AI data center supply chain news — week 41, 2026
340 items · 2026-10-12 to 2026-10-18 ·all news · newer: week 42, 2026 (306) · older: week 40, 2026 (159)
regulation
- 300-plus local data center bans have only delayed just three US projects — Tom's Hardware, 2026-10-18Numerous local data center bans have reportedly stalled just three planned data center projects in the US.
- Taiwan targets illicit AI server exports to China with five-year prison terms — Tom's Hardware, 2026-10-17Taiwan is amending its trade laws to classify AI servers and semiconductors as controlled exports, imposing potential prison sentences for violations.
- FERC proposes easing regulatory pathway for gas pipeline, LNG projects — Utility Dive, 2026-10-16FERC proposed easing regulations for gas pipeline and LNG projects to address infrastructure bottlenecks for getting natural gas to market.
- Reliability standards for AI data centers, crypto miners move closer to adoption — Utility Dive, 2026-10-15Proposed reliability standards for AI data centers and crypto miners require approval from NERC's board and federal regulators, applying to loads of 50 MW or more at 100 kV.
- EU seeks China deal to lift ASML supplier sanctions amid rare-earth crisis — DigiTimes, 2026-10-15The European Union is exploring a trade deal with China to lift sanctions on Sindlhauser Materials GmbH, a supplier in the ASML supply chain, in exchange for removing restrictions on a Chinese entity.
- SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China — DigiTimes, 2026-10-15SK Hynix is reportedly attempting to secure US approval for additional chipmaking equipment exports to its Chinese NAND flash facility by linking the request to plans for a new US-based manufacturing facility.
- Column: 3D memory could redraw chip competition, weaken US sanctions on China — DigiTimes, 2026-10-15The US government has implemented export restrictions on equipment and components used to manufacture high-density 3D NAND flash memory to limit China's access to advanced semiconductor manufacturing capabilities.
- US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders — DigiTimes, 2026-10-15The US Department of Commerce is urging chipmakers to prioritize domestic manufacturing capacity as the CHIPS Act strategy evolves to secure more domestic orders.
- FERC approves Duke large load transmission rules despite cost-shift concerns — Utility Dive, 2026-10-13The FERC approved Duke Energy's proposal for large load transmission rules, which aims to address grid capacity and infrastructure for significant power demands.
- FERC approves PJM's request to create data center database — Data Center Dynamics, 2026-10-13The Federal Energy Regulatory Commission (FERC) approved a request by PJM Interconnect to establish a database for data center power requirements while rejecting a proposal to specifically curtail data center power during grid stress.
- Memphis council delays decision on year-long data center moratorium despite protests — Data Center Dynamics, 2026-10-12The Memphis city council has delayed a decision on a proposed year-long moratorium on new data center developments in an area slated for xAI's data centers.
- Dominion-NextEra merger hearing focused on rates, data centers — Utility Dive, 2026-10-12A regulatory hearing was held to discuss the impact of the Dominion-NextEra merger on electricity rates and the expansion of data center power demands.
- The overlooked impact of India's new data center policy — Data Center Dynamics, 2026-10-12The report explores how India's new data center policy is expected to influence investment, infrastructure development, and the physical construction of data centers in the region.
- FERC rejects most of PJM’s large load interconnection plan — Utility Dive, 2026-10-12The Federal Energy Regulatory Commission (FERC) rejected a PJM Interconnection plan regarding large load curtailment due to concerns over state jurisdiction and discriminatory practices.
- Sponsored: Faster, cleaner data centers that withstand scrutiny — Data Center Dynamics, 2026-10-12New data centers face significant delays in grid connections and increasing community scrutiny regarding their impact on local energy systems and resources.
- Commentary: Could a 65% US-content rule redraw China's 3.2T optical supply chain? — DigiTimes, 2026-10-12The article discusses how a potential 65% US-content requirement could significantly impact the global optical supply chain, particularly regarding China's dominance in components like transceivers and lasers.
other
- Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains — DigiTimes, 2026-10-17Singapore aims to boost its semiconductor sector by focusing on advanced packaging, silicon photonics, and high-value manufacturing roles in global chip supply chains.
- Sponsored: The hidden costs: Why data center sustainability fails without operational discipline — Data Center Dynamics, 2026-10-17Achieving true data center sustainability requires sustained investment and strong operational discipline.
- Google's EMEA energy team hiring for range of new positions — Data Center Dynamics, 2026-10-17Google's EMEA energy team is hiring for various roles related to power and energy planning.
- Plans for data center in Moncalieri, Italy, put on hold by town mayor — Data Center Dynamics, 2026-10-17The proposed data center development in Moncalieri, Italy, has been temporarily paused by the local mayor.
- CATL targets 70GWh in sodium-ion ESS orders with European push — DigiTimes, 2026-10-17CATL aims to increase its market share in European energy storage systems using sodium-ion battery technology after signing an agreement with Intilion for 3GWh of projects.
- TECO targets AI data center growth with energy storage, transformers — DigiTimes, 2026-10-17TECO Electric and Machinery showcased its smart microgrid solutions and future plans for its power and energy business group at Energy Taiwan.
- SEMICON West 2026 Displays AI-Era Chipmaking, Workforce Development — EE Times, 2026-10-16The semiconductor industry is preparing its fabrication facilities and workforce to meet the demands of the AI era.
- Singapore's AI bet shifts from model race to deployment, resilience and trusted adoption — DigiTimes, 2026-10-16Singapore is shifting its focus in artificial intelligence from early experimentation to practical deployment, emphasizing enterprise use, sector change, and reliable access to computing power.
- Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain — DigiTimes, 2026-10-16SEMI's CEO predicts the semiconductor industry will achieve $2 trillion in revenue by 2035, driven by AI and quantum computing growth.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Leading-edge foundry, Silicon wafers, 2.5D/3D advanced packaging, Packaging & bonding equipment, Fab equipment, Fab materials, masks, gases, HBM, DRAM, Scale-up fabric, Scale-out switch ASICs, Optical transceivers, Silicon photonics & co-packaged optics, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Specialty glass & glass fiber
- DCN Warsaw 2026: Poland deserves a greater share of global data center capacity — Data Center Dynamics, 2026-10-16Poland's evolving energy profile positions it well to capitalize on the expansion of global data center infrastructure.
- Stranded natural gas could power offshore data centers — Data Center Dynamics, 2026-10-16A new partnership was formed involving Texas firms to potentially power offshore data centers using stranded natural gas.
- Meeza and Microsoft launch sovereign private cloud in Qatar — Data Center Dynamics, 2026-10-16Microsoft is launching a sovereign private cloud service using Azure Local infrastructure within Meeza's data centers in Qatar.
- NTT Global Data Centers weighs the price tag of not building fast enough — The Register, 2026-10-16NTT Global Data Centers notes that permitting processes, rather than hardware availability, may constrain the pace of the data center expansion driven by AI demand.
- Data Center Power a Prominent Highlight of OCP 2026 — EE Times, 2026-10-16The OCP Summit highlighted key components related to data center power, including power delivery boards, PSU designs, hot-swap controllers, and telemetry.
- LightEdge eyes data center project outside Des Moines, Iowa — Data Center Dynamics, 2026-10-16LightEdge plans a new data center project site in Boone, Iowa, encompassing ten acres of land.
- India's Odisha gov't approves $18.62m data center project — Data Center Dynamics, 2026-10-16The Odisha government in India approved a $18.62 million project intended to function as a disaster recovery data center.
- UK council launches heat network feasibility study for proposed data centers near Didcot Power Station in Oxfordshire — Data Center Dynamics, 2026-10-16A UK council is commissioning a heat network feasibility study for potential data centers near Didcot Power Station, with results expected next year.
- New York City Awards $29.2M to NYU for Quantum Fabrication Facility — HPCwire, 2026-10-16The New York City awarded $29.2 million to NYU to create a Quantum Fabrication Facility.
- Vietnam's CMC and Korea's Lotte partner to develop data centers — Data Center Dynamics, 2026-10-16CMC and Lotte have partnered to develop new data center facilities.
- Silicon is the easy part — Data Center Dynamics, 2026-10-16The story does not mention specific hardware components or supply chain status for inference at the Edge.
- Wolfspeed signs agreement with Infineon for supply off 200mm silicon carbide substrates — Data Center Dynamics, 2026-10-16Wolfspeed has entered into a multi-year agreement with Infineon to support the latter's shift to 200mm silicon carbide substrates for manufacturing.
- Experiment shows liquid metal TIM doesn’t dry out; it turns solid — Tom's Hardware, 2026-10-16Testing using an electron microscope demonstrated that the liquid metal used in thermal interface material does not dry out, solidifying when it contacts copper and nickel-plated coolers.
- Taiwan’s AI Ambitions Run into Talent Gap — EE Times, 2026-10-16AMD indicated that while Taiwan presents significant opportunities in rack-scale AI and physical AI markets, the primary bottleneck hindering progress may be the available talent.
- Thai cops bust 'audacious' cross-border fiberoptic cable running to Myanmar scam compound — Tom's Hardware, 2026-10-16Thai police dismantled a cross-border fiber-optic cable allegedly used for data theft directed toward Myanmar.
- Ukrainian drones hit Russian data centers, disrupting Russian apps and services — Tom's Hardware, 2026-10-16Ukrainian drones struck Russian data centers, causing disruptions to various Russian digital services and apps.
- Gemtek partners with Starman to make optical transceivers in US — DigiTimes, 2026-10-16Gemtek has partnered with Starman to manufacture optical transceivers within the United States.
- Taiwan to build industrial parks in US; Texas site already found — DigiTimes, 2026-10-16Taiwan plans to develop industrial parks in the US, with a specific location already identified in Texas.
- AI server tracker: semiconductor testing and design services rally on compute demand — DigiTimes, 2026-10-16The article discusses the rising demand for semiconductor testing and design services, driven by ongoing compute requirements in AI.
- ASE unveils 18 advanced packaging projects with three universities — DigiTimes, 2026-10-16ASE announced involvement in three advanced packaging projects with universities.
- Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU — DigiTimes, 2026-10-16Bolt Graphics is seeking $100 million in funding to compete with Nvidia and AMD in the GPU space using its Zeus GPU.
- AI Moves to System-Level Co-Design: How Can Taiwan Capture More Value — EE Times, 2026-10-16The article discusses the necessity for Taiwan to enhance its capabilities in system-level co-design for AI components, particularly involving GPUs, custom ASICs, and co-packaged optics.
- Samsung to break ground on second Texas chip fab in November — DigiTimes, 2026-10-16Samsung plans to start construction on a second chip fabrication plant in Texas in November.
- Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF — DigiTimes, 2026-10-16Samsung and SK Hynix plan to address AI memory limitations using zHBM and HBF technologies.
- Delta says AI power gap will drive standalone microgrids — DigiTimes, 2026-10-16Delta suggests that the increasing power demand from AI will necessitate the deployment of independent, localized microgrids.
- This is the AMD Helios HPE Juniper QFX5252 Switch Tray at OCP 2026 — ServeTheHome, 2026-10-16AMD showcased a Helios HPE Juniper QFX5252 Switch Tray at OCP 2026.
- Supermicro appoints Mark Long as chief financial officer — DigiTimes, 2026-10-16Supermicro has appointed Mark Long as its new chief financial officer to guide its expansion in AI and IT infrastructure.
- US chipmakers rely more on overseas production than supplier data suggests, SIA finds — DigiTimes, 2026-10-16The Semiconductor Industry Association reported that while US chipmakers source most of their equipment and materials from US, European, and Japanese firms, only 68% of the actual manufacturing or assembly occurs in those regions.
- Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China — DigiTimes, 2026-10-16The agreement between TSMC and GF suggests that advanced packaging techniques, such as those involving 2.5D/3D integration and interposers, are being applied to mature semiconductor nodes, which impacts the electronics supply chain.
- Charts: YMTC bets on premium eSSDs to take on Samsung — DigiTimes, 2026-10-16YMTC is betting that its premium enterprise SSDs will successfully compete against Samsung's offerings.
- AIDC white paper flags energy efficiency, power management as key to site selection — DigiTimes, 2026-10-16A white paper from AIDC highlighted energy efficiency and power management as crucial factors influencing data center site selection.
- TSMC details pricing, confirms agentic AI boosts CPU demand — DigiTimes, 2026-10-16TSMC provided pricing details and noted that agentic AI is expected to increase demand for CPUs.
- Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking — DigiTimes, 2026-10-16Chinese chip toolmakers are adopting hybrid bonding techniques as Huawei diversifies its technology focus beyond traditional transistor shrinkage.
- ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging — DigiTimes, 2026-10-16ASML's patent filings suggest a trend towards hybrid bonding within the semiconductor packaging equipment sector.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix showcased its vision for future AI infrastructure centered around memory-centric server systems at the OCP Global Summit 2026.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix showcased its future vision for AI infrastructure, emphasizing memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix unveiled its future vision for AI infrastructure, emphasizing memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix presented a vision for next-generation AI infrastructure focusing on memory-centric server systems at the OCP Global Summit 2026.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix presented its vision for next-generation AI infrastructure focusing on memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix presented its future vision for AI infrastructure, emphasizing the importance of memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix presented its future AI infrastructure vision at the OCP Global Summit, focusing on how next-generation memory technology may alleviate emerging data bottlenecks.
- MediaTek ASIC deal with ByteDance would expand data center push — DigiTimes, 2026-10-15MediaTek's partnership with ByteDance is expected to boost their expansion in data center capacity.
- Linde LienHwa tackles hydrogen transport dilemma with HaaS — DigiTimes, 2026-10-15Linde LienHwa is addressing the challenges of transporting hydrogen fuel through a Hardware-as-a-Service model.
- TSMC excludes CPUs from AI accelerator growth forecast — DigiTimes, 2026-10-15TSMC's AI accelerator growth forecast will exclude projections related to CPUs.
- Infrastructure Highlights from OCP Global Summit — HPCwire, 2026-10-15The OCP Global Summit provided updates covering the entire physical infrastructure scope of data center development.
- SK hynix denies playing hardball with Trump admin over 3D NAND fab — Tom's Hardware, 2026-10-15SK hynix reportedly linked the construction of a new Solidigm 3D NAND fab in the U.S. to the continued export of equipment to Solidigm's Dalian, China facility.
- Utilities can use AI to solve grid backlogs: AWS energy lead — Utility Dive, 2026-10-15AWS is exploring the use of AI to assist utilities in managing and solving issues related to grid backlogs.
- DCD Studio: A year of data center development with Matthew Baynes, Schneider Electric — Data Center Dynamics, 2026-10-15A discussion with Matthew Baynes of DCD Studio covered a year of data center development progress.
- DCD Studio: Filtering diesel generators for cleaner air with Senna Nijs, Multronic — Data Center Dynamics, 2026-10-15DCD Studio is focusing on filtering diesel generators to reduce air pollution emissions through work with Senna Nijs.
- Pause in US data center construction could lead to recession, BlackRock CEO warns — Data Center Dynamics, 2026-10-15The BlackRock CEO issued a warning that a slowdown in US data center construction could potentially trigger a recession.
- Colt DCS and RMZ start work on third facility at Mumbai campus, India — Data Center Dynamics, 2026-10-15Colt DCS and RMZ have begun work on their third data center facility at the Mumbai campus in India.
- Two workers killed, third injured, in explosion at Intel’s Kiryat Gat fab in Israel — Data Center Dynamics, 2026-10-15An explosion at Intel's fabrication facility in Kiryat Gat, Israel, resulted in two worker deaths and one injury.
- EU negotiates sanction swap with China to rescue critical ASML supplier — Tom's Hardware, 2026-10-15The EU is reportedly negotiating with China to lift trade restrictions affecting a German supplier of ASML, aiming to keep the company operational.
- TSMC sends scouts to check whether America's datacenters can deliver — The Register, 2026-10-15TSMC is assessing the readiness of US data centers regarding construction and power capabilities.
- Malicious Russian disinformation bot traffic barely flinches after Ukraine strikes Yandex data centers and auto-migration kicks in — Tom's Hardware, 2026-10-15Malicious bot traffic continued operating even after Ukraine struck Yandex data centers, leading to a decrease in legitimate bot traffic.
- OpenAI claims 100-plus secret files followed ex-employee back to Apple — The Register, 2026-10-15OpenAI alleges that a former employee transferred confidential hardware plans from Apple to OpenAI.
- TSMC confirms it is considering Terafab chipmaking expansion with Elon Musk — Tom's Hardware, 2026-10-15TSMC is considering expanding its chip manufacturing capacity beyond its existing sites in Arizona and Texas for a potential 'Terafab' project.
- Elon Musk calls out memory makers over 'extortionate' chip pricing, says Micron is playing smart for long-term loyalty — Tom's Hardware, 2026-10-15Elon Musk criticized memory manufacturers for charging exorbitant prices while suggesting Micron is acting in a strategically advantageous manner for future loyalty.
- Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking — EE Times, 2026-10-15A partnership involving Fraunhofer-IMS highlights the role of European low-volume semiconductor manufacturing in supporting global advanced chip production.
- Russian chipmakers demo homegrown RISC-V and Arm silicon with retro games — Tom's Hardware, 2026-10-15Russian semiconductor companies demonstrated custom CPU and SoC designs based on Arm and Elbrus architectures.
- City of New York awards NYU $29.2m to establish a Quantum Fabrication Facility — Data Center Dynamics, 2026-10-15The City of New York is providing $29.2 million to NYU for the creation of a quantum fabrication facility for chip manufacturing and testing.
- Japanese consortium bets on building bobbing bit barns — The Register, 2026-10-15A Japanese consortium plans to develop data centers on barges docked in ports to address the shortage of suitable land for data center construction.
- Two killed, one seriously hurt in explosion at Intel’s chip plant in Israel — Tom's Hardware, 2026-10-15An explosion caused by a suspected gas cylinder malfunction resulted in fatalities at Intel's Kiryat Gat semiconductor fabrication facility.
- Warm-water ready — Data Center Dynamics, 2026-10-15The report compares the performance and efficiency of two-phase versus single-phase direct-to-chip cooling solutions specifically on NVIDIA B200 server hardware.Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Nvidia
- Australia's SubCo to deploy new fiber route linking Sydney and Melbourne — Data Center Dynamics, 2026-10-15Australian company SubCo is planning to deploy a new fiber optic route connecting Sydney and Melbourne.
- Trump says Taiwan will buy 30% of LNG output from Alaska project; Taipei confirms plans but not final terms — DigiTimes, 2026-10-15Taiwan has reportedly agreed to purchase 30% of the liquefied natural gas (LNG) output from a planned Alaska pipeline project involving a $4.4 billion investment.
- Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows — DigiTimes, 2026-10-15The Touch Taiwan 2027 event is expanding its scope to include dedicated exhibitions for advanced packaging and silicon photonics technology to address AI and high-performance computing demands.
- LightEdge/Lumen-occupied data center in Austin, Texas, up for sale — Data Center Dynamics, 2026-10-15A fully-leased data center facility in Austin, Texas, occupied by LightEdge and Lumen, is currently available for sale.
- TSMC CEO says profitability has no ceiling, plans High-NA EUV adoption in 2030 — DigiTimes, 2026-10-15TSMC CEO C.C. Wei stated that high demand for AI accelerators ensures sustained profitability and announced plans to adopt High-NA EUV lithography by 2030.
- BrightRay looks to expand into US with 10MW prefab data center project in Indiana — Data Center Dynamics, 2026-10-15BrightRay has signed a letter of intent with an unnamed US partner to develop a 10MW prefab data center project in Indiana.
- Sponsored: What really breaks at 128K: Approaching fiber architectures at scale — Data Center Dynamics, 2026-10-15The article discusses the engineering challenges and systemic requirements of building high-density fiber architectures for large-scale AI infrastructure.
