AI data center supply chain news — week 38, 2026
293 items · 2026-09-21 to 2026-09-27 ·all news · newer: week 39, 2026 (116) · older: week 37, 2026 (366)
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- Sponsored: Speed to power: The infrastructure solutions shaping the global data center race — Data Center Dynamics, 2026-09-27Various infrastructure models, including virtual power plants and grid-enhancing technologies, are accelerating power access for data centers.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Transmission, interconnection & grid equipment, Architecture, engineering & MEP design, General contractors & design-build
- Full-Stack Semiconductor Solutions for Smart, Secure Industry and Digital Energy — EE Times, 2026-09-27NSING Technologies offers complete semiconductor solutions, including MCUs and hardware root-of-trust chips, for both industrial automation and AI data centers.
- Beyond redundancy: Why dynamic stability matters in AI data centers — Data Center Dynamics, 2026-09-27The article discusses the importance of dynamic stability for data center resilience in AI environments.
- Nvidia's push for personal AI computers points to a broader shift toward on-premise compute — DigiTimes, 2026-09-27Nvidia's focus on personal AI computing systems suggests a potential shift toward decentralized, on-premise AI processing rather than reliance on centralized data centers.
- South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix — DigiTimes, 2026-09-27Daejeon is planning a national semiconductor research hub with a $1.46 billion open fab to address gaps in South Korea's semiconductor manufacturing infrastructure.
- Sponsored: Sustainable data center backup power is a strategy, not a battery chemistry — Data Center Dynamics, 2026-09-26Data centers face the challenge of meeting high power demands while simultaneously adhering to sustainability goals.
- Russia bombs Ukrainian data centers in latest escalation — Tom's Hardware, 2026-09-26Russia has begun targeting data centers and internet infrastructure in Ukraine, disrupting critical services.
- SpaceX's AI-in-space bet is worth trillions, but space data centers won't be ready until the 2030s — DigiTimes, 2026-09-26The actual buildout of space data centers is projected to take until the 2030s, despite the current high valuation placed on 'AI in space'.
- Acer, Phison split on DRAM outlook as PC memory supply eases — DigiTimes, 2026-09-26Acer and Phison give conflicting views on the DRAM market, suggesting supply is easing for mainstream PC memory while AI and server demand remains constrained.
- Microsoft’s New Maryland Quantum Center to Support DARPA Testing — HPCwire, 2026-09-25Microsoft has opened its new quantum research center in Maryland and is expanding its commitment through research and training partnerships.
- Vocus to build 4,000km fiber link between Brisbane and Darwin — Data Center Dynamics, 2026-09-25Vocus plans to construct a 4,000km fiber link to meet increasing demand from hyperscale, neocloud, and enterprise customers.
- DensityAI: Chip startup founded by former Tesla Dojo execs valued at $10bn – report — Data Center Dynamics, 2026-09-25A report highlights a new chip startup, founded by former Tesla Dojo executives, that aims to develop chips utilizing 3D DRAM stacking.
- Sponsored: How to scale data centers cheaper, faster, and at a higher quality — Data Center Dynamics, 2026-09-25The industry is urged to transition the construction of data centers from manual labor to factory-based manufacturing processes.
- Noctua explores 2,000W micro-channel air cooling — Tom's Hardware, 2026-09-25Noctua and Forced Physics are investigating if densely packed micro-channels can achieve high cooling performance without excessive noise from high-pressure airflow.
- Second federal judge overturns $7B Solar for All cancellation by Trump administration — Utility Dive, 2026-09-25A federal judge overturned the cancellation of the $7B Solar for All initiative previously enacted by the Trump administration.
- DOE Announces Winning Teams in Quantum Grid Planning Competition — HPCwire, 2026-09-25The DOE announced winning teams for a competition that explored using quantum and hybrid computing to guide the deployment of energy storage.
- Keppel, StarHub confirm talks over M1 deal in Singapore — Data Center Dynamics, 2026-09-25Keppel and StarHub have initiated discussions regarding a potential M&A deal in Singapore.
- Intel expects 14A to be 'within 5%' the performance of TSMC's A14 — Tom's Hardware, 2026-09-25Intel claims that its 14A process node will achieve performance within 5% of TSMC's A14 technology.
- Project Suncatcher: Google to launch first space data center test in orbit next week — Data Center Dynamics, 2026-09-25Google plans to launch a space data center test using TPUs.
- Nvidia DLSS 5 power draw hits 647W as power connector runs hotter than the GPU die, upscales frame rates and flame temps on 16-pin — Tom's Hardware, 2026-09-25Testing revealed that the 16-pin power connector on the RTX 5090 reaches temperatures exceeding 90 degrees Celsius when the GPU draws near 650W.
- Comparative HPC Performance Analysis of Scientific Workloads on 5th Gen Intel® Xeon® Scalable Processors and Intel® Xeon® 6 Processors on Lenovo ThinkSystem™ Servers — HPCwire, 2026-09-25This comparative study evaluates the high-performance computing capabilities of Intel's 5th and 6th Gen Xeon processors using Lenovo ThinkSystem servers.
- Singapore deepens chip R&D ties with Applied Materials, KLA and GlobalFoundries — DigiTimes, 2026-09-25Singapore is expanding its semiconductor R&D ecosystem, focusing on advanced packaging and silicon photonics with partners like Applied Materials, KLA, and GlobalFoundries.
- Singapore brands its chip sector as it tries to move up from manufacturing — DigiTimes, 2026-09-25Singapore is strengthening its semiconductor industry by increasing R&D collaboration with companies like Applied Materials, KLA, and GlobalFoundries, focusing on advanced packaging and silicon photonics.
- UK wants more homes heated by waste heat from datacenters — The Register, 2026-09-25The UK plans to finance building and improving heat networks, integrating waste heat from data centers, including hot water transported under the Thames.
- Solid oxide fuel cells enabling growth in a power-constrained world — Data Center Dynamics, 2026-09-25Solid oxide fuel cells are being presented as a scalable option for reliable, on-site power generation amidst increasing grid constraints hindering data center expansion.
- From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors — DigiTimes, 2026-09-25India's new semiconductor incentive regime is generating early interest from manufacturers, suggesting that the reduced subsidy levels are not deterring investment in new projects.
- Can we power it? Yes we GaN — Data Center Dynamics, 2026-09-24The article discusses the potential application of gallium nitride (GaN) in addressing data center power needs.
- EuroHPC Builds HPC and AI Ties with Latin America and the Caribbean — HPCwire, 2026-09-24EuroHPC launched the EU-LAC Supercomputing Network for AI to enhance HPC and AI cooperation between Latin America, the Caribbean, and the European Union.
- Exelon’s climate arm backs grid-planning firm Continuum — Utility Dive, 2026-09-24Exelon's climate arm is interested in technologies that help utilities improve their building infrastructure efficiency.
- Southern Water deploys Lightsonic water-leak technology using Openreach's fiber infrastructure — Data Center Dynamics, 2026-09-24Southern Water is utilizing Openreach's fiber infrastructure to implement Lightsonic leak detection technology for water monitoring.
- Oracle issues force majeure notice to Blue Owl following series of setbacks at Project Jupiter data center campus – report — Data Center Dynamics, 2026-09-24Oracle reported a force majeure notice to Blue Owl due to setbacks at the 2.5GW Project Jupiter data center campus in New Mexico, expected to come online in 2028.
- Sponsored: Powering the AI data center era: Why UPS battery technology needs to evolve — Data Center Dynamics, 2026-09-24AI infrastructure demands an evolution in UPS battery technology and backup power planning.
- Tower Semiconductor to establish large-scale optical chip hub as part of $4bn Japanese investment pledge — Data Center Dynamics, 2026-09-24Tower Semiconductor plans to establish a large-scale hub for optical chips as part of a major Japanese investment.
- Ask HPE and NVIDIA the AI data question you cannot ask in public — The Register, 2026-09-24HPE and NVIDIA discussed data sovereignty concerns regarding AI in a private roundtable discussion.
- Inside TSMC’s Evolving Design Ecosystem: Shaping the Future of AI, with AI — EE Times, 2026-09-24TSMC discussed its Open Innovation Platform to enable AI-driven agentic workflows through the TSMC AI Design Kit.
- After IonQ Buyout, SkyWater Reiterates Role as Quantum Foundry — EE Times, 2026-09-24SkyWater reaffirmed its position as a quantum foundry, emphasizing IP protection as it scales its 200-mm and 300-mm manufacturing platforms for various quantum modalities.
- LightSolver and HLRS Explore Photonic Acceleration for HPC Simulation Workloads — HPCwire, 2026-09-24LightSolver and HLRS published joint research detailing the use of photonic computing acceleration for high-performance computing simulation workloads.
- QuEra partners with HPE to integrate quantum computer within Cray-powered HPC environments — Data Center Dynamics, 2026-09-24QuEra is collaborating with HPE to integrate quantum computing capabilities into high-performance computing environments previously powered by Cray.
