AI data center supply chain news — week 39, 2026
116 items · 2026-09-28 to 2026-10-04 ·all news · newer: week 40, 2026 (159) · older: week 38, 2026 (293)
other
- DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks — DigiTimes, 2026-10-04Increasing AI data center demand is creating significant logistical and infrastructure bottlenecks specifically regarding power availability and cooling capacity.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Utilities, IPPs & power providers signing data-center deals, Transmission, interconnection & grid equipment
- Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism — DigiTimes, 2026-10-04The news discusses the status of TSMC's manufacturing presence in Texas and addresses criticisms regarding the progress of Intel's 18A process node.
- Modder 'fixes' melting RTX 5090 power connectors with custom distributor — Tom's Hardware, 2026-10-04A community modder developed a custom power distribution solution to address melting issues with the power connectors on the NVIDIA RTX 5090 GPU.
- Microsoft using wetlands and native gardens to 'camouflage' 20-plus data center sites by blending them into nature — Tom's Hardware, 2026-10-04Microsoft is utilizing landscaping techniques including wetlands and native gardens to integrate its 20+ data center sites into the surrounding natural environment.
- Musk confirms talks with TSMC over his Texas chip factory project — DigiTimes, 2026-10-03Elon Musk has confirmed discussions with TSMC regarding the construction of a chip manufacturing facility in Texas.
- Amazon promises to spend $1 billion on communities close to its data centers, but critics push back — Tom's Hardware, 2026-10-03Amazon announced a $1 billion investment to support communities near its data center locations, though the plan has faced criticism from local stakeholders.
- Elon Musk, Jensen Huang see China closing lithography gap by 2030 — DigiTimes, 2026-10-03Elon Musk and Jensen Huang commented on the progress of China's semiconductor manufacturing capabilities, specifically regarding the lithography gap which they predict could be closed by 2030.
- Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output — DigiTimes, 2026-10-03Synopsys is evolving its EDA and IP business model to align with AI-driven shifts from seat-based licensing to performance-based revenue models.
- This is BiCS NAND Close Up from Kioxia and Sandisk — ServeTheHome, 2026-10-02The story highlights the BiCS NAND flash technology from Kioxia and SanDisk.
- Shut up and take our money: Amazon plows $1B into quashing datacenter dissent — The Register, 2026-10-02Amazon is investing $1 billion to address and resolve community opposition regarding the construction of data center facilities.
- NetworkOcean runs GPU on floating data center powered by solar panels in San Francisco Bay — Data Center Dynamics, 2026-10-02NetworkOcean is testing a floating data center concept in the San Francisco Bay that utilizes solar power to run GPUs.
- Xeal wants to use spare EV charging capacity to power Edge data centers for AI inference — Data Center Dynamics, 2026-10-02Xeal is exploring the utilization of surplus electric vehicle charging infrastructure to provide power for edge data centers dedicated to AI inference.
- OpenAI’s Jalapeño ASICs are deployed alongside AMD EPYC ‘Turin’ CPUs as hosts, not Nvidia's Vera — Tom's Hardware, 2026-10-02OpenAI is deploying its custom Jalapeño ASICs using AMD EPYC 'Turin' CPUs as host processors instead of Nvidia's Vera platform.
- Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra — DigiTimes, 2026-10-02Nvidia is considering using PTFE and HC materials to develop glass-free PCBs for its upcoming Rubin Ultra architecture.
- Sponsored: With limited power comes great cooling responsibility — Data Center Dynamics, 2026-10-02The story highlights the critical importance of cooling infrastructure and thermal management for high-density data centers powered by limited electricity.
- China AI infrastructure spreads to mid-sized firms — DigiTimes, 2026-10-02China's AI infrastructure development is expanding from large hyperscalers to include mid-sized firms.
- JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities — DigiTimes, 2026-10-02JCET Group has partnered with Wuxi to develop and enhance advanced 2.5D packaging facilities.
- DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide — DigiTimes, 2026-10-02The article discusses how advanced packaging, specifically backside power delivery, is becoming a critical differentiator in the semiconductor supply chain for high-performance computing.