- Grid Modernization’s Hidden Cost: A Growing Attack Surface Few Are Watching — EE Times, 2026-10-15The expansion of grid modernization is increasing the cybersecurity vulnerabilities across both IT and operational technology networks.
- TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable — DigiTimes, 2026-10-15TSMC has officially confirmed it is in talks with Elon Musk's Terafab initiative regarding potential semiconductor manufacturing cooperation.
- China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan — DigiTimes, 2026-10-15Chinese semiconductor equipment manufacturer AMEC has announced a US$1.94 billion R&D plan to develop 102 new equipment models, expanding its portfolio into thin-film deposition and advanced packaging.
- SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips — DigiTimes, 2026-10-15SK Hynix is working toward a 2027 timeline for High-Bandwidth Flash (HBF) standards and exploring integrated DRAM-on-chip architectures for AI inference.
- Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints? — DigiTimes, 2026-10-15Huawei unveiled the architecture of its Kirin 9050 Pro chip, highlighting advancements in LogicFolding and hybrid bonding technologies for its upcoming roadmap.
- Synopsys CEO says fully autonomous AI chip design remains out of reach — DigiTimes, 2026-10-15Synopsys CEO Sassine Ghazi stated that while AI-assisted engineering and multi-agent coordination have advanced, fully autonomous AI chip design is not yet a reality.
- Intel says AI 'gold rush' is over, pushes prompt routing across open hardware — DigiTimes, 2026-10-15Intel announced at the OCP Global Summit that the era of massive, centralized AI models is shifting toward distributed prompt routing across open hardware.
- Taiwan Perovskite Solar Corp. deploys AI to optimize R&D, explore smart energy applications — DigiTimes, 2026-10-15Taiwan Perovskite Solar Corp. presented a new approach using AI to accelerate the development of perovskite technology for green power and smart energy applications.
- 2026 Net-Zero Taiwan: Linde LienHwa highlights oxygen combustion, hydrogen solutions for industrial decarbonization — DigiTimes, 2026-10-15Linde LienHwa is promoting oxygen-enriched combustion and hydrogen solutions to help industrial sectors in Taiwan reduce carbon emissions and improve energy efficiency.
- LX Semicon puts SiC patents up for sale as Novatek gains ground — DigiTimes, 2026-10-15LX Semicon is seeking buyers for a portfolio of silicon carbide (SiC) power semiconductor patents as it pivots away from its current business focus.
- Intel Israel fab explosion kills 1, seriously injures 2 workers — DigiTimes, 2026-10-15An explosion and fire occurred at an Intel wafer fab in Israel involving a potential chemical leak of nitrogen trifluoride.
- Onsemi and Sungrow deepen battery storage tie-up as demand rises for grid power — DigiTimes, 2026-10-15Onsemi's EliteSiC hybrid power modules are being integrated into Sungrow's PowerTitan 3.0 energy storage platform to enhance efficiency and reliability for utility-scale battery systems.
- Taiwanese chipmaker TASC targets 2027 growth with InP optical chips, glucose sensors nearing mass production — DigiTimes, 2026-10-15Taiwan-Asia Semiconductor Corporation (TASC) reports growth in optical communication chips (InP) for AI servers and increased demand for passive and protection components.
- Vietnam's FPT courts Toyota Tsusho unit to sell its power chips in Southeast Asia, India — DigiTimes, 2026-10-15FPT is establishing a distribution partnership with Toyota Tsusho to sell its in-house power semiconductors in Southeast Asia and India.
- AI chip complexity is widening opportunities for semiconductor equipment makers — DigiTimes, 2026-10-15Increased complexity in AI chip manufacturing, specifically regarding transistor density and interconnects, is driving higher demand for advanced semiconductor equipment.
- ASML hints at new 'T'-titled customer for 2029-2030 as Musk's Terafab lines up EUV tools — DigiTimes, 2026-10-15ASML indicated that a new customer starting with the letter 'T' is planning to acquire lithography tools for the 2029-2030 period.
- AI’s $9-Trillion Question — HPCwire, 2026-10-15The rapid growth of the AI boom is significantly inflating costs across the supply chain, including GPUs, CPUs, memory, networking, real estate, and power infrastructure.
- Axe Compute and Penguin Solutions Partner to Accelerate AI Infrastructure Deployments — HPCwire, 2026-10-14Axe Compute has partnered with Penguin Solutions to enhance its build-to-order program for large-scale enterprise AI infrastructure.
- Benchmark Electronics’ Thailand Operations Focus on High-Mix Manufacturing — EE Times, 2026-10-14Benchmark Electronics is expanding its high-mix electronics manufacturing capabilities in Thailand, leveraging flexible production and engineering expertise.
- Beyond Lithography: 3D Scaling Puts New Demands on Materials — EE Times, 2026-10-14ASM International discusses the critical role of materials and process innovations required to support increasingly complex 3D semiconductor packaging and scaling.
- DCD Studio: Powering data centers at scale with Hans Obermillacher, Panduit — Data Center Dynamics, 2026-10-14Panduit's Hans Obermillacher discusses the impact of AI-driven demand on data center infrastructure, including geographic shifts to the Nordic region and the necessity of scalable power and cabling solutions.
- Inside the Secretive AWS Networking Lab — ServeTheHome, 2026-10-14The report details a tour of a private AWS networking laboratory showcasing advanced innovations in management switches, high-capacity 102.4T switches, and optical technologies.
- OpenAI again shakes up data center leadership, with xAI exec Uday Ruddarraju to lead and Sachin Katti to leave — Data Center Dynamics, 2026-10-14OpenAI has announced a leadership change for its Stargate data center project, appointing Uday Ruddarraju from xAI to lead the initiative as Sachin Katti departs.
- DCD Studio: Manufacturing power systems with Michael Beagan, TES Power — Data Center Dynamics, 2026-10-14The discussion covers the importance of switchgear, power distribution, and modular power solutions for accelerating data center construction.
- Co-Packaged Optics Moves from Promise to Production Planning — EE Times, 2026-10-14Major industry players including Meta and Broadcom discussed the roadmap for co-packaged optics (CPO) production and the standardization of the OCI MSA to meet anticipated demand in 2028.
- New motherboards, old RAM, plenty of life left in yesterday's PCs — The Register, 2026-10-14The article discusses the resurgence of using DDR4 memory and older hardware for computing due to rising costs and software alternatives.
- Fossil fuel generation pipeline rebounds while new clean generation slows: EDF — Utility Dive, 2026-10-14EDF reported a rebound in the fossil fuel generation pipeline while new clean energy generation capacity is slowing.
- PJM plans to study SoftBank’s Ohio AI project under state agreement approach — Utility Dive, 2026-10-14PJM plans to analyze SoftBank's proposed AI facility in Ohio using a state agreement framework.
- Analyzing Intel's EMIB and Foveros advanced packaging roadmaps — Tom's Hardware, 2026-10-14The report analyzes the current status and future trajectory of Intel's EMIB and Foveros advanced packaging technologies.
- Akamai signs 13MW rooftop solar vPPA with EDP in Singapore — Data Center Dynamics, 2026-10-14Akamai signed a 13MW rooftop solar virtual power purchase agreement (vPPA) with EDP in Singapore to be delivered from a portfolio of 27 solar projects.
- 300mm fab equipment spending to hit US$227 billion by 2029, SEMI says — DigiTimes, 2026-10-14SEMI reports that spending on 300mm fabrication equipment is projected to reach $227 billion by 2029.
- Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026 — DigiTimes, 2026-10-14Kingboard Laminates has announced a 15% price increase for its thin-cloth laminates and prepreg materials, marking the eighth hike in 2026.
- Sponsored: Why power and zero capex go hand-in-hand as the data center’s real strategic asset — Data Center Dynamics, 2026-10-14AVK Capital is positioning energy as a critical strategic asset for data centers through an 'Energy as a Service' model.
- Taiwan IC substrate maker Xinxing halts some machinery after fatal workplace accident — DigiTimes, 2026-10-14Taiwanese substrate manufacturer Xinxing has suspended operations on certain machinery following a fatal workplace accident.
- AI chip competition shifts to data-center efficiency as memory, interconnect limits bite — DigiTimes, 2026-10-14The competition in AI chip development is pivoting toward data-center efficiency to overcome scaling limitations in high-bandwidth memory and interconnect speeds.
- Broadcom executive says chipmakers must tackle packaging, power limits together — DigiTimes, 2026-10-14A Broadcom executive emphasized that semiconductor manufacturers must simultaneously address advanced packaging challenges and power consumption limits to support next-generation hardware.
- AI accelerator growth shifts toward value as custom ASICs move upmarket — DigiTimes, 2026-10-14The growth of the AI accelerator market is shifting toward value-oriented custom ASICs for upmarket applications.
- Hua Hong forges strategic alliances with four Chinese chip equipment giants — DigiTimes, 2026-10-14Hua Hong Microsystems has established strategic partnerships with four Chinese semiconductor equipment manufacturers to enhance its production capabilities.
- Applied Materials CEO says AI race hinges on technology and capacity — DigiTimes, 2026-10-14The CEO of Applied Materials stated that the AI race's success depends on both technological advancement and available capacity in the semiconductor supply chain.
- Memory bottlenecks drive HBM shift to 8-layer stacks — DigiTimes, 2026-10-14Memory limitations are causing a shift toward using HBM stacks with eight layers.
- CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap? — DigiTimes, 2026-10-14CXMT aims to produce 4F² DRAM two years before Samsung, prompting discussion about China's ability to close the technology gap.
- KYEC signs advanced payment deal with Nvidia for US testing expansion — DigiTimes, 2026-10-14KYEC has entered into an advanced payment agreement with Nvidia to expand testing capabilities in the US.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The research discusses how NAND technology is evolving from pure storage toward computation via 3D FeNAND co-optimization.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The research discusses how NAND flash technology is evolving from a pure storage role into a computing component through 3D FeNAND co-optimization at IEEE.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The article discusses the advanced co-optimization of 3D FeNAND technology, suggesting NAND memory's expanding role beyond simple storage into computation.
- Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling — DigiTimes, 2026-10-14Samsung is integrating AI into daily life while LG showcased smart factories and cooling solutions relevant to data centers.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The article discusses the evolution of NAND flash memory from a pure storage component toward integration with computing capabilities through 3D FeNAND co-optimization at an IEEE event.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The research highlights that NAND flash memory is evolving from a mere storage component toward computing functionality through 3D FeNAND co-optimization.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14The research focuses on using 3D FeNAND technology to enable NAND flash memory to perform computations, extending its role beyond simple storage.
- TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration — DigiTimes, 2026-10-14Major chip manufacturers are collaborating on integrating next-generation technologies to advance AI chipmaking capabilities.
- [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE — newsroom:sk-hynix, 2026-10-14Research is exploring how 3D FeNAND technology can move beyond traditional storage functions and into computational applications.
- Applied Materials Brings Chipmakers Together at New EPIC R&D Center — HPCwire, 2026-10-13Applied Materials is opening a new EPIC R&D center to foster collaboration between chipmakers and enhance innovation in semiconductor manufacturing equipment and materials.
- Amperesand Aims to Smooth AI Data Center Power Spikes — EE Times, 2026-10-13Amperesand is developing power smoothing technology to mitigate load swings caused by AI workloads in data centers.
- Apple unleashes a swarm of Mac Minions to share GPU resources for large AI tasks — The Register, 2026-10-13Apple announced plans to use a collection of Mac Minions to collaboratively share GPU resources for substantial AI workloads.
- Battery system failures fell 98% in 7 years, but older systems need special care: report — Utility Dive, 2026-10-13The Electric Power Research Institute reports a 98% decrease in energy storage system failures over the last seven years attributed to technical and project improvements, though older systems may require retrofitting.
- Google data center strategic sourcing exec heads to OpenAI — Data Center Dynamics, 2026-10-13Google's strategic sourcing executive is joining OpenAI to focus on high-speed interconnects and rack power infrastructure.
- It's all good, man: Goodman Group CEO on his firm's global ambitions — Data Center Dynamics, 2026-10-13Goodman Group CEO Greg Goodman discusses the company's expanding global role and ambitions within the data center infrastructure market.
- Fire protection in data center construction — Data Center Dynamics, 2026-10-13The report highlights the strategic importance of incorporating passive fire protection during the early design phases of data center construction.
- Legrand to integrate Karman AI platform into data center PDUs and power shelves — Data Center Dynamics, 2026-10-13Legrand is integrating the Karman AI platform into its data center power distribution units (PDUs) and power shelves.
- Naver Cloud and FPT partner on AI buildout in Asia Pacific — Data Center Dynamics, 2026-10-13Naver Cloud and FPT are partnering to accelerate the development and deployment of AI data centers across the Asia Pacific region.
- Amazon Ring exec heads to Blue Origin to lead TeraWave network — Data Center Dynamics, 2026-10-13Blue Origin plans to develop a high-speed space link network to connect data centers.
- European datacenter boom threatens higher energy bills unless governments intervene — The Register, 2026-10-13Moody's analysts report that the rapid expansion of data centers in Europe could lead to significant electricity consumption, potentially straining power grids and increasing costs unless supported by government intervention.
- Oracle trucks in gas to support operations at Utah and Texas data centers - report — Data Center Dynamics, 2026-10-13Oracle is reportedly looking into gas supply options to support its data center operations in Utah and Texas, specifically to address stalled projects.
- DCD Talk: Critical power architectures for AI data centers with Mehdi Rajehi, ABB — Data Center Dynamics, 2026-10-13ABB's Mehdi Rajehi discusses how next-generation power architectures are being designed to support the scaling requirements of AI data centers.HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, 800 V DC architecture & solid-state transformers
- Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle — EE Times, 2026-10-13Fraunhofer and Swissbit are collaborating to address the shortage in the 'missing middle' of advanced packaging for high-performance computing and AI hardware.
- Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030 — DigiTimes, 2026-10-13Hua Hong is expanding its partnerships in chip manufacturing equipment to increase its market share in the specialty foundry sector by 2030.
- Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing — DigiTimes, 2026-10-13The article discusses the technological shift toward vertical stacking in memory manufacturing, specifically transitioning from 3D NAND to 3D DRAM architectures.
- Wistron, Wiwynn spotlight liquid-cooled AI compute, storage at OCP — DigiTimes, 2026-10-13Wistron and Wiwynn showcased liquid-cooled AI computing and storage solutions at the Open Compute Project (OCP) event.Rack-scale systems, EMS, system integration & rack-level test, Direct-to-chip cold plates, Coolant distribution units, Rear-door heat exchangers, Immersion cooling systems, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, CRAH / CRAC / fan walls / in-row units, Open Compute Project (OCP), Wistron, Wiwynn
- TSMC power plant funding talks still conceptual, says Taipower — DigiTimes, 2026-10-13Taipower states that discussions regarding the power infrastructure and funding for TSMC's fabrication plants remain in the conceptual stage.
- Fujitsu, New Mexico plan quantum research center with global industry implications — DigiTimes, 2026-10-13Fujitsu announced a plan to develop a quantum research center in New Mexico, highlighting the growth of specialized data center infrastructure for emerging compute technologies.
- Applied Materials opens R&D center to speed chipmaking for the AI era — DigiTimes, 2026-10-13Applied Materials is opening a new R&D center to accelerate chip manufacturing capabilities for AI-driven demand.
- DCD Studio: AVK's billion dollar investment into energy solutions, with Ben Pritchard, AVK — Data Center Dynamics, 2026-10-12AVK announced a $1 billion investment to develop innovative energy solutions for data centers, including microgrids and power infrastructure.Reciprocating engines & engine microgrids, Fuel cells, SMRs, advanced reactors, components, fuel, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs
- DCD Studio: Beyond the hype - Practical strategies for data center development with Nick Marlow, BCS — Data Center Dynamics, 2026-10-12Nick Marlow of BCS discusses the evolving European data center landscape, focusing on increasing power demands and site selection challenges.
- Which AI infrastructure option actually holds a boundary? — The Register, 2026-10-12The article discusses the architectural decisions and infrastructure boundaries for AI systems in the context of a meeting between HPE and NVIDIA.
- SoftBank eyes possible AI data center project in Borneo — Data Center Dynamics, 2026-10-12SoftBank is exploring the development of an AI data center project in Borneo in partnership with Grab and a government-owned oil and gas firm.
- Intel to phase out SGX after Xeon Diamond Rapids in favor of TDX — Tom's Hardware, 2026-10-12Intel announced that it will discontinue the SGX (Software Guard Extensions) feature following the Diamond Rapids Xeon generation, transitioning to TDX (Trust Domain Extensions).
- 160K customers without power in Southeastern US as Hurricane Isaias recovery enters third day — Utility Dive, 2026-10-12Following Hurricane Isaias, Florida Power & Light reported that grid modernization and underground line investments improved restoration speeds and minimized power outages.
- Number of data center fires and power failures has doubled since 2024 — Data Center Dynamics, 2026-10-12Data from the Energy Incident Register shows a significant increase in fire and power failure incidents related to power infrastructure since 2024.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, 800 V DC architecture & solid-state transformers, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, Fusion, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Gas supply chain
- Third strike on Yandex data center in Russia — Data Center Dynamics, 2026-10-12A data center facility operated by Yandex in Vladimir, Russia, was damaged during a drone strike.
- North America data center report: Midyear 2026 — Data Center Dynamics, 2026-10-12The report discusses the historical growth and community challenges surrounding the expansion of data centers in North America.
- Battery storage is scaling fast. Here’s how utilities can trust it to perform. — Utility Dive, 2026-10-12The article discusses the rapid scaling of battery energy storage systems (BESS) and how utilities can ensure their reliability for grid integration.
- Sponsored: Making every watt work — Data Center Dynamics, 2026-10-12nVent's David Wood discusses using real-time power intelligence to manage stranded data center capacity and optimize responsive infrastructure for AI.
- Samsung could unseat SK Hynix as HBM leader in 2027 — DigiTimes, 2026-10-12Samsung is positioned to potentially overtake SK Hynix as the primary market leader for high-bandwidth memory (HBM) by 2027.
- Taiwan semiconductor industry eyes landmark geothermal power deal exceeding 20MW — DigiTimes, 2026-10-12The Taiwanese semiconductor industry is pursuing a significant geothermal power purchase agreement for more than 20MW to support its energy needs.
- AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles — DigiTimes, 2026-10-12The integration of Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies is enabling power delivery systems to handle the megawatt-scale power requirements of modern AI racks.Board-level power: VRMs, power stages, PoL, power semis, Power shelves & PSUs, In-rack busbar & power whips, HV switchgear, GIS, breakers, protection relays, LV switchgear, switchboards, panelboards, Circuit protection, fuses, surge, grounding, UPS (static, modular, rotary/DRUPS) & UPS power semis, 800 V DC architecture & solid-state transformers, Critical minerals: gallium, germanium, indium, tungsten, beryllium
- Rapidus targets customers underserved by TSMC, but can it convince them to take the risk? — DigiTimes, 2026-10-12Rapidus is positioning itself as an alternative for customers who are currently underserved by TSMC's manufacturing capacity, though the company faces the challenge of convincing clients to adopt its technology.
- SK Hynix's US$299 billion chip plan faces military base hurdle — DigiTimes, 2026-10-12SK Hynix's $299 billion investment plan for semiconductor manufacturing in the United States is facing challenges related to its proximity to a military base.
- Taiwan manufacturers to showcase AI data center hardware at OCP summit in San Jose — DigiTimes, 2026-10-12Taiwanese manufacturers are scheduled to present various AI data center hardware components, including rack systems, cooling solutions, and power equipment, at the upcoming OCP Summit in San Jose.
- TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential — DigiTimes, 2026-10-12TSMC and ASML are collaborating on 12-inch photomasks to enable the full-field potential of High-NA EUV lithography for advanced chip manufacturing.
- Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity — DigiTimes, 2026-10-12Sigurd and Winstek are collaborating to enhance optical testing capabilities to meet the rising demand for high-speed AI connectivity.
- Former iPhone display plant in Japan reportedly to enter AI chip supply chain — DigiTimes, 2026-10-12A former iPhone display manufacturing facility in Japan is reportedly transitioning into the production of AI chips.
- Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation — DigiTimes, 2026-10-12The news covers production challenges for Terafab and Samsung's progress in validating HBM4E memory quality.
product launch
- Japan approves TSMC plan to make 3-nanometer chips at its second Kumamoto fab — DigiTimes, 2026-10-17Japan's METI approved an updated plan for TSMC to manufacture 3-nanometer logic chips at its second Kumamoto fab.
- Giga Computing Powers Scaleway’s New AMD Instinct GPU Services to Accelerate AI Workloads — HPCwire, 2026-10-16Giga Computing announced a partnership with Scaleway to deploy AI and cloud platforms utilizing AMD Instinct GPUs, providing the core servers for the compute infrastructure.
- Ericsson and Partners Launch Sferical One AI Supercomputer in Sweden — HPCwire, 2026-10-16Ericsson and several other major Swedish companies are beginning to utilize a new sovereign AI supercomputer in Sweden called Sferical One.
- BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead — DigiTimes, 2026-10-16BOE is testing its 24-layer glass substrates for AI chip packaging, although mass production is not yet expected.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix unveiled its vision for next-generation AI infrastructure, emphasizing memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix presented its future vision for AI infrastructure, focusing on next-generation memory-centric server systems.
- “Memory-Centric Server Systems Are the Future”: SK hynix Presents Its Next-Generation AI Infrastructure Vision at OCP Global Summit 2026 — newsroom:sk-hynix, 2026-10-16SK hynix unveiled its vision for next-generation AI infrastructure, focusing on memory-centric server systems.
- Nvidia unveils PTFE switch board at OCP, names Taiwan partners — DigiTimes, 2026-10-15Nvidia presented a PTFE switch board at OCP and announced partnerships with Taiwanese firms.
- Huawei Proposes Next-Gen OTN for AIDC-Centric All-Optical Network — HPCwire, 2026-10-15Huawei introduced a next-generation Optical Transport Network (OTN) designed specifically for AI/DC-centric all-optical networking applications.
- NTT deploys Nvidia GPU test cluster at Munich 2 data center — Data Center Dynamics, 2026-10-15NTT is deploying a test cluster featuring Nvidia GPUs at the Munich 2 data center.
- Sipeed reveals Chinese-made DGX Spark and Ryzen AI Halo rival, expected to cost $3,999 — Tom's Hardware, 2026-10-15Sipeed introduced the MaixStation, a system utilizing Axera's AX8860P and 128GB of LPDDR5X memory to compete with high-end accelerators like Nvidia's DGX Spark and AMD's Ryzen AI Halo.
- Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch — DigiTimes, 2026-10-15Samsung has reportedly finished developing 4F2 DRAM technology while China's CXMT plans to launch server memory using the same architecture by late 2026.
- Delta Electronics targets SOFC pilot production by year-end, partners with Great Taipei Gas on 550kW installation — DigiTimes, 2026-10-15Delta Electronics is preparing to launch an on-site solid oxide fuel cell (SOFC) power generation solution and its first physical solid-state transformer (SST) by the end of the year.
- Delta Electronics' 13.8kV SST gains traction in China, with US cloud giant testing AI data centre microgrids — DigiTimes, 2026-10-15Delta Electronics introduced a prefabricated 13.8kV solid-state transformer (SST) power solution designed for high-efficiency AI data center microgrids and manufacturing applications.
- Bull to Bring NVIDIA Vera and Vera Rubin Ultra NVL72 to Europe — HPCwire, 2026-10-14Bull is expanding its European portfolio with the NVIDIA Vera and Vera Rubin Ultra NVL72 liquid-cooled rack-scale platforms for AI training and inference.
- SK hynix to place custom tiny CPU cores in its SSD controllers to ease Arm load as drive speeds rocket — Tom's Hardware, 2026-10-14SK hynix is introducing custom 'H-TPU' tiny processor cores into its enterprise SSD controllers to offload routine I/O tasks from Arm-based CPUs to improve performance.
- Cisco, Nvidia team up to build fatter, faster pluggable — The Register, 2026-10-14Cisco and Nvidia are collaborating on a high-speed USFP optical pluggable module capable of reaching 12.8 Tbps.
- AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling — DigiTimes, 2026-10-14AVC introduced a 6MW in-row Coolant Distribution Unit (CDU) at the OCP Global Summit featuring predictive cooling capabilities.
- Samsung, AMD validate CXL memory for AI servers — DigiTimes, 2026-10-14Samsung and AMD have validated the use of CXL (Compute Express Link) memory for AI server applications.
- Cisco expands AI networking with new chips, SONiC, cross-site deployment — DigiTimes, 2026-10-14Cisco is expanding its AI networking capabilities by deploying new switches powered by high-performance silicon and the SONiC operating system across various data center sites.
- Cisco, Nvidia target high-speed optical interconnects with 4x USFP density — DigiTimes, 2026-10-14Cisco and Nvidia are collaborating on high-density optical interconnects featuring 4x USFP density for data center networking.
- MiTAC spotlights liquid cooling, open platforms for AI infrastructure — DigiTimes, 2026-10-14MiTAC showcased liquid cooling solutions and open platforms designed for advanced AI infrastructure requirements.
- Pegatron showcases rack-scale AI infrastructure at OCP Global Summit — DigiTimes, 2026-10-14Pegatron presented its rack-scale AI infrastructure during the OCP Global Summit.
- Upscale AI Launches Token Fabric to Make Rival AI Chips Work Together — HPCwire, 2026-10-13Upscale AI has launched Token Fabric, a software-hardware integrated solution designed to enable interoperability between competing AI accelerators and chips.
- Bolt Graphics Touts Hardware-Accelerated Physics Modeling on Zeus Test Chip — HPCwire, 2026-10-13Bolt Graphics announced a new test chip named Zeus designed to provide hardware acceleration for physics modeling.
- d-Matrix Announces Squadron Compute Clusters for AI Inference at Data Center Scale — HPCwire, 2026-10-13d-Matrix has launched the Squadron, a rack-scale compute cluster designed for high-density AI inference workloads in data center environments.
- Microchip Technology updates its networking and storage products to better support AI and HPC workloads — Data Center Dynamics, 2026-10-13Microchip Technology has updated its networking and storage product portfolio to support the specific infrastructure requirements of AI and High-Performance Computing (HPC) workloads.
- New USFP Pluggable Optics Form Factor for Higher Speeds from Cisco and NVIDIA — ServeTheHome, 2026-10-13Cisco and NVIDIA have announced a new USFP pluggable optics form factor designed to support higher data speeds.
- CXMT president says company’s first 4F² DRAM will be a server DDR5 RDIMM due by year-end — Tom's Hardware, 2026-10-13CXMT announced that its first 4F² architecture DRAM will be launched as a server-grade DDR5 RDIMM by the end of the year.
- SK Hynix unveils low-power processor design for SSDs — DigiTimes, 2026-10-13SK Hynix has introduced a new low-power processor design specifically intended for use in SSDs.
- ASML unveils Hyper NA EUV successor targeting 5nm single exposure — DigiTimes, 2026-10-13ASML has introduced a successor to its Hyper NA EUV machine designed to enable single exposure for 5nm nodes.
- Nvidia and Cisco unveil new optics design to help scale AI factories — DigiTimes, 2026-10-13Nvidia and Cisco have introduced a new optical design engineered to support the scaling requirements of AI data centers.
- Microsoft's 2nm Maia 300 completes cloud AI ASIC lineup, setting up 2027 server supply-chain boom — DigiTimes, 2026-10-13Microsoft has finalized its cloud AI ASIC lineup with the completion of the 2nm Maia 300 chip.
- Microsoft Boosts HBM Bandwidth by 2.5x with Maia 300 Accelerator — HPCwire, 2026-10-12Microsoft announced the Maia 300 accelerator, which features a 2.5x increase in HBM bandwidth for AI workloads.
- Marvell Unveils 2nd-Gen Structera X with Six-channel CXL 3.2 Memory Expanders for AI Inference — HPCwire, 2026-10-12Marvell has announced the second generation of its Structura X family, featuring six-channel CXL 3.2 memory expanders designed to support AI inference workloads.
- Intel's Crescent Island AI accelerator officially powers new GPU D-Series products — Tom's Hardware, 2026-10-12Intel has officially launched its Crescent Island AI accelerator as the foundational power source for its new GPU D-Series products.
- NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories — HPCwire, 2026-10-12NVIDIA and Cisco have launched a new pluggable optics form factor designed to enhance scalability for AI data centers.
- AMD Expands Open AI Infrastructure Portfolio with Helion Rack Design — HPCwire, 2026-10-12AMD has announced a new rack-scale infrastructure design in collaboration with Helion to support AI workloads.
- Microsoft Announces Maia 300, Its Next-Gen Custom AI Chip — HPCwire, 2026-10-12Microsoft has announced the Maia 300, its next-generation custom AI chip designed for high-performance computing.
- Intel’s Crescent Island AI Server GPU Gets a Name and Specs: Meet the Intel GPU D-Series — ServeTheHome, 2026-10-12Intel has announced the specifications and branding for its new D-Series AI server GPUs designed for data center applications.
- Micas Networks Unveils 3 102.4T Open Ethernet Platforms for AI Factories — HPCwire, 2026-10-12Micas Networks has launched three 102.4T Open Ethernet platforms designed for high-scale AI factory interconnects.
- Marvell Structera X 3406 and 3506 CXL 3.2 Memory Expanders — ServeTheHome, 2026-10-12Marvell has launched its Structura X 3406 and 3506 memory expanders, which support CXL 3.2 for high-speed memory expansion and pooling.