- Affordability concerns drive momentum for performance-based ratemaking — Utility Dive, 2026-09-24Michigan is considering utility rate case reforms, which affects how utilities manage power generation and transmission.
- Leading semiconductor analyst says AMD should be investigated for 'treason' over availability of restricted chips in China — Tom's Hardware, 2026-09-24A semiconductor analysis firm questioned AMD's handling of restricted chips for the Chinese market, which AMD characterized as a potential diversion issue.
- Woodway to build 22-mile gas pipeline for undisclosed data center in US — Data Center Dynamics, 2026-09-24Woodway plans to construct a 22-mile gas pipeline to service an undisclosed data center in the US.
- Microsoft to invest $10bn into Gulf states by 2030 — Data Center Dynamics, 2026-09-24Microsoft announced plans to invest $10 billion in several Gulf states by 2030.
- Micron discontinues 2GB GDDR7 chips for gaming GPUs as it pivots toward higher-density memory for AI — Tom's Hardware, 2026-09-24Micron is shifting its focus from producing 2GB GDDR7 chips for gaming to higher-density versions used in AI and professional GPUs.
- Digital Realty hires new global head of energy — Data Center Dynamics, 2026-09-24Digital Realty hired Jim Collins, a former Microsoft employee, as its new global head of energy.
- Microsoft to invest US$10B in Middle East AI infrastructure, despite war risks — DigiTimes, 2026-09-24Microsoft plans to commit US$10 billion to expanding AI infrastructure in the Middle East by 2030, continuing development despite regional risks.
- The hidden cost of commodity thinking — Data Center Dynamics, 2026-09-24The article discusses the importance of selecting the appropriate Programmable Ground-Plane (PG25) component for data center cooling systems.
- SEMICON India 2026: Startup Mitra Sheds Light on Early-Stage Silicon Startup Funding — EE Times, 2026-09-24Indian semiconductor startups require funding to move their silicon designs from early prototypes toward volume manufacturing.
- 800 VDC architecture for AI infrastructure — Data Center Dynamics, 2026-09-24The transition to 800 VDC power architectures is beneficial for improving AI data center efficiency, energy storage, and power distribution.
- LG sharpens focus on data centers, robotics, chip materials — DigiTimes, 2026-09-24LG Group is expanding its focus across data center technologies, robotics, and semiconductor materials, reflecting its corporate capital allocation strategy.
- China AI's new moat: low-cost models meet a rapidly localising hardware stack — DigiTimes, 2026-09-24China's AI market is shifting from policy-driven catch-up to full-stack, system-level localization and commercial ecosystem competition.
- Sponsored: As data center power evolves, so do the logistics behind it — Data Center Dynamics, 2026-09-24The increasing diversity of data center power generation technologies is complicating the logistics and deployment process for related equipment.
- Peking University Dean's rare Intel China appearance hails AI-plus edge adoption — DigiTimes, 2026-09-24Intel used an event featuring Peking University Dean Justin Lin to promote AI applications, including edge AI and physical AI, within China.
- United Renewable Energy eyes US plant, space-based solar power in revenue push — DigiTimes, 2026-09-24United Renewable Energy is awaiting a final location for a US solar module plant joint venture with Sino-American Silicon Products, but anticipates production starting in Q3 2027, which will boost their solar power business revenue.
- South Korea chip, panel lines stay on as AI, iPhone demand surges — DigiTimes, 2026-09-24Due to surging demand from AI and Apple's iPhone, major South Korean semiconductor, display, and electronics parts manufacturers are maintaining continuous production at their facilities.
- Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push — DigiTimes, 2026-09-24Qualcomm confirms its reliance on TSMC for its 2nm Snapdragon flagships, despite increased competitive pressure from Samsung's advanced node development.
- Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game — DigiTimes, 2026-09-24Apple is reportedly developing an enterprise AI server using its planned M8 Ultra chip and integrating Nvidia's NVLink Fusion interconnect technology.
- Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding — DigiTimes, 2026-09-24Samsung reportedly plans to use a hybrid-bonding architecture for its sub-10nm DRAM generation, while reserving its vertical-channel-transistor design for a specialized variant.
- Intel puts CPU-GPU coordination at center of agentic AI strategy — DigiTimes, 2026-09-24Intel plans to leverage closer coordination between CPUs, GPUs, and other computing resources to support the evolving demands of agentic AI workloads.
- OUCC sees semiconductor chemical shipments ramping up in 2027 — DigiTimes, 2026-09-24Oriental Union Chemical Corporation forecasts that semiconductor chemical shipments will increase in 2027 as more products finish customer qualification, targeting electronic chemicals for 10% of its 2028 revenue.
- ASRock Industrial's game-streaming win signals longer revenue tail, but supply risks remain — DigiTimes, 2026-09-24ASRock Industrial secured a long-term North American game-streaming services project, suggesting revenue stability despite ongoing component shortages and pricing concerns.
- Australia’s data center guidelines lay the platform for new good grid citizens — Data Center Dynamics, 2026-09-24The article discusses how data centers can integrate with local energy systems to become better grid citizens and contribute to community energy stability.
- Alibaba Unveils Roadmap on Full-Stack AI Strategy from Chips, Cloud Infrastructure, Models to Agents — HPCwire, 2026-09-23Alibaba announced a comprehensive roadmap for its full-stack AI strategy, covering innovations from chips and cloud infrastructure to models and agents.
- Crusoe and Thinking Machines Lab Partner to Power Open-Model Inference at Scale — HPCwire, 2026-09-23Crusoe and Thinking Machines Lab entered into a $65 million annual agreement to run inference for the lab's open models on Crusoe Cloud.
- The renewable energy deal that looks cheap on paper can leave data centers most exposed — Data Center Dynamics, 2026-09-23An analysis was published suggesting that aligning data centers with a clean power portfolio provides robust protection against future price volatility.
- Microgrid panel highlights push to move beyond pilots and into everyday grid operations — Utility Dive, 2026-09-23EPRI encourages utilities to fully utilize microgrid resources for continuous power delivery, not just for emergency situations.
- Microgrids must push beyond pilots, into everyday grid operations: panel — Utility Dive, 2026-09-23The speaker urges utilities to utilize microgrids for routine power operations, not just emergencies.
- AMD begins to add GDDR7 support to its Linux GPU drivers — Tom's Hardware, 2026-09-23AMD updated its Linux GPU drivers to support GDDR7 memory, potentially indicating development progress for its RDNA 5 GPUs.
- Meta's new transoceanic undersea cable boasts a whopping petabit of bandwidth — Tom's Hardware, 2026-09-23Meta announced Petal, a new subsea cable providing a petabit of raw bandwidth between the USA and France.
- SEMICON India 2026: India Starts Packaging Chips as Ecosystem Takes Shape — EE Times, 2026-09-23India is expanding its semiconductor ecosystem, with five chip packaging plants beginning production through the $13.5 billion ISM 2.0 initiative.
- Are In-Line Amplifiers ready for the age of AI? — Data Center Dynamics, 2026-09-23The article questions whether traditional In-Line Amplifiers (ILA) fiber huts are sufficient for the demands of the new AI era.
- Zeo Energy and Ewyze partner on off-grid power solutions for US data center sector — Data Center Dynamics, 2026-09-23Zeo Energy and Ewyze are partnering to provide off-grid power solutions for data centers in the US, with an eye toward international expansion.
- LG Electronics, Microsoft enter partnership on AI data centers, physical AI — DigiTimes, 2026-09-23LG Electronics and Microsoft formed a partnership to collaborate on AI data centers, AI data transformation, and physical AI initiatives.
- LG Energy enters Nvidia's ecosystem as it pivots batteries to data centers — DigiTimes, 2026-09-23LG Energy is redirecting its North American battery capacity to data centers, making its battery energy storage system available within Nvidia's AI Factory ecosystem.
- Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment — DigiTimes, 2026-09-23Nvidia's shift to 800V HVDC power is increasing data center power density and driving demand for upgraded power equipment like MLCCs, sidecar power cabinets, and BBU units.
- Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset — DigiTimes, 2026-09-23Nexperia China is boosting its domestic 12-inch wafer production to establish a localized semiconductor supply chain covering design, wafer manufacturing, packaging, and testing.
- Episil says AI demand marks structural shift in semiconductor epitaxy — DigiTimes, 2026-09-23Episil Precision noted that AI demand is structurally changing semiconductor epitaxy, requiring expansion into materials like silicon, GaN, SiC, and GeSi for various components.
- SK hynix's venture arm moves beyond memory into optical interconnect and system software — DigiTimes, 2026-09-23SK hynix expanded its venture arm's investment focus beyond memory to include AI computing, data centers, system software, and optical interconnect technologies.
