AI data center supply chain news — week 42, 2026
306 items · 2026-10-19 to 2026-10-25 ·all news · older: week 41, 2026 (340)
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- Nvidia eyes converting old nuclear plants into massive AI data centers — Tom's Hardware, 2026-10-25
- AI data centers drive Taiwan's electrical firms into modular, EPC markets — DigiTimes, 2026-10-25
- ADT R27A-BK3 U.2 to PCIe Adapter Review — ServeTheHome, 2026-10-24
- This week on Tom's Hardware Premium: October 24, 2026 — Tom's Hardware, 2026-10-24
- Leaked video exposes how industrial-scale Chinese factories are dismantling RTX 5090s by the thousands to fuel AI servers — Tom's Hardware, 2026-10-24
- Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open — DigiTimes, 2026-10-24Nvidia's CEO stated that he does not anticipate a surplus in memory supply in the near term and maintained an open dialogue regarding collaboration with China's CXMT.
- AIDC launches Taiwan's largest industrial microgrid with 9MW/54MWh energy storage capacity — DigiTimes, 2026-10-24AIDC inaugurated a 9MW/54MWh large-scale microgrid system in Taichung, marking it as Taiwan's largest industrial behind-the-meter energy storage microgrid.
- Arm Comments on Jury Decision in Qualcomm Trial — EE Times, 2026-10-24Arm's comments on a Qualcomm trial decision highlighted the continuing relevance of open architectures like RISC-V for AI workload flexibility.
- MSI XpertStation WS300 Review NVIDIA DGX Station GB300 — ServeTheHome, 2026-10-23The article reviews the MSI XpertStation WS300, an AI solution built upon the NVIDIA DGX Station platform.
- Core Stack JV adds more data centers to €1bn Italy network — Data Center Dynamics, 2026-10-23The Core Stack JV is adding two more data centers to its existing €1 billion network in Italy, with the facilities currently in advanced planning.
- New Libyan telecom firm to launch data center in 2027 — Data Center Dynamics, 2026-10-23A new Libyan telecom firm plans to launch a data center in 2027, while construction continues on the Medusa subsea cable in Benghazi.
- Crown Castle bullish on carrier spectrum deployment, says it can support SpaceX's terrestrial dreams — Data Center Dynamics, 2026-10-23Crown Castle believes it can provide the necessary infrastructure support to help SpaceX realize its plans for terrestrial network deployment.
- Actyus, Adequita, and Nethits launch fund for Edge data centers - report — Data Center Dynamics, 2026-10-23Actyus, Adequita, and Nethits launched a fund targeting the development of edge data centers for closer proximity to businesses and government entities.
- Meta details Ohio Prometheus data center campus, with first phase live — Data Center Dynamics, 2026-10-23Meta has detailed its Prometheus data center campus in Ohio, with the first phase of the facility already operational.
- Oregon city declares state of emergency over lost data center revenue amid state-wide ban — Data Center Dynamics, 2026-10-23A local Oregon city is facing revenue loss due to a state-wide ban affecting data center operations.
- Solidigm confirms plans to build a fab in the US, abandons IPO plans — Tom's Hardware, 2026-10-23SK hynix has decided to build a 3D NAND fabrication facility in the United States and has canceled its initial public offering plans for Solidigm.
- Gigabyte Z890M Aorus Elite WiFi7 Motherboard Review: Icy-white SFF board offers full-size features for Intel — Tom's Hardware, 2026-10-23
- Russian finance ministry data center struck by Ukrainian forces — Data Center Dynamics, 2026-10-23A data center facility in Russia was damaged by Ukrainian forces.
- O-Green plans data center campus in Zaragoza, Spain — Data Center Dynamics, 2026-10-23A fund linked to Oman plans a €7.4 billion investment to build a data center campus in Zaragoza, Spain.
- Google's fiber unit to snap up dark fiber leasing contract from Ting Fiber in Colorado Springs — Data Center Dynamics, 2026-10-23Google's fiber unit is set to acquire a dark fiber leasing contract from Ting Fiber in Colorado Springs.
- Vertical Semiconductor awarded $73m in CHIPS Act funding to support vGaN transistor development — Data Center Dynamics, 2026-10-23Vertical Semiconductor received $73 million in CHIPS Act funding from the Department of Commerce to advance its vGaN transistor development.
- Amazon bows to local backlash over AI data centers, scraps plans to build four new facilities in Northern Virginia — Tom's Hardware, 2026-10-23Amazon cancelled plans for four new data center facilities in Northern Virginia after facing opposition from local residents and authorities.
- China can make advanced chips without EUV, but the bill keeps growing — Tom's Hardware, 2026-10-23Chinese manufacturers can push older DUV lithography to near 5nm using multiple patterning, but the associated costs and yield issues suggest future advancements will face economic limitations.
- Illegal Nvidia Blackwell Ultra B300 GPUs found inside state-owned China Telecom's network — Tom's Hardware, 2026-10-23A security firm discovered Nvidia Blackwell Ultra B300 AI chips operating within the China Telecom network, although the physical location of the restricted components remains unconfirmed.
- UK proposes 14-year prison sentences for undersea cable saboteurs amid Russian trawler threats — Tom's Hardware, 2026-10-23The UK government plans new legal powers to protect undersea cables in response to perceived threats from Russian vessels.
- Endeavour partners with US desalination firm Trevi to turn data center waste heat into clean water — Data Center Dynamics, 2026-10-23Endeavour is partnering with Trevi to convert waste heat from its US data center facilities into clean water.
- China-aligned hackers deploy AI agents in massive ConnectWise supply chain attack — Tom's Hardware, 2026-10-23
- Wolves roam into Finnish villages after Google destroys 1,300 acres of forest for AI data centers — Tom's Hardware, 2026-10-23Forest clearing for a Google data center development has caused local wolves to move into nearby Finnish villages.
- Battery power: On — Data Center Dynamics, 2026-10-23The article prompts discussion on advanced energy strategies needed to meet data center demand exceeding current grid capacity.
- DCD Talks: Unpacking the AI powertrain with Manav Patel, Schneider Electric — Data Center Dynamics, 2026-10-23Schneider Electric and DCD discussed how grid-to-chip power solutions are accelerating the deployment of resilient AI infrastructure to meet increasing power demands.
- Akashi secures $31.2m financing from EDB for Kazakhstan data center — Data Center Dynamics, 2026-10-23Akashi secured $31.2 million in financing from EDB for a data center in Kazakhstan, with the initial 10MW phase expected to be operational next year.
- Gigawatt-scale data center proposed for steel mill in Illinois — Data Center Dynamics, 2026-10-23TerraWatt is planning to build a gigawatt-scale data center at a former steel mill location in Illinois.
- Doosan Robotics targets automakers, chipmakers as Chinese rivals cut prices — DigiTimes, 2026-10-23Doosan Robotics is directing its sales efforts toward major automotive and semiconductor companies by developing advanced AI systems for complex factory operations.
- Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer — DigiTimes, 2026-10-23A union strike at Micron's Taoyuan facility temporarily paused after members voted against the company's proposed compensation package.
- Sponsored: Rethinking power infrastructure to scale AI data centers — Data Center Dynamics, 2026-10-23ABB suggests that rethinking data center power infrastructure could solve scaling challenges in the AI industry.
- Sponsored: Why is Kazakhstan building Central Asia’s first Tier IV data center? — Data Center Dynamics, 2026-10-23Kazakhstan is restructuring its energy market rules, moving away from cryptocurrency mining, to attract high-density artificial intelligence workloads to build a Tier IV data center.
- TSMC advances CoPoS packaging at Taoyuan Longtan site — DigiTimes, 2026-10-23TSMC is resuming development at its Longtan site to expand advanced packaging capacities, specifically focusing on CoPoS to support growing AI demand.
- Rapidus courts US AI customers ahead of planned 2H27 2nm mass production — DigiTimes, 2026-10-23Rapidus plans to commence 2nm chip mass production in the second half of 2027, with initial demand anticipated primarily from the US AI sector.
- FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions — DigiTimes, 2026-10-23The FCC granted Intel a waiver regarding foreign-made mobile robots to ensure continuity in chip production.
- Analysis: Nvidia's Vera CPU takes on Intel and AMD with a platform play — DigiTimes, 2026-10-23Nvidia secured a CPU supply order from Modal, challenging established CPU manufacturers like Intel and AMD by expanding its hardware offerings beyond accelerators.
- US signs up to US$389 million in CHIPS R&D deals for power chips and fusion — DigiTimes, 2026-10-23The US Department of Commerce awarded federal R&D funds totaling $389 million through the CHIPS Act to companies focused on power management semiconductors and related materials.
- Jensen Huang warns Europe risks falling further behind US, China in AI — DigiTimes, 2026-10-23Nvidia's CEO warned that Europe faces risks of falling behind the US and China in AI advancement, calling for faster adoption and eased regulations.
- AI cuts chip R&D cycles to 9 months, says Etron chair — DigiTimes, 2026-10-23The chairman of Etron stated that AI growth will rapidly increase the semiconductor industry's value and shorten chip development cycles to approximately nine months.
- Interview: TI sees liquid cooling shift to tray-level control in AI data centers — DigiTimes, 2026-10-23Texas Instruments stated that the trend in AI data centers is moving toward granular, tray-level thermal control rather than relying solely on centralized CDU management.
