What Shinko makes for data centers
unknown
Ownership: 6967.T → JIC consortium
Exposure
1 part across 1 layer
No disclosed data-center revenue share on file.
Parts, by layer
Layer 1 — Compute silicon & packaging
| Part | Role | Confidence | Competitors | Note |
|---|---|---|---|---|
| ABF / high-layer package substrates | manufacturer | inferred | AT&S, Daeduck, Ibiden, Kinsus, LG Innotek, Nan Ya PCB |