cooling technology directly at the rack level.
- National Grid’s different gas-electric forecasts are responsible planning — Utility Dive, 2026-09-03National Grid New York is advancing gas-electric planning through coordinated non-pipeline efforts.
- OpenAI CEO Sam Altman says 38,000 ChatGPT queries use as much water as the production of one almond — says data centers use no more water than an office building — Tom's Hardware, 2026-09-03Sam Altman challenged common concerns about data center water usage by comparing the water consumption of ChatGPT queries to that of single almonds and office buildings.
- Santee Cooper partners with Google in shift toward AI-driven forecasting — Utility Dive, 2026-09-03Santee Cooper plans to use Google's AI tools to improve its forecasting of weather, load, and financial metrics.
- TechWorks Aligns U.K. Semiconductors Under UKSIA Umbrella — EE Times, 2026-09-03TechWorks is consolidating various U.K. chip groups under the UKSIA umbrella as funding increases and industry professionals gather in London.
- Amazon signs first APAC battery storage tolling deal with Anza Power in Victoria, Australia — Data Center Dynamics, 2026-09-03Amazon established an initial agreement with Anza Power for battery storage services in Victoria, Australia.
- Orange plans subsea cable linking Réunion Island and South Africa — Data Center Dynamics, 2026-09-03Orange plans to upgrade connectivity between Réunion Island and South Africa using the existing SAFE cable.
- Trane Technologies to Present at the Morgan Stanley Laguna Conference — newsroom:trane, 2026-09-03Trane Technologies is scheduled to present at a Morgan Stanley conference, suggesting a discussion of its HVAC and cooling solutions.
- Google partners with MN8, Eos on West Virginia solar + storage project — Data Center Dynamics, 2026-09-03Google is partnering with MN8 and Eos on a solar and storage project in West Virginia, supporting long-duration storage commercialization.
- SanDisk pushes HBF ecosystem as AI inference reshapes token economics — DigiTimes, 2026-09-03The increasing demand from AI inference and agents is elevating the strategic importance of NAND flash.
- Infineon sees AI data centers, physical AI as growth drivers — DigiTimes, 2026-09-03Infineon forecasts that the buildout of AI data centers and Physical AI applications will drive increased demand for semiconductor infrastructure, power technology, and related components.
- Ada Infrastructure breaks ground on latest Tokyo data center — Data Center Dynamics, 2026-09-03Ada Infrastructure began construction on a new data center facility in Tokyo.
- De-risking high-performance data centers with dynamic simulation — Data Center Dynamics, 2026-09-03Dynamic simulation is helping to reduce the risk associated with high-performance data center designs for AI workloads.
- Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty — DigiTimes, 2026-09-03MHI and NEC formed a strategic alliance to enhance Japan's defense capabilities and national data and AI sovereignty.
- China chip tool makers expand beyond import substitution at CSEAC 2026 — DigiTimes, 2026-09-03China's semiconductor equipment industry is advancing its capabilities beyond simple import substitution, with major developments expected in etching, thin-film deposition, cleaning, metrology, advanced packaging, and core component technologies.
- Niching validates 500-ton press for large heat spreaders — DigiTimes, 2026-09-03Niching Industrial is upgrading its stamping equipment and developing technologies to increase its capacity for manufacturing larger heat spreaders for high-performance computing chips.
- Semiconductor sustainability shifts to cost control as fab resource demand surges — DigiTimes, 2026-09-03A sustainability summit highlighted that water management and equipment upgrades can translate into measurable cost savings for fabs.
- Broadcom says CPO fits scale-out better than scale-up — DigiTimes, 2026-09-03Broadcom stated that co-packaged optics is better suited for scale-out networking rather than scale-up, citing potential power savings of up to 70% versus pluggable modules.
- CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade — DigiTimes, 2026-09-03DRAM manufacturer CXMT has expanded its 2027 recruitment efforts to include roles in Japan for DDR5 and LPDDR technology development.
- Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools — DigiTimes, 2026-09-03Zeiss is expanding its presence in Taiwan to support the advanced semiconductor packaging requirements driven by AI's demand for 2.5D and 3D heterogeneous integration.
- SK Hynix weighs Kioxia production tie-up in Japan — DigiTimes, 2026-09-03SK Group chairman suggests a potential partnership for joint semiconductor production between SK Hynix and Kioxia in Japan.
- Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs — DigiTimes, 2026-09-03Intel raised $23 billion to fund capacity expansion and advanced packaging for CPUs and other components through its fabs in various US locations.
- Taiwan's supply chain is 'one of a kind,' MediaTek CEO says — DigiTimes, 2026-09-03MediaTek's CEO stated that Taiwan's supply chain capabilities are superior for the AI and robotics era, implying a significant future need for chip capacity.
- Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips — DigiTimes, 2026-09-03AI workloads are shifting the bottleneck from raw processing speed to data movement and bandwidth.
- AUO unit eyes TSMC ecosystem as merger benefits emerge — DigiTimes, 2026-09-03A new entity, AET Corporation, formed by AUO Group's merger of two units, is expanding into the semiconductor supply chain and targeting a full-year profit in 2026 within the TSMC ecosystem.
- TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling — DigiTimes, 2026-09-03The future of AI chip performance increasingly depends on advanced packaging, glass substrates, and thermal management breakthroughs, shifting focus beyond traditional transistor scaling.
- HPE has already bought the supply behind its raised fiscal 2027 plan — DigiTimes, 2026-09-03HPE signaled strong future growth by doubling its networking purchase commitments and signing multi-year supply agreements to secure component capacity.
- [AI Ecosystem] The real bottleneck: Data, not compute — newsroom:sk-hynix, 2026-09-02The demand for fast data processing and efficient data movement, rather than just raw computing power, is the key trend driving AI system design.
- CPO material race widens as Taiwan eyes key role — DigiTimes, 2026-09-02Industry experts discussed that silicon photonics bottlenecks are shifting from materials to advanced packaging precision, platform selection, and necessary manufacturing tools.
- Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028 — DigiTimes, 2026-09-02Cooling specialist Auras Technology plans to expand its services to cover ASIC-related cooling products, focusing on liquid cooling solutions for major cloud providers like AWS and Meta.
- JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times — DigiTimes, 2026-09-02JPC Connectivity reported that AI demand continues to boost orders for its optical communications, high-speed transmission, and power products, extending visibility into 2027 and 2028.
- PlayNitride sees 3.2T AI links opening a new front for Micro LED, but auto weakness weighs on 2H26 — DigiTimes, 2026-09-02PlayNitride is positioning Micro LED technology for use in AI optical communications, aiming for commercial deployment in two years if standards and supply chains develop.
- Macronix boosts sustainability spending to NT$780 million — DigiTimes, 2026-09-02Macronix reported that it achieved significant reductions in greenhouse gas emissions and committed to investing NT$780 million in sustainability initiatives for 2025.Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, HBM, DRAM, Memory modules, Memory interface / buffer chips, Scale-up fabric, Scale-out switch ASICs, Switch systems & white-box ODMs, Optical transceivers, Optics contract manufacturing, Lasers, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Board-level power: VRMs, power stages, PoL, power semis, Passives, BMC & platform firmware, Timing, security & misc board silicon, Power shelves & PSUs, Fans, Chassis, rails, rack enclosures, In-rack busbar & power whips, Rack PDUs, Air-cooled heatsinks & vapor chambers, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Fire detection & suppression, Fire detection & suppression, Fire detection & suppression, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, 800 V DC architecture & solid-state transformers
- Update on RISC-V Standards and Adoption at Hot Chips 2026 — ServeTheHome, 2026-09-02The post provided an update on RISC-V standards and adoption at Hot Chips 2026.
- Amazon plots new subsea cable linking US and Japan — Data Center Dynamics, 2026-09-02Amazon is planning a new subsea cable connecting the United States and Japan.
- Infineon, Skeleton Technologies partner on AI data center power systems — Data Center Dynamics, 2026-09-02Infineon and Skeleton Technologies plan to combine Infineon's CoolSiC power semiconductors with Skeleton's expertise to create advanced AI data center power systems.
- SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing — DigiTimes, 2026-09-02The physical AI trend requires robots to adopt increasingly sophisticated sensing capabilities to operate in complex, real-world environments.