- India's CleanMax partners with Apple, Meta to supply green power for AI data centers — DigiTimes, 2026-10-23CleanMax's partnerships with major tech firms like Apple and Meta underscore the increasing global demand for renewable energy supporting AI data centers.
- LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing — DigiTimes, 2026-10-23LG Electronics is increasing its AI presence by integrating custom AI chips into home appliances and by spinning off a startup, PADO, to offer GPU compute leasing services.
- UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging — DigiTimes, 2026-10-23UMC and AP Memory partnered to develop next-generation power delivery solutions for AI data centers by integrating UMC's DTC silicon capacitor technology with AP Memory's design expertise for advanced packaging.
- Taiwan, UK expand offshore wind, CCUS energy cooperation — DigiTimes, 2026-10-23Taiwan and the UK increased cooperation on renewable energy sources, including offshore wind and carbon capture, across multiple policy and industry meetings.
- Lam Research sees WFE topping US$200 billion in 2027 — DigiTimes, 2026-10-23Lam Research forecasts that the wafer fabrication equipment market will exceed $200 billion in 2027, driven by growth in DRAM.
- From Cloud AI to Edge AI: How BIWIN Enables the Next Generation of Storage and Memory Solutions — EE Times, 2026-10-22BIWIN showcases its SSD, embedded storage, and memory offerings to support AI applications ranging from cloud data centers to edge devices.
- Microsoft files for data center campus in Floyd County, Georgia — Data Center Dynamics, 2026-10-22Microsoft has filed plans for a data center campus in Floyd County, Georgia, which will consist of three separate buildings.
- GPUs from stolen $470,000 Nvidia RTX 5090 shipment at Brazil airport appear for sale online, identified by serial numbers — Tom's Hardware, 2026-10-22Stolen Nvidia RTX 5090 GPUs from a shipment in Brazil have been spotted for sale online, with three airport employees identified as the thieves.
- Utilities turn to AI to manage rising power demand — from AI — Utility Dive, 2026-10-22AI's potential in utilities for tasks like maintenance and demand forecasting is limited by the lack of auditable and reconstructible AI outputs.
- Arbol launches moratorium risk insurance coverage — Data Center Dynamics, 2026-10-22Arbol introduced a new form of insurance coverage that will compensate if data center construction is suspended.
- Google signs 1GW virtual power plant deal with Voltus — Data Center Dynamics, 2026-10-22Google signed a deal with Voltus for a 1GW virtual power plant capacity.
- Canada's Uniserve to launch 1MW data center in Vancouver — Data Center Dynamics, 2026-10-22Uniserve is launching a one-megawatt data center facility in Vancouver.
- Former OpenAI head of data centers joins Nvidia to help lead DSX Platform team — Data Center Dynamics, 2026-10-22A former head of data centers from OpenAI has joined Nvidia to work on the DSX Platform team.
- Google supersizes PJM virtual power plant to more than 1 GW — Utility Dive, 2026-10-22Google expanded its participation in the PJM virtual power plant to exceed 1 GW, signaling a major shift for distributed resources in energy markets.
- How Goodram Validates DRAM and SSD Reliability in Europe — EE Times, 2026-10-22Goodram details its European testing methodology for validating the reliability of DRAM and SSDs for industrial and embedded applications.
- Micron pulls the plug on future 4F² DRAM after two decades of research in dramatic shift — Tom's Hardware, 2026-10-22Micron announced it is discontinuing the development of 4F² DRAM because future process nodes offer better bit density improvements for memory.
- Taiwan-France semiconductor alliance strengthens with CPU pact between SiPearl and Egis Group — DigiTimes, 2026-10-22Egis Group and SiPearl signed a pact to jointly develop a Mobius 100 CPU utilizing UCIe chiplet technology for sovereign AI and HPC infrastructure.
- OpenAI hires new energy regulatory lead — Data Center Dynamics, 2026-10-22OpenAI has hired Will Friedman from AWS to lead its energy regulatory efforts.
- Google’s TPUs for AI workloads now run in Meta's data centers — Tom's Hardware, 2026-10-22Google's TPUs are now running for AI workloads at Meta, utilizing open-source engines to run PyTorch models directly on the chips.
- Everspin Expands MRAM Push into AI Servers, Data Centers, Satellite Systems — EE Times, 2026-10-22Everspin's CEO discussed the potential use of MRAM technology in AI servers and data centers, especially in the context of NOR flash supply shortages.
- One Fluke to rule it all (in the data center) — Data Center Dynamics, 2026-10-22Standardizing testing across power, cooling, and connectivity elements can enhance data center reliability, minimize downtime, and sustain performance levels.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The design of future AI infrastructure will require integrating advanced compute, cooling, and power elements from various parts of the supply chain.Merchant GPUs / accelerators, Hyperscaler custom ASICs, Rack-scale systems, GPU baseboards & compute trays, Direct-to-chip cold plates, Rack manifolds, Quick disconnects, Chillers & compressors, CRAH / CRAC / fan walls / in-row units, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, Gas turbines (onsite / behind-the-meter) & HRSGs
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The article discusses future data center designs for AI infrastructure, touching on cooling, power, and overall planning.Merchant GPUs / accelerators, Hyperscaler custom ASICs, Rack-scale systems, EMS, system integration & rack-level test, Direct-to-chip cold plates, Rack manifolds, Chillers & compressors, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Architecture, engineering & MEP design, General contractors & design-build, DCIM, digital twins, capacity planning
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22The article discusses anticipated design principles for future AI infrastructure, focusing on elements like advanced compute components and specialized cooling/interconnect features.
- General Compute signs on to purchase Positron AI hardware — Data Center Dynamics, 2026-10-22General Compute has agreed to purchase Positron AI hardware, starting with Atlas systems and planning to adopt Titan later.
- ADEPT Taiwan holds inaugural in-person meeting as PLP and substrate standardization efforts gain momentum — DigiTimes, 2026-10-22The Advanced Electronic Packaging Technology committee is increasing its presence in Taiwan to advance standards for packaging and substrates.
- Infineon, Nvidia push gallium nitride power for 800-volt AI data centers — DigiTimes, 2026-10-22Infineon is collaborating with Nvidia to implement 800-volt DC power designs for AI data centers using gallium nitride chips in the intermediate bus converter.
- Sponsored: Idle GPUs can now earn their keep: Shadeform launches Spot to help providers recoup rising compute costs — Data Center Dynamics, 2026-10-22Shadeform has launched a marketplace feature allowing hardware providers to sell unused GPU capacity to help recover costs associated with idle compute time.
- [AI Infrastructure Insight] How AI infrastructure will be designed for the future — newsroom:sk-hynix, 2026-10-22Effective real-world AI application requires improvements across faster compute, wider memory bandwidth, higher-performance networking, better storage, and more stable power infrastructure.Merchant GPUs / accelerators, Hyperscaler custom ASICs, ASIC design services, IP & EDA, Server CPUs, NICs / SuperNICs, DPUs, FPGAs, HBM, DRAM, Memory modules, CXL controllers & memory expanders, Scale-up fabric, Scale-out switch ASICs, Optical transceivers, Silicon photonics & co-packaged optics, Rack-scale systems, EMS, system integration & rack-level test, GPU baseboards & compute trays, Motherboards, CPU trays, switch trays, High-layer-count PCBs, Board-level power: VRMs, power stages, PoL, power semis, Direct-to-chip cold plates, Rack manifolds, Coolant distribution units, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Copper, Aluminum, Specialty glass & glass fiber, Industrial & specialty gases
- Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips — DigiTimes, 2026-10-22Samsung is reportedly restructuring its R&D incentives to accelerate the development of future DRAM and NAND memory chips and improve talent retention.
- Why Terafab approached South Korean suppliers first — DigiTimes, 2026-10-22Elon Musk's Terafab project is reportedly engaging with multiple South Korean suppliers covering semiconductor materials, piping, wastewater recycling, and testing components.
- Japan sets execution plan for 17 growth strategies — DigiTimes, 2026-10-22Japan's proposed five-year plan will focus on semiconductor and gaming investments in the near term, with physical AI and hydrogen slated for future growth.
- BOS, LG, and HANA Micron team up on Korean automotive chiplets — DigiTimes, 2026-10-22BOS Semiconductors is collaborating with LG Electronics and HANA Micron to develop automotive semiconductors using chiplets in South Korea.
- Amazon backs 960MW nuclear project for AI power — DigiTimes, 2026-10-22Amazon intends to invest in and purchase power from a 960MW nuclear plant in Indiana to support its expanding AI data center needs.
- Amazon spends US$220B on AI as power delays squeeze cash flow — DigiTimes, 2026-10-22Amazon's planned $220B AI CAPEX for 2026 is hampered by power and construction delays, causing hardware like server racks to stockpile in warehouses.
- Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges — DigiTimes, 2026-10-22Intel is moving forward with equipment installation at its Arizona Fab 62 and advancing construction on its Ohio site amid rising demand for AI data center CPUs.
- Apple, Google push PCB supply chain toward net zero amid challenges — DigiTimes, 2026-10-22PCB manufacturers are increasing sustainability efforts due to AI and HPC demand for better boards, despite facing challenges with renewable power costs and supply chain emissions measurement.
- Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push — DigiTimes, 2026-10-22Lam Research is developing a supplier base in India to align with localization incentives mandated by the Indian government for semiconductor equipment.
- Sibelco to build quartz plant in North Carolina, extending US chip onshoring to raw materials — DigiTimes, 2026-10-22Sibelco plans to expand a quartz plant in North Carolina to further onshore semiconductor supply chain materials in the US.
- Samsung patent boosts AI server memory efficiency without adding GPUs — DigiTimes, 2026-10-22Samsung patented a technology that enhances AI server memory efficiency by calculating and minimizing data transfer costs between GPUs and CPUs to handle more user requests without needing extra GPUs.
- Nvidia's AI factory strategy points to a broader shift in computing, industry — DigiTimes, 2026-10-22Nvidia presented its strategy framing the expansion of AI as a fundamental infrastructure shift requiring new compute and energy capacity.
- Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity — DigiTimes, 2026-10-22Nvidia is collaborating with six suppliers to increase the manufacturing capacity for substrates, advanced packaging, testing, and optical engines to satisfy demand for its AI platforms.
- Micron skips 4F² for 3D DRAM as CXMT pushes ahead — DigiTimes, 2026-10-22Micron announced it will forgo commercializing 4F² DRAM despite its advancement by CXMT due to perceived cost and complexity disadvantages.
- China's IC designers expand into AI server memory interconnects beyond DDR5 — DigiTimes, 2026-10-22Chinese IC designers are increasingly entering the high-speed interconnect market to support the growing demand for server CPUs, memory, and connectivity driven by AI applications.
- Elon Musk expands South Korean supplier network for Terafab — DigiTimes, 2026-10-22Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea across various components and process materials for the entire supply chain.
- Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin — DigiTimes, 2026-10-21Nvidia presented at GTC Berlin, shifting the focus from core silicon bottlenecks to the end-to-end challenges of deploying AI factories, addressing speed, power, and security.
- Chief Telecom's CTSP AI data center bookings exceed 50% — DigiTimes, 2026-10-21Chief Telecom has started construction on a new AI data center in Central Taiwan Science Park, with over 50% of the facility already booked by international cloud service providers and fintech firms.
- Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab — Tom's Hardware, 2026-10-21Intel is advancing its semiconductor manufacturing expansion by installing production tools at its Fab 62 in Arizona and continuing work on its Ohio chip fab.
- Startup neocloud Aolani signs LOI for 500MW of capacity in Malaysia — Data Center Dynamics, 2026-10-21Neocloud startup Aolani has signed a Letter of Intent (LOI) to secure 500MW of capacity in Malaysia, bringing its total commitment to 580MW.
- 4TB Samsung 990 Pro M.2 SSD falls 27%, hits 20 cents per gigabyte — Tom's Hardware, 2026-10-21The price of the 4TB Samsung 990 Pro SSD saw a 27% decrease, reaching a cost of 20 cents per gigabyte.
- SC Capital Partners invests in 40MW data center in Pohang, South Korea — Data Center Dynamics, 2026-10-21SC Capital Partners is investing in a 40MW data center facility in Pohang, South Korea, which will house NeoAI Cloud.
- ASML and other critical semiconductor equipment suppliers expedite shipments to Musk's Terafab — Tom's Hardware, 2026-10-21Elon Musk stated that ASML and other semiconductor equipment providers are accelerating shipments to Tesla's and SpaceX's intended chip manufacturing facility in Texas.
- Geothermal lease sale on federal land in Nevada nets $4.8M — Utility Dive, 2026-10-21
- Solar PPA prices jump 5% in Q3, mainly on new trade tariffs: LevelTen — Utility Dive, 2026-10-21Solar power purchase agreement prices increased by 5% in Q3, primarily influenced by new trade tariffs.
- Intel Moves Forward at Ohio One With First Major Structural Truss Installation Arizona Fab 62 Tooling — ServeTheHome, 2026-10-21Intel is progressing with structural truss installation at its Ohio One facility, and also in relation to its Arizona Fab 62 tooling.
- Sponsored: From power to AI readiness: The architecture decisions behind TeraWulf’s AI and high-performance computing campus — Data Center Dynamics, 2026-10-21The article discusses the architectural decisions made for TeraWulf's AI and high-performance computing campus, emphasizing that securing power is just the initial step.
- The capacity market crisis is a design problem, not a verdict on competition — Utility Dive, 2026-10-21Experts argue that the high capacity prices observed from PJM are due to an over-reliance on spot markets rather than a fundamental flaw in the competitive structure.
- Trump announces mandate forcing AI data centers to pay energy dividends to the local community — Tom's Hardware, 2026-10-21Trump announced a mandate requiring data centers to pay energy dividends to the local community.
- India’s OSAT Buildout Puts Semiconductor Testing in Focus — EE Times, 2026-10-21Semiconductor testing infrastructure in India is seeing activity, with one OSAT selecting test systems while others continue evaluating equipment for upcoming production.
- Amazon withdraws application for data center campus at GWU site in Ashburn, Virginia — Data Center Dynamics, 2026-10-21Amazon withdrew its data center campus application after receiving resistance from local county officials in Loudoun County.
- NorthC breaks ground on data center in Geneva, Switzerland — Data Center Dynamics, 2026-10-21NorthC has started construction on a data center in Geneva, Switzerland, with the first phase scheduled for operation in 2028.
- Qualcomm to cut jobs globally in "performance-based" layoffs, as company pivots to AI data center and edge computing markets — Tom's Hardware, 2026-10-21Qualcomm is initiating global, performance-based layoffs as it repositions its focus toward AI data center and edge computing markets.
- Why Chip Design AI Benchmarks Must Go Beyond Functional Correctness — EE Times, 2026-10-21The increasing need for specialized architectures across various domains like physical AI and edge devices is driving a demand for custom silicon optimized for specific performance, memory bandwidth, and energy targets.
- AMD and Intel will work together to create a single PyTorch code path for AI inference on CPUs — Tom's Hardware, 2026-10-21AMD and Intel are collaborating to provide unified CPU inference optimizations for PyTorch via the oneDNN library.
- Iran threatens to attack undersea cables in the Strait of Hormuz, calls them 'legitimate new targets' in future conflict — Tom's Hardware, 2026-10-21Iran has threatened to target seven undersea cables passing through the Strait of Hormuz, designating them as potential military targets in a future conflict.
- Samsung and SK Hynix are upgrading Chinese factories to produce advanced RAM chips as AI data center competition ramps up — Tom's Hardware, 2026-10-21Samsung and SK Hynix are reportedly upgrading their Chinese factories to produce advanced RAM chips to compete in the AI data center market against Chinese competitors.
- Micron's Taiwan union will launch a one-day strike this week, threatening memory production — Tom's Hardware, 2026-10-21Micron's Taiwan union plans a single-day strike at the Taoyuan DRAM facility due to demands for bonuses and clarity on future bonus terms.
- Hitachi Energy teams up with Ansaldo to develop integrated power solutions for data center sector and grid — Data Center Dynamics, 2026-10-21Hitachi Energy and Ansaldo have formed a collaboration to develop integrated power solutions specifically for the data center sector and the broader electrical grid.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Hitachi Energy
- HPE says it will run the first supercomputer benchmarks on the Moon — Tom's Hardware, 2026-10-21HPE plans to take its Spaceborne Computer-4 to the Moon via Astrolab's FLIP rover to conduct benchmark tests.
- Three workers killed, one in intensive care after fall at TSMC’s 2nm fab construction site — Tom's Hardware, 2026-10-21Multiple workers were injured or killed following a fall incident at the construction site of TSMC's 2nm fabrication facility in Kaohsiung.
- Four workers killed after fall at TSMC’s 2nm fab construction site — Tom's Hardware, 2026-10-21Four contract workers died following a fall at the construction site of TSMC's Fab 22 in Kaohsiung, Taiwan.
- Jensen Huang Nvidia GTC keynote disrupted by Greenpeace protest over chips in Russian drones — Tom's Hardware, 2026-10-21Nvidia's GTC keynote presentation was interrupted by a Greenpeace protest concerning the use of chips in Russian drones.
- Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI — DigiTimes, 2026-10-21The market anticipates sustained high demand for AI-related chips, keeping the outlook positive through 2027 and beyond.
- Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand — DigiTimes, 2026-10-21Infineon and Wolfspeed signed a multi-year deal to transition their SiC wafer supply from 6-inch to 8-inch substrates to support growing power needs in EVs, renewables, and AI data centers.
- Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy — DigiTimes, 2026-10-21Sony Group plans to keep its imaging sensor chip unit structure due to synergies with its creative production while relying on a partnership with TSMC for future manufacturing investment.
- Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies — DigiTimes, 2026-10-21Samsung is moving its next-generation modem to a 2nm process, thereby freeing up 4nm capacity to support the production of HBM base dies.
- Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance — DigiTimes, 2026-10-21Samsung Electronics and SK Hynix are reportedly upgrading their NAND flash fabrication facilities in China to produce chips exceeding 200 layers to compete with YMTC, despite existing US restrictions.
- Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved — DigiTimes, 2026-10-21Micron Technology reached an agreement with its Taichung union branch, while labor negotiations with the Taoyuan union remain unresolved.