- India's Dixon looks beyond smartphones to crack global EMS top 10 — DigiTimes, 2026-09-23Dixon Technologies plans to expand its services beyond smartphones into general components and IT hardware to establish itself among the top global EMS companies.
- Malaysia reviews data centre benefits after 40-plus 2026 applications — DigiTimes, 2026-09-23Malaysia is seeing a continuous boom in data center investment, with over 40 applications submitted in 2026, although officials stressed the importance of environmental value and local benefit over mere volume.
- Taiwan courts Indian IIT chief in bid to boost chip talent ties — DigiTimes, 2026-09-23Taiwan is increasing its cooperation with India's engineering education sector to address intensified global competition for talent in the chip and AI industries.
- ASRock's center of gravity moves from motherboards to AI servers — DigiTimes, 2026-09-23ASRock is strategically shifting its focus from motherboards towards AI servers and edge computing solutions.
- Micron's Taiwan fab took 300,000 cubic meters of concrete. Its supplier sees more coming — DigiTimes, 2026-09-23Increased data center and AI construction demand in Taiwan is benefiting concrete suppliers and is expected to continue due to regional government development plans.
- Taiwan uses AI to close drone thermal imaging gap — DigiTimes, 2026-09-23Taiwan is developing AI algorithms to process low-resolution thermal images from drones, potentially reducing the cost of thermal imaging modules by 50%.
- Taiwan finds way to turn waste LCD glass and road debris into high-value materials — DigiTimes, 2026-09-23Taiwan's ITRI is developing high-value upcycling processes for industrial waste like LCD glass and asphalt, targeting their reintegration into high-value supply chains.
- SiPearl Reanimates European CPU Development — HPCwire, 2026-09-22Philippe Notton, formerly of STMicroelectronics, founded SiPearl to revive European CPU development, initially through the European Processor Initiative (EPI).
- Lower energy costs, community benefits drive 30% battery growth rate: RMI — Utility Dive, 2026-09-22The energy storage industry is experiencing potential headwinds from tariffs, Treasury regulations, and new White House restrictions on foreign-made bulk electrical components.
- Plans progress for 200MW data center in Schladen-Werla, Germany — Data Center Dynamics, 2026-09-22A 200MW data center project is advancing in Schladen-Werla, Germany.
- PEAK:AIO and LANL to Discuss pNFS Lattice at SNIA Developer Conference 2026 — HPCwire, 2026-09-22PEAK:AIO and LANL plan to discuss the open-source pNFS Lattice metadata architecture for AI and HPC storage at the SNIA Developer Conference 2026.
- New Era signs 20-year gas PPA with Vistra subsidiary to power 250MW data center in Ector County, Texas — Data Center Dynamics, 2026-09-22New Era signed a 20-year gas PPA with Vistra to power a 250MW data center in Texas using an adjacent natural gas plant.
- Lithography firm Morphotonics targets data center optical component market after raising €40m — Data Center Dynamics, 2026-09-22Morphotonics, a lithography firm, plans to enter the data center optical component market.
- This $299 2TB MSI SSD is one of the least expensive PCIe 4.0 SSDs you can buy right now — Tom's Hardware, 2026-09-22The MSI Spatium M461 SSD is available for a promotional price, making it one of the more affordable Gen 4x4 SSDs currently on the market.
- Microsoft hires new director of global energy and sustainability policy — Data Center Dynamics, 2026-09-22Microsoft hired Ray Fakhoury III, previously with AWS, to direct global energy and sustainability policy.
- Anthropic, OpenAI expected to start buying memory directly in 2027 — DigiTimes, 2026-09-22Anthropic and OpenAI are anticipated to begin purchasing memory directly from manufacturers starting in 2027, signaling greater control over their chip and data center design.
- Changs Ascending eyes AI data center backup power, storage growth — DigiTimes, 2026-09-22Changs Ascending plans to expand its energy systems integration into the AI data center market, focusing on stable power, backup power, and energy storage solutions.
- China prepares business delegation as Xi seeks steadier US trade ties — DigiTimes, 2026-09-22China is arranging a business delegation for President Xi Jinping's visit to the US to secure more predictable trade ties for companies facing US market-access hurdles.
- How AI Is Accelerating PCB Design and Prototyping — EE Times, 2026-09-22AI tools are shortening PCB design and prototyping time from months to hours, speeding up the innovation process for engineers.
- Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach — DigiTimes, 2026-09-22Hermes Testing Solutions expanded its reach following its OTC debut, positioning itself to benefit from increased demand from AI and high-performance computing by providing services in wafer testing, advanced packaging, and Silicon photonics.
- DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip — DigiTimes, 2026-09-22DeepSeek plans to utilize Huawei chips for future model training, with the first batch expected to arrive in Q4 2026.
- Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032 — DigiTimes, 2026-09-22Alibaba plans a massive expansion of its AI infrastructure, targeting 20 GW of capacity by 2032 through its full-stack cloud services.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix presented its vision for the AI era at a global forum, detailing future strategies for its memory and storage components.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix held a global forum to outline its technology vision and strategy for the evolving AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum detailing its technological vision and strategy for the AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum to share its technology vision and future strategy for the AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum to share its technology vision and strategy for the AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum to discuss its technology vision and future strategies relevant to the AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum detailing its technology roadmap and strategy for the AI era.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix presented its technology roadmap for the AI era, focusing on advanced memory solutions and integrated memory/logic architectures.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix held a forum to share its technology roadmap and strategy for the evolving AI computing landscape.
- SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI Era — newsroom:sk-hynix, 2026-09-22SK hynix hosted a global forum to outline its technology vision and strategy for the AI era, particularly concerning memory and advanced storage solutions.
- ASML opens India operations but ties any scale-up to Tata's Dholera fab — DigiTimes, 2026-09-22ASML started operations in India, confirming that its future expansion is dependent on the successful establishment of the 12-inch wafer fab by Tata Electronics.
- China puts AI computing into orbit with first integrated satellite launch — DigiTimes, 2026-09-22China launched a commercial rocket carrying nine satellites, including its first integrated AI computing project in space.
- Nscale seeks New York listing as AI infrastructure demand tests investor appetite — DigiTimes, 2026-09-22Neocloud provider Nscale filed for a New York listing to raise up to $3 billion, testing investor appetite for AI infrastructure and data centers.
- AI inference demand surges as training slowdown talk fades — DigiTimes, 2026-09-21Industry executives stressed that the current data center buildout is primarily driven by AI inference needs rather than further model training capabilities.
- Loyalty Founder Enterprise sees AI server expansion lifting growth outlook — DigiTimes, 2026-09-21Loyalty Founder Enterprise is leveraging the strong demand for AI infrastructure to boost its growth and profitability by expanding its offerings in AI servers, storage, and networking.
- DKRZ Joins New Horizon Europe Project CLAIMA — HPCwire, 2026-09-21The CLAIMA project, a four-year Horizon Europe initiative, will use AI-based climate models for European High-Performance Computing and AI infrastructure.
- EuroHPC Access Resource Committee Bureau Holds 1st Meeting — HPCwire, 2026-09-21The Access Resource Committee Bureau of the EuroHPC Joint Undertaking held its first meeting to begin implementing the EuroHPC Access Policy.
- AI Power Demands Push GaN into Data Center Design — EE Times, 2026-09-21Increased AI power requirements are driving the adoption of GaN technology for more efficient and dense power conversion within data centers.
- Valorem eyes data centers in Savonlinna and Kankaanpää, Finland — Data Center Dynamics, 2026-09-21French energy firm Valorem is expanding its data center pipeline in Finland by looking at projects in Savonlinna and Kankaanpää.
- iPronics and BSC Partner to Advance Optical Networking for AI and HPC — HPCwire, 2026-09-21iPronics formed a two-year partnership with BSC-CNS to advance programmable optical networking for AI and HPC using silicon photonics.
- China crafts working 3nm gate-all-around transistors without EUV — Tom's Hardware, 2026-09-21China's IMECAS successfully demonstrated building gate-all-around transistors at 3nm using methods that reportedly bypass the need for EUV tools, though this capability is still years away from practical commercial deployment.
- OpenAI projections point to a massive $278 billion cash burn through 2030 that exceeds the national budgets of Indonesia and Norway — $856 billion compute tab outpaces tenfold revenue surge — Tom's Hardware, 2026-09-21OpenAI anticipates spending $278 billion on compute and related infrastructure from 2026 to 2030, surpassing the budgets of several nations.
- China’s DRAM Specialist CXMT Eyes NAND Flash Entry — EE Times, 2026-09-21Chinese memory companies CXMT and YMTC are planning to enter each other's markets to capitalize on shortages in storage for AI.
- Cloudflare saves 100 TB of RAM again, this time by slashing server hashes by 90% — Tom's Hardware, 2026-09-21Cloudflare has achieved a 100 TB RAM saving by optimizing its hash-mapping algorithm.