- Micron expands global fabs, calls on Taiwanese suppliers to go overseas — DigiTimes, 2026-10-02Micron is urging its Taiwanese suppliers to establish manufacturing presence outside of Taiwan as the company expands its global fabrication footprint.
- JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists — DigiTimes, 2026-10-02JSR has completed a South Korean facility dedicated to EUV lithography processes as Japanese suppliers establish a local presence for next-generation resist materials.
- Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds — DigiTimes, 2026-10-02The competition for advanced packaging leadership is expanding to include display, materials, and equipment suppliers seeking to secure positions in the high-end chip manufacturing ecosystem.
- Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle — DigiTimes, 2026-10-02Negotiations have stalled regarding a power semiconductor deal involving major Japanese manufacturers Rohm, Toshiba, and Mitsubishi.
- Fashion brands partner with Schneider Electric to expand renewables — Utility Dive, 2026-10-01Fashion brands are partnering with Schneider Electric to expand their renewable energy capabilities.
- Micron lawsuit claims Chinese memory maker YMTC poached its engineers, then sued it using its own stolen tech — Tom's Hardware, 2026-10-01Micron Technology has filed a lawsuit against Chinese memory maker YMTC, alleging that the company poached engineers and utilized stolen technology to develop memory products.
- SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure — DigiTimes, 2026-10-01The silicon carbide (SiC) substrate market is experiencing a recovery fueled by demand in the automotive, energy, and AI infrastructure sectors.
- Ascend now ahead of Nvidia in China, with domestic supply driving AI chip substitution, says Huawei chairman — DigiTimes, 2026-10-01Huawei Chairman stated that domestic supply chains are driving the substitution of Nvidia's AI chips with domestic alternatives like Ascend.
- China's 'BEST' fusion reactor enters the engineering endgame — DigiTimes, 2026-10-01China's 'BEST' fusion reactor has reached the engineering phase of its development.
- Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move — DigiTimes, 2026-10-01Four major glass manufacturers are reportedly collaborating on a 510x515mm substrate format, which is expected to support TSMC's upcoming advanced packaging requirements.
- BOE eyes closer ties with Samsung, LG as it pushes into chip packaging — DigiTimes, 2026-10-01BOE is seeking to strengthen partnerships with Samsung and LG to expand its capabilities in semiconductor chip packaging.
- Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years — DigiTimes, 2026-10-01Machvision is reporting significant growth in its dual-track strategy focused on semiconductor and substrate visibility, with a current visibility window of three years.
- Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking — DigiTimes, 2026-10-01Samsung's AI Forum 2026 highlighted the integration of agentic AI across various sectors including robotics and semiconductor manufacturing.
- US unveils South Korea's US$20B nuclear, Alaska LNG investment — DigiTimes, 2026-10-01The US government has announced a significant investment package involving nuclear power and Alaska LNG projects in South Korea.
- Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push — DigiTimes, 2026-10-01Applied Materials has partnered with Kioxia to expand its EPIC Center capabilities for advancing 3D stacking and AI memory technologies.
- China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems — DigiTimes, 2026-10-01China Rare Earth Group is expanding its downstream capabilities by connecting rare-earth magnets to robot direct-drive systems.
- DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration — DigiTimes, 2026-10-01The focus of AI scaling is shifting from individual chip miniaturization to the complex integration of system-level architectures and rack-scale configurations.
- Applied Materials and Kioxia team up on AI-era memory tech — DigiTimes, 2026-10-01Applied Materials and Kioxia have partnered to develop advanced memory technologies to support the increasing demands of AI hardware.
- Emergence AI Targets Fabless Chipmakers With Neuroformal AI — EE Times, 2026-09-30Emergence AI is targeting fabless chipmakers to integrate its Neuroformal AI technology for specialized hardware acceleration.
- ZutaCore partners with Options Technology to offer liquid cooling to financial services — Data Center Dynamics, 2026-09-30ZutaCore has partnered with Options Technology to provide liquid cooling solutions specifically tailored for the financial services sector.