- Former OpenAI Stargate exec Shamez Hemani joins Anthropic after brief Meta Compute stint — Data Center Dynamics, 2026-09-02A former executive from OpenAI's Stargate team joined Anthropic after briefly working on Meta's compute infrastructure.
- PG&E sees rising interest in ‘customer-driven’ flexible interconnection pilot — Utility Dive, 2026-09-02PG&E's Flex Connect program enables large loads to connect to power in months rather than years.
- The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected — Tom's Hardware, 2026-09-02The article discusses the current state of hybrid bonding technology at TSMC, specifically noting a 6-micron pitch and unexpected delays in HBM production.
- Gradiant to deliver HyperSolved water treatment system for West Texas data center — Data Center Dynamics, 2026-09-02Gradiant will provide a water treatment system for a data center located in West Texas.
- Transmission expansion could spur billions in savings, especially in PJM: study — Utility Dive, 2026-09-02A study suggests that several planned transmission projects in the Eastern Interconnection could help manage load growth, improve reliability, and lower consumer electricity costs.
- Analysts say Fervo-Google geothermal deal underscores baseload power scarcity — Utility Dive, 2026-09-02Analyst reports highlight that Google's agreement with Fervo for geothermal energy emphasizes the increasing difficulty of securing reliable baseload power for data centers.
- Fractal Define One case review: Balancing noise and thermals — Tom's Hardware, 2026-09-02Fractal's Define One case review analyzes the trade-offs between acoustic noise and thermal management in data center rack enclosures.
- Next-gen AI networks may hinge on the telephone switchboard's return — The Register, 2026-09-02Startups like iPronics are receiving significant funding to develop faster, denser, and cheaper optical circuit switches.
- AI data center investment projected to hit $32 trillion by 2050 — infrastructure spending estimated to exceed capital requirements for railways, electrification, or the internet — Tom's Hardware, 2026-09-02The total investment for AI data center infrastructure is projected to reach $32 trillion by 2050, significantly outstripping the capital requirements of major historical infrastructure projects like rail and internet.
- Techie creates a database of coil-whining graphics cards, power supplies, and liquid cooler pumps — open-source project wants community reports of affected parts — Tom's Hardware, 2026-09-02An open-source project was started to catalog parts like graphics cards, PSUs, and liquid cooler pumps that may suffer from coil whining and is seeking community reports.
- Google inks 396MW geothermal PPA with Fervo in Utah — Data Center Dynamics, 2026-09-02Google has signed a power purchase agreement for 396MW of geothermal energy provided by Fervo Energy in Utah.
- China's EUV technology 'at a similar stage to ASML in 2004,' analyst claims — Beijing's semiconductor industry remains well behind Western rivals — Tom's Hardware, 2026-09-02An analyst suggests that China's development of extreme ultraviolet (EUV) lithography technology is currently comparable to where ASML was in 2004, despite the country remaining behind Western rivals.
- Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth — DigiTimes, 2026-09-02Micron announced that its tightly coupled DRAM technology can provide over 10x the bandwidth compared to current HBM standards.
- Case Study: Avtron LC35 liquid cooled load banks for Apx data centre solutions — Data Center Dynamics, 2026-09-02Avtron highlights the use of its LC35 liquid cooled load banks in data center solutions, designed to test and simulate power loads for equipment like CRAC units and UPS systems.
- Lam Research exec says automated preventive maintenance key to fabs of the future — DigiTimes, 2026-09-02A Lam Research executive highlighted that automated preventive maintenance is essential for the future of semiconductor fabrication facilities.
- DRAM giants target 3D stacking to break memory wall and power bottlenecks — DigiTimes, 2026-09-02Major DRAM manufacturers are prioritizing 3D stacking technologies to improve memory density and power efficiency in response to the increasing demands of AI workloads.
- Sponsored: Driving efficient water usage through closed-loop cooling — Data Center Dynamics, 2026-09-02The news highlights the importance of closed-loop cooling systems for improving water efficiency in data center cooling infrastructure.
- Indium CEO: packaging, cooling and power are next AI bottlenecks — DigiTimes, 2026-09-02Indium's CEO identifies advanced packaging, liquid cooling, and power infrastructure as the primary remaining bottlenecks for AI scaling beyond compute.2.5D/3D advanced packaging, Packaging & bonding equipment, ABF / high-layer package substrates, Board-level power: VRMs, power stages, PoL, power semis, Direct-to-chip cold plates, Coolant distribution units, UPS (static, modular, rotary/DRUPS) & UPS power semis, Utilities, IPPs & power providers signing data-center deals, Indium
- TSMC reportedly asks suppliers to develop 5μm HBM microbumps — DigiTimes, 2026-09-02TSMC is reportedly requesting that suppliers develop 5-micrometer HBM microbumps to enhance high-bandwidth memory packaging.
- Energy and water: How to tackle the fab resource crunch — DigiTimes, 2026-09-02The article discusses the increasing resource demands, specifically regarding electricity and water supply, required to support the expansion of semiconductor fabrication facilities.Leading-edge foundry, Silicon wafers, Fab materials, masks, gases, Water treatment, reuse, consumption, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Site utilities, water & fiber entrance, Ecolab (Nalco)
- IBM's quantum pitch to chip audience: bottleneck is now manufacturing — DigiTimes, 2026-09-02IBM highlighted that manufacturing and packaging complexities are currently the primary bottlenecks for scaling quantum computing hardware.
- MediaTek pushes advanced packaging and supply chain to keep pace with AI — DigiTimes, 2026-09-02MediaTek is scaling its advanced packaging capabilities and supply chain to support the growing demand for AI infrastructure.
- Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center — DigiTimes, 2026-09-02Marvell Technology expects silicon photonics to begin scaling in late 2027, highlighting the importance of the Taiwan supply chain and TSMC's manufacturing capabilities.
- Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC — DigiTimes, 2026-09-02A TSMC executive stated that while hardware production is scaling, the primary bottlenecks for 3D integrated circuits currently lie in software and advanced substrate materials.
- AI demand push expands wafer industry's growth outlook — DigiTimes, 2026-09-02Surging demand for artificial intelligence is driving a positive growth outlook for the semiconductor wafer industry.
- Taiwan materials makers see new opening in chip packaging shift — DigiTimes, 2026-09-02Taiwanese material suppliers are identifying new opportunities as the semiconductor industry shifts toward advanced chip packaging technologies.
- Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint — DigiTimes, 2026-09-02Gemtek and Dixon Technologies are expanding their partnership to increase the production and distribution of optical transceivers and data center connectivity components in India.
- UMC targets 12-inch TFLN to break 400G SiPh bottleneck — DigiTimes, 2026-09-02UMC is targeting 12-inch thin-film lithium niobate (TFLN) technology to overcome current bottlenecks in 400G silicon photonics.
- Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference — DigiTimes, 2026-09-01Chinese memory chipmaker ICY Tech is evaluating the use of MRAM (Magnetoresistive Random-Access Memory) as a potential alternative or supplement to HBM for rack-scale AI inference applications.
- Nvidia pushes into HBM base dies as NVHBM battle heats up — DigiTimes, 2026-09-01Nvidia is intensifying its involvement in the HBM (High Bandwidth Memory) production process by moving into base die manufacturing as competition for memory capacity increases.
- 3 principles to make AI data centers good grid citizens — Utility Dive, 2026-09-01The article outlines three core principles for data center operators to ensure their facilities integrate responsibly and efficiently with the public power grid.
- The Link Budget Is Decided at the Connector — EE Times, 2026-09-01The article discusses how the physical connector and its specific electrical characteristics determine the link budget and signal integrity for high-speed data center networking.
- OnZero partners with Helen to connect Helsinki AI data center to district heating network — Data Center Dynamics, 2026-09-01OnZero has partnered with the energy utility Helen to integrate its Helsinki-based AI data center with the local district heating network to repurpose waste heat.
- National telecoms provider could make $2.7 billion selling recycled copper in AI boom — BT to strip 200,000 tons from legacy network — Tom's Hardware, 2026-09-01BT could generate significant revenue by recycling the massive amount of copper from its legacy network as it upgrades to fiber, driven by data center demand for copper.
- Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains — DigiTimes, 2026-09-01Japanese manufacturers of semiconductor materials are reportedly strengthening their relationships with Taiwanese suppliers to support the growing demand for AI-driven chip production.
- Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers — DigiTimes, 2026-09-01Marvell's CTO highlights that increasing power demands and density constraints in AI data centers are accelerating the shift toward co-packaged optics (CPO) solutions.
- Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan — DigiTimes, 2026-09-01Samsung Electro-Mechanics is bringing its glass substrate technology to Semicon Taiwan to showcase its capabilities in advanced packaging materials.
- LG Energy Solution secures long-term US lithium supply — DigiTimes, 2026-09-01LG Energy Solution has secured a long-term supply of lithium in the United States to support the manufacturing of batteries for energy storage systems.
- Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale — DigiTimes, 2026-09-01The news discusses how CXMT's advancements in HBM3E production provide a strategic pathway for Chinese AI chip manufacturers to scale their hardware capabilities.
- Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide — DigiTimes, 2026-09-01Taiwan has approved a NT$9.8 billion investment into a Lam Research subsidiary to expand the company's global R&D capabilities for etching equipment.
- Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption — DigiTimes, 2026-09-01Nvidia and MediaTek are collaborating to promote and accelerate the adoption of custom AI chips for data center applications.
- Samsung weighs HBM4 bonuses as memory, foundry teams align — DigiTimes, 2026-08-31Samsung is organizing its internal memory and foundry teams to align on HBM4 production as the company prepares for the next generation of high-bandwidth memory.
- Diraq to Deploy a Quantum Computer Inside an Equinix Data Center — HPCwire, 2026-08-31Diraq is planning to deploy a quantum computing system within an Equinix data center facility.
- Kingston's NV3 1TB PCIe 4.0 SSD drops to $156.99 at Newegg — 27% off brings it down to just 15.7 cents per GB — Tom's Hardware, 2026-08-31Kingston has discounted its NV3 1TB PCIe 4.0 SSD by 27% on Newegg, bringing the price down to $156.99.
- Trump says communities that reject data centers 'want to end up being backwards and poor' — President claims China 'could not be happier' with AI data center backlash in the US — Tom's Hardware, 2026-08-31Donald Trump criticized communities that oppose data center construction, stating they would become economically disadvantaged.
- Stakeholders square off over proposed DOE appliance program changes — Utility Dive, 2026-08-31Manufacturers advocate for procedural changes to DOE appliance standards without applying them retroactively, while efficiency advocates worry about lost energy savings.
- Gudeng sees double-digit advanced packaging growth from 2027 — DigiTimes, 2026-08-31Advanced packaging is expected to see double-digit revenue growth starting in 2027 due to sustained demand from AI and high-performance computing sectors.
- The rules of data center development are evolving. Is your strategy? — Utility Dive, 2026-08-31The market for data centers is experiencing continued expansion.
- Marvell sees 2027 acceleration in scale-up optics — DigiTimes, 2026-08-31Marvell predicts that demand for optical solutions like near-package optics (NPO) will accelerate by 2027 because increasing system size is straining copper bandwidth.
- ASE: CPO scale-out demands deeper supply-chain coordination for mass production — DigiTimes, 2026-08-31The industry highlighted that meeting demand for Co-packaged Optics (CPO) will require deeper supply chain coordination for mass manufacturing.
- Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row — DigiTimes, 2026-08-31The chairman of Gudeng Precision Industrial asserted that the trust placed in Taiwan by international customers is crucial to maintaining its role in global supply chains, referencing a controversy involving PCB maker Unimicron.
- Taiwan manufacturing know-how is key physical AI asset — DigiTimes, 2026-08-31Deloitte Taiwan released a report highlighting the growing importance of physical AI for industrial applications.
- Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift — DigiTimes, 2026-08-31SMR technology is gaining interest from government and industry as a potential zero-carbon power source to meet the electricity demands of AI data centers and semiconductor manufacturing.
- Musk tackles key AI power bottleneck with in-house turbine foundry — DigiTimes, 2026-08-31SpaceX plans to manufacture its own turbine blades to alleviate the power bottleneck impacting AI data center construction.
- Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6 — DigiTimes, 2026-08-31The week's semiconductor news covered AI chip advancements, advanced packaging strategies, and shifts in data center infrastructure investments across major players including Apple, Google, MediaTek, and Qualcomm.
supply constraint
- Wah Lee sees faster growth in 2027 as supply stays tight — DigiTimes, 2026-09-06Wah Lee Industrial forecasts accelerated growth in 2027, driven by new advanced packaging capacity and overseas fab construction, amid persistent supply tightness for semiconductor materials and equipment.
- No foundry price relief before 2027 as utilization nears 90% — DigiTimes, 2026-09-06High AI demand is causing a repricing cycle across the foundry industry, raising costs for both leading-edge and mature process components.
- Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027 — DigiTimes, 2026-09-05High demand for AI and HPC is extending order visibility for semiconductor equipment maker Scientech into 2028, though supply constraints may force them to limit customer orders in 2027.
- Telstra confirms July outage was caused by network timing system failure — Data Center Dynamics, 2026-09-04Telstra's failure to respond to warnings regarding its network timing system suggests potential operational weaknesses in its infrastructure.
- TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex — DigiTimes, 2026-09-04TSMC advises HBM manufacturers to make their designs compatible with X-ray inspection due to advanced packaging complexity and detection challenges.
- The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom — DigiTimes, 2026-09-04The industry faces potential bottlenecks related to copper supply and interconnects, which threaten the scalability of AI supercomputing.
- China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls — DigiTimes, 2026-09-04Analyses suggest China could face a 10-15 year delay in mastering EUV lithography due to ongoing Western export controls.
- Processor, memory boom could push chip supply chain out of sync, says Yole — DigiTimes, 2026-09-04Yole Group warns that the rapid growth in processing and memory could lead to a supply-chain imbalance, causing component decoupling.
- TSMC fab equipment demand nearly doubles in six months — AI surge pushes 2026 CapEx toward $64B amid tool shortages — Tom's Hardware, 2026-09-03Increased AI demand has nearly doubled TSMC's fab equipment requirements in the last eight months, despite a relatively small increase in its 2026 Capital Expenditure budget.
- Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise — DigiTimes, 2026-09-03Due to strong demand and limited restarts, the supply of 6-inch silicon carbide (SiC) substrates in China is tightening, leading to imminent price increases.
- TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning — DigiTimes, 2026-09-03TSMC notes that surging AI demand is straining the global chip industry, citing challenges in procurement, labor, and infrastructure that are outpacing the ecosystem's typical planning capacity.
- AI substrate shortages widen as Unimicron signals capacity support through 2029 — DigiTimes, 2026-09-03Unimicron confirmed it is working to alleviate the shortage of AI substrates, providing capacity support for MediaTek through 2029, at Semicon Taiwan 2026.
- HPE's constraint has shifted from demand to memory — DigiTimes, 2026-09-03HPE stated that its current business limitation is not demand or integration, but rather the supply of components, specifically memory.
- Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too — DigiTimes, 2026-09-02Samsung Electro-Mechanics plans to raise prices for MLCCs and ABF substrates due to constrained supply and high demand from the AI server market.
- TCL CSOT bets on InP laser chips as supply tightens — DigiTimes, 2026-09-02TCL CSOT is increasing its focus on InP (Indium Phosphide) laser chips to address tightening supply conditions in the optical communications market.
- Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30% — DigiTimes, 2026-09-02Panasonic is reportedly increasing prices for Copper Clad Laminate (CCL) and Printed Process (PP) materials due to a 30% spike in IC substrate costs.
- US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles — DigiTimes, 2026-09-02A shortage of solar cells and wafers is expected to hinder the growth of US solar module capacity despite a projected lead in production by 2027.
- Trump grid order likely to cause energy storage delays, cancellations: BloombergNEF — Utility Dive, 2026-09-01Executive orders and Treasury guidance are anticipated to significantly disrupt the supply chains for battery and inverter components.
- ASE CEO describes AI resource squeeze as a short-term problem — DigiTimes, 2026-09-01The CEO of ASE stated that the current high demand and supply constraints in the AI hardware market, particularly for advanced packaging, is a short-term bottleneck.
