AI data center supply chain news — week 40, 2026
159 items · 2026-10-05 to 2026-10-11 ·all news · newer: week 41, 2026 (340) · older: week 39, 2026 (116)
other
- India roundup: AI data center buildout accelerates as semiconductor push continues to broaden — DigiTimes, 2026-10-11India is experiencing an acceleration in AI data center construction as the country expands its semiconductor manufacturing capabilities.
- Episil chairman says SiC is not yet shifting from 6-inch to 8-inch — DigiTimes, 2026-10-11The chairman of Episil stated that the production of Silicon Carbide (SiC) remains on 6-inch wafers and has not yet transitioned to 8-inch wafers.
- Sandisk NAS 800 1.92TB SSD Review: Endurance at a premium — Tom's Hardware, 2026-10-11A review of the SanDisk NAS 800 1.92TB SSD focuses on its endurance and performance for storage applications.
- Researchers work out how to control 2D semiconductor growth for future chips — The Register, 2026-10-11Researchers have developed a method using oxygen to control 2D semiconductor crystal growth for future chip manufacturing.
- Sponsored: Why do liquid-cooled AI data centers require different backup power strategy? — Data Center Dynamics, 2026-10-10The article discusses how the high power density and rapid load fluctuations of liquid-cooled AI data centers necessitate specialized backup power strategies and hardware.
- Sponsored: Wärtsilä, Schneider Electric, and Stanley Consultants launch coordinated approach for faster US data center power delivery — Data Center Dynamics, 2026-10-10Wärtsilä, Schneider Electric, and Stanley Consultants have launched a collaborative model to streamline data center power infrastructure delivery by integrating onsite generation and electrical engineering services.Large power transformers (345–765 kV) & substations, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Backup generation: gensets, fuel systems, HVO, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Utilities, IPPs & power providers signing data-center deals, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Schneider Electric, Wärtsilä
- TPCA Show 2026 to spotlight AI computing, Unimicron chair keynote — DigiTimes, 2026-10-10The TPCA Show 2026 will feature a keynote from Unimicron focusing on advancements in substrate materials and high-layer-count packaging for AI computing.
- Semco moves glass substrates to package-level testing — DigiTimes, 2026-10-10Semco is transitioning the testing of glass substrates to the package level.
- SK Hynix sends memory chips into orbit for testing — DigiTimes, 2026-10-10SK Hynix is launching memory chips into space to conduct orbital testing.
- Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst — DigiTimes, 2026-10-10An analyst from Yole highlights Malaysia's growing role in the semiconductor supply chain, specifically noting the importance of advanced packaging technologies driven by AI demand.
- Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI — EE Times, 2026-10-09GlobalFoundries is leveraging its FDX fusion technology to support the manufacturing of high-performance silicon for physical AI applications.
- Google's VP of global infrastructure and capacity Bikash Koley heads to TPU neocloud Crux AI — Data Center Dynamics, 2026-10-09Google's VP of global infrastructure and capacity, Bikash Koley, is joining the TPU-based neocloud Crux AI.
- Mexican authorities seize cryptomine amid suspected cartel funding links — Data Center Dynamics, 2026-10-09Mexican authorities seized a large-scale cryptocurrency mining operation consisting of over 1,000 units linked to organized crime.
- Solid-State Transformers: Accelerate Your SST Design — EE Times, 2026-10-09The article highlights the acceleration of Solid-State Transformer (SST) designs for power applications.
- xAI's Michael Roberson joins OpenAI infrastructure team as commissioning program manager — Data Center Dynamics, 2026-10-09Michael Roberson is joining OpenAI's infrastructure team to manage commissioning programs for their data center operations.
- Sponsored: Lithium-Ion vs Lead-Acid battery technology: A comprehensive overview of fire risks — Data Center Dynamics, 2026-10-09The article provides a comprehensive comparison of fire risks and technical specifications between lithium-ion and lead-acid battery technologies.
- Growing pains: how distributed AI training changes the network between datacenters — The Register, 2026-10-09The article discusses how distributed AI training requirements are necessitating more robust and low-latency network architectures between data centers.
- How colocation providers find and reclaim stranded power capacity — Data Center Dynamics, 2026-10-09The article discusses strategies used by colocation providers to identify and utilize underused electricity capacity within existing power grids to support data center expansion.
- Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems — EE Times, 2026-10-09The article discusses the technical challenges of data movement in multi-die systems, highlighting that interconnecting chiplets is only one part of the architecture required for high-performance computing.
- Sponsored: How 800 VDC could change the liquid cooling game — Data Center Dynamics, 2026-10-09The article discusses how 800V DC electrical architecture could optimize power distribution and heat management for liquid-cooled data centers.
- PPPL Partners on Genesis Mission Project to Build AI Digital Twin for Fusion Energy — HPCwire, 2026-10-09PPPL is partnering on the Genesis Mission Project to develop an AI-powered digital twin for fusion energy.
- Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D — DigiTimes, 2026-10-09Applied Materials and Intel are collaborating to address AI chip bottlenecks by focusing on interconnect scaling and Foveros 3D packaging technologies.
- NASA taps DoE to help it build nuclear space reactors — The Register, 2026-10-08NASA is partnering with the Department of Energy to develop nuclear space reactors.
- Why Custom Silicon Matters in AI Data Centers — EE Times, 2026-10-08The article discusses the importance of custom silicon and ASICs for optimizing performance and efficiency in AI data center infrastructures.
- High-severity Nvidia bug could crash GPU monitoring on exposed servers — The Register, 2026-10-08A high-severity bug in Nvidia GPUs may cause monitoring systems to crash on exposed servers.
- DCD Studio: Market models for SMRs with Rosa Rotko, Mott MacDonald — Data Center Dynamics, 2026-10-08A discussion regarding market models for Small Modular Reactors (SMRs) in the context of data center power needs.
- Optical illusion: Is co-packaged optics the savior the data center industry has been waiting for? — Data Center Dynamics, 2026-10-08The article discusses the potential of co-packaged optics (CPO) to address data center industry challenges.
- Waste heat from Goodman data center in Frankfurt, Germany, to power district heating system — Data Center Dynamics, 2026-10-08The data center operator Goodman is utilizing waste heat from its Frankfurt facility to provide thermal energy for a local district heating system.
- 4-hour storage cheaper than gas peakers across global markets: WoodMac — Utility Dive, 2026-10-08A market analysis by Wood Mackenzie indicates that 4-hour duration energy storage systems are now more cost-effective than gas peaker plants in several global markets.
- Ukrainian drones hit Russia's Yandex data centers housing two top supercomputers — Tom's Hardware, 2026-10-08Ukrainian drones targeted Russian data centers that host high-performance computing systems.
- Breaking the AI Infrastructure Power Wall: From Grid to xPU — EE Times, 2026-10-08The report discusses the critical infrastructure requirements for AI hardware, specifically focusing on the electrical grid, power transformers, and the shift toward high-voltage DC architectures and onsite power generation.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Utilities, IPPs & power providers signing data-center deals, Transmission, interconnection & grid equipment, Hyperscaler custom ASICs, Navitas
- AUO subsidiary Darwin shifts toward high-end manufacturing, explores CPO and semiconductor opportunities — DigiTimes, 2026-10-08AUO's subsidiary, Darwin, is pivoting toward high-end manufacturing with a focus on co-packaged optics (CPO) and advanced semiconductor packaging opportunities.
- Marvell's custom AI chip upgrade points to a broader fight over peripherals — DigiTimes, 2026-10-08Marvell is highlighting the importance of custom silicon and high-speed interconnect peripherals in the broader AI infrastructure landscape.
- Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing — HPCwire, 2026-10-07Applied Materials and Intel are collaborating on manufacturing innovations to support the production of high-performance chips required for AI computing.
- Openreach taps Ciena for 1.6Tbps WaveLogic 6 technology — Data Center Dynamics, 2026-10-07Openreach has selected Ciena's WaveLogic 6 technology to support 1.6Tbps coherent optical networking for its infrastructure.
- Engineering Reliability: Power Architectures for High-Performance Burn-In — EE Times, 2026-10-07The report discusses the engineering requirements for power architecture and reliability during high-performance stress testing and burn-in for data center hardware.
- DCD Studio: The rise of US nuclear power, with Mark Gusakov, The Digital Infrastructure Alliance — Data Center Dynamics, 2026-10-07The news discusses the growing integration of US nuclear power and small modular reactors (SMRs) to support data center power demands.
- Quantum firm Xanadu partners with GlobalFoundries for photonic component development — Data Center Dynamics, 2026-10-07Quantum computing company Xanadu has partnered with GlobalFoundries to develop photonic components, likely leveraging advanced foundry capabilities for silicon photonics.
- Intel and Applied Materials to collaborate on chip manufacturing advancements — Data Center Dynamics, 2026-10-07Intel and Applied Materials are collaborating to develop new manufacturing technologies and equipment for advanced chip production.
- Samsung SDI builds dual-track battery strategy with LFP supply deal, solid-state push — DigiTimes, 2026-10-07Samsung SDI is pursuing a dual-track battery strategy involving an LFP supply deal while simultaneously pushing for solid-state battery development.
- DIGITIMES Insight: HBM expansion raises the bar for memory offload — DigiTimes, 2026-10-07The expansion of HBM (High Bandwidth Memory) capacity is being analyzed as a critical factor for improving memory offload capabilities in AI computing.
- AMD expands Korea push after Taiwan supply talks — DigiTimes, 2026-10-07AMD is expanding its presence in Korea following supply chain discussions regarding its manufacturing and distribution in Taiwan.