- Ameren Missouri files 20-year plan with 10.6 GW of gas additions — Utility Dive, 2026-09-30Ameren Missouri has submitted a 20-year plan involving 10.6 GW of gas-related infrastructure additions.
- ‘This is how AI should be used’ — OpenAI head of hardware breaks down the AI-assisted design of its Jalapeño ASIC — Tom's Hardware, 2026-09-30The head of hardware at OpenAI discussed using AI-assisted design processes to develop the company's custom Jalapeño ASIC.
- AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers — EE Times, 2026-09-30The increasing demand for AI computing is driving the industry toward larger and denser chip packaging, creating significant engineering challenges for equipment and material manufacturers.
- Where We Expect AMD EPYC 9006 CPUs in the era of Agentic AI — ServeTheHome, 2026-09-29The article discusses the role and expected availability of AMD EPYC 9006 series CPUs within the context of the growing Agentic AI landscape.
- Facilities fueling energy storage installations — Utility Dive, 2026-09-29The report discusses facilities and infrastructure supporting the deployment of energy storage systems.
- Schneider gives datacenter switchgear the software-defined treatment — The Register, 2026-09-29Schneider Electric is introducing software-defined capabilities to its data center switchgear products to enhance management and automation.
- Silicon is starting to design silicon — how AI is being used in chipmaking, from EDA tools to OpenAI's Jalapeño and beyond — Tom's Hardware, 2026-09-29The article discusses how AI is being integrated into the semiconductor design process, specifically within Electronic Design Automation (EDA) tools.
- Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs — Tom's Hardware, 2026-09-29Intel has patented a method to embed MicroLEDs into chip packaging, a development that could facilitate optical interconnects using Through-Glass Via (TGV) technology.
- OpenMoonRay™ Performance Accelerated by Lenovo and Intel® Xeon® 6 — HPCwire, 2026-09-28The whitepaper evaluates the performance of OpenMoonRay in cinematic rendering on Lenovo ThinkSystem HPC servers using Intel Xeon processors.
- Energy storage strategies for the data center power chain — Data Center Dynamics, 2026-09-28The article discusses strategies for energy storage in data centers, focusing on matching storage capacity and speed requirements.
- From data centers to AI factories: What utilities need to know about the next wave of load growth — Utility Dive, 2026-09-28Utilities must rapidly update their planning to ensure the grid can support the massive power draw of AI data centers.
- NXP says Singapore fab with Vanguard is its biggest investment since Freescale — DigiTimes, 2026-09-28NXP's new 12-inch fabrication plant in Singapore, a joint venture with Vanguard, represents its largest post-Freescale investment and is scheduled for volume production in Q1 2027.
- Jülich Researchers Earn EuroHPC Award for Study of P3M Performance on GPUs — HPCwire, 2026-09-28Jülich Supercomputing Centre researchers won the Best Paper Award at EuroHPC User Days for their work studying the performance scaling of the P3M method on multiple GPUs.
- Sponsored: Beyond power availability: What makes a data center project power-ready — Data Center Dynamics, 2026-09-28Modern data center power readiness assessment has shifted from simply confirming available power to evaluating the credibility of the project and the guaranteed delivery timeline.
- South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations — DigiTimes, 2026-09-28South Korea's high-bandwidth memory (HBM) exports are showing a two-tiered trade pattern, with premium chips destined for Taiwan and Malaysia, and lower-value parts going elsewhere.
- China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability — DigiTimes, 2026-09-28Micro Han Xin is attempting to establish a standard for miniaturized barcode traceability in the semiconductor supply chain.
- Beyond ASML: China rethinks EUV race with light-source strategy — DigiTimes, 2026-09-28Chinese researchers are exploring alternative methods for developing EUV light sources, moving beyond replicating ASML's existing lithography platform.