- GlobalFoundries and Marvell sign multi-year development agreement for optical technologies — Data Center Dynamics, 2026-09-21GlobalFoundries and Marvell have entered into a multi-year agreement to expand silicon germanium capacity at the GlobalFoundries facility in Burlington, Vermont.
- Google-backed battery storage pilot in Texas demonstrates how BESS can improve hourly carbon-free matching for data centers — Data Center Dynamics, 2026-09-21A battery energy storage system (BESS) pilot in Texas was successful in improving the carbon-free energy matching for data centers.
- Prysmian, Rio Tinto to supply Amazon data center in Ohio with low-carbon aluminum — Data Center Dynamics, 2026-09-21Prysmian and Rio Tinto will supply low-carbon aluminum cabling for Amazon's data center in Ohio.
- Kaohsiung's new industrial park targets advanced packaging suppliers for the post-Moore era — DigiTimes, 2026-09-21An industrial park in Kaohsiung, Taiwan, was inaugurated to support over 20 semiconductor supply-chain companies and strengthen the region's semiconductor corridor, focusing on advanced packaging.
- Blaze Equipment expands east with new Baltimore location and launches online ordering nationwide — Utility Dive, 2026-09-21Blaze Equipment expanded its footprint eastward into Baltimore and launched national online ordering services for equipment and support.
- Samsung builds fab robot team, targets chip equipment maintenance — DigiTimes, 2026-09-21Samsung is creating a dedicated internal robot team to implement automation, starting with preventive maintenance in its semiconductor manufacturing facilities.
- Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant — DigiTimes, 2026-09-21Leading Interconnect Semiconductor plans to establish a major advanced packaging substrate plant in Shenzhen, investing over CNY12 billion to expand its high-end FCBGA capabilities for AI and HPC.
- Rebellions chips process over 4 billion tokens a day for SK Telecom — DigiTimes, 2026-09-21AI chipmaker Rebellions expanded its NPU infrastructure for SK Telecom services, now handling over four billion tokens daily.
- Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain — DigiTimes, 2026-09-21The move of AI into edge devices increases the demand for FD-SOI, and China is establishing a domestic supply chain covering substrates, foundry capabilities, and chip design.
- Apple, Xiaomi, Qualcomm each eye edge AI ecosystem gains — DigiTimes, 2026-09-21Multiple companies, including Apple, are planning edge AI server ecosystems potentially utilizing unreleased processors like the M8 Ultra and features like NVLink for AI inference workloads.
- Tesla AI server order puts Pegatron back alongside Asus, 18 years after split — DigiTimes, 2026-09-21Asus and Pegatron are collaborating on AI server designs, aiming to compete with established players like Quanta, Wistron, Foxconn, and Gigabyte.
- Musk's Memphis move puts xAI at the center of his empire — DigiTimes, 2026-09-21Elon Musk is taking a highly visible, hands-on role in the construction of xAI's Memphis data center, emphasizing the importance of this location to his overall technological infrastructure strategy.
- Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands — DigiTimes, 2026-09-21AI infrastructure demands are reshaping global hardware design, forcing focus on power, cooling, and high-speed interconnect solutions.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Wiwynn
- Intel reportedly in talks with AUO on advanced packaging — DigiTimes, 2026-09-21Intel is reportedly negotiating with AUO to use Micro LED substrate-based advanced packaging for both co-packaged optics and high-density computing.
supply constraint
- Meta Muse fuels agentic AI demand, tightening CPU supply — DigiTimes, 2026-09-27Increased demand for AI infrastructure, driven by Meta's AI assistant Muse and the trend toward agentic AI, is tightening the supply of server CPUs from AMD and Intel.
- Beijing escalates domestic chip drive with Broadcom audits — DigiTimes, 2026-09-27China is increasing its domestic push to replace foreign technology in critical computing infrastructure, focusing on high-speed networking hardware and AI accelerators.
- DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders — DigiTimes, 2026-09-26China's top memory suppliers are seeking capital and increasing output to meet growing chip demand, aiming to strengthen the domestic supply chain.
- Uncle Sam coughs up $1.9B for grid upgrades as datacenters hit a power wall — The Register, 2026-09-25The U.S. government funding for grid upgrades is expected to enable at least 23 gigawatts of additional power capacity for data centers.
- Raspberry Pi surfs memory crunch to record first half — The Register, 2026-09-25A stable supply of RAM helped keep Raspberry Pi boards shipping despite general memory shortages.
- Trump-Xi summit leaves rare-earth issue unresolved amid yttrium supply squeeze — DigiTimes, 2026-09-25The Trump-Xi summit failed to resolve the supply issue of rare-earth metals like yttrium, which is critical for semiconductor manufacturing equipment.
- CPC, Taipower pay premiums to secure energy supplies, face financial strain — DigiTimes, 2026-09-25Taiwanese power providers (CPC and Taipower) are absorbing high energy costs and facing financial strain to stabilize domestic prices due to geopolitical tensions and falling shipping volumes.
- Leading semiconductor analyst says AMD should be investigated for 'treason' over availability of restricted chips in China, AMD blames diversion of export-controlled RFSoC — Tom's Hardware, 2026-09-24An analyst firm accused AMD of potential export control violations in China regarding restricted chips, which AMD attributed to the diversion of export-controlled RFSoC technology.
- ASML says it sold 'absolutely nothing' in Europe in 2026 — Tom's Hardware, 2026-09-24ASML stated that European demand for its semiconductor equipment was nonexistent in 2026, prompting it to request help from EU authorities to stimulate the local market.
- CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM — DigiTimes, 2026-09-24As Samsung and SK Hynix redirect production to HBM, China's CXMT is positioned to grow its presence in the conventional DRAM market.
- TSMC locks in 3-6% wafer out price hikes for 2027 — DigiTimes, 2026-09-24TSMC plans to raise wafer foundry prices by 3-6% starting in 2027 due to persistent tight capacity and robust AI demand.
- GMI AI compute leasing business sells out in US as big users lock in long contracts — DigiTimes, 2026-09-24AI computing demand is leading to limited supply of computing capacity, with major US users signing long-term contracts through distributors like GMI Technology.
- US energy storage faces a costly China battery exit — DigiTimes, 2026-09-23The US is accelerating its shift to domestic battery manufacturing despite continued heavy dependence on low-cost Chinese cells for market growth.
- China rare earth giant builds moat Western rivals struggle to cross — DigiTimes, 2026-09-23China is using rare earths as a strategic trade commodity in its discussions with the US, potentially expanding export controls.
- Samsung weighs 4nm expansion as HBM4 demand strains capacity — DigiTimes, 2026-09-22Due to strong demand for HBM4, Samsung is evaluating an expansion of its 4nm foundry capacity and considering a future 2nm production line for HBM5 base dies.
- Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries — DigiTimes, 2026-09-22Due to high demand for silicon carbide (SiC) driven by electric vehicles and AI, capacity in Chinese foundries is becoming constrained, directing excess business to Taiwan's foundries.
- China's memory race turns inward — CXMT, YMTC head toward patent showdown — DigiTimes, 2026-09-22Global demand for DRAM and NAND flash remains high due to AI and cloud applications, leading to sharp price increases and prompting China's leading memory manufacturers, CXMT and YMTC, to challenge their established market divisions.
- EZconn eyes 2027 high-core fiber ramp as shortages persist — DigiTimes, 2026-09-21EZconn stated that ongoing AI demand is causing shortages in global fiber and optical cable supplies, which are expected to ease in 2027 as upstream suppliers increase capacity.
- Local opposition blocked $68 billion worth of data center projects in the second quarter of 2026 — Tom's Hardware, 2026-09-21Local opposition has blocked $68 billion worth of data center projects in Q2 2026, despite continued investment increases.
- Huawei shelves global AI chip rollout as China's own demand outstrips supply — 15,488-chip Atlas clusters leverage optical networking to counter Nvidia, scales to 120 EFLOPS — Tom's Hardware, 2026-09-21Huawei halted its global rollout of AI chips, keeping them for China due to intense domestic demand and leveraging optical networking to compete with Nvidia.
- Huawei shelves global AI chip rollout as China's own demand outstrips supply — Tom's Hardware, 2026-09-21Huawei will restrict the global rollout of its latest AI chips to China because its domestic demand exceeds current supply capacity.
- AI, Crypto Mining Expose Global Compute Infrastructure Constraints — EE Times, 2026-09-21Global semiconductor bottlenecks, foundry lead times, and trade friction are creating supply constraints for compute infrastructure needed for AI and crypto.
- ByteDance's China AI chip push hits substrate shortage — DigiTimes, 2026-09-21Demand for advanced packaging substrates is intensifying due to AI model expansion in China, causing a severe compute supply bottleneck for companies like ByteDance and Huawei.
- Acer founder says slowing AI development will be hard, amid call for AI slowdown — DigiTimes, 2026-09-21Acer's founder warned that current AI development is outpacing available semiconductor capacity, citing the ongoing need for sufficient supply.