- TSMC delays CoWoS orders as CoPoS plans take shape — DigiTimes, 2026-09-01TSMC is reportedly delaying orders for CoWoS (Chip on Wafer on Substrate) as it shifts focus toward CoPoS (Chip on Package on Substrate) processing plans.
- Samsung locks 70% of memory output as HBM spot prices soar — DigiTimes, 2026-09-01Samsung is reportedly allocating 70% of its memory production capacity to HBM due to surging spot prices.
- Nvidia demand nearly doubles as supply meets only 70% — DigiTimes, 2026-08-31Despite projected high growth and massive data center revenue increases, Nvidia stated that current supply capabilities can only meet approximately 70% of customer demand.
- Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates — DigiTimes, 2026-08-31Unimicron stock dropped after prosecutors revealed an investigation into alleged false country-of-origin labeling concerning printed circuit boards (PCBs).
- Kingboard Laminates raises prices again as CCL shortages deepen — DigiTimes, 2026-08-31Kingboard Laminates announced a price increase on its copper-clad laminates (CCL) due to deepening shortages and surging costs of core materials like fiberglass cloth and copper foil.
- CXMT's global DRAM push runs into US curbs — DigiTimes, 2026-08-31DRAM maker CXMT is challenging the Pentagon's designation of its company to mitigate a global memory shortage and achieve overseas expansion.
- South Korea risks 'HBM 2.0' trap in emerging CPO market — DigiTimes, 2026-08-31South Korea risks failing to transition from only component supply capabilities in Co-packaged optics (CPO) while foreign players control the higher-value platform components.
earnings
- Every Chinese CPU maker grew in 1H26 but only one grew on processors — DigiTimes, 2026-09-06Revenue increased across all examined Chinese chip companies in the first half of 2026 due to domestic substitution efforts, with varying performance levels among them.
- I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales — DigiTimes, 2026-09-05I-Chiun is increasing its focus on advanced thermal solutions, projecting that thermal products will account for over 50% of its revenue by 2026/2027.
- SEMI: Global Semiconductor Equipment Billings Increased 23% YoY in Q2 2026 — HPCwire, 2026-09-04SEMI reported that global semiconductor equipment billings grew 23% year-over-year in Q2 2026, reaching $40.53 billion.
- MSScorps August revenue hits new high on silicon photonics gains — DigiTimes, 2026-09-04MSScorps reported a record August 2026 revenue, driven by increased global demand for AI computing, which requires advanced processes, packaging, and high-speed optical interconnects.
- China's GPU makers found scale as profit came from elsewhere — DigiTimes, 2026-09-03While China's domestic GPU industry saw overall growth in the first half of 2026, the earnings of listed companies showed that revenue growth did not translate into profit for most players, who largely gained revenue from sources other than chip sales.
- Nanya, ESMT hit record August revenue on higher contract prices — DigiTimes, 2026-09-03Nanya Technology and ESMT reported record revenue for August 2026 due to increased contract pricing.
- Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028 — DigiTimes, 2026-09-03Broadcom outlined that its six XPU customers require 30GW of accelerated compute capacity between fiscal 2027 and 2028, totaling US$350 billion in semiconductor shipments.
- China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027 — DigiTimes, 2026-09-03The demand for 800G and 1.6T optical modules, driven by AI expansion, is expected to boost earnings for Chinese suppliers well into 2027.
- Broadcom's custom AI silicon takes over the income statement as revenue climbs 86% — DigiTimes, 2026-09-03Broadcom reported strong third-quarter revenue of US$29.6 billion, with custom AI silicon revenue reaching US$16.7 billion and now exceeding all other product segment sales.
- SK Hynix wafer purchases jump 104% on AI demand — DigiTimes, 2026-09-02SK Hynix significantly increased its semiconductor wafer purchases in Q2 2026 due to rising prices and strong AI demand, a move that garnered more attention than Samsung Electronics' spending increase.
- SEMI lifts 2028 wafer fab equipment forecast to US$220 billion — DigiTimes, 2026-09-01SEMI has raised its 2028 wafer fab equipment forecast to $220 billion.
- China's memory chipmakers post a record 1H — but not all of it came from chips — DigiTimes, 2026-09-01Chinese memory chip manufacturers reported record-breaking revenue for the first half of the year, driven by significant gains in memory hardware demand.
- Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race — DigiTimes, 2026-09-01CXMT reported a significant profit surge driven by its position in the AI memory market, particularly regarding its production of memory products used in high-performance computing.
- MetaX posts first-half profit while China's AI GPU rivals split — DigiTimes, 2026-08-31MetaX reported profit for the first half of the year due to growing GPU shipments and successful commercialization of its C600 accelerator, contrasting with a split performance in China's AI chip sector.
- China's silicon wafer makers report profit gains of varying quality — DigiTimes, 2026-08-31Several Chinese semiconductor-grade silicon wafer makers reported first-half 2026 results showing an uneven sector recovery, with profitability varying among companies.
m and a
- China's JCET seeks US$968M for AI-driven packaging expansion — DigiTimes, 2026-09-06JCET Group is raising approximately US$968 million through a private placement to expand its advanced packaging, testing, and memory capacity for high-performance computing applications.
- T5 spins out construction arm, sells operations biz to Salute — Data Center Dynamics, 2026-09-04T5 spun out a construction arm and sold its operations business to Salute, resulting in the construction arm being renamed EverOn Data Center Services.
- WIOCC secures $300m to fuel pan-African infrastructure build-out — Data Center Dynamics, 2026-09-04WIOCC secured $300 million from Africa Finance Corporation and Vision Invest to support pan-African infrastructure development.
- Flex acquires data center power conversion manufacturer EPC Power in $4.4bn deal — Data Center Dynamics, 2026-09-04Flex acquired data center power conversion manufacturer EPC Power in a $4.4 billion transaction.
- Nscale signs $3.5bn compute agreement with robotics company Figure — Data Center Dynamics, 2026-09-04Nscale has signed a $3.5 billion compute agreement with Figure, potentially expanding to $6 billion.
- Taiwan-based Liteon purchases 25 percent stake in Polish liquid cooling firm, DCX — Data Center Dynamics, 2026-09-04Liteon purchased a 25% stake in the Polish liquid cooling firm, DCX, in a deal valued at approximately $176 million.
- Equinix & CPP close acquisition of atNorth — Data Center Dynamics, 2026-09-04Equinix and CPP finalized the acquisition of atNorth, with Partners Group choosing to maintain a minority ownership stake.
- TDS withdraw plans to fully acquire Array Digital Infrastructure — Data Center Dynamics, 2026-09-04TDS has withdrawn its plans to acquire Array Digital Infrastructure after failing to reach an agreement.
- CXMT allegedly used a written roadmap to steal Samsung DRAM tech — South Korean court says 'Project Hefei' lifted 620-step recipe to build 10% global market share — Tom's Hardware, 2026-09-04A South Korean court ruled that CXMT allegedly used a detailed written roadmap, named 'Project Hefei,' to steal DRAM technology from Samsung, enabling their significant market share.
- Chinese chipmaker CXMT allegedly used a written roadmap to steal Samsung DRAM tech — South Korean court says 'Project Hefei' lifted 620-step recipe to build 10% global market share — Tom's Hardware, 2026-09-04South Korean court ruled that Chinese firm CXMT used a stolen recipe, allegedly via 'Project Hefei,' to build its DRAM technology and achieve a significant global market share.
- Lite-On makes US$170 million strategic investment in DCX for AI cooling push — DigiTimes, 2026-09-04Lite-On Technology is making a strategic investment to acquire a significant stake in the liquid cooling provider DCX Polska.
- Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff — DigiTimes, 2026-09-04Nvidia's acquisition of Hugging Face included payments to chip rivals Intel and AMD, suggesting the deal was partly aimed at maintaining staff and competing in the open-weight model market.
- Nvidia acquires Hugging Face for $12.93 billion — company gains control of major AI model distribution platform — Tom's Hardware, 2026-09-03Nvidia purchased Hugging Face for $12.93 billion, expanding its control over AI model platforms while promising to support diverse models and hardware ecosystems.
- GoPro to enter AI data center market via merger with optical photonics company — Data Center Dynamics, 2026-09-03GoPro is merging with Action Acquisitions and Starman Optical to enter the AI data center market, specifically involving optical photonics.