- Edge AI MCU Features Multimodal Compute, Tiered Memory — EE Times, 2026-10-21
- Qisda integrates four companies to build scalable rack-scale AI solutions — DigiTimes, 2026-10-21Qisda Group is forming a consortium of four companies to build scalable rack-level AI solutions integrating high-speed connectivity, modular compute, and liquid cooling.
- Sponsored: The metric that matters: Why AI data centers should be measured in value, not volume — Data Center Dynamics, 2026-10-21The article argues that the data center industry should shift its measurement focus from pure physical capacity to the actual business value generated per watt.
- China launches state-owned data group as market-facing arm of its AI infrastructure push — DigiTimes, 2026-10-21China established a new state-owned entity, National Data Group, to advance its AI infrastructure goals.
- Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity — DigiTimes, 2026-10-21Taiwan's Printed Circuit Board industry anticipates exceeding NT$1 trillion in output in 2026, fueled by increased demand from the AI infrastructure boom.
- Micron funds critical minerals processing at Indium Corporation's New York facility — DigiTimes, 2026-10-21Micron Technology committed funding to Indium Corporation's facilities in New York for processing critical minerals and manufacturing high-purity materials.
- CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026 — DigiTimes, 2026-10-21Chinese DRAM manufacturer CXMT announced a goal to achieve high-density server memory using hybrid bonding techniques by the end of 2026.
- AMD: Physical AI demands more than TOPS — DigiTimes, 2026-10-21AMD suggested that measuring performance solely by TOPS is insufficient for physical AI systems, which require evaluating end-to-end, real-time responsiveness.
- AMEC seeks South Korean foothold through MOCVD trials with SK Keyfoundry, Magnachip — DigiTimes, 2026-10-21AMEC is trying to enter the South Korean power semiconductor market by conducting MOCVD equipment trials with SK Keyfoundry and Magnachip, specifically noting that its competitors are currently unable to supply Samsung and SK Hynix's fabs.
- How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions — DigiTimes, 2026-10-21Three Chinese tech giants have placed a massive order for Nvidia's new RTX PRO 5500 graphics cards, valued at over $35 billion.
- AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP — DigiTimes, 2026-10-21The semiconductor industry's focus for AI computing is shifting towards 3D architectures, making power efficiency the primary measure of improvement.
- Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer — DigiTimes, 2026-10-21Samsung is reportedly focusing its near-term strategy on utilizing its existing 4nm and 5nm foundry nodes because securing deals for its more advanced 2nm technology is facing delays.
- Advanced PCB drilling faces growing demand from AI and high-speed applications — DigiTimes, 2026-10-21Topoint Technology is increasing its capacity for advanced PCB drilling services to meet the growing needs of AI, HPC, and high-speed applications, showcasing support for materials like ABF substrates and quartz cloth.
- AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab — DigiTimes, 2026-10-21The chairman of Unimicron Technology discussed opportunities for the printed circuit board industry in the age of AI at the TPCA Show Taipei 2026.
- Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking — DigiTimes, 2026-10-21As AI performance gains are challenged by memory bandwidth limitations, the industry is advancing HBM, advanced packaging, and 3D integration techniques to connect memory and compute more densely.
- Nvidia's Vera CPU signals a broader shift in AI infrastructure — DigiTimes, 2026-10-21Nvidia is emphasizing the growing importance of CPU resources for complex AI workloads, suggesting a potential architectural shift in AI compute design.
- Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T — DigiTimes, 2026-10-21Samsung Electro-Mechanics signed a long-term supply agreement for memory packaging substrates, expanding its existing agreements that cover MLCCs and silicon capacitors.
- Taiwan promotes Hsinchu science-park model to Mexico and Poland — DigiTimes, 2026-10-21Taiwan is promoting its science-park development model to Mexico and Poland to help build industrial hubs that can shape global supply chains.
- Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain — DigiTimes, 2026-10-21Industry experts noted that close cooperation among packaging, substrate, PCB, and assembly manufacturers is crucial to overcome the technical hurdle of package-to-board integration driven by AI and HPC demands.
- Foreign suppliers stand to gain first as India's chemical makers chase Tata's chip fab — DigiTimes, 2026-10-21International chemical material suppliers, specifically from Japan, South Korea, and Europe, are expected to benefit most from India's new chip fabrication plant due to their established purification expertise and vendor relationships with chipmakers.
- [AI Ecosystem] The semiconductor paradigm shifts toward memory — newsroom:sk-hynix, 2026-10-21The industry trend is shifting towards a greater reliance on memory components, suggesting changes in accelerator and memory demand.
- [AI Ecosystem] The semiconductor paradigm shifts toward memory — newsroom:sk-hynix, 2026-10-21The semiconductor industry is shifting its focus towards memory solutions, indicating a strong trend in memory technology.
- [AI Ecosystem] The semiconductor paradigm shifts toward memory — newsroom:sk-hynix, 2026-10-20The shift in AI workloads towards inference and agentic AI means that system performance is increasingly dependent on data storage, data movement speed, and processing efficiency, rather than just raw compute power.
- Tens of thousands of Nvidia GPUs sit idle in Meta's Prometheus supercluster, just waiting for a failure — The Register, 2026-10-20Thousands of Nvidia GPUs are reportedly idle in Meta's Prometheus supercluster, awaiting potential failures as part of model training efforts.
- Georgia electric cooperative plans 50-MW home battery deployment — Utility Dive, 2026-10-20The cooperative plans to deploy 50-MW home batteries to mitigate system peaks and energy costs in response to demands from hyperscale data centers.
- Amazon pledges €16bn investment in Germany in 2027 — Data Center Dynamics, 2026-10-20Amazon announced a planned €16 billion investment in Germany by 2027 to expand its data center and AI infrastructure, along with high-speed internet and logistics.
- Closing the Loop: Are closed-loop systems the solution to data centers' water woes? — Data Center Dynamics, 2026-10-20The article questions whether implementing closed-loop water systems is the definitive solution for the water usage challenges facing data centers.
- Blackstone closes latest energy transition fund at $8.7bn, backs several data center focused energy firms — Data Center Dynamics, 2026-10-20Blackstone closed an energy transition fund totaling $8.7 billion, investing in several firms focused on the energy sector supporting data centers.
- HPE Spaceborne Computer-4 Will Bring AI and HPC to the Moon on Astrolab FLIP — ServeTheHome, 2026-10-20HPE plans to take its Spaceborne Computer 4 system to the moon via Astrolab's FLIP for testing AI and HPC capabilities in a space environment.
- US restarts three shut-down nuclear reactors to feed AI data centers — Tom's Hardware, 2026-10-20The U.S. is supporting the restart of nuclear reactors to increase energy supply for AI data centers.
- Google Cloud says a 'power event' caused today's outage — The Register, 2026-10-20Google Cloud reported an outage in the Fells London zone affecting multiple businesses, with recovery tentatively expected by 13:00 UTC.
- China’s tech giants drop $35 billion on export-compliant Nvidia RTX Pro 5500 workstation GPU orders to power AI ambitions, according to reports — Tom's Hardware, 2026-10-20Tencent, Alibaba, and ByteDance reportedly placed orders for $35 billion worth of Nvidia RTX Pro 5500 GPUs, exceeding Nvidia's projected supply.
- Modal taps Nvidia Vera CPUs after firm's internal tests show 2x throughput over Intel and AMD chips — Tom's Hardware, 2026-10-20Modal claims that Nvidia's Vera CPU achieves double the throughput of chips from Intel and AMD when running AI agent workloads.
- Intel asks FCC for waiver to buy foreign robots — Tom's Hardware, 2026-10-20Intel requested an FCC waiver because a ban on foreign robots may prevent the company from servicing its fleet of automated guided vehicles.
- How Singapore Connects Chip Research, Startups, and Manufacturing — EE Times, 2026-10-20Singapore is cultivating an industrial ecosystem that links deep-tech research, startups, and manufacturing across components like SiC power devices and silicon photonics.
- Google Cloud's London zones takes a nap, multiple services disrupted — The Register, 2026-10-20Multiple financial and service organizations in London experienced service disruptions due to an outage in the europe-west2-b zone.
- Jensen Huang urges Germany to embrace physical AI at Berlin summit — DigiTimes, 2026-10-20Nvidia CEO Jensen Huang advised German businesses at a Berlin summit to adopt physical AI to modernize industries like automotive and machinery.
- 1GW data center proposed alongside solar farm in Norfolk, UK — Data Center Dynamics, 2026-10-20A proposed 1GW data center will be co-located with a solar farm in Norfolk, UK.
- AI server demand lifts Tongtai drilling orders through 2027 — DigiTimes, 2026-10-20Increased demand for AI servers is boosting order visibility for PCB drilling equipment, with the company showcasing high-precision drilling machines.
- Sponsored: Ablecom releases whitepaper introducing high-efficiency RDHx liquid cooling solution — Data Center Dynamics, 2026-10-20The whitepaper presents a high-efficiency liquid cooling solution designed to help data center operators manage heat loads up to 75 kW per rack and reduce PUE.
- Sponsored: Building a battery ecosystem for AI data centers — Data Center Dynamics, 2026-10-20The future power stability for AI data centers is projected to rely on advanced energy storage and intelligent DC infrastructure.