- DB HiTek gains pricing power as 8-inch supply tightens — DigiTimes, 2026-09-21DB HiTek is expected to benefit from stronger demand and tighter supply of 8-inch foundry materials, improving its pricing power.
- Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV — DigiTimes, 2026-09-21The AI boom is causing bottlenecks and intense competition in the semiconductor and AI supply chains, covering everything from ASIC demand and packaging to equipment shortages and materials limitations.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, 2.5D/3D advanced packaging, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Memory modules, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, Critical minerals: gallium, germanium, indium, tungsten, beryllium, SanDisk
earnings
- Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles — DigiTimes, 2026-09-26Samsung's foundry business is improving due to higher utilization and pricing, but future profitability hinges on the performance of its 2nm technology and the ramp-up of the Taylor fab.
- ASRock Industrial revenue jumps 95% in 1H26 on North America deal — DigiTimes, 2026-09-24ASRock Industrial reported a significant revenue increase in the first half of 2026, driven by a major North American contract and expansion into edge computing applications.
- AI drives Episil GeSi, PMIC growth — DigiTimes, 2026-09-24Increased demand from AI data centers is expected to significantly boost the market for silicon photonics germanium silicon (GeSi) epitaxy.
- Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise — DigiTimes, 2026-09-24Eternal Materials reported strong unaudited earnings in August 2026, seeing significant increases in both period and cumulative earnings compared to the previous year.
- Powertech targets quarterly growth in 2026, eyes record high — DigiTimes, 2026-09-24Powertech expects record revenue in 2026, driven by increased demand for memory packaging, higher ASPs, and advanced DDR5 production, while its FOPLP line for AMD will contribute revenue starting in 2027.
- Memory chips are now more expensive than compute chips on a per-area basis — Tom's Hardware, 2026-09-22DRAM manufacturers may command higher pricing per area than TSMC for its N3 chips.
product launch
- Huawei and Alibaba Tout Progress in AI Chip, Clusters, and Models — HPCwire, 2026-09-25Huawei showcased new products and offerings, including AI chips and clusters, while Alibaba announced new chips, servers, and AI models to advance AI scale.
- Huawei and Alibaba Tout Progress in AI Chips, Clusters, and Models — HPCwire, 2026-09-25Huawei and Alibaba announced progress in AI chips, clusters, and models, showcasing new products and capabilities during events like Huawei Connect 2026.
- ACCESS Supports Fivefold Speedup in GPU-Based Hurricane Simulations — HPCwire, 2026-09-25ACCESS demonstrated that GPUs significantly accelerate the complex fluid dynamics calculations needed to predict hurricanes, which is crucial for saving lives.
- AMD Takes the Lid off of Next-Gen EPYC 9006 Venice As Zen 6 Comes to Servers — ServeTheHome, 2026-09-25AMD is announcing the upcoming release of its next generation EPYC 9006 processors, based on the Zen 6 architecture.
- Meta Muse runs agents on AMD EPYC Turin hosts with two cores and 8GB of memory — Tom's Hardware, 2026-09-25Meta plans to power its Muse AI agents using AMD EPYC Turin hosts, which dedicate two vCPUs and 8GB of memory per user sandbox.
- Huawei’s Tau Law Takes Commercial Form — EE Times, 2026-09-25Kirin 9050 Pro utilizes the Tau scaling law, representing a new chip architecture designed to overcome the limitations of EUV lithography.
- NVIDIA Launches DSX Ready to Qualify Power and Cooling Products for AI Factories — HPCwire, 2026-09-25NVIDIA launched a qualification program, DSX, to help builders identify power and cooling products, such as battery storage and CDUs, that meet requirements for AI factories.
- Google's orbital AI data center test packs four TPUs and 1,000W of solar power — Tom's Hardware, 2026-09-25Google is testing an experimental satellite in orbit that includes four TPUs and solar power.
- ASRock Rack SORANOD8-2L2T Review A New AMD EPYC 8005 Sorano Motherboard — ServeTheHome, 2026-09-24ASRock Rack launched a new motherboard, the SORANOD8-2L2T, designed for the AMD EPYC 8005 Sorano series processor.
- Delos Data Targets Heterogeneous AI with Data Interface — EE Times, 2026-09-24Delos introduced the Apollo chiplet, designed to create a low-latency interface spanning GPUs, accelerators, CPUs, and memory.
- EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform for Physical AI — HPCwire, 2026-09-24EdgeCortix announced RAIDEN, a new energy-efficient AI chiplet platform designed to power physical AI applications outside of centralized data centers.
- SiPearl delivers first samples of Rhea1 CPU to Bull for Jupiter exascale supercomputer — Data Center Dynamics, 2026-09-24SiPearl has delivered initial samples of its Rhea1 processor to Bull for use in the Jupiter exascale supercomputer.
- Sponsored: Huawei unveils new UnifiedBus computing architecture for SuperPoDs and clusters — Data Center Dynamics, 2026-09-24Huawei launched the UnifiedBus architecture to interconnect clusters and SuperPoDs, addressing increasing demand for computing power.
- Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production — DigiTimes, 2026-09-24Cadence and Synopsys certified design flows for TSMC's A14 process node, preparing the foundry for volume production scheduled for 2028.
- Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap — DigiTimes, 2026-09-24Alibaba announced its proprietary Zhenwu V900 AI chip, designed to supplement the high-end accelerators previously restricted by Nvidia.
- Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks — DigiTimes, 2026-09-24Supermicro started shipping the Nvidia Vera Rubin NVL72 AI racks, deploying a full-scale computing platform that integrates computing and liquid cooling.
- LSTC links with Rapidus to revive Japan's advanced chipmaking — DigiTimes, 2026-09-24LSTC is partnering with Rapidus to establish a framework for mass-producing 2nm chips in 2027, aiming to boost Japan's position in advanced semiconductor technology.
- New SDK Paves the Way for Photonic Computing’s Future, Q.ANT Says — HPCwire, 2026-09-23Q.ANT GmbH released a new software development kit (SDK) and APIs allowing programmers to create software for photonic computers using Python and C/C++.
- WhiteFiber Launches WhiteFiber Continuum Distributed GPU Supercluster Architecture — HPCwire, 2026-09-23WhiteFiber announced the commercial availability of WhiteFiber Continuum, a cross-data-center networking solution designed to eliminate bandwidth limitations for distributed GPU superclusters.
- Q.ANT Launches World 1st Open-Source SDK for Photonic Computing — HPCwire, 2026-09-23Q.ANT released an open-source SDK to allow developers to create and test applications for its photonic computing processor.
- Europe's fastest supercomputer is finally getting its domestic silicon infusion — The Register, 2026-09-23The system builder Bull is receiving the Rhea1 CPUs from SiPearl for the supercomputer JUPITER.
- Supermicro Now Shipping NVIDIA Vera Rubin NVL72 Racks — HPCwire, 2026-09-23Super Micro is now distributing NVL72 racks featuring NVIDIA Vera Rubin, integrated with the company’s liquid cooling systems.
- An Epyc trip to Venice: Everything we do and don't know about AMD's 256-core monster chip — The Register, 2026-09-23AMD is introducing a high-core-count processor featuring DDR5 support, high clock speeds, and CXL 3.1 memory capabilities.
- Alibaba unveils Zhenwu V900 AI accelerator, claims it's 'the most powerful AI chip in China' — Tom's Hardware, 2026-09-23Alibaba launched the Zhenwu V900 AI accelerator chip, boasting significantly increased performance and large memory capacity to power its Qwen models.
- Meta plans Petal, the first transoceanic subsea cable at petabit capacity — Data Center Dynamics, 2026-09-23Meta plans to deploy Petal, which will be the first transoceanic subsea cable with petabit capacity to connect the US and France.
- China launches 'Supercomputing-1' AI satellite as orbital data centers gather momentum — Tom's Hardware, 2026-09-23China launched the 'Supercomputing-1' AI satellite, indicating growing interest in distributed computing infrastructure.
- Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform — DigiTimes, 2026-09-23Samsung has validated its next-generation LPDDR6 memory with Qualcomm, aiming to provide higher bandwidth and improved power efficiency for next-generation Snapdragon platforms used in AI workloads.
- Hermes-Epitek eyes CPO test revenue in 2027 — DigiTimes, 2026-09-23Hermes-Epitek announced that its testing services for silicon photonics co-packaged optics are projected to generate revenue starting in 2027.
- Hygon takes China's CPU ambitions beyond servers, into physical AI — DigiTimes, 2026-09-23Hygon launched an embedded industrial CPU family designed for non-server edge AI applications like robotics and machine vision.
- Coherent Launches PhotonLink Integrated Optics Platform for AI Infrastructure — HPCwire, 2026-09-22Coherent Corp. launched the PhotonLink platform, an integrated optics solution supporting co-packaged and near-packaged optics for AI data centers.