- Huawei's NPO bet challenges CPO's path to AI scale — DigiTimes, 2026-10-07Huawei is positioning its NPO (Network Processor Optical) technology as an alternative to CPO (Co-packaged Optics) to address the scaling challenges of AI infrastructure.
- Exclusive: GaN defends fast-charging turf, eyes AI power as low-cost SiC pushes into consumer electronics — DigiTimes, 2026-10-07Gallium Nitride (GaN) technology is positioning itself to compete in the AI power space as Silicon Carbide (SiC) moves into consumer electronics.
- Canon courts India's chip projects as toolmakers jostle for an early foothold — DigiTimes, 2026-10-07Canon is seeking to establish a foothold in India's semiconductor manufacturing landscape as the country expands its chip production capabilities.
- Seagate, Toshiba reportedly compete for TDK's HDD head unit, a key AI storage link — DigiTimes, 2026-10-07Seagate and Toshiba are reportedly competing to secure a supply of HDD head units from TDK, which are essential components for high-capacity AI storage.
- Robots still can't build Nvidia's AI servers as well as people can — DigiTimes, 2026-10-07The article discusses the limitations of using robotics to assemble complex Nvidia AI server hardware compared to human manual assembly.
- Google teams with nuclear power giant to give reactors a tune-up — The Register, 2026-10-06Google is collaborating with a nuclear power provider to optimize existing reactor performance for data center power needs.
- Xanadu and GlobalFoundries Partner to Scale Photonic Quantum Chip Production — HPCwire, 2026-10-06Xanadu and GlobalFoundries have established a partnership to scale the production of photonic quantum chips.
- CXL-Connected MRAM Address AI Storage Latency — EE Times, 2026-10-06New research demonstrates that using CXL (Compute Express Link) to connect MRAM (Magnetoresistive Random Access Memory) can significantly reduce latency in AI storage systems.
- Firmus and CDC end 1.6GW Project Southgate collaboration, deploy just 42MW — Data Center Dynamics, 2026-10-06Firmus and CDC have terminated their collaboration on the 1.6GW Project Southgate, with only 42MW currently deployed.
- Cerebras' stock slide stops after Sam Altman calls it 'close partner' — DigiTimes, 2026-10-06Sam Altman described Cerebras as a close partner following a period of stock price volatility.
- Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks — DigiTimes, 2026-10-06Taiwan is positioning itself as a key manufacturing hub for silicon photonics and co-packaged optics (CPO) to address the massive power and density challenges of AI data centers.
- Samsung 9100 Pro SSDs slashed up to 41% while supplies last — huge price cuts hit all capacities from 1TB to 8TB — Tom's Hardware, 2026-10-06Samsung has announced significant price reductions of up to 41% on its 9100 Pro enterprise SSD lineup across all capacities.
- Samsung steps up HBM cooling as TSMC expands CoWoS — DigiTimes, 2026-10-06Samsung is increasing its focus on cooling solutions for High Bandwidth Memory (HBM) while TSMC continues to expand its CoWoS advanced packaging capacity.
- Jedec unveils new standard for silicon photonics reliability qualification and testing — DigiTimes, 2026-10-06JEDEC has introduced a new standard for the reliability qualification and testing of silicon photonics components.
- Kioxia CM9-R 15.36TB E3.S NVMe SSD Review — ServeTheHome, 2026-10-05The article provides a technical review of the Kioxia CM9-R 15.36TB E3.S NVMe SSD.
- Amazon, Constellation sign 20-year PPA to expand Maryland nuclear plant — Utility Dive, 2026-10-05Amazon has signed a 20-year power purchase agreement (PPA) with Constellation Energy to source carbon-free electricity from a nuclear power plant in Maryland to support its data center operations.
- Russian firm completes country's first 130nm-capable chipmaking tool, trails modern equipment by 25 years — Tom's Hardware, 2026-10-05A Russian company has finished manufacturing its first chipmaking tool capable of 130nm production, though the technology significantly lags behind current global standards.
- Maximizing efficiency: How commissioning and retro-commissioning facilities can strengthen grid resiliency — Utility Dive, 2026-10-05The article discusses how commissioning and retro-commissioning data center facilities can improve operational efficiency and enhance the resiliency of the electrical grid.
- Huawei counters chip-node limits with Ascend, SuperPoD and τ law — DigiTimes, 2026-10-05Huawei is positioning its Ascend accelerators and SuperPoD systems to navigate and counter international chip-node restrictions.
- Cheap SiC substrates ignite demand wave, reshape ecosystem — DigiTimes, 2026-10-05The availability of lower-cost Silicon Carbide (SiC) substrates is driving increased demand and restructuring the supply chain for power electronics and high-voltage components.
- TSMC, Intel named as Musk's Terafab ambitions face reality check — DigiTimes, 2026-10-05Elon Musk's Terafab initiative is facing practical challenges related to the manufacturing capabilities of TSMC and Intel.