- Building Physical AI Systems That Can Work in the Real World — EE Times, 2026-10-20The article discusses the need for holistic system architecture that balances compute, power, and safety when building physical AI systems, suggesting this approach is more critical than just model size.
- US firms eye Malaysia to diversify rare earth supply chains — DigiTimes, 2026-10-20Multiple US firms are investigating Malaysia's rare earth sector to diversify sources away from China, aligning with US efforts to secure critical mineral supplies.
- AUO selects glass substrate specs for semiconductor processes, not size rivalry — DigiTimes, 2026-10-20AUO is customizing its glass core substrate specifications for semiconductor process needs instead of focusing on panel size competition, aiming to supply OSAT leaders like ASE and Powertech.
- Taiwan anchors US chip revival, SEMICON West spotlights trusted partners — DigiTimes, 2026-10-20Following SEMICON West, discussions emphasized Taiwan's vital role in the rebuilding of US semiconductor manufacturing, covering investment, process technology, supply chain expertise, and talent development.
- AI servers drive TVS and ESD demand for Yea Shin Tech — DigiTimes, 2026-10-20AI server demand is increasing the need for transient voltage suppressors (TVS) and ESD protection components, and Yea Shin Technology plans to increase the share of 6-inch wafers in its capacity for these products.
- DeepSeek-Huawei chip co-design could shift AI training away from Nvidia — DigiTimes, 2026-10-20DeepSeek is reportedly collaborating closely with Huawei on future AI chip designs to reduce dependence on Nvidia.
- Kioxia targets higher-value AI storage with Nvidia partnership, advanced NAND technology — DigiTimes, 2026-10-20Kioxia plans to focus on developing high-value, proprietary NAND flash solutions for AI applications rather than increasing overall storage capacity.
- AI substrate bottleneck shifts from design to manufacturing — DigiTimes, 2026-10-20The increasing size, layer count, and power demands of accelerator substrates are causing the primary industry bottleneck to shift from design limitations to physical manufacturing capacity.
- Micro LED optical interconnect targets AI racks amid unsettled standards — DigiTimes, 2026-10-20The growing demand for optical interconnects in AI racks is driving the potential use of Micro LED technology for short-reach optical transmission within data centers.
- Taiwan's behind-the-meter energy storage faces space, cost barriers as ITRI proposes three solutions — DigiTimes, 2026-10-20Taiwan's adoption of energy storage systems is constrained by spatial and cost limitations, despite their increasing necessity for grid stability and corporate energy transitions.
- TPK targets 2028 TGV mass production with NT$6 billion investment — DigiTimes, 2026-10-20TPK Holding has initiated joint development with packaging companies for glass-substrate through-glass via (TGV) technology, aiming for mass production by 2028.
- Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950 — DigiTimes, 2026-10-20Alibaba's RISC-V IP, branded XuanTie, has surpassed 6 billion chip shipments and is expanding its use into AI servers.
- South Korean govt, SK Hynix launch KRW2 trillion loan guarantee program for chip suppliers — DigiTimes, 2026-10-20South Korean government entities launched a KRW2 trillion loan guarantee program to bolster semiconductor materials, parts, and equipment suppliers.
- Taiwan industry seeks nuclear restart and utility relief amid energy costs boom — DigiTimes, 2026-10-20Taiwan's business groups are urging the government to financially support state utilities and speed up nuclear power plant restarts due to massive increases in natural gas costs.
- Hanmi Semiconductor establishes US hub to support AI packaging customers — DigiTimes, 2026-10-20Hanmi Semiconductor has opened a US subsidiary in Silicon Valley to meet the growing demand for advanced semiconductor packaging equipment fueled by AI chip expansion.
- Zhen Ding launches PCB talent development platform with National Central University, partners — DigiTimes, 2026-10-20Four companies, along with National Central University, are investing in a talent development program focused on advanced printed circuit boards and industry growth.
- Amazon makes vague commitment to unproven nuclear tech to power Indiana datacenters — The Register, 2026-10-19Amazon has made an unspecified commitment to unproven nuclear technology to supply power for data centers in Indiana.
- Superconducting Neuromorphic Chip Passes Fusion Test — HPCwire, 2026-10-19A superconducting neuromorphic chip tested successfully using data generated from a fusion reactor, indicating potential for future development in this area.
- Authorities in Lithuania foil arson plot against Starlink satellite gateway station — Data Center Dynamics, 2026-10-19Authorities in Lithuania foiled an arson attempt against a Starlink satellite gateway station.
- Amazon and AEP to explore deployment of up to 960MW of X-energy SMRs in Indiana — Data Center Dynamics, 2026-10-19Amazon and AEP are exploring the deployment of up to 960MW of X-energy's Small Modular Reactors in Indiana.
- Canada puts out Advanced Procurement Notice for data center in Ontario — Data Center Dynamics, 2026-10-19Canada issued an advanced procurement notice for a data center facility in Ontario with an estimated cost range of CA$1.5bn to $1.85bn.
- Russian official proposes data centers in disused coal mines to protect from drone strikes — Data Center Dynamics, 2026-10-19A Russian official suggested locating data centers within abandoned coal mines as a means of defense against drone attacks.
- 400MW data center eyed at old Navy cyber site in San Diego, California — Data Center Dynamics, 2026-10-19Manchester Financial Group is considering developing a 400MW data center at the former Navy cyber site in San Diego.
- Power alone won't unlock the next generation of AI data centers — Data Center Dynamics, 2026-10-19The article stresses that energy flexibility, beyond mere power provision, must be considered crucial for advancing next-generation AI data centers.
- Anthropic named as customer of EverWind's data center project in Nova Scotia — Data Center Dynamics, 2026-10-19Anthropic will be a customer for a data center project by EverWind in Nova Scotia which is currently in the pre-construction phase.Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Architecture, engineering & MEP design, General contractors & design-build, MEP & electrical contractors, Structure, steel, precast, envelope, site equipment, Prefab / modular data centers & power/cooling skids, Site utilities, water & fiber entrance, Physical security & access, Testing, commissioning & certification, Anthropic
- Google explores data center site in Roanoke County, Virginia — Data Center Dynamics, 2026-10-19Google is evaluating the Wood Haven Technology Park in Roanoke County, Virginia, as a potential location for a new data center project.
- Sponsored: Data center siting in the AI era: A smarter approach to environmental and community impact — Data Center Dynamics, 2026-10-19The article discusses the importance of thoughtful site selection for data centers impacted by AI growth, focusing on environmental and community considerations.
- AEP signs 960-MW Indiana nuclear pact with Amazon, X-energy — Utility Dive, 2026-10-19Amazon signed a 960-MW nuclear power purchase agreement with AEP in Indiana, covering the facility's cost and operation.
- Stack files for second building at Lancaster campus, Texas — Data Center Dynamics, 2026-10-19A company plans to begin work on the second building at its Lancaster campus in Texas starting in March.
- AI chip startup Tenstorrent raises $1.5bn at $6.2bn valuation — Data Center Dynamics, 2026-10-19Tenstorrent secured $1.5 billion in funding at a $6.2 billion valuation to support development of its Galaxy servers.
- Norwegian undersea cable builder pitches 2,800-mile transatlantic data link between Canada and Europe to bypass the US — Tom's Hardware, 2026-10-19Norway's Bulk Infrastructure Group AS aims to develop a 2,800-mile transatlantic undersea cable connecting Canada and Europe to bypass infrastructure in the United States.
- Arm says its AGI CPU delivers nearly 2X the performance per rack of AMD EPYC 9755 in new agentic AI CPU tests — Tom's Hardware, 2026-10-19Arm asserts that its AGI CPU architecture significantly outperforms the AMD EPYC 9755 in simulated rack-level performance across various agentic AI tasks.
- Microsoft signs 20-year power deal with Indiana utility NiSource for planned data center in the state — Data Center Dynamics, 2026-10-19Microsoft has secured a 20-year power agreement with the utility NiSource to support a planned data center facility in Indiana.
- Grading the grid: How ISOs stack up against FERC’s large-load mandate — Utility Dive, 2026-10-19The article discusses the state of grid operators in relation to FERC's mandate, which impacts utilities, developers, and investors.
- Underground utilities: A shifting grid and the materials built to match it — Utility Dive, 2026-10-19Utilities are rapidly undergrounding power lines, necessitating innovation in materials like specialized glass and industrial gases to support this infrastructure shift.
- DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge — DigiTimes, 2026-10-19Microsoft's Maia 300 is highlighted as a leader in the 2nm race, while TSMC's US strategy is changing and Intel's EMIB-T packaging is reportedly encountering yield issues.
- Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal — DigiTimes, 2026-10-19Anthropic secured a US$60 billion financing deal from Blackstone, implying a significant investment into AI chip development.
- AI inference is running into a memory bottleneck. Huawei wants to tackle it with OceanStor M900 — The Register, 2026-10-19The Context Memory Storage platform is positioned to enhance the cost-effectiveness of running large-scale AI inference.
- Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power — DigiTimes, 2026-10-19Elon Musk suggested that a projected surge in China's DRAM supply by 2028 could challenge the pricing dominance held by Samsung and SK Hynix.