- AMD unveils Helion racks for AI agents at OCP summit — The Register, 2026-10-12AMD introduced Helion racks designed for AI agents, featuring CPU-only and mixed CPU/GPU configurations slated for release in November.
- Nvidia opens up Vera Rubin rack and tray designs to OCP — Data Center Dynamics, 2026-10-12Nvidia has released the rack and tray designs for its Vera Rubin generation to the Open Compute Project (OCP), highlighting a shift toward liquid cooling in the MGX 1.2 specification.
- Nvidia gears up to smash CPU hegemony as Vera starts shipping — Data Center Dynamics, 2026-10-12Nvidia is shipping its Vera platform, which features a discrete processor design intended to isolate agentic workloads from the NVL72 system to improve performance.
- GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET — Tom's Hardware, 2026-10-12GlobalFoundries has announced the development of a 7nm-class FDX Fusion process node using FD-SOI technology, with production slated to begin in 2028.
- Diamond-infused watercooling coldplates for 2,300W Nvidia Rubin drop temps by up to 22C — Tom's Hardware, 2026-10-12Frore has introduced a LiquidJet Diamond coldplate designed for high-power Nvidia Rubin chips to achieve significant temperature reductions in water-cooled AI server systems.
- AMD debuts Helion reference design for agentic AI servers with up to 32,768 Zen 6 ‘Venice’ cores — Tom's Hardware, 2026-10-12AMD has introduced the Helion reference design for agentic AI servers, featuring up to 32,768 Zen 6 'Venice' cores.
- Introducing AMD Helion, Agentic AI Compute at Rack Scale — newsroom:amd, 2026-10-12AMD has announced its new Helion platform, which is a rack-scale computing solution designed specifically for agentic AI workloads.
- Biren's BR20X GPU targets 1,024-chip AI systems, but US curbs cloud mass production — DigiTimes, 2026-10-12Biren has unveiled its BR20X GPU designed for 1,024-chip AI systems, though US export restrictions may impact its mass production capabilities.
- AMD EPYC 8005 SKU List and Value Analysis: Mainstream Sorano’s Big Stride — ServeTheHome, 2026-10-12AMD has released the SKU list and value analysis for the mainstream Sorano family of EPYC 8005 series server CPUs.
- CyberTAN enters 1.6T AI switch race with Marvell-backed platform — DigiTimes, 2026-10-12CyberTAN has launched a new platform designed for 1.6T AI switching, supported by Marvell Technology.
- CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals — DigiTimes, 2026-10-12CXMT has announced plans to launch 4F^2 DDR5 RDIMMs by 2026 to compete with existing server memory suppliers.
design win
- TSMC’s 3nm Kumamoto plan wins Japan’s approval, qualifying for up to $4.1 billion in aid — DigiTimes, 2026-10-17Japan's METI approved an updated plan for TSMC to build 3nm logic chips at its Kumamoto fab, qualifying it for significant financial aid.
- South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance — DigiTimes, 2026-10-15Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a Delta Electronics subsidiary.
m and a
- Taiwan Mask targets Japan's Kyushu chip expansion with US$4.75 million TCK acquisition — DigiTimes, 2026-10-17Taiwan Mask Corporation is expanding its business in Japan by acquiring TCK, a semiconductor equipment services provider, to bolster its presence beyond mask manufacturing.
- Optical switching startup Salience Labs raises $125m with AMD and Intel participating in round — Data Center Dynamics, 2026-10-16Salience Labs secured $125 million in a Series B funding round with participation from AMD and Intel to advance optical circuit switching technology.
- DayOne doubles Johor data center financing to MYR30 billion as billings pass 1GW — DigiTimes, 2026-10-16DayOne increased its financing for a data center in Johor to MYR30 billion, while also exceeding 1GW in billings.
- Japan Offers GlobalFoundries $21B for U.S. Fab Expansion — EE Times, 2026-10-15Japan has proposed a $21 billion investment to support the expansion of GlobalFoundries' U.S. fabrication facility.
- AEP in deal to buy up to 1.6 GW of Mainspring linear generators — Utility Dive, 2026-10-15AEP is in an agreement to acquire up to 1.6 GW of linear generators from Mainspring.
- Samsung, Applied Materials back startup targeting chip packaging warpage — DigiTimes, 2026-10-15Samsung Ventures and Applied Materials' venture arm invested in Flexcompute to develop simulation technology for predicting and managing deformation in advanced semiconductor packaging.
- AUO-backed Star Shining Energy targets 2028 IPO with shift from solar assets to energy technology — DigiTimes, 2026-10-15Star Shining Energy acquired Star Shining Enetek to expand its portfolio from solar assets into geothermal power, waste heat recovery, and energy storage.
- StarSeeds, Kaga Electronics target December 2026 AI server production in Japan — DigiTimes, 2026-10-15Kaga Electronics and StarSeeds entered a contract manufacturing agreement to produce AI servers in Japan with a target production date of December 2026.
- LS Electric secures $138m order to supply switchgear for Bloom fuel cells at Pennsylvania data center — Data Center Dynamics, 2026-10-14LS Electric has secured a $138 million contract to provide switchgear for Bloom Energy fuel cells at a data center in Pennsylvania.
- Adani and Jabil plan 50:50 JV to make AI data center hardware in India — DigiTimes, 2026-10-14Adani and Jabil are establishing a 50:50 joint venture to manufacture AI data center hardware within India.
- D-Wave signs quantum chip manufacturing deal with SkyWater Technologies — Data Center Dynamics, 2026-10-13D-Wave has entered into an agreement with SkyWater Technologies to manufacture specialized quantum chips.
- Simple Mining buys Sphere 3D cryptomine, grows Iowa footprint to 160MW — Data Center Dynamics, 2026-10-13Simple Mining has acquired Sphere 3D's cryptomine facility in Iowa, expanding its operational footprint to 160MW.
- Sponsored: VEIR raises $110 million Series C to accelerate commercialization of superconducting power delivery technology for AI data centers — Data Center Dynamics, 2026-10-13Veir raised $110 million in Series C funding to scale the manufacturing and deployment of superconducting power delivery systems designed for high-density AI data centers.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, LV switchgear, switchboards, panelboards, Busway / busbar trunking, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, 800 V DC architecture & solid-state transformers, Copper
supply constraint
- Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints — DigiTimes, 2026-10-17Samsung Electro-Mechanics' planned expansion for AI server substrate production is reportedly facing equipment supply constraints and longer delivery times from machinery manufacturers.
- CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment — DigiTimes, 2026-10-16CXMT plans to target DDR5 RDIMMs by the end of 2026, while SiCarrier is showcasing advanced chipmaking equipment from China.
- Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear — DigiTimes, 2026-10-16Intel did not comment on the expected output of its Israeli Fab 28 facility following a fatal explosion, creating uncertainty regarding the supply of CPUs.
- SK hynix reportedly playing hardball with Trump admin over 3D NAND fab — Tom's Hardware, 2026-10-15SK hynix is reportedly engaging in difficult negotiations with the Trump administration regarding its 3D NAND fabrication plant.
- ASML struggling to keep up with demand for chipmaking equipment as AI spending continues to boom — Tom's Hardware, 2026-10-15ASML reported that customer demand for its advanced chipmaking equipment is so strong due to AI spending that orders are being placed years ahead, potentially straining current capacity.
- US AI data center power shortages drive demand for hybrid solar, natural gas and geothermal systems — DigiTimes, 2026-10-15The rapid expansion of AI data centers in the US is causing grid strain and construction delays due to high electricity demands, prompting a shift toward hybrid power sources including solar, natural gas, and geothermal energy.Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, SMRs, advanced reactors, components, fuel, Utilities, IPPs & power providers signing data-center deals, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment, Gas supply chain, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs
- ASML holds back 2029-2030 orders and confirms first price increases as EUV shortage deepens — DigiTimes, 2026-10-15ASML is managing a growing order backlog for EUV lithography tools by transitioning to an allocation model for orders extending into 2029 and 2030 due to capacity constraints.
- LEO satellite boom strains supply chain amid AI data-center demand — DigiTimes, 2026-10-15The simultaneous expansion of LEO satellite constellations and AI data centers is creating supply chain strain and competition for power-related equipment and grid capacity.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, Circuit protection, fuses, surge, grounding, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Utilities, IPPs & power providers signing data-center deals, Transmission, interconnection & grid equipment
- Fossil generation pipeline rebounds while new clean generation slows: EDF — Utility Dive, 2026-10-14EDF reports that rising costs and supply shortages are causing delays and increased expenses in the construction of new gas-fired power plants for the energy grid.
- Nvidia GPU prices spike in Japan; prices up to 41% higher than Amazon US — Tom's Hardware, 2026-10-14Nvidia GPU prices in Japan have surged, reaching up to 41% higher than prices in the United States.
- Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs — DigiTimes, 2026-10-14The CEO of Cerebras stated that OpenAI transitioned to using Nvidia GPUs due to a significant capacity shortfall in alternative hardware offerings.
- SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027 — DigiTimes, 2026-10-14SK Hynix has reportedly deferred some HBM4 production equipment installations until 2027.
- ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028 — DigiTimes, 2026-10-14ASML reported record third-quarter sales for 2026, highlighting a significant capacity gap in the supply of equipment needed to meet soaring AI chip demand through 2028.
- Qualcomm says edge AI faces power, cost, and scale hurdles — DigiTimes, 2026-10-14Qualcomm indicated that edge AI implementations face challenges related to power consumption, operational cost, and scalability.
- LGES diversifies ESS equipment suppliers after Daejin Machinery default, court rehabilitation — DigiTimes, 2026-10-14LGES is diversifying its suppliers for Energy Storage System (ESS) equipment following the default of Daejin Machinery and subsequent court rehabilitation.
- SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration — DigiTimes, 2026-10-14SK Hynix and Micron are addressing AI memory limitations through the standardization and integration of HBM technology.
- AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck — DigiTimes, 2026-10-13While shortages of substrate materials for AI chips are beginning to ease, the industry is facing new bottlenecks related to the availability of advanced manufacturing equipment.
- Samsung's US$9B chip expansion faces funding, supply hurdles — DigiTimes, 2026-10-13Samsung is facing funding and supply chain challenges regarding its $9 billion chip production expansion.
- AI demand squeezes capacitor, resistor capacity as Taiwan suppliers eye price hikes — DigiTimes, 2026-10-13Taiwanese suppliers of capacitors and resistors are planning price increases due to soaring demand driven by the AI industry.
- Taiwan optical suppliers post record sales as Lumentum warns of shortages — DigiTimes, 2026-10-13Lumentum has issued a warning regarding supply shortages for optical components as Taiwan-based suppliers report record sales.
- Intel CEO warns AI hardware shortages could last up to 3 years — DigiTimes, 2026-10-13Intel's CEO has issued a warning regarding potential supply shortages in AI hardware that could persist for as long as three years.
- Samsung, SK Hynix accept ASML's 10% price hike in parts, report says — DigiTimes, 2026-10-12Samsung and SK Hynix have reportedly agreed to a 10% price increase from ASML for semiconductor manufacturing equipment and parts.
capacity
- Carrier Connect leases 4MW data center in Alpharetta, Georgia — Data Center Dynamics, 2026-10-16Carrier Connect is leasing a 4MW data center facility in Alpharetta, Georgia, which was previously owned by GE and is managed by Mapletree.
- Digital Realty eyes gigawatt-scale data center site outside Indianapolis, Indiana — Data Center Dynamics, 2026-10-16Digital Realty plans to develop a gigawatt-scale data center facility near Kokomo, Indiana.
- Taiwan raising $4 billion to build industrial park in Texas to support US chipmaking supply chain — Tom's Hardware, 2026-10-16Taiwan plans to build a $4 billion industrial park in Texas to help smaller Taiwanese companies expand their presence supporting major chipmakers.
- FICG eyes 4x optical communications capacity by 2027 — DigiTimes, 2026-10-16FICG plans to expand its optical communications production in Malaysia and China to meet anticipated AI demand, projecting a fourfold increase in capacity by 2027.
- Digital Realty tops out second data center in Seoul, South Korea — Data Center Dynamics, 2026-10-15Digital Realty has completed construction on its second data center facility in Seoul, South Korea.
- CtrlS plans 150MW data center in Bihar, India — Data Center Dynamics, 2026-10-15CtrlS has committed $1 billion to develop a 150MW data center in Bihar, India.
- TSMC bars capacity resale, aims to leave no AI money on the table — DigiTimes, 2026-10-15TSMC announced that it will not allow customers to sublease or resell their allocated wafer capacity to ensure maximum production for the high-demand AI chip market.
- FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines — DigiTimes, 2026-10-15FIC Group opened a new manufacturing facility in Malaysia to increase production capacity for 800G to 6.4T optical communication modules.
- PowerHouse & Big Watt secure approval for 1GW behind-the-meter campus in Taylor, Texas — Data Center Dynamics, 2026-10-15PowerHouse and Big Watt have received local approval for a 1GW natural gas-powered data center campus in Taylor, Texas.
- US DoD seeks partner to build $4bn "mission critical facility" and data center in Alabama — Data Center Dynamics, 2026-10-15The US Department of Defense is seeking a design-build contractor to develop a $4 billion mission-critical data center facility in Alabama by 2031.
- India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai — DigiTimes, 2026-10-15RRP Electronics has opened a new facility in Navi Mumbai for Advanced Wafer-Level Packaging (AWLP) and SIM/eSIM module production.
- Photonics quantum firm Orca Computing deploys PT-3 system at Digital Realty’s LHR19 data center — Data Center Dynamics, 2026-10-15Orca Computing has successfully deployed its PT-3 quantum system at Digital Realty's LHR19 data center, achieving operational status within 24 hours.
- Micron opens second Taiwan advanced packaging plant as HBM supply tightens — DigiTimes, 2026-10-15Micron Technology opened its second advanced assembly and test facility in Taiwan to expand packaging and testing capacity for high-bandwidth memory (HBM) to meet growing AI demand.
- Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem — DigiTimes, 2026-10-15GlobalFoundries has signed a multi-year agreement with TSMC to provide silicon interposer capacity for its CoWoS advanced packaging ecosystem at its Malta facility.
- OCP-recognized infrastructure spending forecast to hit US$800 billion by 2029, nearly triple prior estimate — DigiTimes, 2026-10-15IDC forecasts that global spending on Open Compute Project (OCP) recognized IT infrastructure equipment will reach approximately $800 billion by 2029.
- Genius Electronic Optical secures US$150 million 3M investment for optical communications — DigiTimes, 2026-10-15Genius Electronic Optical and 3M have partnered to expand the manufacturing capacity and development of optical communications components.
- Semiconductors to consume 30% of Taiwan's power by 2035 — DigiTimes, 2026-10-15Taiwan's semiconductor industry, including wafer fabrication, memory, and advanced packaging, is projected to consume 30% of the nation's total electricity by 2035 to meet rising demand for high-end servers.
- Application filed for 3.3 million sq ft data center campus in Augusta, Georgia — Data Center Dynamics, 2026-10-14A new application has been filed for a 3.3 million-square-foot data center campus in Augusta, Georgia, with a planned operational date in 2028/2029.
- GlobalFoundries to build and operate two new chip fabs in NY as part of $21bn US-Japan deal — Data Center Dynamics, 2026-10-14GlobalFoundries will construct and operate two new semiconductor fabrication facilities in New York as part of a $21 billion investment agreement with Japan.
- ASML’s EUV Expansion Runs Through Zeiss — EE Times, 2026-10-14ASML's expansion of EUV production capacity is dependent on Zeiss's ability to increase the production of qualified precision optics.
- Elon Musk's Terafab will reportedly receive its first EUV tool from ASML in mid-2027 — Tom's Hardware, 2026-10-14Elon Musk's Terafab will begin its manufacturing capabilities with the delivery of its first EUV lithography tool from ASML in mid-2027.
- TOK expands Koriyama photoresist capacity as AI chip demand rises — DigiTimes, 2026-10-14TOK is increasing its photoresist production capacity in Koriyama to meet growing demand from the AI chip sector.
- KYEC, Nvidia eye Texas site for US AI chip testing plant — DigiTimes, 2026-10-14KYEC and Nvidia are looking at a site in Texas to establish a facility for testing AI chips.
- Scaleway Deploys AI Supercomputer in Sweden with AMD Instinct MI355X GPUs — HPCwire, 2026-10-13Scaleway has deployed a new AI supercomputer in Sweden utilizing AMD Instinct MI355X GPUs to support large-scale AI workloads.
- Scaleway plans GPU cluster deployments in Sweden and Copenhagen — Data Center Dynamics, 2026-10-13Scaleway announced plans to deploy GPU clusters in Sweden and Copenhagen during its AI-Pulse 2026 event.
- Chinese AI companies buy 1 million Nvidia GPUs in a single year, report claims — Tom's Hardware, 2026-10-13Reports indicate that Chinese artificial intelligence companies have purchased 1 million Nvidia GPUs within a one-year period.
- Microsoft plans multi-gigawatt rollout of next-gen Azure Maia AI accelerator racks — The Register, 2026-10-13Microsoft is planning a multi-gigawatt deployment of its next-generation Azure Maia AI accelerator racks.
- Microscan plans Rs 3.5bn subsea cable landing station in Alibaug, India — Data Center Dynamics, 2026-10-13Fiber networking service provider Microscan is planning a Rs 3.5bn subsea cable landing station in Alibaug, India, to accommodate upcoming cable landings.
- Chemical firm turns data center operator, proposes 500MW site in Maharashtra, India — Data Center Dynamics, 2026-10-13A chemical company is pivoting to become a data center operator by proposing a 500MW facility in Maharashtra, India, with a planned $3.3 billion investment.
- Arvica Cloud plans liquid-cooled modular data center in Queensland, Australia — Data Center Dynamics, 2026-10-13Arvica Cloud is planning to deploy a liquid-cooled modular data center in Swanbank, Queensland.
- Taisic Materials expands SiC capacity for AI data centers, 8-inch markets — DigiTimes, 2026-10-13Taisic Materials is expanding its Silicon Carbide (SiC) production capacity to serve the power electronics and electrical equipment needs of AI data centers.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, UPS (static, modular, rotary/DRUPS) & UPS power semis, 800 V DC architecture & solid-state transformers, Foxconn (Hon Hai)
- Samsung sends yield engineers to Texas ahead of 2nm production ramp — DigiTimes, 2026-10-13Samsung is deploying yield engineers to its Texas facility to prepare for the production ramp of 2nm technology.
- Wistron expands Taiwan capacity with NT$8 billion investment — DigiTimes, 2026-10-13Wistron is investing NT$8 billion to expand its manufacturing capacity in Taiwan, which includes production for advanced packaging and server assembly.
- Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production — DigiTimes, 2026-10-13Nanya Technology has secured long-term agreements to cover up to 70% of its production capacity at its Pingtung 3D IC plant, which is scheduled to begin production in the second half of 2028.
- SWI raises €800 million for data center expansion — Data Center Dynamics, 2026-10-12SWI has secured €800 million in funding to expand its data center operations across the United States and Europe.
- FiveNines Group and Nexus Core Systems partner on 20MW data center in Morocco — Data Center Dynamics, 2026-10-12FiveNines Group and Nexus Core Systems have partnered to develop a 20MW data center facility located outside of Casablanca, Morocco.
- Nebius signs LOI with Volt for data center capacity in Rotterdam, the Netherlands — Data Center Dynamics, 2026-10-12Nebius has signed a letter of intent to lease data center capacity from Volt's 'AI Gigafactory' located in the Port of Rotterdam.
- Five-building data center campus proposed in Metter, Georgia — Data Center Dynamics, 2026-10-12A new five-building data center campus is proposed for development in Metter, Georgia.