- Keppel acquires majority stake in two Tokyo data centers — Data Center Dynamics, 2026-09-03Keppel acquired a majority stake in two data centers in Tokyo, expanding its holdings in Japan.
- Vertiv acquires microgrid company UtilityInnovation — Data Center Dynamics, 2026-09-03Vertiv acquired UtilityInnovation, a move positioning the company higher up in the data center's power infrastructure supply chain.
- KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid — DigiTimes, 2026-09-03KEPCO is seeking US$18 billion from Samsung and SK Hynix to help fund the necessary power infrastructure for South Korea's expanding semiconductor clusters.
- CXMT's 'Hefei Project' exposed in Samsung DRAM theft case — DigiTimes, 2026-09-03Prosecutors allege that Chinese company ChangXin Memory Technologies (CXMT) attempted to acquire Samsung Electronics' core DRAM technology and engineers through an organized project starting in 2016.
- SB Energy eyes US listing as Nvidia commits US$1.5 billion — DigiTimes, 2026-09-02SB Energy filed for an IPO, potentially valued over $50 billion, with significant backing promised by Nvidia's $1.5 billion investment.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Nvidia
- iPronics Raises $125M to Scale Programmable Optical Networking for AI Data Centers — HPCwire, 2026-09-02iPronics secured $125 million in Series B funding, with NVIDIA joining the round, to expand its silicon photonics-based optical circuit switching for AI data centers.
- Mercedes Spinout Athos Closes Its Doors — EE Times, 2026-09-02The startup Athos, spun out of Mercedes, shut down because it could not secure necessary funding to bring its chiplet technology to market.
- Vertiv to Acquire UtilityInnovation Group for $1.45B — HPCwire, 2026-09-02Vertiv is acquiring Utility Innovation Group, a company specializing in microgrid solutions and advanced power controls.
- CollPlant Biotechnologies acquires laser-based computing startup LightSolver — Data Center Dynamics, 2026-09-02CollPlant Biotechnologies acquired the laser-based computing startup LightSolver.
- GoPro to expand into AI data centers after $285 million merger with optical-photonics company — move to solve camera maker’s financial woes, move manufacturing back into the US — Tom's Hardware, 2026-09-02GoPro is merging with an optical-photonics company to expand into the AI data center market and relocate manufacturing to the United States.
- Equinix and CPP Investments Complete $4B Acquisition of atNorth — HPCwire, 2026-09-02Equinix and CPP Investments have finalized a $4 billion acquisition of the data center operator atNorth.
- Phoenix Tower signs $6.5bn financing agreement — Data Center Dynamics, 2026-09-02Phoenix Tower has secured a $6.5 billion financing agreement to support its data center development and expansion efforts.
- Nvidia and Micron top NT$4.4T in Taiwan investment — DigiTimes, 2026-09-02Nvidia and Micron have collectively invested over NT$4.4 trillion in Taiwan to bolster their manufacturing and supply chain presence for high-performance computing hardware.
- NVIDIA and Mediatek Ink $3.5B Investment Deal, Accelerate NVLink Fusion Adoption — ServeTheHome, 2026-09-01NVIDIA and MediaTek have entered into a $3.5 billion investment agreement to accelerate the adoption of NVLink Fusion technology for high-speed GPU-to-GPU interconnects.
- Nvidia pours $3.5 billion into MediaTek — company will adopt NVLink Fusion for its custom AI accelerators — Tom's Hardware, 2026-09-01Nvidia has invested $3.5 billion in MediaTek, which will utilize NVLink Fusion technology for its custom AI accelerator designs.
- Charter CFO Jessica Fischer to join Google-Blackstone's TPU neocloud — Data Center Dynamics, 2026-09-01Google and Blackstone are partnering to develop a new cloud platform centered around Google's custom TPU accelerators.
- Lambda secures $1bn private debt to purchase Nvidia GPUs - report — Data Center Dynamics, 2026-09-01Lambda has secured $1 billion in private debt financing specifically to acquire Nvidia GPUs for its infrastructure.
- Anthropic signs $35bn cloud agreement with Lambda - report — Data Center Dynamics, 2026-09-01Anthropic has reportedly signed a $35 billion cloud services agreement with Lambda to support its large-scale AI infrastructure needs.
- Chinese court freezes $318 million in Nexperia assets as Wingtech presses to regain control — Dutch chipmaker says seizures won't affect day-to-day operations — Tom's Hardware, 2026-09-01Chinese court proceedings froze Nexperia assets, which the Dutch chipmaker stated would not impact ongoing operations despite the total value being significantly higher than Wingtech's reported sales.
- One Nuclear inks binding LOI to develop 2.88GW gas plant and BESS to power data center in Louisiana — Data Center Dynamics, 2026-09-01One Nuclear has signed a letter of intent to develop a 2.88GW gas plant and battery energy storage system (BESS) to provide power for a data center in Louisiana.
- Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding — DigiTimes, 2026-08-31Agentrys, a startup using agentic tools for semiconductor design, secured $24.5 million in funding from investors including MediaTek.
- France draws Taiwanese investment projects worth EUR7.5 billion — DigiTimes, 2026-08-31Taiwanese companies are investing approximately EUR7.5 billion into French projects, focusing on advanced semiconductor packaging and AI infrastructure.
product launch
- SiliconAuto pushes AI chiplets as automotive SoC ties tighten — DigiTimes, 2026-09-06SiliconAuto announced that it is highlighting AI chiplet architectures for use in automotive and industrial edge AI applications.
- Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next — DigiTimes, 2026-09-06Taiwanese and Dutch companies are collaborating on a silicon photonics program aiming to develop 1.6T DR8 optical links by 2026 and 3.2T links by 2027.
- QNAP QSW-M2130 2.5GbE and 10GbE Switches Shown — ServeTheHome, 2026-09-06QNAP unveiled two managed enterprise switches, the QSW-M2130 and QSW-M2130P, featuring 24x 2.5GbE and 6x 10GbE ports with RJ45 and SFP+ options.
- FSP Mega GM 1200W power supply review: An in-house FSP platform that quietly overshoots its own Gold label — Tom's Hardware, 2026-09-06The FSP Mega GM 1200W power supply is a Platinum-grade, compact unit featuring Japanese capacitors.
- Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market — DigiTimes, 2026-09-05I-Chiun Precision Industry and ITRI launched Huizhi Advanced, a new startup aiming to capitalize on the $19.2 billion global liquid-cooling market for AI chips.
- Google TPU splits training, inference as CPU becomes next focus — DigiTimes, 2026-09-04Google indicated that if a specific AI workload reaches sufficient scale, it may develop additional dedicated custom silicon chips for different computing needs, focusing on optimizing for tasks like training versus inference.
- Jmem Tek's PQC security chip nears mass production — DigiTimes, 2026-09-04Jmem Tek demonstrated its PUF and PQC hardware security technologies, aiming to establish a chip-level hardware root of trust for future AI and smart devices.
- AMD Announces Threadripper Halo Station: A High-End AI-Centric Developer Workstation — ServeTheHome, 2026-09-04AMD launched the Threadripper Halo Station, an AI-centric developer workstation combining Threadripper Pro CPUs and Instinct MI350P accelerators.
- Minisforum launches local AI solutions at IFA 2026 — AI Agent NAS N5 and AI Mini Workstation MS-S1 use AMD Ryzen AI Max+ Pro 495 processors designed to run models locally — Tom's Hardware, 2026-09-04Minisforum launched the NAS N5 and MS-S1 mini-PCs at IFA 2026, utilizing AMD Ryzen AI Max+ Pro processors with integrated GPUs and up to 192GB of unified memory.
- Quantum Foundry Copenhagen Unveils Plans for European Quantum Chip Facility — HPCwire, 2026-09-04Quantum Foundry Copenhagen and the Novo Nordisk Foundation plan to build a new 5,300 m² facility to manufacture quantum chips in Europe.
- APU Opens NVIDIA DGX Spark-Powered AI Lab in Malaysia — HPCwire, 2026-09-04APU opened an AI Supercomputing Lab in Malaysia featuring NVIDIA DGX Spark, providing advanced computing capabilities for academic use.