- TSMC emerges as potential Terafab partner as suppliers see over 80% chance of Musk deal — DigiTimes, 2026-10-05Suppliers are evaluating TSMC as a potential partner for a large-scale manufacturing deal involving Elon Musk, with an estimated 80% probability of the deal closing.
- Applied Materials, Besi broaden packaging partnership for AI chip integration — DigiTimes, 2026-10-05Applied Materials and Besi are expanding their partnership to enhance packaging capabilities for AI chip integration.
- Weekly news roundup: Musk looms large as AI chip boom drives capacity expansion and geopolitical risks — DigiTimes, 2026-10-05The report highlights how Elon Musk's influence and the AI chip boom are driving significant data center capacity expansion while highlighting escalating geopolitical risks.
m and a
- Hyperscale Data plans Patriot BTC subsidiary for Bitcoin mining business — Data Center Dynamics, 2026-10-11Hyperscale Data is transferring its Montana data center operations to a newly formed subsidiary of Patriot for its bitcoin mining business.
- GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion — Tom's Hardware, 2026-10-08GlobalFoundries has signed a $2 billion, five-year agreement to manufacture silicon interposers in the United States for TSMC's CoWoS packaging technology.
- TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal — The Register, 2026-10-08TSMC has entered into a $2 billion agreement with GlobalFoundries to increase the production of silicon interposers within the United States.
- GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components — Data Center Dynamics, 2026-10-08GlobalFoundries has entered into a $2 billion, five-year agreement with TSMC specifically for the production of advanced packaging components.
- AMD seeks 'broader partnership' with Samsung as it looks to secure memory supply — Tom's Hardware, 2026-10-08AMD is pursuing a broader partnership with Samsung to ensure a stable supply of memory components for its products.
- SpaceX pursues US$40 billion Nvidia chip financing while Terafab charts path to AI compute independence — DigiTimes, 2026-10-08SpaceX is reportedly seeking $40 billion in financing to secure Nvidia chips while Terafab is working to establish independent domestic AI compute manufacturing capabilities.
- Infineon completes acquisition of C2i to expand AI data center power capabilities — DigiTimes, 2026-10-08Infineon has acquired C2i to bolster its position in providing power semiconductors and power management solutions for AI data centers.
- Wolfspeed secures conditional US$1.5B US defense loan for SiC, GaN expansion — DigiTimes, 2026-10-08Wolfspeed has secured a conditional $1.5 billion US defense loan to expand production of Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductors.
- Taiwan's Gemtek to help Dixon enter data center market through Indian optics venture — DigiTimes, 2026-10-08Gemtek is partnering with Dixon to facilitate their entry into the data center market via an optical components venture in India.
- Seagate and Toshiba battle for TDK's HDD head business, a critical hard drive component — Tom's Hardware, 2026-10-07Seagate and Toshiba are competing to acquire the hard drive head business from TDK, a critical component for high-capacity storage.
- Schneider-PTC deal targets industrial AI across the lifecycle — DigiTimes, 2026-10-07Schneider Electric and PTC have announced a strategic partnership to integrate industrial AI into the lifecycle management of physical infrastructure.
- DOE intends to loan Vistra $4.2B for nuclear fleet improvements — Utility Dive, 2026-10-06The Department of Energy (DOE) plans to provide a $4.2 billion loan to Vistra to facilitate improvements and expansions across its nuclear power fleet.
- Constellation, Google strike 890-MW nuclear deal in PJM — Utility Dive, 2026-10-06Google has signed a power purchase agreement with Constellation to source 890 megawatts of carbon-free electricity from a nuclear portfolio in the PJM interconnection.
- Schneider Electric drops $22.6B on PTC as datacenter boom rains money on infra companies — The Register, 2026-10-05Schneider Electric is acquiring PTC for $22.6 billion to bolster its infrastructure capabilities amidst the growing data center market.HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Gas turbines (onsite / behind-the-meter) & HRSGs, Utilities, IPPs & power providers signing data-center deals, Schneider Electric
- Ares ups investment in Sabey Data Centers — Data Center Dynamics, 2026-10-05Ares Management has increased its investment in Sabey Data Centers, a firm involved in data center development and operations.
- Tencent scores 100,000 offshore AI chip deal with Oracle for $7 billion despite climbing prices — Tom's Hardware, 2026-10-05Tencent has secured a $7 billion deal with Oracle for 100,000 offshore AI chips.
- Lite-On invests NT$8.85 billion in Kaohsiung expansion; subsidiary Leotek to acquire AmpUp — DigiTimes, 2026-10-05Lite-On is investing NT$8.85 billion to expand its facilities in Kaohsiung, while its subsidiary Leotek is acquiring AmpUp to strengthen its position in the substrate materials market.
capacity
- Cipher extends Barber Lake data center lease commitments to 20 years — Data Center Dynamics, 2026-10-10Fluidstack and an unnamed AI laboratory have entered into a long-term 20-year data center lease agreement managed by Cipher.