- Samsung reportedly secures long-term contracts covering up to 80% of 2027 memory supply — DigiTimes, 2026-10-12Samsung has reportedly secured long-term contracts that will account for up to 80% of its memory supply for 2027.
- Chenbro Micom expands into Nvidia Vera Rubin rack-scale systems, 2026 revenue already tops full-year 2025 — DigiTimes, 2026-10-12Chenbro Micom is expanding its operations to include rack-scale systems for the Nvidia Vera Rubin architecture, with projected 2026 revenue exceeding its full-year 2025 figures.
- Sumitomo Bakelite expands packaging material production across Singapore, China — DigiTimes, 2026-10-12Sumitomo Bakelite is increasing its production capacity for packaging materials in Singapore and China to support growing demand.
- Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang — DigiTimes, 2026-10-12SJ Electronics is investing $70 million to construct a manufacturing facility in Penang to produce thermal materials.
- Lumentum says AI laser capacity is sold out into 2029 as hyperscalers help fund expansion — DigiTimes, 2026-10-12Lumentum reports that its AI laser production capacity is fully booked through 2029, driven by hyperscaler demand for optical components.
- Booked before launch, Tata's Dholera fab faces test of turning commitments into wafer volume — DigiTimes, 2026-10-12Tata Group's semiconductor fabrication facility in Dholera is facing pressure to convert pre-booked commitments into actual wafer production.
earnings
- South Korea's September ICT Exports Surge Past US$75B on AI Demand — DigiTimes, 2026-10-16South Korea's ICT exports reached over US$75 billion in September 2026, heavily supported by semiconductor exports that surpassed $60 billion due to global AI infrastructure spending.
- China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains — DigiTimes, 2026-10-16The article notes that while chip earnings are booming in China, there is a noted gap between the sustained high demand for AI processors and the diminishing price gains seen in DRAM and NAND flash.
- TSMC investor conference: TSMC lifts 2026 revenue growth forecast to 44%, 2nm expansion, new 3nm fab — DigiTimes, 2026-10-15TSMC has increased its 2026 revenue growth forecast to 44%, citing strong demand for AI and advanced process technologies at its leading-edge nodes.
- Aurotek posts record 3Q26 revenue, up 58% on automation demand — DigiTimes, 2026-10-15Aurotek Corp. reported a 57.93% year-over-year revenue increase driven by demand for automation equipment and subsystems from semiconductor and high-end AI server customers.
- AI server tracker: AIC accelerates as Taiwan's connector and chassis suppliers post uneven growth — DigiTimes, 2026-10-15Taiwanese server chassis and connector suppliers, including AIC and Chenbro, reported strong year-over-year revenue growth for the September period.
- AI server tracker: Taiwanese ODM/EMS players post NT$2.18T in September 2026, up 56% YoY — DigiTimes, 2026-10-15Major Taiwanese electronics manufacturers reported a significant year-over-year revenue increase in September 2026 driven by sustained demand for AI server hardware.
- Applied Materials CEO says agentic AI drives wafer demand — DigiTimes, 2026-10-15Applied Materials CEO Gary Dickerson reported that AI-driven demand for higher yields and increased wafer output is expected to drive over 20% revenue growth in related businesses.
- TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins — DigiTimes, 2026-10-15TSMC projects significant revenue growth for Q4 2026 driven by strong demand for advanced semiconductor manufacturing and the expansion of its 2nm production capacity.
- TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins — DigiTimes, 2026-10-15TSMC reported a record net profit for the third quarter of 2026, driven by high demand for advanced semiconductors used in artificial intelligence.
- Applied Materials targets US$5 billion advanced packaging revenue — DigiTimes, 2026-10-15Applied Materials projects over $5 billion in revenue from its advanced packaging business as AI chip demand drives the transition to multi-die designs.
- 32GB of DDR5 6000 RAM now costs $450 — Tom's Hardware, 2026-10-14The retail price for 32GB of DDR5 6000 RAM has reached $450.
- Nvidia's share of China's AI chips falls by a third while Huawei gains — DigiTimes, 2026-10-14Nvidia's market share in the Chinese AI chip sector has decreased by one-third as Huawei's market presence expands.
- Elon Musk says Micron is 'reasonable' on memory prices while others are 'extortionate' — DigiTimes, 2026-10-14Elon Musk commented on the memory market, stating that Micron's pricing is reasonable compared to other suppliers.
- CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix — DigiTimes, 2026-10-13Market competition from CXMT's expanding server DRAM production is creating pricing pressure and margin concerns for industry leaders Samsung and SK Hynix.
- AI server tracker: Taiwan's CCL, PCB and IC substrate suppliers see widening growth gap despite AI boom — DigiTimes, 2026-10-13Taiwanese suppliers of high-layer count PCBs and IC substrates are experiencing a widening growth gap despite the overall boom in AI server demand.
- AI server tracker: Supply, not demand, caps BMC growth as Aspeed's 2027 orders top this year's revenue — DigiTimes, 2026-10-13Aspeed's order book for 2027 has surpassed its current year's revenue, though supply constraints are currently limiting the growth of BMC (Baseboard Management Controller) sales.
- Nanya gross margin hits 85.7% as low-priced DRAM contracts roll off — DigiTimes, 2026-10-12Nanya reported a gross margin of 85.7% as the company transitioned away from lower-priced DRAM contracts.
- HTSI September revenue surges 150% as AI chip testing demand accelerates — DigiTimes, 2026-10-12HTSI reported a 150% revenue increase in September driven by heightened demand for AI chip testing.
Covered this week
Parts: Data center developers, operators & REITs, Prefab / modular data centers & power/cooling skids, Physical security & access, ASIC design services, IP & EDA, 2.5D/3D advanced packaging, Silicon photonics & co-packaged optics, DCIM, digital twins, capacity planning, Cluster management & GPU orchestration, Merchant GPUs / accelerators, Hyperscaler custom ASICs, Leading-edge foundry, Site selection, power procurement, market intelligence, brokerage, Silicon wafers, General contractors & design-build, MEP & electrical contractors, Energy storage: UPS batteries & BESS, Fab equipment, ABF / high-layer package substrates, Substrate materials, Glass-core substrates, Interposers, silicon bridges, RDL, Large power transformers (345–765 kV) & substations, MV switchgear, E-houses, power skids, MV/LV transformers, Rack-scale systems, EMS, system integration & rack-level test, Chip-level thermal: lids, heat spreaders, TIMs, Semiconductor test & burn-in, Fab materials, masks, gases, Packaging & bonding equipment, HBM, DRAM, Scale-up fabric, Scale-out switch ASICs, Optical transceivers, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Specialty glass & glass fiber, Gas turbines (onsite / behind-the-meter) & HRSGs, Renewables & long-duration storage hardware, Utilities, IPPs & power providers signing data-center deals, Hyperscalers, neoclouds & model labs, Power shelves & PSUs, UPS (static, modular, rotary/DRUPS) & UPS power semis, Board-level power: VRMs, power stages, PoL, power semis, Gas supply chain, Heat reuse & district heating interfaces, Building management, controls, environmental sensors, FPGAs, NICs / SuperNICs, Fiber, connectors, structured cabling, Optics contract manufacturing, Optical DSPs, drivers, TIAs, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Enterprise SSDs & controllers, Memory modules, NAND flash, Architecture, engineering & MEP design, Server CPUs, CXL controllers & memory expanders, PCIe/CXL switches & retimers, Memory interface / buffer chips, Board-level connectors & sockets, Industrial & specialty gases, Floor PDUs, RPPs, static transfer switches, ATS, Power smoothing / supercapacitors, Reciprocating engines & engine microgrids, HV switchgear, GIS, breakers, protection relays, LV switchgear, switchboards, panelboards, Structure, steel, precast, envelope, site equipment, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Hoses, tubing, fittings, valves, Coolant distribution units, CDU internals: plate heat exchangers, pumps, filters, Rear-door heat exchangers, Immersion cooling systems, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Transmission, interconnection & grid equipment, Copper: DAC / ACC / AEC cables, Chassis, rails, rack enclosures, DCI / coherent optics, Circuit protection, fuses, surge, grounding, SMRs, advanced reactors, components, fuel, 800 V DC architecture & solid-state transformers, Fuel cells, DPUs, Lasers, Passives, Busway / busbar trunking, LV cable, wire, tray, raceway, Switch systems & white-box ODMs, Timing & telemetry silicon, HDD, CRAH / CRAC / fan walls / in-row units, Copper-clad laminate & PCB materials, Startup accelerators, In-rack busbar & power whips, Rack PDUs, Fire detection & suppression, Site utilities, water & fiber entrance, Copper, BMC & platform firmware, Chillers & compressors, Nuclear: existing fleet PPAs & restarts, Fusion, Critical minerals: gallium, germanium, indium, tungsten, beryllium
Companies: SemiAnalysis, Samsung Electro-Mechanics, Gigabyte, Intel, Microsoft, Digital Realty, Infineon, Wolfspeed, Foxconn (Hon Hai), Nvidia, Together, Samsung Electronics, SK Hynix, Delta Electronics, Supermicro, GlobalFoundries, Huawei, Shengyi, Shennan, Victory Giant, ByteDance, MediaTek, Linde, Helion, Open Compute Project (OCP), Amazon (AWS), Schneider Electric, BlackRock, Bloom Energy, Mainspring, Apple, OpenAI, Micron, CtrlS, Bizlink, Chenbro, Lumen, Applied Materials, Synopsys, onsemi, Sungrow, Entegris, ASM International, Panduit, Broadcom, SoftBank, Cisco, Tesla, LS Electric, Cerebras, Kingboard, Jabil, LG Energy Solution, MiTAC (Tyan), Pegatron, d-Matrix, Duke Energy, Legrand, Oracle, Walsin, Yageo, Lumentum, Aspeed, Wistron, Wiwynn, Fujitsu, Lenovo, Nanya, Marvell, Dominion, NextEra, Nebius, Sumitomo Bakelite, nVent, Indium, Shinko, Vicor
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.