- AMD unveils Threadripper Halo Station, an AI workstation packing 96 cores and dual liquid-cooled MI350P accelerators — 'the most powerful workstation in the world' can run trillion-parameter models, says AMD — Tom's Hardware, 2026-09-04AMD launched the Threadripper Halo Station, an AI workstation featuring a 96-core Zen 5 processor and dual MI350P accelerators, supported by 2TB of DDR5 memory.
- MIPS Launches Workload-Native Platforms for Physical AI — HPCwire, 2026-09-04MIPS, operating through GF, launched three workload-native platforms designed to enable Physical AI capabilities across industrial, transport, and embedded systems.
- SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology — DigiTimes, 2026-09-04As AI demands push chip architecture toward complex 3D stacking and hybrid bonding, traditional inspection tools are failing to keep up.
- China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development — DigiTimes, 2026-09-04Montage Technology is expanding its role in AI data center infrastructure by developing products for CXL 3.2, DDR6, and PCIe, moving beyond traditional DDR interfaces.
- CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough — DigiTimes, 2026-09-04E&R Engineering introduced a new laser micromachining platform for high-density 2D Fiber Array Units (FAU) required by next-generation optical interconnects.
- Ennostar accelerates AI optical communications with micro LED — DigiTimes, 2026-09-04Ennostar is advancing the use of micro LED technology for high-speed optical communications in AI, noting that mass production represents the primary barrier to commercial deployment.
- Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications — DigiTimes, 2026-09-04Taisic Materials introduced a p-type silicon carbide substrate for ultra-high-voltage applications in grids and rail systems.
- China Motor unit Greentrans launches Taiwan-made quadruped robots — DigiTimes, 2026-09-04Greentrans, a subsidiary of China Motor Corp., launched new quadruped robots (GT5X and GT3X) at SEMICON Taiwan 2026 to support smart semiconductor fabrication and autonomous operations in Taiwan.
- Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers — DigiTimes, 2026-09-04Sumitomo Chemical has launched the mass production of InP epitaxial wafers, a critical material used in optical semiconductors for advanced data centers.
- CIQ Launches Fuzzball 4.2 with Agentic AI and AMD GPU Support — HPCwire, 2026-09-03CIQ launched Fuzzball 4.2, an orchestration platform providing sovereign AI and HPC capabilities with support for AMD GPUs.
- Lenovo ThinkCentre X Ultra packs Gorgon Halo — AMD Ryzen AI Max+ Pro 495 shows up in mini workstation — Tom's Hardware, 2026-09-03Lenovo displayed the ThinkCentre X Ultra incorporating the AMD Ryzen AI Max+ Pro 495 chip, which is powered by AMD's Gorgon Halo technology.
- Intel's Core Ultra 400 'Nova Lake' launch schedule leaks out — mass production in Q4, first Nova Lake CPUs in Q1 2027 — Tom's Hardware, 2026-09-03Intel's Core Ultra 400-series 'Nova Lake-S' CPUs will enter mass production next quarter but won't launch until Q1 2027, starting with 28-core models.
- Bull selected to deliver AMD-powered Lumi-AI supercomputer — Data Center Dynamics, 2026-09-03Bull plans to deploy an AI supercomputer powered by AMD in the second half of 2027.
- Chinese supercomputer manufacturer reveals the 'world's first' 64-thread mobile workstation for AI — domestic CPU paired with mystery GPU with 16GB of VRAM promises cloud-level performance — Tom's Hardware, 2026-09-03Sugon announced a new mobile workstation featuring a 64-thread CPU and a 16GB VRAM GPU designed for AI workloads.
- Chinese supercomputer manufacturer reveals the 'world's first' 64-thread mobile workstation for AI — homegrown CPU paired with mystery GPU with 16GB of VRAM promises cloud-level performance — Tom's Hardware, 2026-09-03Sugon has announced a mobile workstation aimed at AI tasks, featuring a 64-thread processor and 16GB of VRAM.
- CHPT spans wafer to system-level testing — DigiTimes, 2026-09-03Chunghwa Precision Test Tech presented various test interface solutions, including probe cards and burn-in boards, for AI ASICs and high-performance computing chips at SEMICON Taiwan 2026.
- Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue — DigiTimes, 2026-09-03Ligitek is transitioning from LED packaging to silicon photonics and 1.6T optical modules, with initial revenue expected in the second half of 2027.
- Solomon leverages AI vision and optical tech to tap semiconductor inspection market — DigiTimes, 2026-09-03Solomon Technology showcased AI vision and optical tech for wafer warpage and TGV defect inspection, targeting advanced packaging quality.
- China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration — DigiTimes, 2026-09-03SJ Semiconductor expanded its 2.5D packaging platform to 3.3-reticle scale to improve integration density for AI and HPC chips using silicon interposers and HBM.
- Win Semiconductors unveils 0.1μm GaN for AI, satellite links — DigiTimes, 2026-09-03WIN Semiconductors unveiled 0.1µm GaN technology, emphasizing its role in high-speed AI and satellite communications.
- UniVista expands China EDA stack with AI agents, native 3DIC tools — DigiTimes, 2026-09-03UniVista launched a comprehensive EDA framework featuring native 3DIC tools and an advanced-process closure platform to strengthen China's domestic chip design toolchain.
- LCY Advanced Materials launches wet chemicals for AI chip packaging — DigiTimes, 2026-09-02LCY Advanced Materials introduced a new wet chemical solution for advanced interconnects to support high-density chip packaging required by AI computing.
- Haffner Energy launches biomass power-cooling system for data centers — Data Center Dynamics, 2026-09-02Haffner Energy introduced a biomass-powered system that provides both power and cooling solutions for data centers.
- Samsung teases new HBM5 with twice the performance of HBM4E —ambitious data transfer rates could hint at 4,096-bit interface — Tom's Hardware, 2026-09-02Samsung expects HBM5 to provide 4 TB/s of bandwidth per stack by the late 2020s, supporting AI accelerators with an aggregated memory bandwidth of about 100 TB/s.
- VDURA Powers AI and HPC Research at New Mexico State University with Data Platform Deployment — HPCwire, 2026-09-02VDURA completed the deployment of a high-performance data platform for AI and HPC research at New Mexico State University.
- Sandisk says HBF can match HBM bandwidth with up to 16x the capacity — DigiTimes, 2026-09-02Sandisk announced that its HBF (High Bandwidth Flash) memory can achieve HBM-level bandwidth while offering up to 16 times the storage capacity.
- Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World — EE Times, 2026-09-02HrdWyr is developing AI-native System-on-Chips (SoCs) aimed at physical control applications such as power management and motor control.
- Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand — DigiTimes, 2026-09-02Zhen Ding has introduced 1.6T optical modules and 34-layer AI server boards designed for next-generation AI infrastructure.
- Certain Micro targets AI test-interface demand with three Semicon products — DigiTimes, 2026-09-02Microchip Technology has announced three new semiconductor products designed to address the increasing demand for AI testing and interface requirements.
- Innolux targets advanced packaging with debut of Chip Last tech — DigiTimes, 2026-09-02Innolux has introduced its new Chip Last technology designed for advanced packaging applications.
- NVIDIA RISC-V for NVIDIA GPUs at Hot Chips 2026 — ServeTheHome, 2026-09-01NVIDIA announced its plans to integrate RISC-V architecture into its GPU ecosystem, as presented at Hot Chips 2026.
- Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor — Tom's Hardware, 2026-09-01Samsung announced a three-phase HBM roadmap featuring 'zHBM' technology, which involves stacking DRAM directly onto the processor to integrate logic and compute within the memory.
- SK Hynix touts up to 5.15x inference gains with custom HBM — DigiTimes, 2026-09-01SK Hynix announced that its custom High Bandwidth Memory (HBM) provides up to 5.15x performance gains for inference tasks.
- Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain — DigiTimes, 2026-09-01Samsung announced plans to begin production of LPDDR5X-PIM memory by early 2027, claiming a 3.8x performance improvement.
- XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6 — DigiTimes, 2026-09-01XCENA and Samsung have partnered to demonstrate rack-scale CXL memory systems utilizing Intel Xeon 6 processors.
- Cisco: CPO is ready for mass deployment amid surging AI data-center demand — DigiTimes, 2026-09-01Cisco announced that its Co-Packaged Optics (CPO) technology is ready for mass deployment to meet the high bandwidth demands of AI data centers.
- Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion — DigiTimes, 2026-08-31Nvidia is accelerating its memory technology roadmap by developing custom NVHBM memory and expanding its NVLink Fusion interconnect technology to enhance data-center performance.
- Think Unveils Fabric Platform for High-Density AI Compute — HPCwire, 2026-08-31Think has announced a new fabric platform designed to support high-density AI computing clusters.
- TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration — DigiTimes, 2026-08-31TSMC unveiled its updated roadmap for silicon photonics to boost bandwidth and utilize heterogeneous integration for future co-packaged optics.
- TSMC sees SiPh going mainstream in 2027 — DigiTimes, 2026-08-31According to TSMC, silicon photonics is projected to achieve mainstream adoption in 2027 due to accelerating AI scale-out demands for optical transceivers.
- SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux — DigiTimes, 2026-08-31SiFive launched its BigSky development server to enable hyperscalers and developers to port data center workloads to RISC-V architectures, validating production designs.
- Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace — DigiTimes, 2026-08-31Taisic Materials created Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace developed in-house.
design win
- Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands — DigiTimes, 2026-09-05Hanmi Semiconductor successfully qualified its 2.5D packaging bonder equipment for a Taiwanese foundry, bolstering its position in the advanced packaging supply chain.
- Siemens Brings Precision FPGA Synthesis to NanoBridge Semiconductor Devices — HPCwire, 2026-09-04NanoBridge Semiconductor will use Siemens’ Precision FPGA Synthesis tool for its FPGA development initiatives.
- HPE and Oracle Expand Collaboration on AI Data Center Networking — HPCwire, 2026-09-04HPE and Oracle expanded their partnership to deploy HPE Juniper Networking solutions across Oracle's global AI data centers to scale its infrastructure.
- GlobalFoundries and RAAAM Tape Out GCRAM Test Chip on FDX Platform — HPCwire, 2026-09-03GlobalFoundries and RAAAM Memory Technologies began a collaboration to develop Gain-Cell RAM (GCRAM) by successfully submitting a test chip on GlobalFoundries’ FDX FD-SOI platform.
- US defense contractor Northrop Grumman awarded $7m for diamond-cooled chip technology — Data Center Dynamics, 2026-09-02Northrop Grumman received $7 million in funding from the US Defense Advanced Research Projects Agency for diamond-cooled chip technology.
- Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify — DigiTimes, 2026-09-02Meta has reportedly selected SeeYA to supply OLED panels for their data center hardware, following a failure by BOE to qualify for the project.
- AMD, Cisco and HUMAIN Expand Saudi Arabia’s AI Infrastructure as AMD Instinct Systems Go Live — newsroom:amd, 2026-08-31AMD and Cisco are partnering with HUMAIN to expand AI infrastructure in Saudi Arabia using AMD Instinct systems.
regulation
- Trump slaps up to 100% tariffs on imported drones and critical components in latest move against China's proliferation of U.S. drone market, citing national security — products from allied nation face 10-15% rates — Tom's Hardware, 2026-09-05The Trump administration imposed up to 100% tariffs on imported drones and key components to reduce dependence on Chinese technology and strengthen the domestic supply chain.
- Moscow bans cryptomining until end of 2032, citing power concerns — Data Center Dynamics, 2026-09-04Moscow has banned cryptocurrency mining until 2032 due to concerns over power consumption.
- California lawmakers pass data center ratepayer protection bills, send to governor for approval — Data Center Dynamics, 2026-09-03The proposed legislation aims to establish separate electricity tariffs for large data centers in California.
- Almost 70% of voters in Missouri city vote to recall council member who said yes to AI data center tax breaks — councilor said disagreement over an issue shouldn’t be enough to unseat him — Tom's Hardware, 2026-09-03Voters recalled a local council member who supported granting tax breaks to the Nebius data center for over $6 billion.
- Loudoun County could reverse data center by-right grandfathering exemption — Data Center Dynamics, 2026-09-03The Loudoun County board of supervisors voted to evaluate the legality and impact of reversing a data center's existing exemption from building codes.
- Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America — DigiTimes, 2026-09-03The US is preparing new semiconductor tariffs that exempt companies with US manufacturing operations, fundamentally tying tariff exposure to investment in American fabrication facilities.
- Large loads face reliability requirements under MISO proposal — Utility Dive, 2026-09-01MISO plans to specifically classify and regulate large computational loads, such as those from data centers, to ensure reliability.
- PJM drops Oklo advanced nuclear project from interconnection study cycle — Utility Dive, 2026-08-31PJM has removed Oklo's advanced nuclear project from its current interconnection study cycle.
- Key Nvidia and Intel supplier raided over alleged China origin fraud — Unimicron faces probe over PCB origin washing, risk of 40% U.S. tariff penalty — Tom's Hardware, 2026-08-31Prosecutors are investigating Unimicron for allegedly shipping and mislabeling China-made PCBs as Taiwanese products, which are critical components for major tech companies like Nvidia and Intel.
- Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector — DigiTimes, 2026-08-31Investigations into IC substrate maker Unimicron highlight increased scrutiny of cross-border manufacturing practices in Taiwan's electronics industry.
- US weighs limits on China's access to chips in overseas data centers — DigiTimes, 2026-08-31U.S. regulations may restrict China's access to advanced computing resources, impacting data center operators and cloud service providers in Southeast Asia.
- Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging — DigiTimes, 2026-08-31Shanghai's 15th Five-Year Plan prioritizes ICs, AI, and advanced packaging while focusing on high-value areas like advanced chips and critical materials.
capacity
- Pure starts work on second building at Brent Cross campus in London, UK — Data Center Dynamics, 2026-09-04Pure intends to build a second data center building at its Brent Cross campus in London, with a capacity of 70MW.
- Meta's $1.2bn data center in Kuna, Idaho, goes live — Data Center Dynamics, 2026-09-04Meta opened its second AI-optimized data center facility in Kuna, Idaho.
- Bitdeer buys 200 acres in Milam County, Texas, to expand AI and HPC data center — Data Center Dynamics, 2026-09-04Bitdeer is acquiring 200 acres in Milam County, Texas, for the expansion of its AI and HPC data center capabilities.
- Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge — DigiTimes, 2026-09-04Micron plans to double its HBM capacity by late 2026, specifically focusing on increasing 12-high HBM4 output for Nvidia's AI platform.
- Taiwan to expand AI compute capacity as supercomputer at research institute hits full load — DigiTimes, 2026-09-04Taiwan is accelerating its AI compute capacity expansion due to surging demand for AI chips, GPUs, and servers, with current government facilities already at full utilization.
- Firmus proposes third data center project in Tasmania — Data Center Dynamics, 2026-09-03Firmus plans to develop a 52MW data center project in Wesley Vale, Tasmania.
- New 400MW AI data center planned for Algoma in Ontario, Canada — Data Center Dynamics, 2026-09-03Algoma Steel and Red Jar Energy Partners are planning a new 400MW AI data center in Algoma, Ontario.
- Ecuador's Telconet opens data center in Guayaquil, targets another in Quito — Data Center Dynamics, 2026-09-03Telconet is expanding its presence by opening a data center in Guayaquil, with plans for a third location in Quito.
- Google to expand Taipei AI infrastructure center as Taiwan ties deepen — DigiTimes, 2026-09-03Google is expanding its AI research center in Taipei, highlighting the region's deep involvement in the global supply chain for next-generation computing hardware, including chips and cooling.
- Samsung to add 1,612 new equipment units at Vietnam chip plant — DigiTimes, 2026-09-02Samsung is accelerating its semiconductor back-end manufacturing efforts in Vietnam by installing 1,612 new processing units at its expanding facility.
- Telehouse adds new building to Frankfurt data center campus — Data Center Dynamics, 2026-09-02Telehouse increased its data center capacity in Frankfurt with the addition of Building N, providing 5.4MW.
- AWS and Humain commit to bringing 50MW online at Saudi AI Zone by 2028 — Data Center Dynamics, 2026-09-02Amazon Web Services (AWS) and Humain have announced a commitment to establish a 50MW data center facility within the Saudi AI Zone, scheduled for completion by 2028.