- India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent — DigiTimes, 2026-09-28India is increasing its focus and investment across the entire technology ecosystem, including semiconductor design, manufacturing, cloud infrastructure, and supply chain links.Hyperscaler custom ASICs, ASIC design services, IP & EDA, Startup accelerators, Leading-edge foundry, HBM, DRAM, Silicon photonics & co-packaged optics, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, SMRs, advanced reactors, components, fuel, Critical minerals: gallium, germanium, indium, tungsten, beryllium
capacity
- Nanya Tech expands 3D OSAT to chase HBM-like demand — DigiTimes, 2026-10-04Nanya Technology is expanding its 3D OSAT (Outsourced Semiconductor Assembly and Test) capabilities to capitalize on the surging demand for high-bandwidth memory (HBM) packaging.
- Toshiba to double HDD production capacity amid devastating shortages — Tom's Hardware, 2026-10-02Toshiba is planning to double its hard disk drive production capacity to address significant supply shortages.
- Plans filed for 1GW data center campus at former nuclear plant in Scotland — Data Center Dynamics, 2026-10-02Plans have been submitted for a 1GW data center campus to be built at a decommissioned nuclear site in Scotland.
- Micron ramps up HBM capacity at Taiwan's four major sites — DigiTimes, 2026-10-02Micron Technology is increasing its production capacity for HBM memory across its four primary manufacturing locations in Taiwan.
- LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals — DigiTimes, 2026-10-02LG Electronics and LS Electric are expanding their capabilities to address AI data center infrastructure needs by expanding US cooling production and securing high-voltage power infrastructure deals.Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, Utilities, IPPs & power providers signing data-center deals, Transmission, interconnection & grid equipment, LS Electric
- Toshiba reportedly to double HDD production as AI drives storage demand — DigiTimes, 2026-10-02Toshiba is reportedly doubling its hard disk drive production to meet the surging storage demands driven by artificial intelligence.
- Nebius signs 50MW lease with AIB Data Centers — Data Center Dynamics, 2026-10-01Nebius has signed a lease for 50MW of capacity at AIB Data Centers.
- AI cloud provider Blackfuel emerges from stealth, plans first deployment in Spain — Data Center Dynamics, 2026-10-01AI cloud provider Blackfuel has emerged from stealth mode with plans to launch its first data center deployment in Spain.
- Tencent signs on for 100,000 GPUs via Oracle - report — Data Center Dynamics, 2026-10-01Tencent has reportedly signed an agreement with Oracle to secure 100,000 GPUs.
- Infineon opens new backend chip plant in Thailand, eyes growth to up to five modules — DigiTimes, 2026-10-01Infineon is expanding its manufacturing presence by opening a new backend chip plant in Thailand with plans to scale up to five modules.
- Meta's Muse lifts server CPU demand, with AMD EPYC orders extending into 2028 — DigiTimes, 2026-10-01Meta's internal projects are driving sustained demand for AMD EPYC server CPUs, with purchase orders extending into 2028.
- Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion — DigiTimes, 2026-10-01Analysis highlights China's rapid expansion in AI data center infrastructure as global tech giants increase capital expenditure to scale capacity.
- China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up — DigiTimes, 2026-10-01The market share of Chinese Outsourced Semiconductor Assembly and Test (OSAT) providers in cloud AI accelerators is projected to reach 13% by 2026 driven by an increase in local ASIC production volumes.
- MediaTek TPU orders rise as chip capacity war intensifies — DigiTimes, 2026-10-01MediaTek is seeing an increase in orders for its TPUs as competition for chip manufacturing capacity grows.
- Unimicron expands ABF substrate capacity with NT$10B Hukou land deal — DigiTimes, 2026-10-01Unimicron is expanding its ABF substrate production capacity by securing a NT$10B land deal in Hukou.
- CoreWeave Delivers NVIDIA Vera Rubin NVL72 Performance at Production Scale, Starting with Cognition — HPCwire, 2026-09-30CoreWeave has launched production-scale deployments of NVIDIA Vera Rubin NVL72 systems, beginning with Cognition.
- CScale Exits Stealth with $145M to Build the Interconnect for Gigawatt-Scale AI — HPCwire, 2026-09-30CScale has raised $145 million in funding to develop high-density interconnect infrastructure specifically designed for gigawatt-scale AI data centers.