- ACM Research bets on panel-level packaging and overseas growth as adoption risks persist — DigiTimes, 2026-10-19ACM Research is focusing on panel-level packaging while navigating ongoing risks associated with international growth.
- IBM and Siemens collaborate to advance nanostack chip architecture — DigiTimes, 2026-10-19IBM and Siemens are partnering to advance nanostack chip architecture.
- Von Ardenne's flexible equipment targets unsettled panel-level packaging market — DigiTimes, 2026-10-19Von Ardenne is developing flexible equipment aimed at the underdeveloped segment of panel-level packaging.
- Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years — DigiTimes, 2026-10-19Wooptix plans to target leading chip manufacturers with its wafer metrology technology, expecting production adoption in the next three to five years.
- SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits — DigiTimes, 2026-10-19SK Hynix is advancing chip inspection technology to handle the challenges presented by 3D memory stacking.
- Shipments of high-end cloud AI accelerators, 2027 — DigiTimes, 2026-10-19The headline indicates shipments of high-end AI accelerators are expected in 2027.
- Anthropic signs first Canada data center lease — DigiTimes, 2026-10-19Anthropic has signed its first data center lease in Canada.
- AUO, Largan Micro LED debate highlights optical communications uncertainty — DigiTimes, 2026-10-19The discussion surrounding AUO and Largan's Micro LED technology suggests ongoing uncertainty in the field of optical communications.
- Micron develops robot memory as Samsung, SK Hynix target physical AI — DigiTimes, 2026-10-19Micron is developing robot memory technology, aiming to challenge competitors Samsung and SK Hynix in the physical AI market.
- Infineon extends Wolfspeed wafer deal to 8-inch silicon carbide — DigiTimes, 2026-10-19Infineon has extended its silicon carbide wafer supply agreement with Wolfspeed to cover 8-inch wafers.
- Beyond displays: AUO eyes co-packaged optics, glass core substrates for AI-era growth — DigiTimes, 2026-10-19AUO is targeting co-packaged optics and glass core substrates to support the growth of AI-era computing.
- AI memory demand lifts Samsung, SK Hynix 2027 outlook — DigiTimes, 2026-10-19Increased demand from AI workloads is boosting the 2027 outlook for memory manufacturers Samsung and SK Hynix.
- TECO's modular data center validation nears completion — DigiTimes, 2026-10-19TECO's modular data center validation process is nearing completion.
- Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback — DigiTimes, 2026-10-19Intel's CEO provided assistance to Tata's Dholera fab, indicating potential support for its comeback.
- Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says — DigiTimes, 2026-10-19Nvidia's use of custom High Bandwidth Memory (HBM) is influencing Samsung to utilize TSMC's 3nm process.
product launch
- Nvidia unveils OOI CPO prototype for post-2028 AI needs — DigiTimes, 2026-10-25
- Sponsored: GF completes LiquidCore portfolio with intelligent Multi Control Valve to maximize direct liquid cooling efficiency — Data Center Dynamics, 2026-10-24GF has launched a Multi Control Valve to finalize its LiquidCore system, enhancing the active intelligence layer for direct liquid cooling.
- ZTE unveils data center module designed for AI workloads — Data Center Dynamics, 2026-10-23ZTE has unveiled a new data center module engineered for AI workloads, capable of providing rack power between 20kW and 60kW.
- Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance — Tom's Hardware, 2026-10-23Micron's next-generation 3D NAND technology is set to achieve a density of 42 Gb/mm2 using over 400 layers, boosting SSD capacity and performance.
- Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry — DigiTimes, 2026-10-23Japanese institutions announced a joint project to develop a next-generation medical imaging system utilizing a dedicated 2nm AI inference chip.
- Analysis: Nvidia's DSX POD reshapes AI factory supply chains — DigiTimes, 2026-10-23Nvidia introduced its DSX POD reference design for AI data centers, which involves integrating and validating equipment within containerized modules for on-site deployment.
- Samsung Foundry targets automotive, edge AI chips with 8LPU+ — DigiTimes, 2026-10-23Samsung Foundry plans to utilize its established 8-nanometer process for a second generation of chips targeting automotive and edge AI applications.
- HPE expands Private Cloud AI solution to support mixed Nvidia hardware clusters, launches Vera CPU rack — Data Center Dynamics, 2026-10-22HPE launched a rack featuring Vera CPUs to expand its private cloud AI solution supporting mixed Nvidia hardware clusters.
- Dell unveils Nvidia Vera CPU offerings, launches its first Groq 3 LPU rack-scale inference solution — Data Center Dynamics, 2026-10-22Dell has unveiled its offerings featuring Nvidia Vera CPUs and its inaugural Groq 3 LPU rack-scale inference solution, all designed for agentic AI applications.
- Nvidia Vera Rubin infrastructure now generally available on Google Cloud — Data Center Dynamics, 2026-10-22Nvidia's Vera Rubin infrastructure will be generally available through Google Cloud starting next month via A5X instances.
- Inside Nvidia DSX POD: How a factory-built AI data center could go live in 14 days — DigiTimes, 2026-10-22Nvidia presented its DSX POD, a modular, factory-built computing container designed to accelerate data center deployment across Europe by treating AI production as an industrial process.
- NVIDIA GTC Berlin 2026 NVIDIA Intros DSX PODs and More — ServeTheHome, 2026-10-21NVIDIA presented the DSX POD, a new type of server housed within a container, at the GTC 2026 event.
- Water harvesting firm Aquaria launches pilot for modular onsite water supply system for data center sector — Data Center Dynamics, 2026-10-21Aquaria is launching a pilot modular onsite water supply system specifically designed for the data center sector.
- FADU puts the filesystem inside the SSD's flash to bypass host CPUs — Tom's Hardware, 2026-10-21FADU released an FS-SSD that handles NFSv3 file operations directly via NVMe commands, enabling accelerators to access files without relying on the host CPU.
- Nvidia launches DSX POD, claims the Vera-Rubin reference architecture will make AI data centers more water and energy efficient — Data Center Dynamics, 2026-10-21Nvidia announced the DSX POD, claiming the Vera-Rubin reference architecture will improve the water and energy efficiency of AI data centers.
- Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup — DigiTimes, 2026-10-21Zhen Ding Technology displayed its latest advancements in AI server infrastructure and high-speed optical communication PCBs at the TPCA Show 2026.
- Contrel, FSE combine laser and plasma processes for advanced packaging — DigiTimes, 2026-10-21Contrel and FSE presented combined laser and plasma process technologies at TPCA Show 2026, focusing on applications in advanced packaging and high-end substrate manufacturing.
- xMems solid-state cooling chips for data centers and Edge devices go into production — Data Center Dynamics, 2026-10-20xMems has started manufacturing solid-state cooling chips designed for data centers and edge devices.
- HPE to launch AI straight to the Moon — The Register, 2026-10-20HPE plans to release AI-focused hardware featuring unspecifed silicon and mirrored Solid State Drives before the end of the year.
- Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities — DigiTimes, 2026-10-20Global Tek Industrial opened its large Thai facility, which will expand production to include components for AI liquid cooling alongside its existing aerospace and automotive work.
- Daeduck Electronics targets 2029 ceramic substrates for AI packaging — DigiTimes, 2026-10-20Daeduck Electronics is developing ceramic core substrates as a potential replacement for glass cores in next-generation, large-area AI semiconductor packages, aiming for mass production by 2029.
- NVIDIA BlueField-4 STX Server for CMX at OCP 2026 — ServeTheHome, 2026-10-20NVIDIA showcased the BlueField-4 STX server designed for context memory (CMX) at OCP 2026.
- Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment — DigiTimes, 2026-10-20Intel claimed at OCP that its foundry is uniquely positioned to supply 12-inch InP silicon photonics at scale for near-term co-packaged optics deployment.
- Great Sky, National Labs Explore Superconducting AI for Plasma Control — HPCwire, 2026-10-19Several national laboratories, including Brookhaven and Princeton Plasma Physics Laboratory, are collaborating with Great Sky to develop superconducting AI chips designed for real-time plasma control in fusion reactors.
- Torch Lit: NYU Debuts Supercomputer to Power Academic Discovery — HPCwire, 2026-10-19New York University has deployed a new supercomputer named Torch, establishing it as the leading academic computational system in the state.
- Altera Brings Defense-Grade Capabilities Across the Agilex FPGA Portfolio — HPCwire, 2026-10-19Altera announced that its Agilex FPGA and SoC FPGA portfolio now supports a wider range of aerospace and defense programs with defense-grade features.
- Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup — DigiTimes, 2026-10-19Hanmi plans to launch a wide Thermal Compression Bonder by 2027 and is also expanding its offerings for 2.5D AI chip packaging.
- Lite-On showcases 800VDC power technology at Nvidia MGX event — DigiTimes, 2026-10-19Lite-On demonstrated its 800V DC power technology at an event hosted by Nvidia.
capacity
- Meta’s AI commitments surge to US$825 billion, testing financing power — DigiTimes, 2026-10-25
- Crusoe to develop 106MW data center site in Paraguay — Data Center Dynamics, 2026-10-23Crusoe plans to develop a 106MW data center site in Paraguay.