- JNTC bets US$259 million on glass substrates ahead of 2028 ramp — DigiTimes, 2026-10-10JNTC is investing $259 million to scale up its production of glass substrates, aiming for a full production ramp-up by 2028.
- Bitdeer expands Soluna mining agreement to 35MW — Data Center Dynamics, 2026-10-09Bitdeer has expanded its mining agreement with Soluna to include an additional 35MW of power capacity.
- Digital Realty begins work on KIX15 data center in Japan — Data Center Dynamics, 2026-10-09Digital Realty has commenced construction on the KIX15 data center facility in Japan.
- Anthropic-linked $366m data center project filed for in Cedar Creek, Texas — Data Center Dynamics, 2026-10-09Anthropic-linked entity filed for a $366 million data center project in Cedar Creek, Texas.
- Engie, LS Power land 2.1 GW in fast-track interconnection approval from PJM — Utility Dive, 2026-10-09Engie and LS Power have received fast-track interconnection approval for a 2.1 GW power project from the PJM interconnection market.
- PJM approves fast-track interconnection for 2.1 GW from Engie, LS Power — Utility Dive, 2026-10-09PJM has approved a fast-track interconnection for 2.1 GW of power capacity requested by Engie and LS Power.
- Bitdeer AI signs 67MW AI cloud agreement in Malaysia — Data Center Dynamics, 2026-10-09Bitdeer has signed an agreement to provide 67MW of power capacity for its AI cloud operations in Malaysia.
- GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Tom's Hardware, 2026-10-08GlobalFoundries has announced it will manufacture silicon interposers in the United States to support TSMC's CoWoS advanced packaging technology.
- Lam Research launches South Korea chip fund after 15,000-chamber milestone — DigiTimes, 2026-10-08Lam Research has reached a milestone of 15,000 chambers and is launching a chip fund in South Korea to expand its manufacturing equipment footprint.
- Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing — EE Times, 2026-10-08Rohm Semiconductor is expanding its back-end manufacturing capabilities to include more outsourced chip packaging and testing services.
- Bloom Energy SOFC system to support AOI's Taiwan expansion — DigiTimes, 2026-10-08Bloom Energy's Solid Oxide Fuel Cell (SOFC) systems will be deployed to support the power requirements of AOI's expanding data center presence in Taiwan.
- Hanmi wins rare Samsung order amid US$5 billion chip substrate expansion — DigiTimes, 2026-10-08Hanmi Semiconductor has secured a significant order from Samsung to expand its production capacity for chip substrates, supported by a $5 billion investment.
- AI demand drives Episil SiC V-shaped recovery as GaN and TVS capacity reaches full utilization — DigiTimes, 2026-10-08Episil reports a V-shaped recovery in Silicon Carbide (SiC) demand driven by AI, while Gallium Nitride (GaN) and TVS capacity are currently at full utilization.
- Samsung expands memory testing beyond Korea with US$4.08 billion Vietnam project — DigiTimes, 2026-10-08Samsung is investing $4.08 billion to expand its memory chip manufacturing and testing capabilities in Vietnam.
- AirTrunk plans additional $1bn investment in data center campus in Inzai, Japan — Data Center Dynamics, 2026-10-07AirTrunk is planning a $1 billion investment to expand its data center campus in Inzai, Japan.
- CoreWeave teams up with AdaniConneX for AI cloud region in India — Data Center Dynamics, 2026-10-07CoreWeave has partnered with AdaniConneX to develop a dedicated AI cloud region in India to support growing compute demands.
- Sigurd raises prices, signs long AI capacity contracts, eyes higher 2026 capex — DigiTimes, 2026-10-07Sigurd has announced price increases and the signing of long-term AI capacity contracts while projecting higher capital expenditure for 2026.
- Towa returns strategic chip packaging production to Japan as AI demand accelerates — DigiTimes, 2026-10-07Towa is relocating strategic chip packaging production to Japan to meet the surging demand for AI-related semiconductor packaging.
- India nears 2GW of data center capacity, but its racks were built for a pre-AI power load — DigiTimes, 2026-10-07India is approaching 2GW of data center capacity, though current rack infrastructure was designed for lower power densities prior to the AI boom.
- Google signs 3.6GW deal with Constellation to secure power in PJM service area — Data Center Dynamics, 2026-10-06Google has signed a 3.6 gigawatt power purchase agreement with Constellation to ensure reliable energy supply for its data centers in the PJM interconnection region.
- Applied Digital to develop 1GW data center campus in Finland — Data Center Dynamics, 2026-10-06Applied Digital is developing a 1GW data center campus in Finland to support AI workloads.
- EV charging company plans to deploy 100,000 Nvidia GPUs in pods at sites across the US — Tom's Hardware, 2026-10-06An electric vehicle charging company is planning to deploy 100,000 Nvidia GPUs organized in pods at various locations across the United States.
- LG lands 5GW North American data center cooling deal — DigiTimes, 2026-10-06LG has secured a major contract to provide cooling infrastructure for a 5GW data center project in North America.