- Vertiv expands data center kit manufacturing capacity in Slovakia — Data Center Dynamics, 2026-09-28Vertiv will increase the capacity of its power and cooling manufacturing facility in Slovakia by adding 22,000 square meters.
product launch
- Intel Xeon 6+ SKU List and Value Analysis: Clearwater Forest Runs Wide — ServeTheHome, 2026-10-04Intel has released the SKU list and value analysis for the Xeon 6 family of server CPUs.
- Biren readies BR20X, sharpening China's AI GPU challenge to Nvidia — DigiTimes, 2026-10-03BirenTech has announced the preparation of its BR20X AI GPU to compete directly with Nvidia's offerings in the Chinese market.
- ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform — DigiTimes, 2026-10-02ficonTEC and Hermes Testing have launched the INS-2 platform to scale up testing for Co-packaged Optics (CPO) technologies.
- NetApp Eliminates Metadata Bottleneck for Zettascale Storage with New Novus Architecture — HPCwire, 2026-10-01NetApp announced its Novus architecture designed to handle metadata bottlenecks in zettascale storage systems.
- First Intel Panther Lake mini PC cooled with solid-state AirJet tech operates at less than 21 dBA — Tom's Hardware, 2026-10-01Intel has released a Panther Lake mini PC that utilizes solid-state AirJet cooling technology to maintain noise levels below 21 dBA.
- VDURA V12 Brings the Hyperscaler Storage Playbook to AI Factories — HPCwire, 2026-10-01VDURA has launched its V12 storage system designed to handle the high-performance requirements of AI factory workloads.
- Trane Technologies Demonstrates 800-Volt Direct Current Chiller for Next-Gen AI Data Centers — HPCwire, 2026-10-01Trane Technologies has showcased an 800-volt direct current chiller specifically designed to meet the cooling and power requirements of next-generation AI data centers.
- Sponsored: Castrol launches Castrol CORE, an integrated thermal management offer for data centers — Data Center Dynamics, 2026-10-01Castrol has launched Castrol CORE, a thermal management solution specifically designed for data center cooling systems.
- Trane Technologies Demonstrates Industry-First 800-Volt Direct Current Chiller for Next-Generation AI Data Centers — newsroom:trane, 2026-09-30Trane Technologies showcased a first-of-its-kind 800V DC chiller designed to support the high power demands and cooling requirements of next-generation AI data centers.
- AMD drops an EPYC $15,000, 256-core beast — Tom's Hardware, 2026-09-29AMD has announced a new 256-core EPYC server CPU priced at $15,000.
- Trane Technologies Expands System Architecture with Two New AI Factory Reference Designs Based on NVIDIA DSX AI Factory Platform — newsroom:trane, 2026-09-28Trane Technologies has introduced two new reference designs for AI factory cooling systems built upon the NVIDIA DSX AI Factory platform.
- Xcena Cuts Data Movement to Address Memory Bottlenecks — EE Times, 2026-09-28Xcena's MX1 utilizes CXL to enhance programmability by integrating DDR5 memory, SSD storage, and RISC-V cores to reduce data movement overhead.
- “Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP Conference — newsroom:sk-hynix, 2026-09-28SK hynix presented its next-generation memory portfolio and development strategies at the TSMC OIP Conference.
- “Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP Conference — newsroom:sk-hynix, 2026-09-28SK hynix presented its next-generation memory portfolio, including HBM and high-bandwidth memory solutions, during the TSMC OIP conference.
- “Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP Conference — newsroom:sk-hynix, 2026-09-28SK hynix showcased its next-generation memory portfolio, including HBM and DDR5, during the TSMC OIP conference.
m and a
- General Compute signs multi-year agreement with Cerebras — Data Center Dynamics, 2026-10-02General Compute has entered into a multi-year agreement with Cerebras to provide access to its specialized AI accelerator hardware.
- Intro Group to invest $270m in Egypt’s Kemet Data Center — Data Center Dynamics, 2026-10-02Intro Group is investing $270 million into the Kemet Data Center project in Egypt.
- Sharon AI and Lambda secure GPU-backed debt funding — Data Center Dynamics, 2026-10-02Sharon AI and Lambda have secured debt financing to support their GPU-backed infrastructure and compute capabilities.
