#concentration
Where the supply chain narrows to a few names — and where the catalog only makes it look that way.
- Nine supercomputers, six countries, one foundry2026-10-05
Six countries and four chip designers built these nine machines. Fugaku and JUPITER even commissioned their own processors. All nine still fab at TSMC.
- Eight parts of an AI data center have no US-listed supplier at all2026-09-04
163 parts here have three or more listed suppliers. On eight, not one trades in the US — and six sit either directly under the GPU or directly around it.
- Eighteen companies cross four layers of this stack. 984 never leave one.2026-09-03
984 of the 1,163 companies on a part here sit in exactly one of the eleven layers. Eighteen reach four or more, and two pairs occupy identical parts.
- The further you get from the chip, the less of the supply chain is listed2026-09-02
652 of the 1,164 companies on a part here are listed: 87% of the rack layer, 41% of the building shell, and four parts with no listed supplier at all.
- The 17 parts where only one listed company shows up2026-09-01
A query for parts with exactly one publicly listed supplier returns 17 rows. Every one of those 17 edges is an unsourced lead — which is the actual finding.
- Who depends on whom: reading customer concentration in SEC filings2026-08-31
197 concentration disclosures from 101 suppliers. Two name the customer. Here is what the other 195 are still worth.
What #concentration covers in the catalog
The rows these posts are written about. Each page carries the confidence tag on every supplier placement, so you can see what is sourced and what is still a lead.
Parts: leading-edge foundry, 2.5D/3D advanced packaging, rack-scale systems, silicon wafers, ABF / high-layer package substrates, substrate materials, motherboards, CPU trays, switch trays, fans, chassis, rails, rack enclosures, air-cooled heatsinks & vapor chambers, sensors, HV switchgear, GIS, breakers, protection relays, direct-to-chip cold plates, fiber, connectors, structured cabling, LV cable, wire, tray, raceway, prefab / modular data centers & power/cooling skids, startup accelerators, immersion cooling systems, fusion, transmission, interconnection & grid equipment, architecture, engineering & MEP design, MEP & electrical contractors, CDU internals: plate heat exchangers, pumps, filters, paralleling switchgear & generator controls, precast, certification and standards, geothermal
Companies: TSMC, HPE, AMD, Nvidia, Arm, Fujitsu, GlobalWafers, Shin-Etsu, Ajinomoto, Unimicron, King Slide, Auras, Nidec, Boyd, Schneider Electric, Vertiv, Eaton, ABB, Prysmian, Nexans, Dell, Cerebras, LiquidStack, Commonwealth Fusion, EMCOR, Comfort Systems, Corning, Ormat, UL Solutions, Smith-Midland, Keysight, CoreWeave, STMicroelectronics, Micron, KLA