- Alibaba unveils Zhenwu V900, says cloud capacity will hit 20GW by 2032 — Data Center Dynamics, 2026-09-22Alibaba announced the Zhenwu V900, a new AI chip, which is scheduled for release in the first quarter of 2027.
- NVIDIA Announces DSX Ready Qualification Program for Data Center Power and Cooling Hardware — ServeTheHome, 2026-09-22NVIDIA launched the DSX Ready program, a qualification standard for data center power and cooling hardware used in AI data center construction.Chassis, rails, rack enclosures, Rack PDUs, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Nvidia
- SiPearl Delivers 1st Rhea1 CPU Samples to Bull for JUPITER Supercomputer — HPCwire, 2026-09-22SiPearl delivered initial samples of its energy-efficient CPU, Rhea1, to Bull for the JUPITER supercomputer, marking a significant step for European computing sovereignty.
- Huawei Upgrades Stellar AI Fabric Solution to Build Efficient AI Computing Production Networks — HPCwire, 2026-09-22Huawei unveiled its upgraded Stellar AI Fabric Solution at HUAWEI CONNECT 2026 to maximize compute utilization in production AI clusters.
- GUC Announces 2nm 16 Gbps HBM4E IP — EE Times, 2026-09-22GUC introduced its design-ready Intellectual Property for HBM4E, which operates at 2nm and 16 Gbps, and will be used in customer AI ASICs.
- New DapuStor SSD pairs high-capacity QLC with a permanent pSLC region — trades 6% to 20% of its QLC capacity for more than 7x faster random writes — Tom's Hardware, 2026-09-22DapuStor introduced the dual-mode J5060 QLC SSD, dedicating a portion of its NAND flash memory to operate as faster pSLC for random write enhancement.
- New DapuStor SSD pairs high-capacity QLC with a permanent pSLC region — Tom's Hardware, 2026-09-22DapuStor launched a dual-mode QLC SSD, the J5060, which utilizes a permanent pSLC region by dedicating 4TB of storage to provide 800GB of faster flash.
- China's CXMT hits 12nm-class DRAM milestone — new 5th-gen DRAM tech uses quadruple-patterning to boost die capacity by 50% — Tom's Hardware, 2026-09-22CXMT has successfully started mass production of its 5th generation DRAM using quadruple-patterning to increase die capacity by 50%.
- China's CXMT hits 12nm-class DRAM milestone — Tom's Hardware, 2026-09-22China's DRAM company, CXMT, has started manufacturing its DRAM using the 5th Gen process technology.
- SiPearl delivers first homegrown server chips for Europe's exascale supercomputer — DigiTimes, 2026-09-22SiPearl delivered the initial Rhea1 CPU chips, which will be integrated by Bull into Europe's JUPITER supercomputer.
- Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging — DigiTimes, 2026-09-22Hanmi Semiconductor shipped its first FC Bonder 75 to a client, expanding its packaging services beyond HBM into general semiconductor packaging.
- Alibaba speeds V900 rollout, targeting 20GW of data centers — DigiTimes, 2026-09-22Alibaba is speeding up the deployment of its Zhenwu V900 accelerator, aiming to build a comprehensive computing platform across processors, networking, storage, and data centers.
- BOE looks beyond displays with glass substrates for AI packaging — DigiTimes, 2026-09-22BOE Technology is pivoting its glass substrate technology from development toward customer validation for AI packaging applications.
- India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout — DigiTimes, 2026-09-22Two new semiconductor assembly and testing facilities, operated by Suchi Semicon and CDIL Semiconductor, began commercial production in India, bringing the total number of operational semiconductor projects in the country to five.
- Apple's reported AI server push could reshape its role in enterprise infrastructure — DigiTimes, 2026-09-22Apple is reportedly developing a new enterprise AI inference server using its M8 Ultra chips, potentially re-entering the enterprise hardware market.
- Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership — DigiTimes, 2026-09-21Increased power consumption and density in AI deployments are driving the necessity for high-end multilayer ceramic capacitors (MLCCs).
- FCT Introduces Liquid Leak Detection Flex Assembly for AI and HPC Systems — HPCwire, 2026-09-21FCT released a Liquid Leak Detection Flex Assembly, a custom sensor for liquid-cooled AI and HPC systems, covering CDUs, manifolds, and quick disconnects.
- Qotom Q30952UE Review the New Black Box for 10G Networking — ServeTheHome, 2026-09-21The Qotom Q30952UE is a new networking device that features two SFP+ 10G ports and six 2.5GbE ports.
- Huawei Unveils New UnifiedBus Computing Architecture for SuperPoDs and Clusters — HPCwire, 2026-09-21Huawei introduced the UnifiedBus interconnect architecture and associated computing products designed for large superPoDs and clusters.
- Flag to deploy Ciena's Waveserver platform on Echo subsea cable — Data Center Dynamics, 2026-09-21Flag plans to utilize Ciena’s Waveserver platform to launch new 400GbE and 800GbE services over its Echo subsea cable.
- LG launches centrifugal air cooling system for AI data centers — Data Center Dynamics, 2026-09-21LG has introduced a centrifugal air cooling system designed specifically for AI data centers, which reportedly does not require oil for its magnetic system.
- China crafts working 3nm gate-all-around transistors without EUV — stacked nanosheets target 3nm without EUV, but full node remains distant — Tom's Hardware, 2026-09-21China successfully demonstrated the fabrication of 3nm gate-all-around transistors without EUV tools, though the technology is still far from commercial viability.
- Lattice Mach-N2 transitions to 16nm FinFET, integrating post-quantum encryption to strengthen control security — DigiTimes, 2026-09-21Lattice Semiconductor launched its Mach-N2 series, a next-generation FPGA built on the Nexus 2 platform featuring embedded flash memory and post-quantum cryptography for enhanced data center security.
- SK Hynix pushes deeper into logic for next-generation 3D DRAM — DigiTimes, 2026-09-21SK Hynix is advancing next-generation 3D DRAM by integrating logic design to separate memory processing from control circuits, enabling optimized manufacturing.
- Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight — DigiTimes, 2026-09-21Samsung reportedly plans to double the output of its HBM4 memory in 2027 due to persistent market supply constraints.
- CXMT closes in on DRAM leaders with G5 process breakthrough — DigiTimes, 2026-09-21China's CXMT has commenced mass production of its fifth-generation DRAM platform (G5), bringing higher-density LPDDR5X into volume production.
capacity
- Google-backed energy outfit brings 33 MW of 4 GW geothermal potential online in Utah — The Register, 2026-09-25Fervo Energy, backed by Google, aims to bring 100 MW of geothermal power online by the New Year and reach half a gigawatt by 2028.
- Elon Musk's SpaceXAI to add another 660,000 AI GPUs this year, nearing a total of 1.44 million in operation — Tom's Hardware, 2026-09-25SpaceXAI plans to install an additional 660,000 AI GPUs this year, bringing its total operating GPU count to over 1.44 million.
- Tower Semiconductor to invest $4 billion in Japanese ops to set up massive optical connectivity hub — Tom's Hardware, 2026-09-25Tower Semiconductor is planning a major optical connectivity hub in Japan, aiming for a 40-fold increase in output by 2029.
- DOE unveils $1.9bn in funding for 31 grid upgrade projects to speed data center connections — Data Center Dynamics, 2026-09-25The Department of Energy announced $1.9 billion in funding for 31 grid upgrade projects to increase data center connectivity capacity.
- Google-backed Fervo Energy achieves first power at up to 900MW Cape Station geothermal plant in Utah — Data Center Dynamics, 2026-09-25Fervo Energy achieved initial power at a large-scale geothermal station in Utah, marking a significant milestone for utility-scale geothermal power.
- Applied Digital reveals $3.2bn Delta Forge 2 AI data center will be built in Alabama — Data Center Dynamics, 2026-09-25Applied Digital announced a $3.2 billion AI data center project in Alabama, with operations potentially beginning by 2028.
- Advanced transmission projects get $1.9B in DOE funding — Utility Dive, 2026-09-24The Department of Energy expects that advanced transmission projects, backed by $1.9 billion in funding, will increase grid capacity by 23 GW.
- Alibaba Cloud accelerates AI infrastructure buildout with 20GW target, eight-market expansion — DigiTimes, 2026-09-24Alibaba Cloud announced plans for global expansion, targeting a 20GW data center footprint across eight new markets by 2026.
- OpenAI and Anthropic seek 20-30MW data center deployments — Data Center Dynamics, 2026-09-23OpenAI and Anthropic are planning to deploy data centers with a capacity of 20-30MW.
- China's ByteDance gained access to over 2,000 Nvidia B200 chips through Norway data center — Tom's Hardware, 2026-09-23Nscale secured access to thousands of Nvidia B200 chips for a data center project involving ByteDance's subsidiary.
- Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration — DigiTimes, 2026-09-23Biwin Storage Technology plans to invest US$672 million in expanding its wafer-level advanced packaging and testing capabilities, focusing on 2.5D integration and compute-memory co-packaging.
- Win Semiconductors expands optical communications capacity with DUV tools — DigiTimes, 2026-09-23Due to increasing AI demand, the market for optical communications is facing shortages, leading Win Semiconductors to expand its capacity for photodiode and laser diode components to support faster data rates like 800G and 1.6T.
- Internet2 and Cisco Add AI Capacity to the National Research Platform — HPCwire, 2026-09-22Internet2 and Cisco are deploying new AI PODs at two universities to increase shared computing capacity for research and education.
- BDx breaks ground on AI Campus 2 in Jatiluhur, Indonesia — Data Center Dynamics, 2026-09-22BDx is beginning construction on its second 120MW AI campus in Jatiluhur, Indonesia, scheduled for completion in early 2027.
- Polcom to build 40MW data center in Skawina, Poland — Data Center Dynamics, 2026-09-22Polcom plans to build a 40MW data center facility in Skawina, Poland.
- OpenAI and Anthropic scramble for smaller data centers as massive gigawatt projects lag — 20-30 MW facilities to provide capacity as mega structures undergo construction — Tom's Hardware, 2026-09-22OpenAI and Anthropic are focused on securing smaller, immediate data center capacities while larger mega-projects are still under construction.
- OpenAI and Anthropic scramble for smaller data centers as massive gigawatt projects lag — Tom's Hardware, 2026-09-22OpenAI and Anthropic are seeking smaller data center deals to address immediate capacity needs while pursuing massive, multi-gigawatt projects.
- Microsoft opens fourth India cloud region, casting Hyderabad as an AI hub for Asia and the Global South — DigiTimes, 2026-09-22Microsoft opened a new cloud region in Hyderabad, India, designating the country as an AI compute hub for the Global South.
- TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung — DigiTimes, 2026-09-22Taiwan is establishing its first advanced packaging cluster in Kaohsiung, led by TSMC, in response to rising demand from AI and HPC.
- Taiwan advances major science park expansion to support AI, semiconductor growth — DigiTimes, 2026-09-22Taiwan plans to expand its Longtan Science Park to accommodate the continued growth of AI and semiconductor industries.
- Microsoft Taiwan to double data centers as AI computing demand exceeds supply — DigiTimes, 2026-09-22Microsoft plans to expand its data center presence in Taiwan from two to four facilities to meet escalating demand for AI computing power.
- Kodiak Gas Services to supply 76MW of behind-the-meter gas power to West Texas data center — Data Center Dynamics, 2026-09-21Kodiak Gas Services will provide 76MW of natural gas-fueled power directly to a data center in West Texas.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Copper, Aluminum, Grain-oriented electrical steel & amorphous cores, Rare earths & permanent magnets, Specialty glass & glass fiber, Refrigerants & insulating gases, Industrial & specialty gases, Critical minerals: gallium, germanium, indium, tungsten, beryllium
- Nabiax breaks ground on 100MW data center in Madrid, Spain — Data Center Dynamics, 2026-09-21Nabiax initiated construction on a 100MW data center in Madrid, Spain, adding to its existing capacity in the region.
- Oman’s O-Green targets 200MW of data center capacity by 2028 — Data Center Dynamics, 2026-09-21O-Green plans to develop 200MW of data center capacity by 2028 in Oman and Europe, powered by low-cost renewable energy.
- TSMC builds Kaohsiung hub to speed advanced packaging tests — DigiTimes, 2026-09-21TSMC is constructing an advanced packaging validation hub in Taiwan to accelerate the qualification process for emerging chip technologies like CoWoS.
- Largan makes seventh land, factory purchase of 2026 in co-packaged optics push — DigiTimes, 2026-09-21Largan Precision acquired significant land and building space in Taiwan for future capacity expansion, signaling preparations for co-packaged optics.
m and a
- NetApp Plans PEAK:AIO Acquisition to Scale Storage for AI Clouds — HPCwire, 2026-09-25NetApp plans to acquire PEAK:AIO, a company specializing in metadata architecture and high-performance parallel file systems, to better serve AI cloud storage needs.
- Vertiv to acquire data center fluid management firm King Environmental Services — Data Center Dynamics, 2026-09-25Vertiv is acquiring King Environmental Services, a firm that specializes in data center fluid management.
- Akamai plans US$5.5 billion cloud buildout after US$11.6 billion Anthropic deal — DigiTimes, 2026-09-25Akamai plans to invest $5.5 billion to expand its cloud infrastructure and server capacity following a $11.6 billion, seven-year agreement with Anthropic.
- Interview: GMI Cloud bets on Taiwan as a proving ground for global AI expansion — DigiTimes, 2026-09-25GMI Cloud is investing $500 million in a new AI facility in Taiwan, which will deploy approximately 7,000 Nvidia Blackwell GPUs for customers like Trend Micro and Wistron.
- PicoJool Raises $27.5M Series A to Scale Optical Connectivity for AI Infrastructure — HPCwire, 2026-09-24PicoJool, a company focused on optical connectivity for AI infrastructure, secured $27.5 million in Series A funding.
- Vertiv to Buy King Environmental Services to Bolster Data Center Cooling — HPCwire, 2026-09-24Vertiv announced plans to acquire King Environmental Services to expand its global thermal management services, particularly for liquid-cooled data centers.
- Chinese foundry CanSemi seeks US$918M ChiNext listing — DigiTimes, 2026-09-24Wafer foundry CanSemi Technology plans to raise approximately US$918 million through an initial public offering on Shenzhen's ChiNext board.
- Nexstrom raises $12m for post-silicon chip wafers — Data Center Dynamics, 2026-09-23Nexstrom, a Singapore-based startup, raised $12 million to develop a platform for growing 12-inch single-crystal 2D semiconductor materials.
- Meta signs 144MW solar PPA with Apex in Texas — Data Center Dynamics, 2026-09-23Meta has signed a seventh Power Purchase Agreement (PPA) for 144 MW of solar energy from Apex in Texas.
- SKC raises Absolics stake to 82% as glass substrates remain in testing — DigiTimes, 2026-09-23SKC is raising its stake in Absolics, a US glass substrate subsidiary, due to continued commitment to the materials which are currently in customer testing before volume production.
- YMTC's capital arm enters FD-SOI — China's 12-inch SOI build-out gathers pace — DigiTimes, 2026-09-22Changcun Capital, an investment arm of YMTC, invested in Ruili Pingxin Microelectronics, indicating an expansion of China's semiconductor capital into specialty logic and wafer foundry technologies like FD-SOI.
- The Novel Chip-Pairing Strategy Powering Gimlet Labs’ Growth — HPCwire, 2026-09-21Gimlet Labs, a neocloud provider, secured $300 million in funding at a $3 billion valuation to expand its data center infrastructure for AI inference.
- Generac signs $8bn back up generator deal with Amazon — Data Center Dynamics, 2026-09-21Generac entered into an $8 billion agreement with Amazon for the provision of backup generators, with initial deliveries totaling $2.4 billion over the next two years.
- IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing — DigiTimes, 2026-09-21An IBM company won a $1 billion CHIPS Act award to expand quantum wafer manufacturing in New York.
regulation
- FERC rejects Oklo complaint seeking to reinstate project to PJM’s interconnection study cycle — Utility Dive, 2026-09-25FERC rejected Oklo's attempt to restart its 750-MW project within PJM's interconnection study process, potentially delaying the project for a minimum of 14 months.
- Northern Virginia's Prince William County puts controls on new data center projects — Data Center Dynamics, 2026-09-25Local government in Prince William County, Virginia, restricted new data center developments by significantly reducing the scope of their 'by right' overlay district.
- Thailand set to finalize new data center regulations by mid-October - report — Data Center Dynamics, 2026-09-25Thailand plans to finalize new data center regulations by mid-October, which will classify facilities exceeding 100MW as hyperscale.
- New Jersey hits Microsoft-linked AI data center with record fine for 62 unpermitted power generators, issues 45-day shutdown deadline — Tom's Hardware, 2026-09-25A data center in New Jersey was fined $1.07 million for operating numerous unpermitted portable turbine generators, leading to a 45-day shutdown mandate.
- Dutch PM presses US to avoid tighter ASML China curbs — DigiTimes, 2026-09-25The Dutch Prime Minister is urging the United States to prevent further tightening of export restrictions on ASML's critical lithography systems and services for China.
- Taiwan keeps door open for Chinese parts in drones — DigiTimes, 2026-09-25Taiwan is allowing the use of Chinese-made components for non-critical items like passive components, magnets, and optical lenses in its drone supply chain.
- Victoria, Australia, proposes rules requiring data centers to secure own renewable energy supply — Data Center Dynamics, 2026-09-24Victoria, Australia, plans to mandate that data centers ensure their own renewable energy supply, alongside rules targeting water use and cost management.