- AMD to expand Taiwan supply chain investment as AI demand drives capacity needs — DigiTimes, 2026-10-06AMD is increasing its investment in the Taiwan supply chain to bolster production capacity in response to surging demand for AI hardware.
- Samsung secures customer backing for US$5B substrate expansion — DigiTimes, 2026-10-06Samsung has secured backing for a $5 billion expansion to increase its production capacity for high-layer package substrates.
- Solidigm expands Taiwan SSD production base to tap AI server supply chain — DigiTimes, 2026-10-06Solidigm is increasing its production capacity in Taiwan to support the growing demand for AI servers.
- AM Intelligence expands India AI infrastructure push with 20,000 more Nvidia Rubin GPUs — DigiTimes, 2026-10-06AM Intelligence is expanding its India AI infrastructure by adding 20,000 Nvidia Rubin GPUs.
- LB Semicon expands power chip capacity as Qualcomm production ramps up — DigiTimes, 2026-10-06LB Semicon is increasing its production capacity for power management chips to support the rising demand from Qualcomm's production ramps.
- Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances — DigiTimes, 2026-10-06Samsung is increasing production capacity for 2nm silicon wafers to support the rollout of next-generation Exynos processors.
- China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm — DigiTimes, 2026-10-06WG Tech is scaling up its glass substrate production capacity to 1 million square meters to compete with South Korean manufacturers.
- Applied Digital adds 75MW of capacity at Ellendale data center campus in North Dakota — Data Center Dynamics, 2026-10-05Applied Digital is expanding its data center capacity by adding 75MW at its Ellendale campus located in North Dakota.
- Tech giants push into Australia for AI data centers — DigiTimes, 2026-10-05Major technology companies are expanding their presence in Australia to establish data centers for AI infrastructure.
earnings
- Phison posts record September revenue as AI tops half of sales — DigiTimes, 2026-10-10Phison reported record revenue for September driven largely by its memory products, with AI-related sales exceeding half of its total revenue.
- Innodisk, Apacer post September 2026 revenue growth on AI demand — DigiTimes, 2026-10-09Innodisk and Apacer reported significant revenue growth driven by surging demand for memory products in the AI sector.
- Trane Technologies Schedules Third Quarter 2026 Earnings Conference Call — newsroom:trane, 2026-10-08Trane Technologies has scheduled its third quarter 2026 earnings conference call.
- Doosan bets big on China as CCL prices climb — DigiTimes, 2026-10-08Doosan is increasing its focus on the Chinese market as the prices for copper-clad laminate (CCL) continue to rise.
- Team Group posts record quarterly revenue as memory market tightens — DigiTimes, 2026-10-08Team Group reported record quarterly revenue amid a tightening supply environment in the memory market.
- Microloops sees 2027 growth as ASIC shipments near GPU crossover — DigiTimes, 2026-10-07Microloops anticipates significant growth in 2027 as its custom ASIC shipments approach the volume of GPU shipments.
- Tokyo Electron eyes record profit on chipmakers' spending boom — DigiTimes, 2026-10-07Tokyo Electron expects record profits driven by increased capital expenditure from semiconductor manufacturers.
- Mature-node DRAM momentum stays strong into 4Q26 — DigiTimes, 2026-10-07The market for mature-node DRAM remains strong with demand projected to continue into the fourth quarter of 2026.
- Quanta says September server dip is normal as revenue falls 23% from August — DigiTimes, 2026-10-07Quanta Computers reported a 23% revenue decrease in September compared to August, noting that the decline is a typical seasonal fluctuation.
- Samsung 9100 Pro SSD gets another price cut, up to 51% off — Tom's Hardware, 2026-10-07Samsung has reduced the price of its 9100 Pro enterprise SSD by up to 51%.
- Commentary: Largan earnings call spotlight — CPO, expansion and 4Q26 order momentum — DigiTimes, 2026-10-07Largan's earnings call highlighted their momentum in Co-Packaged Optics (CPO) and expansion plans for late 2026.
- Marvell raises 2028 revenue outlook to US$20 billion as AI connectivity expands — DigiTimes, 2026-10-07Marvell Technology raised its 2028 revenue outlook to $20 billion, driven by growing demand for AI connectivity infrastructure.
- Kingston retains 62% memory module share as B2B AI demand surges — DigiTimes, 2026-10-07Kingston reports maintaining a 62% market share in memory modules driven by increasing demand from the B2B AI sector.
- Repon revenue slips in September as Vera Rubin, ASIC slide rail shipments ramp up — DigiTimes, 2026-10-07Repon reported a decline in September revenue despite the ramping up of shipments for the Rubin and Kyber ASIC rail systems.
- ADATA posts record 3Q revenue as memory prices rise — DigiTimes, 2026-10-06ADATA reported record revenue for the third quarter driven by rising memory prices.