- Tape companies ship 160 exabytes of storage in 2025, AI data demands drive 'unprecedented data growth' — capacity shipped in Q1 2026 rose 57% YOY driven by AI, LTO‑9 momentum, and early LTO‑10 uptake — Tom's Hardware, 2026-09-02Tape storage manufacturers anticipate continued high growth in capacity shipment, projecting a 57% year-over-year increase for Q1 2026, driven by AI demand and newer tape standards.
- ChronoScale and Microsoft partner on 50MW deployment in North America — Data Center Dynamics, 2026-09-02ChronoScale and Microsoft have partnered to deploy a 50MW data center facility in North America.
- Cerebras starts construction on 165MW data center in Mikkeli, Finland — Data Center Dynamics, 2026-09-02Cerebras has commenced construction of a 165MW data center facility in Mikkeli, Finland.
- TSMC moves into Baipu Industrial Park, boosts advanced packaging — DigiTimes, 2026-09-02TSMC is expanding its presence in the Baipu Industrial Park to enhance its advanced packaging capabilities.
- Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout — DigiTimes, 2026-09-02Chinese foundry Hua Hong Grace is expanding its production capacity by 55,000 wafers per month (wpm) as part of a $4.17 billion Phase III construction project in Wuxi.
- DayOne partners with TNB to develop up to 1.5GW of onsite generation for planned data center in Selangor, Malaysia — Data Center Dynamics, 2026-09-01DayOne has partnered with Tenaga Nasional Berhad (TNB) to develop up to 1.5GW of onsite power generation for a planned data center facility in Selangor, Malaysia.
- Green Mountain secures neocloud customer at data center in London, UK — Data Center Dynamics, 2026-09-01Green Mountain has secured a neocloud customer for its data center facility located in London, UK.
- CXMT reportedly begins risk production of HBM3E memory in breakthrough for Chinese DRAM production — company could be in mass production in 2027 — Tom's Hardware, 2026-09-01CXMT has reportedly entered risk production for HBM3E memory, a significant milestone for Chinese DRAM manufacturing with mass production targeted for 2027.
- SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap — EE Times, 2026-09-01SK Hynix is investing $4 billion into a new manufacturing project in the United States to expand its HBM production capacity and address supply gaps in the chipmaking sector.
- Micron opens Tainan plant after 6.5 months amid labor dispute — DigiTimes, 2026-09-01Micron has reopened its Tainan manufacturing facility after a six-month closure caused by labor disputes.
- South Korea CCL exports surge 42% on AI demand — DigiTimes, 2026-09-01Exports of Copper Clad Laminate (CCL) from South Korea have increased by 42% driven by surging demand for AI-related hardware components like high-layer-count PCBs.
- Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand — DigiTimes, 2026-09-01Samsung Electro-Mechanics has announced a significant supply agreement for multilayer ceramic capacitors (MLCCs) to meet the growing demand for AI server production.
- Trymax lands multi-year AOI order as InP laser capacity race tightens — DigiTimes, 2026-09-01Trymax has secured a multi-year automated optical inspection (AOI) order to increase capacity for InP lasers as demand outpaces supply.
- JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts — DigiTimes, 2026-09-01JCET has increased its 2026 capital expenditure to CNY 10 billion to meet the surging demand for AI-related semiconductor packaging.
- AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team — DigiTimes, 2026-08-31Nidec is increasing its production capacity in Vietnam and establishing a dedicated liquid cooling team to support the growing demand for AI server cooling solutions.
- AMD to Power €387.8M LUMI-AI System for European Research and Industry — HPCwire, 2026-08-31AMD will provide the computing power for the LUMI-AI supercomputer, a major European research and industry system.
- ChronoScale Plans 50 MW AI Compute Deployment with Microsoft — HPCwire, 2026-08-31ChronoScale has announced a plan to deploy a 50 MW AI compute facility in partnership with Microsoft.
- SK Hynix explores Japanese expansion to meet global AI chip demand — DigiTimes, 2026-08-31To meet high global AI demand for memory chips, SK Hynix is evaluating expansion and investment opportunities in Japan.
- China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands — DigiTimes, 2026-08-31Hangzhou Lion Microelectronics plans to invest $446 million in expanding its 12-inch silicon wafer production capacity.
Covered this week
Parts: Rack manifolds, Coolant distribution units, Chip-level thermal: lids, heat spreaders, TIMs, Chillers & compressors, UPS (static, modular, rotary/DRUPS) & UPS power semis, 2.5D/3D advanced packaging, Fab equipment, Fab materials, masks, gases, Server CPUs, Packaging & bonding equipment, Memory modules, Memory interface / buffer chips, Leading-edge foundry, Silicon wafers, Interposers, silicon bridges, RDL, ASIC design services, IP & EDA, Startup accelerators, Optical transceivers, Optical DSPs, drivers, TIAs, Silicon photonics & co-packaged optics, Merchant GPUs / accelerators, Hyperscaler custom ASICs, Substrate materials, Semiconductor test & burn-in, Power shelves & PSUs, Direct-to-chip cold plates, Energy storage: UPS batteries & BESS, Copper, DRAM, Switch systems & white-box ODMs, Quick disconnects, Hoses, tubing, fittings, valves, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, Board-level power: VRMs, power stages, PoL, power semis, Facility water loop hardware, Water treatment, reuse, consumption, Fire detection & suppression, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Hyperscalers, neoclouds & model labs, Site selection, power procurement, market intelligence, brokerage, CXL controllers & memory expanders, NAND flash, Physical security & access, Architecture, engineering & MEP design, Data center developers, operators & REITs, Critical minerals: gallium, germanium, indium, tungsten, beryllium, Chassis, rails, rack enclosures, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, HBM, Air-cooled heatsinks & vapor chambers, Fusion, Refrigerants & insulating gases, Lasers, General contractors & design-build, MEP & electrical contractors, Rack-scale systems, Structure, steel, precast, envelope, site equipment, Timing & telemetry silicon, DCIM, digital twins, capacity planning, Prefab / modular data centers & power/cooling skids, PCIe/CXL switches & retimers, Scale-up fabric, 800 V DC architecture & solid-state transformers, Fiber, connectors, structured cabling, Robotics, inspection & operations hardware, SMRs, advanced reactors, components, fuel, Utilities, IPPs & power providers signing data-center deals, Specialty glass & glass fiber, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Scale-out switch ASICs, EMS, system integration & rack-level test, DPUs, Site utilities, water & fiber entrance, Cluster management & GPU orchestration, NVLink copper spine / backplane cartridges, High-layer-count PCBs, ABF / high-layer package substrates, NICs / SuperNICs, FPGAs, Optics contract manufacturing, Test & measurement instruments, Enterprise SSDs & controllers, AI storage systems, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, DCI / coherent optics, Glass-core substrates, Industrial & specialty gases, Copper: DAC / ACC / AEC cables, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, Copper-clad laminate & PCB materials, Board-level connectors & sockets, Passives, BMC & platform firmware, Timing, security & misc board silicon, Fans, In-rack busbar & power whips, Rack PDUs, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Aluminum, Nuclear: existing fleet PPAs & restarts, Gas supply chain
Companies: Eaton, Nvidia, Hanmi Semiconductor, Legrand, Samsung Electronics, SK Hynix, Samsung SDI, Siemens, euNetworks, Nscale, Oracle, atNorth, Equinix, Micron, Kyocera (AVX), Kioxia, Intel, Foxconn (Hon Hai), MediaTek, Firmus (Sustainable Metal Cloud), Lenovo, Nebius, OpenAI, GlobalFoundries, Amazon (AWS), Morgan Stanley, SanDisk, Infineon, Vertiv, Mitsubishi Heavy Industries, Broadcom, Apple, ASE Technology (ASE/SPIL), Unimicron, Marvell, Samsung Electro-Mechanics, Telehouse, Skeleton Technologies, Anthropic, Gradiant, Fervo, Humain, Microsoft, Cerebras, Phoenix, Avtron, Lam Research, Zhen Ding, Schneider Electric, Indium, Ecolab (Nalco), Lumentum, GlobalWafers, Panasonic, Intertek, Together, Invenergy, Green Mountain, Blackstone, Lambda, Alibaba, Ajinomoto, Daikin, Doosan, Applied Optoelectronics, LG Energy Solution, Cisco, Nidec, Kingston
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.