- ASE stake, expansion open doors for Machvision — DigiTimes, 2026-10-02ASE has taken a stake in Machvision, a company specializing in advanced packaging and equipment for the semiconductor industry.
- AMD bets on AI demand by buying World Labs — DigiTimes, 2026-10-02AMD has acquired World Labs to strengthen its position in the AI market and address growing demand for high-performance computing.
- GMI Cloud secures NT$14.05 billion loan for AI factory — DigiTimes, 2026-10-02GMI Cloud has secured a loan of NT$14.05 billion to fund the construction and operation of a new AI data center facility.
- Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity — DigiTimes, 2026-10-01Shinko Electric has acquired JDI's Mobara manufacturing facility to increase its capacity for advanced semiconductor packaging.
- Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development — DigiTimes, 2026-10-01Amazon and Synopsys have entered into a billion-dollar agreement to accelerate the development of custom ASICs and specialized silicon.
- Synopsys and Amazon sign $1bn multi-year IP agreement for custom chip development — Data Center Dynamics, 2026-09-30Amazon has entered into a billion-dollar multi-year agreement with Synopsys to utilize their intellectual property for the development of custom hyperscaler ASICs.
- Custom chip firm Semifive signs $52m deal with unnamed US AI company — Data Center Dynamics, 2026-09-30Custom chip design firm Semifive has secured a $52 million contract to develop custom silicon for an undisclosed American AI company.
- AMD to Acquire World Labs to Advance the Future of AI Compute — newsroom:amd, 2026-09-28AMD has announced the acquisition of World Labs to enhance its AI compute capabilities and hardware offerings.
earnings
- Micron eyes NVHBM profits with TSMC custom HBM push — DigiTimes, 2026-10-02Micron is positioned to benefit from the increasing demand for custom HBM as TSMC scales its advanced packaging capabilities for high-bandwidth memory.
- SK Hynix says Solidigm IPO remains undecided as AI storage demand drives investment — DigiTimes, 2026-10-02SK Hynix stated that the IPO for its NAND flash brand, Solidigm, remains undecided while the company continues to invest heavily to meet soaring AI storage demand.
- Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts — DigiTimes, 2026-10-01Micron Technology is increasing its high-bandwidth memory (HBM) prices for 2027 because the projected memory demand surge in 2026 fell short of expectations under current fixed-price contracts.
- Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking — DigiTimes, 2026-10-01Jabil has announced a target of $17.5 billion in revenue from its data center business, focusing on power, cooling, and networking infrastructure.EMS, system integration & rack-level test, Coolant distribution units, CRAH / CRAC / fan walls / in-row units, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Jabil
- Jabil targets 24% growth in FY27 as AI hardware ramp reshapes business — DigiTimes, 2026-10-01Jabil anticipates 24% growth in fiscal year 2027 driven by the accelerating demand for AI hardware manufacturing and assembly.
supply constraint
- Micron projects tightening RAM shortages through 2028 as it generates record profit — Tom's Hardware, 2026-10-01Micron Technology is experiencing a tightening supply of memory products expected to persist through 2028 despite the company reporting record profits.
- DB HiTek raises foundry prices by up to 30% as Chinese demand strains 200mm capacity — DigiTimes, 2026-10-01Foundry manufacturer DB HiTek is increasing prices on 200mm wafer production due to high demand from Chinese customers.
- Micron sees no end to the memory shortage, even after new fabs open in 2028 — DigiTimes, 2026-10-01Micron anticipates that memory shortages will persist even after the completion of new fabrication facilities scheduled for 2028.
- AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote — DigiTimes, 2026-10-01A labor dispute involving a Taiwanese snack factory operated by ASE may impact production capacity for advanced semiconductor packaging.
- AWS Trainium 3 shipments stall as supply chain sees turnaround — DigiTimes, 2026-10-01Shipments of AWS Trainium 3 accelerators have stalled as the supply chain undergoes a turnaround.