- ASML system sales in Europe remain at zero as EU debates Chips Act 2.0 — DigiTimes, 2026-09-24ASML reported that chipmaking system sales in Europe are currently zero, despite upcoming debates on the Chips Act 2.0.
- SK Hynix Indiana HBM plant faces lawsuit — DigiTimes, 2026-09-24A lawsuit has been filed against SK Hynix's planned HBM facility in Indiana, potentially delaying construction amidst heightened competition for AI memory capacity.
- China's YMTC wins patent battle against Micron in ongoing 3-year legal war over memory patents — Tom's Hardware, 2026-09-23A Munich court granted YMTC two injunctions against Micron concerning 3D NAND patents, continuing a prolonged legal dispute.
- California governor signs seven-bill package targeting data center energy and water use — Data Center Dynamics, 2026-09-23The California governor signed a seven-bill package intended to regulate and mitigate the costs of data center development related to energy and water use.
- FERC rejects ComEd’s cancellation of PowerHouse Hillwood data center contract — Utility Dive, 2026-09-23FERC scrutinized a low letter of credit provided for a large planned 1.8-GW data center contract by PowerHouse Hillwood.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Utilities, IPPs & power providers signing data-center deals, Hyperscalers, neoclouds & model labs
- Efforts to curb data center speculation gain ground across the US — Utility Dive, 2026-09-23Various measures, including tariffs and policy changes, are emerging across the US to regulate and curb excessive data center speculation.
- Abbott halts new Texas data center permits pending ERCOT audit — Data Center Dynamics, 2026-09-23Abbott paused new data center permits in Texas due to a pending audit by ERCOT, which is expected to finish by December.
- YMTC wins German injunctions against Micron in latest round of NAND patent battle — DigiTimes, 2026-09-23German courts ruled in favor of YMTC, issuing injunctions that could restrict Micron's supply of NAND in Germany and affect the European industrial market.
- California tightens oversight of data center energy use, grid costs — Utility Dive, 2026-09-22New state regulations passed in California mandate that data centers contribute financially to necessary infrastructure, wildfire mitigation, and liability costs.
- North Carolina regulators deny Duke Energy gas turbine request over ‘staggering’ cost, uncertain need — Utility Dive, 2026-09-22NC regulators denied Duke Energy’s gas turbine request due to its high cost and unclear utility for serving data centers.
- European Commission proposes energy and water efficiency disclosure rules for data centers — Data Center Dynamics, 2026-09-22The European Commission has proposed new rules requiring data centers to disclose information regarding their energy and water efficiency.
- Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them — DigiTimes, 2026-09-22The European Commission plans to implement a mandatory public efficiency rating for data centers of 500kW or more, covering both energy and water usage.
- Local opposition blocked 45 data center projects worth $68 billion in the second quarter of 2026 — data center investments reportedly still on track to hit $32 trillion by 2050 — Tom's Hardware, 2026-09-21Local opposition blocked $68 billion worth of data center projects in Q2 2026, though overall industry investment is projected to reach $32 trillion by 2050.
- Texas PUC adopts softened rules on data center interconnection — Utility Dive, 2026-09-21The Texas Public Utility Commission revised its proposed interconnection rules by removing a non-refundable fee, reducing financial security requirements, and extending deadlines for energization.
- Newsom vetoes bill to create California PUC inspector general — Utility Dive, 2026-09-21Newsom signed new laws for data centers, strengthening energy reporting and establishing a transmission infrastructure accelerator.
- New York regulators approve 90-mile transmission line — Utility Dive, 2026-09-21New York regulators approved a $3.3-billion transmission line project to boost downstate power delivery by 2030.
- Taiwan delays 2026 power rate decision as war drives fuel costs higher — DigiTimes, 2026-09-21Taiwan delayed a 2026 electricity rate decision due to increased fuel costs from the Middle East war, necessitating government funding.
- Microsoft AI chief says regulation is not a bad thing — DigiTimes, 2026-09-21Microsoft AI chief Mustafa Suleyman argues that technology should serve humanity and that regulation should not be inherently negative.
design win
- Kairos Power selects Samsung C&T to help build 50MW SMR for Google in Tennessee — Data Center Dynamics, 2026-09-22Kairos Power selected Samsung C&T to construct a 50MW Small Modular Reactor (SMR) for Google's facility in Tennessee.
- OData to deploy Aligned's DeltaFlow liquid cooling system at Brazil and Mexico data centers — Data Center Dynamics, 2026-09-21Aligned will deploy its DeltaFlow liquid cooling system in data center facilities in Brazil and Mexico for a total project cost of $630 million.
- Tower Semiconductor to make Japan its largest optical chip base — DigiTimes, 2026-09-21Tower Semiconductor plans to expand its manufacturing base for optical communications semiconductors, including SiPh and SiGe, in Japan to meet growing demand from AI data centers.
Covered this week
Parts: Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Transmission, interconnection & grid equipment, Architecture, engineering & MEP design, General contractors & design-build, Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, DPUs, Cluster management & GPU orchestration, Site selection, power procurement, market intelligence, brokerage, Server CPUs, Rack-scale systems, GPU baseboards & compute trays, Leading-edge foundry, Silicon wafers, Fab materials, masks, gases, Backup generation: gensets, fuel systems, HVO, Renewables & long-duration storage hardware, Memory modules, DRAM, Memory interface / buffer chips, Motherboards, CPU trays, switch trays, Power shelves & PSUs, EMS, system integration & rack-level test, LV cable, wire, tray, raceway, Metering, power quality, monitoring, AI storage systems, Fiber, connectors, structured cabling, HBM, 2.5D/3D advanced packaging, Optics contract manufacturing, Silicon photonics & co-packaged optics, Physical security & access, Prefab / modular data centers & power/cooling skids, MEP & electrical contractors, Direct-to-chip cold plates, Rack manifolds, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Air handling, economizers, filtration, Heat reuse & district heating interfaces, Site utilities, water & fiber entrance, Refrigerants & insulating gases, SMRs, advanced reactors, components, fuel, Utilities, IPPs & power providers signing data-center deals, Coolant distribution units, Rear-door heat exchangers, Immersion cooling systems, Chillers & compressors, Building management, controls, environmental sensors, Circuit protection, fuses, surge, grounding, Board-level power: VRMs, power stages, PoL, power semis, In-rack busbar & power whips, Chip-level thermal: lids, heat spreaders, TIMs, Gas turbines (onsite / behind-the-meter) & HRSGs, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, High-layer-count PCBs, Copper-clad laminate & PCB materials, Fuel cells, Critical minerals: gallium, germanium, indium, tungsten, beryllium, MV/LV transformers, LV switchgear, switchboards, panelboards, Gas supply chain, Rare earths & permanent magnets, Specialty glass & glass fiber, Industrial & specialty gases, Timing, security & misc board silicon, FPGAs, CXL controllers & memory expanders, Optical transceivers, CDU internals: plate heat exchangers, pumps, filters, Scale-up fabric, Scale-out switch ASICs, Startup accelerators, Fab equipment, Packaging & bonding equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Power smoothing / supercapacitors, 800 V DC architecture & solid-state transformers, NVLink copper spine / backplane cartridges, BMC & platform firmware, DCI / coherent optics, Chassis, rails, rack enclosures, NAND flash, Reciprocating engines & engine microgrids, Water treatment, reuse, consumption, DCIM, digital twins, capacity planning, Busway / busbar trunking, Paralleling switchgear & generator controls, Optical DSPs, drivers, TIAs, Lasers, Switch systems & white-box ODMs, Rack PDUs, Quick disconnects, Hoses, tubing, fittings, valves, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Rack/row cooling controls & software, CRAH / CRAC / fan walls / in-row units, Facility water loop hardware, Enterprise SSDs & controllers, Semiconductor test & burn-in, PCIe/CXL switches & retimers, Passives, NICs / SuperNICs, Structure, steel, precast, envelope, site equipment, Copper, Aluminum, Grain-oriented electrical steel & amorphous cores, HDD
Companies: Intel, Nvidia, Broadcom, Samsung Electronics, Alibaba, Huawei, Microsoft, NetApp, Tesla, Tower Semiconductor, Lenovo, Vertiv, Applied Digital, Anthropic, Applied Materials, GlobalFoundries, Wistron, ASRock Rack, Exelon, Blue Owl, Oracle, Micron, Digital Realty, SK Hynix, Synopsys, Apple, Supermicro, Crusoe, OpenAI, ByteDance, Absolics, Cisco, STMicroelectronics, Duke Energy, Vistra, Samsung C&T, Hanmi Semiconductor, Foxconn (Hon Hai), Nscale, Murata, Ciena, Marvell, Amazon (AWS), Prysmian, Rio Tinto, Generac, Rebellions, Gigabyte, Pegatron, Wiwynn, SanDisk
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.