- BizLink revenue rises on European site restart, Interplex integration — DigiTimes, 2026-10-06BizLink reported a revenue increase driven by a European site restart and the integration of Interplex.
- HBM4 prices to nearly triple in 2027, memory makers see windfall margins spread — DigiTimes, 2026-10-06Memory manufacturers are expected to see significant profit margin expansion in 2027 as prices for HBM4 memory are projected to nearly triple.
- CHPT posts record quarterly revenue as chip test demand rises — DigiTimes, 2026-10-05CHPT reported record quarterly revenue driven by increasing demand for semiconductor chip testing.
- Samsung reportedly seeks more than triple HBM prices for 2027 as HBM4 ramps — DigiTimes, 2026-10-05Samsung is reportedly planning to significantly increase HBM prices for 2027 as production scales up for the HBM4 generation.
product launch
- Kioxia unveils E1.L SSDs for hyperscalers with up to 122.88TB capacity — Tom's Hardware, 2026-10-09Kioxia has announced the E1.L enterprise SSD line, featuring capacities up to 122.88TB, targeted at hyperscale customers.
- Xsight Labs Adds E1L to DPU Portfolio with Support for up to 200G — HPCwire, 2026-10-09Xsight Labs has announced the addition of the E1L DPU to its product portfolio, supporting speeds up to 200G.
- Xsight Labs E1L DPU for Lower-Power 200Gbps DPUs — ServeTheHome, 2026-10-08Xsight Labs has announced the E1L, a low-power 200Gbps Data Processing Unit (DPU) designed for high-efficiency networking.
- Kioxia LD4 E1.L QLC NVMe SSD Announced — ServeTheHome, 2026-10-08Kioxia has announced the LD4 E1.L QLC NVMe SSD, a high-capacity storage solution designed for enterprise applications.
- AMD's EPYC Verano AI host CPU will reportedly use a special SB1 socket — Tom's Hardware, 2026-10-08AMD's EPYC Verano AI host CPU is reportedly expected to utilize a specialized SB1 socket.
- Qisda's Aewin targets 200kW liquid-cooled AI servers — DigiTimes, 2026-10-08Qisda's Aewin brand is targeting the market with 200kW liquid-cooled AI servers designed for high-density data center deployments.
- HPE Accelerates Enterprise AI Innovation with Next-Gen AMD CPU-Powered Servers — HPCwire, 2026-10-07HPE has announced new enterprise AI servers powered by the latest generation of AMD CPUs.
- Hua Yang, Zeiss launch COSMA-M for chip metrology — DigiTimes, 2026-10-07Hua Yang and Zeiss have launched the COSMA-M system, a specialized tool for chip metrology in semiconductor manufacturing.
- Gigabyte W775-V10-L01 Hands-on Bringing NVIDIA GB300 Deskside — ServeTheHome, 2026-10-06Gigabyte showcased the W775-V10-L01 workstation, which features the NVIDIA GB300 architecture for high-performance computing.
- Gigaphoton debuts neon recycling system with claimed 50% recovery rate — Tom's Hardware, 2026-10-06Gigaphoton has launched a new recycling system designed to recover 50% of materials from optical components.
- Kepler Aims to Launch Energy-Saving Replacement for HBM in 2027 — EE Times, 2026-10-05Kepler announced plans to launch a new energy-efficient memory technology intended to replace HBM by 2027.
design win
- GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap — DigiTimes, 2026-10-09GlobalFoundries has secured a $2 billion deal from TSMC to manufacture interposers, addressing a supply gap in the US semiconductor packaging market.
- Samsung HBM4E wins NVIDIA nod for AI accelerator push — DigiTimes, 2026-10-09Samsung has secured a design win for its HBM4E memory to be used in NVIDIA's next-generation AI accelerators.
regulation
- Department of War dishes out $1.5 billion loan commitment to boost semiconductor supply chain — Tom's Hardware, 2026-10-08The Department of Defense has committed $1.5 billion in loans to strengthen the domestic semiconductor supply chain.
- US and 14 nations issue statement on overcapacity, target semiconductors — DigiTimes, 2026-10-08A coalition of countries, including the US, issued a joint statement regarding global semiconductor overcapacity and the necessity of securing semiconductor supply chains.
- States, renewable developers back MISO’s accelerated interconnection queue plan — Utility Dive, 2026-10-06Several states and renewable energy developers are supporting MISO's initiative to accelerate the interconnection queue for grid-connected projects.
- China's 15th five-year plan elevates PCB role in AI supply chains — DigiTimes, 2026-10-06China's 15th five-year plan aims to elevate the role of printed circuit boards (PCBs) within the artificial intelligence supply chain.
- Amazon warns $68 billion in blocked data centers threatens US AI lead — Tom's Hardware, 2026-10-05Amazon has issued a warning regarding the impact of bureaucratic delays and blocked permits on the construction of data centers necessary for maintaining the United States' leadership in AI.