- Memory shortages deepen as AI demand keeps server prices climbing — DigiTimes, 2026-10-01Increasing demand for AI-driven server infrastructure is causing a shortage in memory components, leading to higher costs for server manufacturers.
- America is planning more AI datacenters than its chip supply can fill — The Register, 2026-09-30The United States is experiencing a supply-demand imbalance where the planned expansion of AI data centers exceeds the current manufacturing capacity of domestic semiconductor chips.
- Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight — DigiTimes, 2026-09-28China's AI hardware sector is maturing, focusing on platform and bottleneck components like memory, advanced packaging, and photonics, while facing supply shifts and US geopolitical tensions.
design win
- HPE secures US$1.2 B order from Vultr for first AMD Helios AI rack systems — DigiTimes, 2026-10-01HPE has secured a $1.2 billion order from Vultr to provide the first AMD Helios AI rack systems.
- HPE Secures Its 1st AMD Helios Order in $1.2B Deal with Vultr — HPCwire, 2026-09-30HPE has secured a $1.2 billion order from Vultr for AMD Helios-class rack-scale systems.
regulation
- Facilities are using 48E investment tax credits to make energy projects pencil out — Utility Dive, 2026-09-30Data center developers and energy projects are leveraging 48E investment tax credits to improve the financial viability of energy infrastructure and grid interconnection.
Covered this week
Parts: Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Utilities, IPPs & power providers signing data-center deals, Transmission, interconnection & grid equipment, 2.5D/3D advanced packaging, HBM, Leading-edge foundry, Server CPUs, Power shelves & PSUs, In-rack busbar & power whips, Rack PDUs, Data center developers, operators & REITs, General contractors & design-build, Structure, steel, precast, envelope, site equipment, Hyperscalers, neoclouds & model labs, Fab materials, masks, gases, ASIC design services, IP & EDA, Merchant GPUs / accelerators, Hyperscaler custom ASICs, NAND flash, Enterprise SSDs & controllers, MEP & electrical contractors, Startup accelerators, HDD, Renewables & long-duration storage hardware, Silicon photonics & co-packaged optics, Semiconductor test & burn-in, High-layer-count PCBs, Copper-clad laminate & PCB materials, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, Packaging & bonding equipment, Silicon wafers, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, UPS (static, modular, rotary/DRUPS) & UPS power semis, AI storage systems, Chip-level thermal: lids, heat spreaders, TIMs, Fans, 800 V DC architecture & solid-state transformers, DRAM, Memory modules, Fab equipment, Critical minerals: gallium, germanium, indium, tungsten, beryllium, Refrigerants & insulating gases, Fusion, Specialty glass & glass fiber, EMS, system integration & rack-level test, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Floor PDUs, RPPs, static transfer switches, ATS, Rack-scale systems, GPU baseboards & compute trays, Rare earths & permanent magnets, Scale-up fabric, Scale-out switch ASICs, Switch systems & white-box ODMs, Optical transceivers, Optics contract manufacturing, Optical DSPs, drivers, TIAs, Copper: DAC / ACC / AEC cables, Fiber, connectors, structured cabling, Gas supply chain, Gas turbines (onsite / behind-the-meter) & HRSGs, Energy storage: UPS batteries & BESS, Architecture, engineering & MEP design, DCIM, digital twins, capacity planning, CXL controllers & memory expanders, LV cable, wire, tray, raceway, Memory interface / buffer chips
Companies: Nanya, Intel, Microsoft, Tesla, Amazon (AWS), Nvidia, OpenAI, Synopsys, Kioxia, SanDisk, Cerebras, Yageo, Toshiba, Lambda, Micron, LS Electric, Samsung Electronics, SK Hynix, Together, Mitsubishi Electric, NetApp, Nebius, Digital Realty, Schneider Electric, Oracle, Tencent, Trane, Infineon, Shinko, Huawei, Castrol, Nippon Electric Glass, Schott, SemiAnalysis, Alibaba, MediaTek, Jabil, Applied Materials, Vultr, Unimicron, ASE Technology (ASE/SPIL), CoreWeave, Alliant, Zutacore, Ameren, Wood Mackenzie, Equinix, Lenovo, Vertiv
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