#method
How this dataset is built and what its tags mean.
- The eleven parts that only show up above hyperscale2026-09-09
Eleven of this catalog's 130 part categories never appear below campus scale. Ten of them are power. One is optics.
- Half the supplier bench, a sixth of the coverage2026-09-07
Cooling, power distribution and generation hold 43% of this catalog's supplier placements and drew 16% of three weeks of trade coverage.
- Eight parts of an AI data center have no US-listed supplier at all2026-09-04
163 parts here have three or more listed suppliers. On eight, not one trades in the US — and six sit either directly under the GPU or directly around it.
- Eighteen companies cross four layers of this stack. 984 never leave one.2026-09-03
984 of the 1,163 companies on a part here sit in exactly one of the eleven layers. Eighteen reach four or more, and two pairs occupy identical parts.
- The further you get from the chip, the less of the supply chain is listed2026-09-02
652 of the 1,164 companies on a part here are listed: 87% of the rack layer, 41% of the building shell, and four parts with no listed supplier at all.
- What 'reported' means on this site2026-09-02
Our three-tier confidence system, why most edges start as leads, and how to send a correction.
- The 17 parts where only one listed company shows up2026-09-01
A query for parts with exactly one publicly listed supplier returns 17 rows. Every one of those 17 edges is an unsourced lead — which is the actual finding.
- Who depends on whom: reading customer concentration in SEC filings2026-08-31
197 concentration disclosures from 101 suppliers. Two name the customer. Here is what the other 195 are still worth.
What #method covers in the catalog
The rows these posts are written about. Each page carries the confidence tag on every supplier placement, so you can see what is sourced and what is still a lead.
Parts: DCI / coherent optics, large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, 800 v DC architecture & solid-state transformers, gas turbines (onsite / behind-the-meter) & HRSGs, nuclear: existing fleet PPAs & restarts, SMRs, advanced reactors, components, fuel, fusion, renewables & long-duration storage hardware, transmission, interconnection & grid equipment, gas supply chain, rear-door heat exchangers, immersion cooling systems, merchant GPUs / accelerators, HBM, busway / busbar trunking, floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, energy storage: UPS batteries & BESS, data center developers, operators & REITs, hyperscalers, neoclouds & model labs, silicon wafers, ABF / high-layer package substrates, substrate materials, motherboards, CPU trays, switch trays, fans, chassis, rails, rack enclosures, air-cooled heatsinks & vapor chambers, sensors, direct-to-chip cold plates, fiber, connectors, structured cabling, LV cable, wire, tray, raceway, rack-scale systems, prefab / modular data centers & power/cooling skids, startup accelerators, architecture, engineering & MEP design, MEP & electrical contractors, CDU internals: plate heat exchangers, pumps, filters, paralleling switchgear & generator controls, NVLink copper spine / backplane cartridges, precast, certification and standards, geothermal
Companies: Siemens Energy, Hitachi Energy, GE Vernova, Cleveland-Cliffs, Pennsylvania Transformer, Piller, Vertiv, Starline, ABB, Riello, Delta Electronics, GlobalWafers, Shin-Etsu, Ajinomoto, Unimicron, King Slide, Auras, Nidec, Boyd, Schneider Electric, Eaton, Prysmian, Nexans, Dell, HPE, Cerebras, LiquidStack, Commonwealth Fusion, EMCOR, Comfort Systems, Corning, Ormat, UL Solutions, Smith-Midland, Keysight, CoreWeave, STMicroelectronics, Micron, KLA