- Lenovo mounts AI comeback with Nvidia Vera Rubin NVL72 deliveries and US plant expansion — DigiTimes, 2026-10-23
- Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap — DigiTimes, 2026-10-23Samsung Electronics ordered final equipment to boost its Texas foundry fab's 2nm capacity to 20,000 wafers per month by the second half of 2027.
- Why is TSMC suddenly looking at Texas? — DigiTimes, 2026-10-23TSMC is evaluating Texas as a potential location for future US manufacturing capacity and considering a cooperative agreement with Terafab.
- Solidigm to Discontinue Review of Potential IPO, Reaffirming Commitment to Long-Term Growth and Shareholder Value — newsroom:sk-hynix, 2026-10-22
- Crusoe signs on for Polar DC's upcoming 40MW data center in Norway — Data Center Dynamics, 2026-10-22Crusoe is securing a deal to build a 40MW data center at Polar's Tørdal campus in Norway.
- Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B — DigiTimes, 2026-10-22Chi Yi Hsin Technology has reported a substantial order backlog for its advanced-process and packaging facilities in Arizona, with work continuing through 2028 and visibility to 2030.
- Tata Power eyes 2.8GW of generation, transmission, and distribution for Indian data center sector — Data Center Dynamics, 2026-10-21Tata Power plans to secure significant generation, transmission, and distribution capacity for the burgeoning Indian data center industry.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Utilities, IPPs & power providers signing data-center deals
- Vultr to deploy 20MW AMD MI355X cluster in Chennai, India — Data Center Dynamics, 2026-10-21Vultr plans to install a 20MW cluster utilizing AMD MI355X accelerators in Chennai, India.
- Axcelis plans US$35 million semiconductor facility in South Korea — DigiTimes, 2026-10-21Axcelis Technologies plans a US$35 million facility in South Korea to manufacture ion implantation equipment, indicating an investment in semiconductor infrastructure for AI.
- Chief Telecom breaks ground on 16MW data center in Taiwan — Data Center Dynamics, 2026-10-20A chief telecommunications company began construction on a 16MW data center facility located in Taiwan, with an expected operational date in 2028.
- Chief Telecom starts NT$3.3 billion AI data center in Taiwan — DigiTimes, 2026-10-20Chief Telecom began construction on a new AI data center in Taiwan, committing NT$3.3 billion, with operations expected by the second half of 2028.
- Amkor triples Gwangju investment as AI packaging demand grows — DigiTimes, 2026-10-20Amkor Technology is significantly increasing its investment in Gwangju to boost advanced packaging capabilities required for AI and high-performance computing.
- Curtis Hall proposes temporary 49.9MW gas power plant for Cardiff data center campus - report — Data Center Dynamics, 2026-10-19Curtis Hall has proposed a temporary 49.9MW gas power plant for a data center campus in Cardiff.
regulation
- SpaceXAI facing $6.1m fine in Mississippi for building data centers without securing correct permits — Data Center Dynamics, 2026-10-24SpaceXAI faces a fine in Mississippi for constructing data centers without obtaining the necessary building permits.
- First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule — DigiTimes, 2026-10-23The US FCC prohibited two electronic devices from entering the US market due to the presence of surveillance chips from Huawei's HiSilicon.
- Memphis councilors reject 18-month data center moratorium — Data Center Dynamics, 2026-10-21The Memphis councilors rejected an 18-month moratorium on data centers and instead implemented a 135-day ban on new projects.
- Virginia governor seeks 6-year rate freeze if Dominion-NextEra merger is approved — Utility Dive, 2026-10-20The governor suggested a rate freeze conditional on the Dominion-NextEra merger and proposed adjustments to Dominion's debt structure.
- Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking — DigiTimes, 2026-10-20Intel requested an FCC waiver for the US foreign robot ban, arguing that the restriction could impede semiconductor manufacturing by preventing necessary equipment updates.
- Malaysia says data center investors must fund transmission upgrades — DigiTimes, 2026-10-20Malaysia is requiring data center investors to fund necessary transmission upgrades, increasing the link between investment and local grid capacity.
- Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure — DigiTimes, 2026-10-20China is proposing to expand its AI export controls to cover chip design IP, memory technologies, and large-scale computing clusters by setting specific technical thresholds for each area.
- FERC approves ISO-NE ‘asset condition’ transmission review process — Utility Dive, 2026-10-19FERC approved an 'asset condition' transmission review process that commissioners suggested other regions should adopt for increased oversight of local transmission projects.
earnings
- LGES Poland plant nears breakeven as utilization rebounds — DigiTimes, 2026-10-24
- JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion — DigiTimes, 2026-10-23JCET Group reported significant year-over-year increases in revenue and net profit, demonstrating strong financial performance.
- Western Digital bets on pricing and HAMR, not new capacity, as Toshiba plans to double output — DigiTimes, 2026-10-23Western Digital plans to increase pricing and density of its HDDs rather than building new capacity, relying on HAMR adoption while Toshiba aims to double its output.
- Western Digital argues AI's longer payoff lies in stored data, not compute — DigiTimes, 2026-10-23Western Digital stated that the demand for hard drives is sustained by multiple sources, including cloud services, model training, inference, and physical AI, rather than being solely reliant on the current AI compute spending.
- Western Digital widens margins on pricing and exabyte growth — DigiTimes, 2026-10-23Western Digital reported a significant increase in its hard-drive business gross margin for the first quarter due to pricing and increased demand.
- IBM infrastructure revenue bounces back after Q2 drop — Data Center Dynamics, 2026-10-22IBM's CEO highlighted the positive momentum expected from sovereign AI initiatives boosting infrastructure revenue after a dip in the second quarter.
- Texas Instruments posts rising Q3 sales across data centers, cars, industry — DigiTimes, 2026-10-22Texas Instruments reported strong third-quarter sales driven by demand in industrial, automotive, and data center sectors, despite facing tight chip supply while ramping up production capacity.
- Supermicro lifts quarterly sales estimate as AI demand outpaces forecasts — DigiTimes, 2026-10-21Supermicro updated its sales forecasts upwards due to stronger demand for its AI platforms and a favorable product mix.
- OVHcloud has 110MW of data center capacity up for grabs — Data Center Dynamics, 2026-10-20OVHcloud announced during its annual earnings call that it possesses 110MW of available data center capacity.
- Grid equipment manufacturer ABB sees US orders rise 82% — Utility Dive, 2026-10-20ABB reported that utility investments are increasing for electrical grid refurbishment and build-out to ensure power availability and efficiency.
- Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump — DigiTimes, 2026-10-20Hygon's revenue increased by over 57% due to demand for AI chips, though slower growth and stock declines revealed a disconnect between operations and market expectations.
- Schneider Electric sees record-high Q3 revenue on global data center boom — Utility Dive, 2026-10-19Schneider Electric reported record Q3 revenue driven by the global data center expansion, noting higher organic growth in China and East Asia compared to North America.
- CXMT eyes nearly US$20 billion profit as AI-driven DRAM shortages fuel earnings turnaround — DigiTimes, 2026-10-19CXMT's anticipated profit increase is fueled by shortages in DRAM and related memory components due to AI demand.
m and a
- InsurTech company Reliance Global Group to acquire GPU cloud company and pivot strategy — Data Center Dynamics, 2026-10-23InsurTech company Reliance Global Group plans to acquire a GPU cloud company and change its strategic focus.
- Pilot Fiber to buy Boldyn Network's New York-New Jersey metro fiber business — Data Center Dynamics, 2026-10-23Pilot Fiber is acquiring Boldyn Network's New York-New Jersey metro fiber business, and the company also raised $330 million in financing.
- Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity — DigiTimes, 2026-10-23Tesla and Nvidia are reportedly investing combined funds into Samsung Electro-Mechanics to expand ABF substrate production capacity in South Korea.
- Trane Technologies to Acquire Cancoil, Strengthening Supply Chain Resiliency and Thermal Management Expertise — newsroom:trane, 2026-10-21Trane Technologies plans to acquire Cancoil to bolster its capabilities in thermal management and supply chain resilience for cooling solutions.
- TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition — DigiTimes, 2026-10-21Due to high demand for AI infrastructure, companies are looking to convert idle LCD fabrication plants into advanced semiconductor packaging and AI computing facilities, with LG Innotek considering an acquisition from LG Display.
- Google expands partnership with Entergy Arkansas, will fund renewable energy and grid upgrades for West Memphis data center — Data Center Dynamics, 2026-10-20Google signed a 440MW Power Purchase Agreement with Entergy Arkansas to finance both renewable energy generation and two battery energy storage system projects for a data center in West Memphis.
- Genius Electronic Optical partners with 3M on EBO development — DigiTimes, 2026-10-20Genius Electronic Optical is partnering with 3M to develop and expand production capacity for Expanded Beam Optical (EBO) solutions, with 3M investing NT$4.8 billion.
supply constraint
- Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain — DigiTimes, 2026-10-23Semco's extended lead times for MLCCs are giving suppliers pricing power due to sustained demand in the AI supply chain.
- Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions — DigiTimes, 2026-10-23An Israeli security firm reportedly found 32 Nvidia Blackwell Ultra B300 GPUs on a network linked to China Telecom, raising concerns about US export controls.