- China's ASML DUV stockpile spurs calls to close export-control loophole — DigiTimes, 2026-10-05The Chinese government is being urged to address export-control loopholes regarding ASML's deep ultraviolet (DUV) lithography equipment.
supply constraint
- Nittobo expands glass cloth output as AI chip demand strains global supply — DigiTimes, 2026-10-06Nittobo is increasing production of glass cloth materials to meet the rising demand for glass-core substrates and reinforced materials used in AI chip packaging.
- 3.2T optical upgrade triggers PCB redesign, shrinking supplier pool to 3 — DigiTimes, 2026-10-06The shift to 3.2T optical interconnects is necessitating a redesign of server PCBs, which has significantly narrowed the viable supplier base to only three companies.
- Bangkok floods disrupt logistics for Taiwan PCB makers in Thailand — DigiTimes, 2026-10-05Flooding in Bangkok is causing logistics disruptions for Taiwan-based PCB manufacturers operating in Thailand.
- LPDDR5X supply tightens around AI servers, squeezing PCs, smartphones into 2027 — DigiTimes, 2026-10-05The supply of LPDDR5X memory is becoming constrained due to high demand from AI server applications, impacting the availability for the PC and smartphone markets until 2027.
- Samsung reportedly turns to Winbond for TV DRAM as legacy memory supply tightens — DigiTimes, 2026-10-05Samsung is reportedly sourcing TV DRAM from Winbond as the supply of legacy memory components becomes increasingly constrained.
Covered this week
Parts: Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Silicon wafers, Fab equipment, Fab materials, masks, gases, Enterprise SSDs & controllers, Leading-edge foundry, Power shelves & PSUs, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Large power transformers (345–765 kV) & substations, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Backup generation: gensets, fuel systems, HVO, Fuel cells, Utilities, IPPs & power providers signing data-center deals, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, DRAM, Memory modules, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, HBM, 2.5D/3D advanced packaging, Packaging & bonding equipment, Hyperscaler custom ASICs, 800 V DC architecture & solid-state transformers, Scale-up fabric, Scale-out switch ASICs, Switch systems & white-box ODMs, DCI / coherent optics, Transmission, interconnection & grid equipment, Direct-to-chip cold plates, Coolant distribution units, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Fusion, DCIM, digital twins, capacity planning, DPUs, Merchant GPUs / accelerators, SMRs, advanced reactors, components, fuel, ASIC design services, IP & EDA, Rack-scale systems, BMC & platform firmware, Silicon photonics & co-packaged optics, Optics contract manufacturing, Heat reuse & district heating interfaces, Renewables & long-duration storage hardware, NAND flash, HV switchgear, GIS, breakers, protection relays, MV/LV transformers, LV cable, wire, tray, raceway, Server CPUs, CRAH / CRAC / fan walls / in-row units, Semiconductor test & burn-in, Board-level power: VRMs, power stages, PoL, power semis, PCIe/CXL switches & retimers, Copper-clad laminate & PCB materials, EMS, system integration & rack-level test, Rack manifolds, Quick disconnects, Critical minerals: gallium, germanium, indium, tungsten, beryllium, Optical transceivers, Lasers, Optical DSPs, drivers, TIAs, Memory interface / buffer chips, HDD, Nuclear: existing fleet PPAs & restarts, Copper: DAC / ACC / AEC cables, Specialty glass & glass fiber, GPU baseboards & compute trays, Chassis, rails, rack enclosures, AI storage systems, Industrial & specialty gases, CXL controllers & memory expanders, Startup accelerators, Air handling, economizers, filtration, Facility water loop hardware, Water treatment, reuse, consumption, Refrigerants & insulating gases, High-layer-count PCBs, Motherboards, CPU trays, switch trays, Testing, commissioning & certification, Copper
Companies: SanDisk, Cipher, Fluidstack, Schneider Electric, Wärtsilä, Phison, Unimicron, Samsung Electro-Mechanics, SK Hynix, GlobalFoundries, Soluna, Digital Realty, OpenAI, Together, Anthropic, Engie, Kioxia, Commonwealth Fusion, Watts, Nvidia, Samsung Electronics, Applied Materials, Intel, Mott MacDonald, Wolfspeed, Wood Mackenzie, Navitas, Lam Research, Applied Optoelectronics, Bloom Energy, Infineon, Hanmi Semiconductor, Marvell, Doosan, Open Compute Project (OCP), Tokyo Electron, AirTrunk, Ciena, AdaniConneX, CoreWeave, Seagate, Toshiba, Quanta Computer, POSCO, Samsung SDI, Huawei, Canon, Foxconn (Hon Hai), Kingston, Gigabyte, Constellation, Applied Digital, Vistra, Amazon (AWS), Firmus (Sustainable Metal Cloud), ADATA, Cerebras, Nittobo, Bizlink, Renesas, Galaxy, Sabey, Oracle, Tencent, Microsoft, Lite-On, Winbond, Tesla
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.