#coverage
What this catalog holds, what it is missing, and how thin the evidence is under each count.
- Half the supplier bench, a sixth of the coverage2026-09-07
Cooling, power distribution and generation hold 43% of this catalog's supplier placements and drew 16% of three weeks of trade coverage.
- Eight parts of an AI data center have no US-listed supplier at all2026-09-04
163 parts here have three or more listed suppliers. On eight, not one trades in the US — and six sit either directly under the GPU or directly around it.
- Eighteen companies cross four layers of this stack. 984 never leave one.2026-09-03
984 of the 1,163 companies on a part here sit in exactly one of the eleven layers. Eighteen reach four or more, and two pairs occupy identical parts.
- The further you get from the chip, the less of the supply chain is listed2026-09-02
652 of the 1,164 companies on a part here are listed: 87% of the rack layer, 41% of the building shell, and four parts with no listed supplier at all.
- The 17 parts where only one listed company shows up2026-09-01
A query for parts with exactly one publicly listed supplier returns 17 rows. Every one of those 17 edges is an unsourced lead — which is the actual finding.
What #coverage covers in the catalog
The rows these posts are written about. Each page carries the confidence tag on every supplier placement, so you can see what is sourced and what is still a lead.
Parts: merchant GPUs / accelerators, HBM, large power transformers (345–765 kV) & substations, HV switchgear, GIS, breakers, protection relays, busway / busbar trunking, floor PDUs, RPPs, static transfer switches, ATS, UPS (static, modular, rotary/DRUPS) & UPS power semis, energy storage: UPS batteries & BESS, gas turbines (onsite / behind-the-meter) & HRSGs, data center developers, operators & REITs, hyperscalers, neoclouds & model labs, silicon wafers, ABF / high-layer package substrates, substrate materials, motherboards, CPU trays, switch trays, fans, chassis, rails, rack enclosures, air-cooled heatsinks & vapor chambers, sensors, direct-to-chip cold plates, fiber, connectors, structured cabling, LV cable, wire, tray, raceway, rack-scale systems, prefab / modular data centers & power/cooling skids, startup accelerators, immersion cooling systems, fusion, transmission, interconnection & grid equipment, architecture, engineering & MEP design, MEP & electrical contractors, CDU internals: plate heat exchangers, pumps, filters, paralleling switchgear & generator controls, precast, certification and standards, geothermal
Companies: Hitachi Energy, Siemens Energy, Pennsylvania Transformer, Piller, Vertiv, Starline, ABB, Riello, Delta Electronics, GlobalWafers, Shin-Etsu, Ajinomoto, Unimicron, King Slide, Auras, Nidec, Boyd, Schneider Electric, Eaton, Prysmian, Nexans, Dell, HPE, Cerebras, LiquidStack, Commonwealth Fusion, EMCOR, Comfort Systems, Corning, Ormat, UL Solutions, Smith-Midland, Keysight