- TSMC reportedly surveys suppliers on rare-earth-free motors as China's export-control pause nears legal expiry — DigiTimes, 2026-10-23TSMC is examining options for rare-earth-free motors in its factory equipment due to approaching changes in China's rare-earth export controls.
- TSMC is seeking chipmaking equipment that doesn't contain Chinese rare-earth magnets — Tom's Hardware, 2026-10-22TSMC is requesting that equipment suppliers provide factory machinery that avoids rare-earth magnets to mitigate risks associated with China's control over critical minerals.
- Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains — DigiTimes, 2026-10-22Unimicron warned that the rapid increase in AI demand is straining the PCB supply chain due to equipment constraints, short development cycles, and overlapping capacity bookings.
- Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in — DigiTimes, 2026-10-22Nvidia's lead over Huawei in China's AI accelerator market has significantly narrowed according to IDC data for the first half of 2026.
- Walrus Pump sees slower demand for higher-capacity AI cooling pumps — DigiTimes, 2026-10-22The expectation is that Walrus Pump will see slower demand for high-capacity AI cooling pumps despite the increasing mainstream adoption of liquid cooling in AI servers.
- Vantage signs 1GW solid-state transformer supply deal with Heron Power — Data Center Dynamics, 2026-10-21Vantage has secured a deal with Heron Power to supply 1GW of solid-state transformers.
- PCB material shortages persist as capacity expansion extends beyond 2029 — DigiTimes, 2026-10-21The demand driven by AI and HPC is pushing PCBs towards higher density, causing an ongoing shortage of materials like copper-clad laminates, copper foil, and drill bits.
- DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment — DigiTimes, 2026-10-21The increasing need for higher data rates in AI servers is driving the upgrade of PCBs with more layers and better materials, creating high demand for advanced backdrilling equipment to maintain signal integrity.
- SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor — DigiTimes, 2026-10-21The rapid scaling of AI infrastructure is being constrained by the availability of electrical capacity, cooling solutions, and necessary compute hardware.Merchant GPUs / accelerators, Hyperscaler custom ASICs, Scale-up fabric, Rack-scale systems, Direct-to-chip cold plates, Chillers & compressors, Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Hyperscalers, neoclouds & model labs
- LS Power COO sees sweeping power sector investing needs: gas, renewables, transmission and more — Utility Dive, 2026-10-20LS Power's COO stated that current demand growth is substantial and that the supply side of the power infrastructure, including gas, renewables, and transmission, requires significant time to meet market needs.Large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Backup generation: gensets, fuel systems, HVO, Paralleling switchgear & generator controls, Metering, power quality, monitoring, Gas turbines (onsite / behind-the-meter) & HRSGs, Reciprocating engines & engine microgrids, Fuel cells, Renewables & long-duration storage hardware, Transmission, interconnection & grid equipment
- Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives — DigiTimes, 2026-10-20Samsung's anticipated high level of pre-committed memory contracts is noted alongside China's CXMT expanding capacity, which draws attention from Western tech firms looking for alternative DRAM suppliers.
- Nscale set to lose Microsoft as anchor tenant over UK power delays, adding uncertainty to IPO — DigiTimes, 2026-10-20The UK neocloud provider Nscale may lose Microsoft as an anchor tenant due to anticipated power delays from the National Grid, which may not have sufficient electricity for the site until after 2030.
- Commentary: Samsung's US 2nm ramp faces no room for error — DigiTimes, 2026-10-20Samsung's ability to successfully ramp production of its 2nm process at its US fab is crucial for its foundry recovery and servicing major orders from clients like Tesla and Broadcom.
- Microsoft abandons UK AI supercomputer as grid struggles to keep up — The Register, 2026-10-19Microsoft has withdrawn from its planned UK AI supercomputer because power grid connection issues are expected to delay the nation's AI infrastructure goals until the 2030s.Large power transformers (345–765 kV) & substations, MV switchgear, E-houses, power skids, MV/LV transformers, Floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, Energy storage: UPS batteries & BESS, Utilities, IPPs & power providers signing data-center deals, Microsoft
design win
- Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion — DigiTimes, 2026-10-21Samsung Electro-Mechanics won a large contract to supply package substrates for memory semiconductors due to rising AI demand.
- iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise — DigiTimes, 2026-10-19iBase Solution is aiming for engineering, procurement, and construction (EPC) contracts for AI data centers by offering expertise in modular liquid cooling and energy storage.
Covered this week
Parts: Nuclear: existing fleet PPAs & restarts, ABF / high-layer package substrates, Interposers, silicon bridges, RDL, Silicon photonics & co-packaged optics, Prefab / modular data centers & power/cooling skids, Enterprise SSDs & controllers, Merchant GPUs / accelerators, Physical security & access, General contractors & design-build, Quick disconnects, Hoses, tubing, fittings, valves, Memory modules, Memory interface / buffer chips, CXL controllers & memory expanders, Energy storage: UPS batteries & BESS, DCIM, digital twins, capacity planning, Hyperscaler custom ASICs, Rack-scale systems, Data center developers, operators & REITs, Hyperscalers, neoclouds & model labs, Site utilities, water & fiber entrance, NAND flash, Fab equipment, Fab materials, masks, gases, Motherboards, CPU trays, switch trays, Air-cooled heatsinks & vapor chambers, Fiber, connectors, structured cabling, Leading-edge foundry, Silicon wafers, Coolant distribution units, Rear-door heat exchangers, Refrigerants & insulating gases, UPS (static, modular, rotary/DRUPS) & UPS power semis, Metering, power quality, monitoring, DCI / coherent optics, Structure, steel, precast, envelope, site equipment, Robotics, inspection & operations hardware, Passives, Power smoothing / supercapacitors, Backup generation: gensets, fuel systems, HVO, FPGAs, Building management, controls, environmental sensors, 2.5D/3D advanced packaging, Server CPUs, HV switchgear, GIS, breakers, protection relays, MV switchgear, E-houses, power skids, Industrial & specialty gases, Rare earths & permanent magnets, EMS, system integration & rack-level test, Chassis, rails, rack enclosures, HDD, Scale-up fabric, ASIC design services, IP & EDA, Packaging & bonding equipment, Direct-to-chip cold plates, Rack manifolds, CDU internals: plate heat exchangers, pumps, filters, Rack/row cooling controls & software, Utilities, IPPs & power providers signing data-center deals, Cluster management & GPU orchestration, Chip-level thermal: lids, heat spreaders, TIMs, Dry coolers, adiabatic/evaporative units, cooling towers, fans & motors, Facility water loop hardware, Heat reuse & district heating interfaces, GPU baseboards & compute trays, Power shelves & PSUs, DRAM, Test & measurement instruments, Chillers & compressors, CRAH / CRAC / fan walls / in-row units, Large power transformers (345–765 kV) & substations, Gas turbines (onsite / behind-the-meter) & HRSGs, Architecture, engineering & MEP design, Startup accelerators, Substrate materials, 800 V DC architecture & solid-state transformers, Critical minerals: gallium, germanium, indium, tungsten, beryllium, NICs / SuperNICs, DPUs, HBM, Scale-out switch ASICs, Optical transceivers, High-layer-count PCBs, Board-level power: VRMs, power stages, PoL, power semis, Copper, Aluminum, Specialty glass & glass fiber, Semiconductor test & burn-in, Timing, security & misc board silicon, Copper-clad laminate & PCB materials, MEP & electrical contractors, Immersion cooling systems, MV/LV transformers, LV switchgear, switchboards, panelboards, Busway / busbar trunking, Floor PDUs, RPPs, static transfer switches, ATS, LV cable, wire, tray, raceway, Paralleling switchgear & generator controls, Renewables & long-duration storage hardware, Board-level connectors & sockets, Glass-core substrates, PCIe/CXL switches & retimers, Fluids & coolant treatment, Leak detection, flow & pressure sensing, Water treatment, reuse, consumption, Reciprocating engines & engine microgrids, Fuel cells, Transmission, interconnection & grid equipment, Circuit protection, fuses, surge, grounding, Site selection, power procurement, market intelligence, brokerage, Optics contract manufacturing, Optical DSPs, drivers, TIAs, SMRs, advanced reactors, components, fuel, Testing, commissioning & certification, Air handling, economizers, filtration, Gas supply chain
Companies: Nvidia, Meta Platforms, LG Energy Solution, Crown Castle, Amazon (AWS), Micron, SK Hynix, Gigabyte, Intel, Crusoe, Microsoft, Schneider Electric, Lenovo, Huawei, Samsung Electronics, Samsung Electro-Mechanics, Seagate, Toshiba, Western Digital, Texas Instruments, Apple, Lam Research, SiPearl, OpenAI, Fluke, Infineon, Tesla, Unimicron, Vantage, NextEra, TeraWulf, Hitachi Energy, Wolfspeed, Alpha Networks, LG Innotek, Supermicro, Dominion, Blackstone, Alibaba, ByteDance, Tencent, Entergy, Kioxia, Nscale, Broadcom, Hanmi Semiconductor, Elite Material, X-energy, Anthropic, Tenstorrent, Fujitsu, GlobalFoundries, Siemens, Hitachi, Murata, Together, Lite-On, Open Compute Project (OCP)
Headlines link out to the original publisher. Placement of a story against a part or company is an editorial mapping, not a disclosure — see sources & method.